Claims (15)
一種線鋸之製造方法，包括：(a)提供一研磨材料，其中，該研磨材料係包含一結合劑以及一磨料，該磨料之粒徑係介於1-100μm間且係均勻散佈於該結合劑中，以該研磨材料總重量為100重量百分比計算，該磨料係佔0.1-30重量百分比；以及(b)透過成型製程，再以透過固化製程，使該研磨材料形成一研磨主體，其中，該研磨主體係一單股型線鋸。
A method for manufacturing a wire saw, comprising: (a) providing an abrasive material, wherein the abrasive material comprises a bonding agent and an abrasive, the abrasive having a particle size ranging from 1 to 100 μm and uniformly dispersed in the bonding In the agent, the abrasive is 0.1 to 30% by weight based on 100% by weight of the total weight of the abrasive; and (b) the through-forming process, and then through the curing process, the abrasive material is formed into a grinding body, wherein The grinding main system is a single-strand wire saw.
如申請專利範圍第1項所述之方法，其中該單股型線鋸之線徑介於0.1-3mm間。
The method of claim 1, wherein the single-strand wire saw has a wire diameter of between 0.1 and 3 mm.
如申請專利範圍第1項所述之方法，步驟(b)之成型製程係壓出成型、擠出成型或射出成型。
The molding process of the step (b) is extrusion molding, extrusion molding or injection molding, as in the method of claim 1.
如申請專利範圍第1項所述之方法，其中更包含一步驟(c)將複數之該單股型線鋸形成一多股型線鋸或一絞線型線鋸。
The method of claim 1, further comprising a step (c) of forming the plurality of strand saws into a stranded wire saw or a stranded wire saw.
如申請專利範圍第1項所述之方法，其中該結合劑之材料係為一光固化材料或一熱固化材料。
The method of claim 1, wherein the material of the binder is a photocurable material or a heat curing material.
如申請專利範圍第1項所述之方法，其中該結合劑之材料係至少一選自由：尼龍、碳纖維、聚乙烯、環氧丙烯酸樹脂、聚氨酯丙烯酸酯樹脂及聚酯丙烯酸樹脂所組成之群組。
The method of claim 1, wherein the material of the binder is at least one selected from the group consisting of nylon, carbon fiber, polyethylene, epoxy acrylate resin, urethane acrylate resin, and polyester acrylate resin. .
如申請專利範圍第1項所述之方法，其中該磨料係至少一選自由：鑽石、氧化鋁、氮化硼及碳化矽所組成之群組。
The method of claim 1, wherein the abrasive is at least one selected from the group consisting of: diamond, alumina, boron nitride, and tantalum carbide.
如申請專利範圍第1項所述之方法，其中，該磨料之表面更披覆一鍍層，且該鍍層之材料係至少一選自由：鎳、鉻及鈦所組成之群組。
The method of claim 1, wherein the surface of the abrasive is further coated with a plating layer, and the material of the plating layer is at least one selected from the group consisting of nickel, chromium and titanium.
如申請專利範圍第1項所述之方法，其中該研磨材料更包括一增韌劑，且係至少一選自由：液體聚硫橡膠、液體聚丁二烯橡膠、丁腈橡膠、乙丙橡膠、丁苯橡膠、聚氨酯類、苯乙烯類、聚烯烴類、聚酯類、及聚醯胺類所組成之群組，以該單股型線鋸總重量為100重量百分比計算，該增韌劑係佔0-20重量百分比。
The method of claim 1, wherein the abrasive material further comprises a toughening agent, and at least one selected from the group consisting of: liquid polysulfide rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber, a group consisting of styrene-butadiene rubber, polyurethane, styrene, polyolefin, polyester, and polyamine, calculated by the total weight of the single-strand wire saw being 100% by weight, the toughener Occupy 0-20% by weight.
一種線鋸，係包括：一研磨主體，其中該研磨主體係包含一結合劑以及一磨料，該磨料係散佈於該研磨主體，且該磨料之粒徑係介於1-15μm間，以該線鋸總重量為100重量百分比為計，該磨料係佔0.1-30重量百分比。
A wire saw includes: a grinding body, wherein the grinding main system comprises a bonding agent and an abrasive, the abrasive is dispersed in the grinding body, and the abrasive has a particle size of between 1 and 15 μm, The total weight of the saw is 100% by weight, and the abrasive is 0.1-30% by weight.
如申請專利範圍第10項所述之線鋸，其中該結合劑之材料係為一光固化材料。
The wire saw of claim 10, wherein the material of the bonding agent is a photocurable material.
如申請專利範圍第11項所述之線鋸，其中該光固化材料係至少一選自由：環氧丙烯酸樹脂、聚氨酯丙烯酸酯樹脂及聚酯丙烯酸樹脂所組成之群組。
The wire saw according to claim 11, wherein the photocurable material is at least one selected from the group consisting of epoxy acrylate resin, urethane acrylate resin and polyester acrylate resin.
如申請專利範圍第10項所述之線鋸，其中該磨料係至少一選自由：鑽石、氧化鋁、氮化硼及碳化矽所組成之群組。
The wire saw of claim 10, wherein the abrasive is at least one selected from the group consisting of: diamond, alumina, boron nitride, and tantalum carbide.
如申請專利範圍第10項所述之線鋸，其中該磨料之表面係披覆一鍍層，且該鍍層之材料係至少一選自由：鎳、鉻及鈦所組成之群組。
The wire saw according to claim 10, wherein the surface of the abrasive is coated with a plating layer, and the material of the plating layer is at least one selected from the group consisting of nickel, chromium and titanium.
如申請專利範圍第10項所述之線鋸，其中該線鋸係單股型線鋸、多股型線鋸或絞線型線鋸。The wire saw of claim 10, wherein the wire saw is a single-strand wire saw, a multi-strand wire saw or a strand wire saw.