TWI452738B - Led package and method for manufacturing the same - Google Patents

Description

Light-emitting diode package structure and manufacturing method thereof

The present invention relates to a semiconductor package structure, and more particularly to a light emitting diode package structure and a method of fabricating the same.

Nowadays, Light Emitting Diodes (LEDs) have been widely used in many fields, for example, for illumination, as a backlight for liquid crystal displays, and the like. The light emitted by the light-emitting diode is generally a natural light with a disordered polarization direction. In some applications, it is often necessary to use polarized light having a specific polarization direction.

In view of the above, it is necessary to provide a light emitting diode package structure capable of emitting polarized light and a method of fabricating the same.

A light emitting diode package structure includes a package carrier, a light emitting diode wafer attached to one surface of the package carrier, and a package overlying the LED body. The package comprises a transparent colloid and a carbon nanotube arranged in parallel in the same direction in the transparent colloid.

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a package carrier; attaching a light emitting diode wafer to a surface of the package carrier; and covering a liquid transparent gel mixed with a carbon nanotube On the light-emitting diode wafer; forming a directional magnetic field around the light-emitting diode wafer before the liquid transparent colloid is cured So that the carbon nanotubes are arranged in parallel in the same direction in the transparent gel; and the transparent colloid is cured.

In the light emitting diode package structure and manufacturing method, since the package body has carbon nanotubes arranged substantially in parallel in the same direction, the package body has a function of a polarizing plate, so that light emitted from the light emitting diode chip passes through the The package becomes polarized light. In addition, since the carbon nanotube has excellent thermal conductivity, the thermal conductivity of the entire package can be improved, which is advantageous for improving the heat dissipation efficiency of the LED.

100‧‧‧Light emitting diode package structure

10‧‧‧Package carrier

11‧‧‧Insulation body

12‧‧‧ lead frame

20‧‧‧Light Diode Wafer

30‧‧‧Package

40‧‧‧Reflection Cup

101‧‧‧ first surface

102‧‧‧ second surface

1 is a cross-sectional view of a light emitting diode package structure according to an embodiment of the present invention.

2 is a flow chart of a method of manufacturing the light emitting diode package structure of FIG. 1.

The invention will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 , a light emitting diode package structure 100 according to an embodiment of the present invention includes a package carrier 10 , a light emitting diode chip 20 , a package body 30 , and a reflective cup 40 .

The package carrier 10 includes an insulative housing 11 and two lead frames 12 . The package carrier 10 includes opposing first and second surfaces 101, 102. Each of the leadframes 12 is exposed on the first surface 101 of the package carrier 10 and the other end is exposed on the second surface 102 of the package carrier 10. The insulative housing 11 can be made of a highly thermally conductive and electrically insulating material that can be selected from the group consisting of graphite, tantalum, ceramic, diamond-like, epoxy or decane-oxygen. The lead frame 12 may be made of metal or a metal alloy.

The LED chip 20 is attached to the package carrier 10. Specifically, the LED chip 20 can be attached to the insulative housing 11 or attached to the guide. The wire frame 12 is exposed on one end of the first surface 101. In this embodiment, the LED wafer 20 is attached to one end of a lead frame 12 exposed on the first surface 101. The LED wafer 20 can be electrically connected to the two lead frames 12 by flip-chip, eutectic or wire bonding. In the embodiment, the LED wafer 20 is connected to the two lead frames 12 by wire bonding.

The package body 30 is covered on the LED substrate 20 for protecting the LED chip 20 from dust, moisture and the like. The package body 30 includes a transparent colloid 31 and a carbon nanotube 32 arranged substantially parallel in the same direction in the transparent colloid 31. The material of the transparent colloid 31 may be silicone, epoxy or a combination thereof. The transparent colloid 31 refers to a colloid capable of transmitting light emitted from the LED chip 20. Since the parallel arrangement of the carbon nanotubes 32 has the function of a polarizing plate, the light emitted from the LEDs 20 passes through the package 30 and becomes polarized light. In addition, since the carbon nanotubes 32 have excellent thermal conductivity, the thermal conductivity of the entire package 30 can be improved, which is advantageous for improving the heat dissipation efficiency of the LEDs 20. Since the carbon nanotubes 32 also have good mechanical properties, the material strength of the entire package 30 can be improved. Preferably, the package body 30 may be doped with phosphor powder, and the phosphor powder may be selected from one or more of yttrium aluminum garnet, yttrium aluminum garnet, nitride, sulfide and citrate. Combination of species.

The reflector cup 40 is disposed on the first surface 101 of the package carrier 10 around the LED chip 20 and the package 30. The reflector cup 40 is used to improve the light extraction efficiency of the entire LED package structure 100. The reflector cup 40 may be entirely made of a reflective material, or only its inner surface may be made of a reflective material. Preferably, the reflective cup 40 is made of a highly thermally conductive material to improve heat dissipation efficiency of the LED wafer 20. In this embodiment, the carbon nanotubes 32 are substantially parallel to the first table of the package carrier 10 In the surface 101, since the carbon nanotubes 32 have excellent thermal conductivity in the axial direction, the heat in the package 30 can be quickly conducted to the reflective cup 40, so that the heat dissipation efficiency of the light-emitting diode wafer 20 can be further improved.

Referring to FIG. 2 , an embodiment of the present invention further provides a method for manufacturing a light emitting diode package structure 100 . The method for manufacturing the LED package structure 100 includes the following steps:

In step S401, a package carrier 10 is provided. The package carrier 10 includes an insulative housing 11 and two lead frames 12. The package carrier 10 includes opposing first and second surfaces 101, 102. Each of the leadframes 12 is exposed on the first surface 101 of the package carrier 10 and the other end is exposed on the second surface 102 of the package carrier 10. The insulative housing 11 can be made of a highly thermally conductive and electrically insulating material that can be selected from the group consisting of graphite, tantalum, ceramic, diamond-like, epoxy or decane-oxygen. The lead frame 12 may be made of metal or a metal alloy.

In step S402, the LED wafer 20 is attached to the package carrier 10 and electrically connected to the two lead frames 12. Specifically, the LED chip 20 can be attached to the insulative housing 11 or attached to one end of the lead frame 12 exposed on the first surface 101. In this embodiment, the LED wafer 20 is attached to one end of a lead frame 12 exposed on the first surface 101.

In step S403, a reflective cup 40 is disposed on the package carrier 10 around the light emitting diode chip 20. The reflector cup 40 is used to improve the light extraction efficiency of the entire LED package structure 100. The reflector cup 40 may be entirely made of a reflective material, or only its inner surface may be made of a reflective material. Preferably, the reflective cup 40 is made of a highly thermally conductive material to improve heat dissipation efficiency of the LED wafer 20. In other embodiments, the LED package structure 100 may not include the reflective cup 40, and thus does not require steps. Step S403.

In step S404, the liquid transparent colloid 31 mixed with the carbon nanotubes 32 is overlaid onto the light-emitting diode wafer 20. Preferably, the carbon nanotubes 32 are uniformly distributed in the liquid transparent colloid 31.

In step S405, before the liquid transparent colloid 31 is cured, a directional strong magnetic field is formed around the light emitting diode wafer 20, so that the carbon nanotubes 32 are arranged substantially in parallel in the same direction in the transparent colloid 31. Preferably, the carbon nanotubes 32 are substantially parallel to the first surface 101 of the package carrier 10. Preferably, the strong magnetic field has a magnetic field strength greater than 10 Tesla.

Step S406, curing the transparent colloid 31 to obtain a light emitting diode package structure 100.

In the LED package structure and manufacturing method provided by the embodiment of the present invention, since the package 30 has the carbon nanotubes 32 arranged substantially in parallel in the same direction, the package 30 has the function of a polarizing plate, thereby making the LEDs The light emitted from the bulk wafer 20 passes through the package 30 and becomes polarized light. In addition, since the carbon nanotubes 32 have excellent thermal conductivity, the thermal conductivity of the entire package 30 can be improved, which is advantageous for improving the heat dissipation efficiency of the LEDs 20.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

100‧‧‧Light emitting diode package structure

10‧‧‧Package carrier

11‧‧‧Insulation body

12‧‧‧ lead frame

20‧‧‧Light Diode Wafer

30‧‧‧Package

40‧‧‧Reflection Cup

101‧‧‧ first surface

102‧‧‧ second surface

Claims (4)

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a package carrier; attaching a light emitting diode wafer to a surface of the package carrier; and covering a liquid transparent gel mixed with a carbon nanotube On the light-emitting diode wafer; before the liquid transparent colloid is cured, an orientation magnetic field is formed around the light-emitting diode wafer so that the carbon nanotubes are arranged in parallel in the same direction in the transparent gel; and the transparent colloid is cured. The method of manufacturing a light emitting diode package structure according to claim 1, wherein the magnetic field has a magnetic field strength greater than 10 Tesla. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the light emitting diode is before the liquid transparent colloid mixed with the carbon nanotube is coated on the light emitting diode wafer. The method of fabricating a package structure further includes the step of providing a reflective cup around the light emitting diode chip. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the carbon nanotube is attached to a surface of the light emitting diode wafer in parallel with the package carrier.