TWI452769B - Circuit board for coupling a wire to a usb 3.0 receptacle connector and coupling method therefor - Google Patents

Description

Circuit board coupled with USB 3.0 socket connector and cable and coupling method thereof

The present invention relates to a circuit board; and more particularly to a circuit board for coupling a USB 3.0 socket connector and a cable and a coupling method thereof.

The Universal Serial Bus (USB) is the transmission standard for computer systems and external devices. Since the theoretical transmission speed of USB 3.0 can reach 5 Gbps, compared with the theoretical transmission value of 480 Mbps of USB 2.0, the USB 3.0 has gradually become the mainstream in the market.

However, in the original nine pin (pin #1 to #9) designs of the USB 3.0 socket connector that meets the 2008 industry standard, two pairs of signal lines share a ground (GND), so two pairs of signal lines It is necessary to separately sing the respective GND lines into one GND line for soldering, which is difficult to process in the process. Moreover, after the impedance test, the impedance is not easy to control, and the stripping of the core line is too long, which may cause The characteristic impedance value is too high. Furthermore, currently only cable assemblies for USB 2.0 socket connectors are used, and for USB 3.0 socket connectors, only external wires are required, so different connectors and boards must be designed.

Therefore, there is an urgent need for a new circuit board and processing method to meet the requirements of the Association's USB 3.0 characteristic impedance, and at the same time more in line with the needs of soldering different wires, in other words, using a circuit board to solder wires, flexible wires or very fine coaxial Different wires such as cables.

The invention provides a circuit board coupled with a USB 3.0 socket connector and a cable, comprising: pads connected to a plurality of pins of the USB 3.0 socket connector, the pads are defined by pins of the USB 3.0 connector Arranged in two staggered and parallel columns, one of which is a power pin pad connecting the USB 3.0 connector pins #1 to #4, a USB 2.0 differential signal pad pad group, and a power ground pad pad. The other column is an ultra-high speed receiving differential signal butt pad group, a signal grounding pad pad and an ultra high speed transmission differential signal butt pad group connected to the USB 3.0 connector pins #5 to #9; a plurality of touch pads disposed on one of the two rows of pads and including wires electrically connected to the plurality of pins of the USB 3.0 socket connector; wherein the USB 2.0 differential signal butt pads are connected The plurality of touch pads of the ultra-high speed receiving differential signal butt pad group and the ultra high speed transmission differential signal butt pad group are respectively spaced apart by a signal grounding pad.

In the foregoing circuit board of the present invention, the cable is a wire, a flexible cable (FFC) or a micro coaxial cable.

In the foregoing circuit board of the present invention, the plurality of touch pads are disposed adjacent to one side of the plurality of pins #5 to #9, and the contact pads connecting the pair of USB 2.0 differential signal butt pads are located at the touch The center of the pad is placed between the signal grounding pads.

The present invention provides a method of coupling a USB 3.0 socket connector and a cable, comprising the steps of: providing a circuit board having pads for connecting a plurality of pins of the USB 3.0 socket connector, and a plurality of contact pads, wherein The pads are arranged in two staggered and parallel columns according to the pin definition of the USB 3.0 connector, one of which is a power pin pad connecting the USB 3.0 connector pins #1 to #4, USB 2.0 differential The signal is connected to the pad pad group and the power ground pin pad, and the other column is connected to the USB 3.0 connector pin #5 to #9 ultra-high speed receiving differential signal padding pad group, signal grounding pin welding The pad and the ultra-high speed transmission differential signal docking pad group, and the plurality of contact pads are arranged in a single row outside one of the two columns of pads, and comprise a plurality of pins electrically connected to the USB 3.0 socket connector respectively a connection line, wherein the USB 2.0 differential signal butt pad group, the ultra high speed receiving differential signal butt pad group, and the ultra-high speed transmission differential signal butt pad group are connected in pairs The ground is separated by a signal grounding pad; The USB 3.0 receptacle connector is positioned on the circuit board; and the cable is soldered to a plurality of contact pads of the circuit board and secured.

In the foregoing method of the present invention, the cable is a wire, a flexible cable (FFC) or a micro coaxial cable.

In the foregoing method of the present invention, a grounding claw is further provided and fixed to the micro coaxial cable.

In the foregoing method of the present invention, an iron shell is further provided to cover the soldered cable and to fix the iron shell to the circuit board.

The description of specific embodiments of the invention will be made hereinafter. It should be noted that the disclosed embodiments are merely illustrative. The scope of the invention is not limited to the specific embodiments disclosed, which are intended to include specific features, structures, or properties, and are defined by the scope of the appended claims. In addition, the illustrations referred to in the specification do not specifically describe all the features of the present invention, and the elements depicted may be expressed in a simplified and schematic manner, and the dimensions of various elements in the drawings may be described. It is exaggerated or does not conform to the actual ratio. Whether or not the foregoing is abbreviated, or whether the relevant features are described in detail, the persons described in the table are those skilled in the relevant art, and other specifics related to the features, structures, or properties may be The examples are implemented within the scope of knowledge.

Referring to the first figure, a first diagram is a schematic diagram of a circuit board in accordance with an embodiment of the present invention. The circuit board 100 is coupled to a USB 3.0 connector. The circuit board 100 includes a plurality of pins 1101 to 1109, a plurality of contact pads 1201 to 1210, a recess 130, an iron housing positioning hole 140, and a connector positioning hole 150. Screw hole 160. The plurality of touch pads 1201 to 1210 include a power contact pad 1201, an ultra high speed transmission differential signal pair touch pad group 1202, 1203, a first signal ground contact pad 1204, a USB 2.0 differential signal pair touch pad group 1205, 1206, a second signal grounding contact pad 1207, an ultra-high speed receiving differential signal pair of contact pad sets 1208, 1209 and a power grounding contact pad 1210 are arranged in a row along the X direction on the circuit board 100, and The representative positions are #1, #2, #3, #4, #5, #6, #7, #8, #9, and #10. The plurality of pins 1101 to 1109 include a first column pin 1101 to 1104 and a second column pin 1105 to 1109. The first row of pins 1101 to 1104 includes a power pin 1101, a USB 2.0 differential signal pairing pin group 1102, 1103, and a power grounding pin 1104 disposed on the circuit board 100 in the X direction, and is represented by The feet are in the order of #1, #2, #3, and #4. The second row of pins 1105 to 1109 includes an ultra-high speed receiving differential signal pairing pin group 1105, 1106, a signal grounding pin 1107 and an ultra high speed transmission differential signal pairing pin group 1108, 1109 in the opposite direction of the X direction. They are sequentially disposed on the circuit board 100, and the represented feet are sequentially #5, #6, #7, #8, and #9. In one embodiment of the invention, the contact pads can be SMT pads and the pins can be perforated pins.

With further reference to the second figure, the second figure is a layout of the circuit board of the first figure. The power pin 1101 is electrically connected to the power contact pad 1201, and the USB 2.0 differential signal pair pin group 1102 and 1103 are electrically connected to the USB 2.0 differential signal pair touch pad group 1205 and 1206, and the power ground pin 1104 is electrically connected. Connected to the power grounding pad 1210, the ultra-high speed receiving differential signal pairing pins 1105, 1106 are electrically connected to the ultra-high speed receiving differential signal pair of contact pads 1208, 1209, ultra-high speed transmission differential signal docking pin set 1108 The 1109 series is electrically connected to the ultra-high speed transmission differential signal pair touch pad group 1202 and 1203, and the first signal ground contact pad 1204 and the second signal ground contact pad 1207 are electrically grounded. The groove 130 is electrically connected to the iron shell positioning hole 140. The iron shell positioning hole 140 is electrically connected to the connector positioning hole 150. The connector positioning hole 150 is electrically connected to the screw hole 160.

The electrical connection relationship and signal name of the plurality of pins 1101 to 1109 and the plurality of pads 1201 to 1210 are arranged as shown in the following table:

The circuit board 100 of the first figure can meet the requirements of soldering different wires, such as wires, flexible wires or very thin coaxial cables. The following is a description of the flexible cable and the ultra-fine coaxial cable. Referring to the third A diagram, the third diagram is a schematic diagram of the circuit board 100 of the first diagram soldering the flexible cable 300. The plurality of touch pads 1201 through 1210 of the circuit board 100 can be designed to be 1.0 Pitch or 0.5 Pitch to conform to the commonly used dimensions of the flexible cable 300. The signals corresponding to the plurality of touch pads 1201 to 1210 are as shown in the above table. The SSTX and SSRX two pairs of signal lines have a grounded first signal grounding contact pad 1204 and a second signal grounding contact pad 1207, which are suitable for general outer covering aluminum foil and For the twisted pair of the ground wire, it is not necessary to weld the ground wire of the two pairs of twisted wires to one grounding contact pad, which is convenient for processing and easy to control the characteristic impedance value.

In a specific embodiment of the present invention, after the flexible cable 300 is soldered to the corresponding plurality of touch pads 1201 to 1210, the glue 310 or the molding and the conductive cloth 320 may be further applied to the flexible cable 300. And iron shell 330, conductive cloth, copper foil or aluminum foil is added to further control the characteristic impedance value. Further referring to the third B diagram, the third B diagram is a waveform diagram of the characteristic impedance value of the soldering flexible cable 300 of the circuit board 100 of the first embodiment of the present invention, and it can be clearly seen that the characteristic impedance value is relatively stable.

In an embodiment of the invention, the iron shell positioning hole 150 of the circuit board 100 is adapted to the iron shell 330 to fix the iron shell 330 to achieve electromagnetic interference (EMI). In a specific embodiment of the present invention, the conductive cloth 320 may be further attached to the iron shell 330 or the conductive cloth 320 may be applied when the flexible cable 300 is processed in the early stage to enhance the effect of preventing EMI. In a specific embodiment of the present invention, the connector positioning hole 150 of the circuit board 100 is adapted to the positioning portion 210 of the USB 3.0 connector 200 to fix the USB 3.0 connector 200. Further, the screw hole 160 of the circuit board 100 is Adapt a screw 340 to meet the requirements of the customer's organization and make adjustments flexibly. In a specific embodiment of the present invention, the steps of fabricating a USB 3.0 connector assembly are as follows: a. fabricating the circuit board 100; b, soldering the USB 3.0 connector 200 to the circuit board 100 by hand soldering or soldering furnace The plurality of pins 1101 to 1109; c, soldering the flexible cable 300 to the plurality of contact pads 1201 to 1210 of the circuit board 100 by hand soldering or hot-welding (Hot-Bar) method; d, dispensing flexible cable 300; e, according to different customer needs plus the iron shell 330 to the iron plate positioning hole 150 of the circuit board 100 (if the EMI design is better, no need to add the iron shell 330); f, according to different customer needs plus conductive cloth 320 (If the EMI design is better, the conductive cloth 320 is not needed, and the conductive cloth 320 can also be attached when the flexible cable 300 is processed in the early stage; g), the circuit board 100 is positioned by the screw 340.

Similarly, the circuit board 100 of the first figure can also solder the very thin coaxial cable 400. Referring to the fourth figure, the fourth figure is a schematic diagram of the soldering of the thin coaxial cable of the circuit board of the first figure. Compared with the foregoing circuit board 100 soldering the flexible cable 300, the recess 130 of the circuit board 100 makes the circuit board 100 more suitable for the soldering of the ultra-fine coaxial cable 400, and the recess 130 is adapted to a grounding claw 350. The grounding claw 350 has two protrusions 351 for connection to the grounded SMT pads 1204 and 1207, which further saves the use of the ground wire. In a specific embodiment of the present invention, the steps of fabricating a USB 3.0 connector assembly are as follows: a. fabricating the circuit board 100; b, soldering the USB 3.0 connector 200 to the circuit board 100 by hand soldering or soldering furnace The plurality of pins 1101 to 1109; c, the micro-coaxial cable 400 and the grounding claw 350 are soldered to the circuit board 100 by a hot-rolling method; d, the micro-coaxial cable 400 is dispensed; e, according to different customers The need to add the iron shell 330 to the iron shell positioning hole 150 of the circuit board 100 (if the EMI design is better, the iron shell 330 is not needed); f, according to different customer requirements plus the conductive cloth 320 (if the EMI design is better, The conductive cloth 320 is not needed, and the conductive cloth 320 can also be attached when the ultra-fine coaxial cable 400 is processed in the early stage; g, the circuit board 100 is positioned by the screw 340.

Accordingly, the circuit board of the present invention can meet the requirements of soldering different wires by adding a grounded SMT contact pad, that is, the same circuit board can be used to solder the wire, the flexible wire or the very thin coaxial cable, and the conventional method can be improved. The original nine SMT touch pads are designed to be difficult to control the characteristic impedance values when soldering wires.

The scope and spirit of the present invention are not limited to the foregoing embodiments. In addition, the drawings shown in the specification are for the purpose Some parts of the diagram may be magnified and others may be abbreviated. Accordingly, the disclosure and the drawings are to be considered as illustrative and not restrictive.

100. . . Circuit board

1101. . . Power pin

1102, 1103. . . USB 2.0 differential signal docking pin set

1104. . . Power grounding pin

1105, 1106. . . Ultra-high speed receiving differential signal docking pin set

1107. . . Signal grounding pin

1108, 1109. . . Ultra-high speed transmission differential signal docking pin set

1201. . . Power contact pad

1202, 1203. . . Ultra-high speed transmission differential signal to touch pad set

1204. . . First signal grounding pad

1205, 1206. . . USB 2.0 differential signal to touch pad set

1207. . . Second signal grounding pad

1208, 1209. . . Ultra-high speed receiving differential signal to touch pad set

1210. . . Power grounding pad

130. . . Groove

140. . . Iron shell positioning hole

150. . . Connector positioning hole

160. . . Screw hole

200. . . Connector

210. . . Connector positioning section

300. . . Soft cable

310. . . Dispensing

320. . . Conductive cloth

330. . . Iron shell

340. . . Screw

350. . . Grounding claw

351. . . Grounding claw protrusion

400. . . Very thin coaxial cable

The first figure is a schematic diagram of a circuit board in accordance with an embodiment of the present invention.

The second figure is a layout diagram of the circuit board of the first figure.

The third A is a schematic diagram of the circuit board soldering flexible cable of the first figure.

The third B is a waveform diagram of the characteristic impedance value of the soldered flexible cable 300 of the circuit board 100 of the first embodiment of the present invention.

The fourth figure is a schematic diagram of the circuit board soldering ultra-fine coaxial cable of the first figure.

100. . . Circuit board

1101~1109. . . Multiple pins

1201~1210. . . Multiple touch pads

130. . . Groove

140. . . Iron shell positioning hole

150. . . Connector positioning hole

160. . . Screw hole

Claims (7)

A circuit board coupled to a USB 3.0 socket connector and a cable, comprising: pads connected to a plurality of pins of the USB 3.0 socket connector, the pads being arranged in two according to a pin definition of the USB 3.0 connector Interleaved and parallel columns, one of which is the power pin pad connecting the USB 3.0 connector pins #1 to #4, the USB 2.0 differential signal pad pad group and the power ground pad pad, and the other column For connecting the USB 3.0 connector pins #5 to #9, the ultra-high speed receiving differential signal docking pad group, the signal grounding pad pad and the ultra-high speed transmission differential signal docking pad group; and a plurality of contacts a pad, the single row is disposed outside one of the two columns of solder pads, and includes a circuit that is respectively electrically connected to the plurality of pins of the USB 3.0 socket connector; wherein the USB 2.0 differential signal butt pad group is connected The ultra-high speed receiving differential signal butt pad group and the plurality of touch pads of the ultra high speed transmission differential signal docking pad group are respectively spaced apart by a signal grounding pad. The circuit board of the USB 3.0 socket connector and the cable is coupled as the wire of the first aspect of the invention, wherein the cable is a wire, a flexible cable (FFC) or a micro coaxial cable. The circuit board of the USB 3.0 socket connector and the cable, as described in claim 1 or 2, wherein the plurality of touch pads are disposed adjacent to one of the plurality of pins #5 to #9, and are connected. The contact pads of the pair of USB 2.0 differential signal docking pad pads are located at the center of the contact pad row and are sandwiched between the signal grounding pads. A method for coupling a USB 3.0 socket connector and a cable, comprising the steps of: providing a circuit board having pads for connecting a plurality of pins of the USB 3.0 socket connector; and a plurality of contact pads, wherein the pads According to the pin definition of the USB 3.0 connector, two staggered and parallel columns are arranged, one of which is a power pin pad connecting the USB 3.0 connector pins #1 to #4, and a USB 2.0 differential signal butt welding. Pad set and power grounding pad pads, and another column for connecting the USB 3.0 connector pins #5 to #9 ultra-high speed receiving differential signal butt pad group, signal grounding pad pad and ultra high speed Transmitting a differential signal butt pad set, and the plurality of touch pads are disposed on a side of one of the two rows of pads, and include a circuit that is electrically connected to a plurality of pins of the USB 3.0 socket connector, respectively. The plurality of touch pads of the USB 2.0 differential signal are connected to the pad, the ultra-high speed receiving differential signal butt pad group, and the plurality of touch pads of the ultra high speed transmission differential signal butt pad group are respectively paired The signal grounding pads are spaced apart; the USB 3.0 plug is fixed The connector on the circuit board; and a welding cable to the plurality of the contact pads of the circuit board and to be fixed. The method of claim 4, wherein the cable is a wire, a flexible cable (FFC) or a micro coaxial cable. According to the method of claim 5, a grounding claw is further provided and fixed to the micro coaxial cable. In the method of claim 4 or 5, an iron casing is further provided to cover the welded cable and to fix the iron casing to the circuit board.