TWI452655B - - Google Patents

Info

Publication number: TWI452655B
Authority: TW; Taiwan

Application number

TW098142243A

Other languages

Other versions

TW201121004A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-12-10

Filing date

2009-12-10

Publication date

2014-09-11

2009-12-10 Application filed filed Critical

2009-12-10 Priority to TW098142243A priority Critical patent/TW201121004A/en

2011-06-16 Publication of TW201121004A publication Critical patent/TW201121004A/en

2014-09-11 Application granted granted Critical

2014-09-11 Publication of TWI452655B publication Critical patent/TWI452655B/zh

Classifications

- H10W72/5449—

TW098142243A 2009-12-10 2009-12-10 Semiconductor chipsets. TW201121004A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW098142243A TW201121004A (en)	2009-12-10	2009-12-10	Semiconductor chipsets.

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW098142243A TW201121004A (en)	2009-12-10	2009-12-10	Semiconductor chipsets.

Publications (2)

Publication Number	Publication Date
TW201121004A TW201121004A (en)	2011-06-16
TWI452655B true TWI452655B (en)	2014-09-11

Family

ID=45045393

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW098142243A TW201121004A (en)	2009-12-10	2009-12-10	Semiconductor chipsets.

Country Status (1)

Country	Link
TW (1)	TW201121004A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN116130456A (en) *	2022-09-14	2023-05-16	珠海越亚半导体股份有限公司	Chip high-density interconnection packaging structure and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20070107930A1 (en) *	2005-11-15	2007-05-17	Sharp Kabushiki Kaisha	Printed circuit board and method for manufacturing the same
US20080099237A1 (en) *	2006-10-27	2008-05-01	Nitto Denko Corporation	Printed circuit board and electronic component device
TWM369636U (en) *	2009-06-11	2009-11-21	Boardtek Electronics Corp	Heat-dissipating structure of the circuit board

2009
- 2009-12-10 TW TW098142243A patent/TW201121004A/en not_active IP Right Cessation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20070107930A1 (en) *	2005-11-15	2007-05-17	Sharp Kabushiki Kaisha	Printed circuit board and method for manufacturing the same
US20080099237A1 (en) *	2006-10-27	2008-05-01	Nitto Denko Corporation	Printed circuit board and electronic component device
TWM369636U (en) *	2009-06-11	2009-11-21	Boardtek Electronics Corp	Heat-dissipating structure of the circuit board

Also Published As

Publication number	Publication date
TW201121004A (en)	2011-06-16

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Legal Events

Date	Code	Title	Description
2018-06-11	MM4A	Annulment or lapse of patent due to non-payment of fees