TWI452574B - Nand flash memory device and method for speeding up erasing verification procedure - Google Patents
Nand flash memory device and method for speeding up erasing verification procedure Download PDFInfo
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Description
本發明係關於一種NAND快閃記憶體裝置及操作方法,更特別的是關於一種可加速抹除驗證程序的NAND快閃記憶體裝置及方法。The present invention relates to a NAND flash memory device and method of operation, and more particularly to a NAND flash memory device and method that can speed up an erase verification process.
在快閃記憶體裝置中,驗證操作係必要的,以確認電荷係藉由程式化操作而適當地射入至記憶體胞元中。如果驗證操作發生失敗,則會重複地進行程式化操作及驗證操作,直到驗證操作之結果成功或滿足特殊條件(例如:重複100次仍失敗時)為止。In a flash memory device, a verification operation is necessary to confirm that the charge is properly injected into the memory cell by a stylization operation. If the verification operation fails, the stylization and verification operations are repeated until the result of the verification operation is successful or a special condition is met (for example, if it is repeated 100 times).
在抹除操作中,驗證操作係類似地進行以確認從記憶體單元適當地移除電荷。抹除驗證通常藉由施加0V電壓至記憶胞元中,若記憶胞元的操作正常,後端連接之頁緩衝器即會收到0V電壓並輸出驗證通過之訊號。In the erase operation, the verify operation is similarly performed to confirm that the charge is properly removed from the memory cell. The erase verification is usually performed by applying a voltage of 0 V to the memory cell. If the operation of the memory cell is normal, the page buffer of the back-end connection receives a voltage of 0 V and outputs a signal for verification.
然而,一旦記憶體單元中因製程上的缺陷或其他失敗造成位元線毀損斷連時,雖然位元線已毀損的記憶單元會被冗餘(redundancy)記憶單元取代,但抹除驗證指令ERV卻仍是會對毀損的記憶體單元進行驗證程序,並經過一定時間的重複驗證皆失敗後才會停止驗證程序,因而導致了過長的抹除驗證時間。However, once the bit line is broken due to defects in the process or other failures in the memory cell, although the memory cell whose bit line has been damaged is replaced by a redundant memory cell, the erase command ERV is erased. However, the verification process of the damaged memory unit is still performed, and the verification process is stopped after repeated verification of a certain period of time, thereby causing an excessive erasure verification time.
本發明之一目的在於減少抹除驗證時間。One of the objects of the present invention is to reduce the erase verification time.
為達上述目的及其他目的,本發明提出一種可加速抹除驗證程序的NAND快閃記憶體裝置,其包含一頁緩衝器及內含複數條位元線的一記憶胞陣列,該等位元線係接收一抹除驗證指令,其特徵在於更包含:一抹除驗證修正單元,係連接於該等位元線與該頁緩衝器之間,該抹除驗證修正單元係具有對應地連接該等位元線的複數接地開關,該等接地開關被設定為於接收該抹除驗證指令時始使該等位元線中已毀損之位元線連接至接地電壓。To achieve the above and other objects, the present invention provides a NAND flash memory device capable of speeding up an erase verification process, comprising a page buffer and a memory cell array including a plurality of bit lines, the bit elements The line system receives a erase verification command, and further includes: a erase verification correction unit connected between the bit line and the page buffer, the erase verification correction unit having correspondingly connecting the bits A plurality of grounding switches of the line, the grounding switches being configured to cause the damaged bit lines in the bit lines to be connected to the ground voltage upon receiving the erase verifying command.
為達上述目的及其他目的,本發明復提出一種加速NAND快閃記憶體裝置之抹除驗證程序的方法,該NAND快閃記憶體裝置包含一頁緩衝器及內含複數條位元線的一記憶胞陣列,該方法包含:取得該記憶胞陣列中已毀損之位元線的位址;將一抹除驗證修正單元連接於該等位元線與該頁緩衝器之間,並使該抹除驗證修正單元中之複數接地開關對應地連接該等位元線;及根據該位址,設定該等接地開關,以於該抹除驗證修正單元接收到一抹除驗證指令時,使連接至已毀損之位元線的接地開關連接至接地電壓。To achieve the above and other objects, the present invention provides a method for accelerating an erase verification program for a NAND flash memory device, the NAND flash memory device including a page buffer and a plurality of bit lines a memory cell array, the method comprising: obtaining an address of a damaged bit line in the memory cell array; connecting an erase verifying correction unit between the bit line and the page buffer, and erasing the bit line Verifying that the plurality of grounding switches in the correction unit are correspondingly connected to the bit line; and setting the grounding switches according to the address, so that when the erasing verification correction unit receives a wiping verification instruction, the connection is broken The grounding switch of the bit line is connected to the ground voltage.
於一實施例中,該等接地開關被設定為於接收該抹除驗證指令時,其餘未毀損之位元線亦連接至該接地電壓。In one embodiment, the grounding switches are set to receive the erase verify command, and the remaining uncorrupted bit lines are also connected to the ground voltage.
於一實施例中,於該抹除驗證修正單元接收到該抹除驗證指令時,係使連接至其餘位元線的接地開關亦連接至接地電壓。In an embodiment, when the erase verifying unit receives the erase verify command, the ground switch connected to the remaining bit lines is also connected to the ground voltage.
藉此,本發明藉由對已毀損位元線的特別線路安排,使得於抹除驗證程序進行時,抹除驗證修正單元即可同時輸出一預定電壓訊號至頁緩衝器中,使得該頁緩衝器會認為該已毀損位元線已通過抹除驗證,進而大幅節省了習知技術下所耗用的重複驗證時間。Thereby, the present invention arranges the special line of the damaged bit line so that when the erase verification process is performed, the erase verification unit can simultaneously output a predetermined voltage signal to the page buffer, so that the page buffer The device will consider that the damaged bit line has been verified by erasure, which greatly saves the repeated verification time consumed by the prior art.
為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.
首先請參閱第1圖,係本發明實施例中之NAND快閃記憶體裝置於抹除驗證狀態時的電路方塊圖。第1圖之記憶體陣列100係以三個NAND串為示例,於此示例中,每一NAND串400包括一串選擇電晶體ST1、一地選擇電晶體ST2、及三個記憶體胞元MC。First, please refer to FIG. 1 , which is a circuit block diagram of the NAND flash memory device in the embodiment of the present invention in the erase verify state. The memory array 100 of FIG. 1 is exemplified by three NAND strings. In this example, each NAND string 400 includes a string of selection transistors ST1, a selection transistor ST2, and three memory cells MC. .
該記憶胞陣列100包含串接於一位元線(BL0、BL1或BL2)及一地選擇線GSL(ground select line)之間的複數個記憶胞元MC。其中,與位元線(BL0、BL1或BL2)、串選擇電晶體ST1及地選擇電晶體ST2相串接之記憶胞元MC係被稱為一NAND串400。該串選擇電晶體ST1及該地選擇電晶體ST2係用以選定用來進行操作之記憶胞元MC,而串選擇電晶體ST1之導通(turn on)或關閉(turn off)則由一串選擇線SSL(string select line)之狀態所決定。該串選擇電晶體ST1被選擇性地切換以耦合相關的記憶胞元串及位元線。該地選擇電晶體ST2則被選擇性地切換來控制每一NAND串400與一共源線(common source line,圖未示)之間的電連接。於第1圖中,該共源線係為接地,以響應NAND串的抹除狀態,因此,於抹除狀態下,每一串NAND串400應連接至接地電壓。The memory cell array 100 includes a plurality of memory cells MC connected in series between a bit line (BL0, BL1 or BL2) and a ground select line (GSL). The memory cell MC in series with the bit line (BL0, BL1 or BL2), the string selection transistor ST1 and the ground selection transistor ST2 is referred to as a NAND string 400. The string selection transistor ST1 and the ground selection transistor ST2 are used to select a memory cell MC for operation, and the turn-on or turn-off of the string selection transistor ST1 is selected by a string. The state of the line SSL (string select line) is determined. The string selection transistor ST1 is selectively switched to couple the associated memory cell strings and bit lines. The ground selection transistor ST2 is selectively switched to control the electrical connection between each NAND string 400 and a common source line (not shown). In Figure 1, the common source line is grounded in response to the erased state of the NAND string, and therefore, in the erased state, each string of NAND strings 400 should be connected to a ground voltage.
如第1圖所示,一條位元線與一NAND串400係組成記憶體單元陣列100的一行(column)。字元線(WL0、WL1、及WL2)則為該記憶體陣列100之列(row)。每一字元線係連接每一列中之每一記憶體胞元MC之控制閘極。As shown in FIG. 1, one bit line and one NAND string 400 constitute a column of the memory cell array 100. The word lines (WL0, WL1, and WL2) are the rows of the memory array 100. Each word line connects the control gate of each memory cell MC in each column.
,當記憶體陣列100中之NAND串400所連接的位元線毀損時,如第1圖所示之毀損區域BA,抹除指令雖使每一串NAND串400連接至接地電壓,然而,位元線毀損之NAND串將無法傳遞後續之抹除驗證時所該傳遞的接地電壓訊號至該頁緩衝器200中。如此,於習知技術下,頁緩衝器200將無法送出ERV的通過(pass)訊號(即該緩衝器200已收到NAND串的接地電壓訊號),驗證程序即會在毀損的位元線上反複地進行驗證。When the bit line connected to the NAND string 400 in the memory array 100 is damaged, as in the damaged area BA shown in FIG. 1, the erase command causes each string of the NAND string 400 to be connected to the ground voltage, however, The NAND string corrupted by the line will not be able to pass the ground voltage signal that was passed during the subsequent erase verification to the page buffer 200. Thus, under the prior art, the page buffer 200 will not be able to send the pass signal of the ERV (ie, the buffer 200 has received the ground voltage signal of the NAND string), and the verification program will repeat on the damaged bit line. Verify the ground.
基於此,本發明於實施例中係更增加一抹除驗證修正單元300,其係為一硬體區塊,內包含有複數接地開關GSW,該等接地開關係作用如一邏輯閘。由於每一記憶體陣列在製作完成時皆會進行記憶體胞元的功能測試,並於記憶體胞元發生錯誤或毀損時以冗餘記憶胞元取代,毀損的記憶體胞元的位址因而可被輕易取得。Based on this, in the embodiment, an erase verification correction unit 300 is further added, which is a hardware block, and includes a plurality of grounding switches GSW, and the grounding relationship acts as a logic gate. Since each memory array is tested for the function of the memory cell at the completion of the production, and replaced by redundant memory cells when the memory cell is erroneous or damaged, the address of the damaged memory cell is thus Can be easily obtained.
因此,本實施例即以製作完成時所取得之錯誤或毀損的記憶體胞元的位址為基礎,進行抹除驗證的修正。該抹除驗證修正單元300係連接於該等位元線(BL0、BL1、BL2)與該頁緩衝器200之間,且每一位元線係對應地連接一接地開關GSW。該等接地開關GSW係以錯誤或毀損的記憶體胞元位址為基礎被設定為於接收該抹除驗證指令ERV時,才會使已毀損之位元線對應的接地開關GSW連接至接地電壓。進而使得該頁緩衝器200會認為該已毀損之位元線已通過抹除驗證,進而可大幅減少習知技術下所耗用的重複驗證時間。Therefore, in this embodiment, the correction of the erasure verification is performed based on the error or the address of the memory cell obtained at the time of completion of the production. The erase verification correction unit 300 is connected between the bit lines (BL0, BL1, BL2) and the page buffer 200, and each bit line is correspondingly connected to a ground switch GSW. The grounding switch GSW is configured to connect the grounding switch GSW corresponding to the damaged bit line to the ground voltage based on the wrong or damaged memory cell address to receive the erase verifying command ERV. . In turn, the page buffer 200 will consider that the damaged bit line has been verified by erasing, thereby greatly reducing the repetitive verification time consumed by the prior art.
其餘正常的位元線因為可自行傳遞NAND串於抹除狀態下所具有的接地電壓,因此可不用對連接至正常位元線的接地開關GSW進行特殊的修正設定。然而,而一實施例中,亦可將連接至正常位元線的接地開關GSW,設定為於接收該抹除驗證指令ERV時,使對應的接地開關GSW連接至接地電壓。The remaining normal bit lines can pass the grounding voltage of the NAND string in the erase state by itself, so that the grounding switch GSW connected to the normal bit line can be not specially modified. However, in an embodiment, the grounding switch GSW connected to the normal bit line may be set to connect the corresponding grounding switch GSW to the ground voltage when receiving the erasing verification command ERV.
前述之該抹除驗證修正單元300及該等接地開關GSW的功能係可藉由各種邏輯閘或其他等效元件輕易達成前述之功能動作,其係所屬技術領域中具通常知識者所能輕易完成,故於此不在贅述抹除驗證修正單元300中的各邏輯運算元件之配置。The foregoing function of the erase verification correction unit 300 and the grounding switches GSW can easily achieve the foregoing functional actions by various logic gates or other equivalent components, which can be easily accomplished by those skilled in the art. Therefore, the configuration of each logical operation element in the erase verification unit 300 will not be described here.
接著請參閱第2圖,係本發明實施例中加速NAND快閃記憶體裝置之抹除驗證程序的方法流程圖。Next, please refer to FIG. 2, which is a flowchart of a method for accelerating the erase verification program of the NAND flash memory device in the embodiment of the present invention.
NAND快閃記憶體裝置包含一頁緩衝器及內含複數條位元線的一記憶胞陣列,加速抹除驗證程序的方法包含:(S1)取得該記憶胞陣列中已毀損之位元線的位址;(S2)將一抹除驗證修正單元連接於該等位元線與該頁緩衝器之間,並使該抹除驗證修正單元中之複數接地開關對應地連接該等位元線;(S3)根據該位址,設定該等接地開關,以於該抹除驗證修正單元接收到一抹除驗證指令時,使連接至已毀損之位元線的接地開關連接至接地電壓。The NAND flash memory device includes a page buffer and a memory cell array including a plurality of bit lines. The method for accelerating the erase verifying process includes: (S1) obtaining the damaged bit line in the memory cell array. Address (S2) connecting a erase verification correction unit between the bit line and the page buffer, and causing the plurality of ground switches in the erase verification correction unit to be correspondingly connected to the bit line; S3) According to the address, the grounding switches are set to connect the grounding switch connected to the damaged bit line to the grounding voltage when the erasing verification correction unit receives a erasing verification command.
本發明實施例係以一條毀損之位元線為示例,實際實施時可根據記憶體陣列之位元線毀損情況選用不同驅動能力之抹除驗證修正單元,舉例來說:當記憶體陣列具有對應50串NAND之50條毀損的位元線時,抹除驗證修正單元必須串接於50條位元線與至少一頁緩衝器之間,且該抹除驗證修正單元亦必須有能力分別提供50組預設電壓訊號至該至少一頁緩衝器中。In the embodiment of the present invention, a damaged bit line is taken as an example. In actual implementation, an erase verifying correction unit with different driving capabilities may be selected according to the bit line damage condition of the memory array. For example, when the memory array has a corresponding In the case of 50 corrupted bit lines of 50 strings of NAND, the erase verification correction unit must be serially connected between 50 bit lines and at least one page buffer, and the erase verification correction unit must also have the capability to provide 50 respectively. The group presets the voltage signal into the at least one page buffer.
綜上所述,本發明藉由對已毀損位元線的特別線路安排,使得於抹除驗證程序進行時,抹除驗證修正單元即可同時輸出一預定電壓訊號至頁緩衝器中,使得該頁緩衝器會認為該已毀損位元線已通過抹除驗證,進而大幅節省了習知技術下所耗用的重複驗證時間。In summary, the present invention provides a special circuit arrangement for the damaged bit line, so that when the erase verification process is performed, the erase verification unit can simultaneously output a predetermined voltage signal to the page buffer, so that the The page buffer will consider that the corrupted bit line has been verified by erasure, which greatly saves the repetitive verification time consumed by the prior art.
本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.
100...記憶體陣列100. . . Memory array
200...頁緩衝器200. . . Page buffer
300...抹除驗證修正單元300. . . Erase verification correction unit
400...NAND串400. . . NAND string
BA...毀損區域BA. . . Damaged area
BL0~2...位元線BL0~2. . . Bit line
ERV...抹除驗證指令ERV. . . Erase verification instruction
MC...記憶體胞元MC. . . Memory cell
SSL...串選擇線SSL. . . String selection line
GSL...地選擇線GSL. . . Ground selection line
GSW...接地開關GSW. . . Grounding switch
ST1...串選擇電晶體ST1. . . String selection transistor
ST2...地選擇電晶體ST2. . . Ground crystal
S1~S3...步驟S1~S3. . . step
WL0~3...字元線WL0~3. . . Word line
第1圖為本發明實施例中之NAND快閃記憶體裝置的電路方塊圖。FIG. 1 is a circuit block diagram of a NAND flash memory device in an embodiment of the present invention.
第2圖為本發明實施例中加速NAND快閃記憶體裝置之抹除驗證程序的方法流程圖。2 is a flow chart of a method for accelerating an erase verification program of a NAND flash memory device in an embodiment of the present invention.
100...記憶體陣列100. . . Memory array
200...頁緩衝器200. . . Page buffer
300...抹除驗證修正單元300. . . Erase verification correction unit
400...NAND串400. . . NAND string
BA...毀損區域BA. . . Damaged area
BL0~2...位元線BL0~2. . . Bit line
ERV...抹除驗證指令ERV. . . Erase verification instruction
MC...記憶體胞元MC. . . Memory cell
SSL...串選擇線SSL. . . String selection line
GSL...地選擇線GSL. . . Ground selection line
GSW...接地開關GSW. . . Grounding switch
ST1...串選擇電晶體ST1. . . String selection transistor
ST2...地選擇電晶體ST2. . . Ground crystal
WL0~2...字元線WL0~2. . . Word line
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| TW (1) | TWI452574B (en) |
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| US20030035322A1 (en) * | 2001-08-09 | 2003-02-20 | Multi Level Memory Technology, Inc. | Flash memory array partitioning architectures |
| US20030133340A1 (en) * | 2002-01-12 | 2003-07-17 | June Lee | NAND flash memory and method of erasing, programming, and copy-back programming thereof |
| US20060072362A1 (en) * | 2004-10-04 | 2006-04-06 | Hynix Semiconductor Inc. | Memory device and test method thereof |
| US20060092736A1 (en) * | 2004-10-29 | 2006-05-04 | Markus Rohleder | Integrated semiconductor memory device including sense amplifiers |
| US20060239070A1 (en) * | 2004-03-15 | 2006-10-26 | Applied Intellectual Property Co., Ltd. | High density memory array system |
| US20080174297A1 (en) * | 2007-01-23 | 2008-07-24 | Hynix Semiconductor Inc. | Circuit and method of testing a fail in a memory device |
| US20100290288A1 (en) * | 2009-05-13 | 2010-11-18 | Tai Kyu Kang | Nonvolatile memory device and method of testing the same |
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- 2011-10-04 TW TW100135961A patent/TWI452574B/en active
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| US20030035322A1 (en) * | 2001-08-09 | 2003-02-20 | Multi Level Memory Technology, Inc. | Flash memory array partitioning architectures |
| US20030133340A1 (en) * | 2002-01-12 | 2003-07-17 | June Lee | NAND flash memory and method of erasing, programming, and copy-back programming thereof |
| US20060239070A1 (en) * | 2004-03-15 | 2006-10-26 | Applied Intellectual Property Co., Ltd. | High density memory array system |
| US20060072362A1 (en) * | 2004-10-04 | 2006-04-06 | Hynix Semiconductor Inc. | Memory device and test method thereof |
| US7136314B2 (en) * | 2004-10-04 | 2006-11-14 | Hynix Semiconductor Inc. | Memory device and test method thereof |
| US20060092736A1 (en) * | 2004-10-29 | 2006-05-04 | Markus Rohleder | Integrated semiconductor memory device including sense amplifiers |
| US20080174297A1 (en) * | 2007-01-23 | 2008-07-24 | Hynix Semiconductor Inc. | Circuit and method of testing a fail in a memory device |
| US20100290288A1 (en) * | 2009-05-13 | 2010-11-18 | Tai Kyu Kang | Nonvolatile memory device and method of testing the same |
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| TW201316339A (en) | 2013-04-16 |
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