TWI448221B - Rigid-flexible printed circuit board and method for manufacturing same - Google Patents

Description

Soft and hard combined circuit board and manufacturing method thereof

The present invention relates to the field of circuit board manufacturing, and in particular, to a soft and hard combined circuit board and a manufacturing method thereof.

Printed circuit boards have been widely used due to their high assembly density. For application of the board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans On Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425.

The hard and soft bonding circuit board is a circuit board structure including a flexible circuit board and a rigid circuit board which are connected to each other, and can have both the flexibility of the flexible circuit board and the hardness of the rigid circuit board. In the manufacturing process of the soft and hard circuit board, the material of the hard circuit board is sequentially layered and added on the flexible circuit board, and the flexible circuit board part and the hard circuit board part are connected by the through hole/buried hole/blind hole. Turn on. However, the method of sequentially adding layers is to add a layer of a rigid circuit board after the flexible circuit board is completed, which takes a long time, and the soft and hard combined circuit board is inefficient.

Therefore, it is necessary to provide a method for fabricating a hard and soft combined circuit board with high manufacturing efficiency and a soft and hard bonded circuit board fabricated by the method.

A method for fabricating a hard and soft combined circuit board, comprising the steps of: providing a flexible circuit board comprising a first substrate layer and a first conductive line pattern disposed on a surface of the first substrate layer, the flexible circuit board comprising a first product a first product area having a connected exposed area and a first pressing area; providing a rigid circuit board, the rigid circuit board comprising a second substrate layer and a fourth conductive line pattern disposed on a surface of the second substrate layer, The rigid circuit board includes a second product area corresponding to the first product area, the second product area has an adjacent second pressing area and a first opening, the first opening corresponding to the exposed area; Attaching a first film having a third opening corresponding to the exposed area on the rigid circuit board to cover the surface of the fourth conductive line pattern and the surface of the rigid circuit board exposed from the fourth conductive line pattern, and exposing a portion a fourth conductive line pattern to form a plurality of fourth connection terminals; a conductive paste is printed on the surface of the plurality of fourth connection terminals, and each of the fourth connection terminals and the conductive paste printed on the surface thereof form a a first connecting protrusion; and aligning and pressing the rigid circuit board and the flexible circuit board, so that the first nip area and the second nip area are bonded to each other through the first film, and the exposed area is opened by the first opening The three openings are exposed and each of the first connection bumps is electrically connected to the first conductive line pattern.

A method for fabricating a soft-hard combination circuit board, comprising the steps of: providing a flexible circuit board, the flexible circuit board comprising a first substrate layer, a first conductive line pattern and a second conductive line pattern, the first substrate layer having a first first a surface and a second surface, the first conductive line pattern and the second conductive line pattern are respectively disposed on the first surface and the second surface, the flexible circuit board includes a first product area, and the first product area has a connected exposed area And a first bonding region; providing a first rigid circuit board, the first rigid circuit board comprising a second substrate layer and a fourth conductive circuit pattern disposed on the surface of the second substrate layer, the first rigid circuit board including the first a second product area corresponding to the product area, the second product area has an adjacent second pressing area and a first opening, the first opening corresponding to the exposed area; providing a second rigid circuit board, the first The second rigid circuit board includes a third base layer and a sixth conductive line pattern disposed on a surface of the second base layer, the second rigid circuit board includes a third product area corresponding to the first product area, the first The product area has an adjacent third pressing area and a second opening corresponding to the exposed area; and attaching a first opening having a third opening corresponding to the exposed area on the first rigid circuit board a film covering the surface of the fourth conductive line pattern and the surface of the first rigid circuit board exposed from the fourth conductive line pattern, and exposing a portion of the fourth conductive line pattern to form a plurality of fourth connection terminals, in the second Attaching a second film having a fourth opening corresponding to the exposed area on the rigid circuit board to cover the surface of the sixth conductive line pattern and the surface of the second rigid circuit board exposed from the sixth conductive line pattern, and exposing a portion of the sixth conductive line pattern to form a plurality of sixth connection terminals; a conductive paste is printed on the surface of the plurality of fourth connection terminals and the plurality of sixth connection terminals, and each of the fourth connection terminals and the conductive paste printed on the surface thereof form a first a connecting protrusion, each of the sixth connecting terminals and the conductive paste printed on the surface thereof constitute a second connecting protrusion; and aligning and pressing the first rigid circuit board, and being flexible a road board and a second rigid circuit board, so that the first nip area and the second nip area are bonded to each other through the first film, and the first nip area and the third nip area are bonded to each other through the second film, and the exposed area is One side is exposed by the first opening and the third opening, and the opposite side of the exposed area is exposed by the second opening and the fourth opening, and each of the first connecting protrusions is connected to the first conductive line The pattern is electrically connected, and each of the second connection protrusions is electrically connected to the second conductive line pattern.

A flexible combination circuit board includes a flexible circuit board, a first rigid circuit board and a first film. The flexible circuit board includes a first base layer and a first conductive line pattern disposed on a surface of the first base layer, the flexible circuit board including a first nip and an exposed area, the first of the first nip The conductive line pattern has a plurality of first connection terminals. The first rigid circuit board has a first opening corresponding to the exposed area, the first rigid circuit board includes a second base layer and a fourth conductive line pattern disposed on a surface of the second base layer, the fourth conductive line pattern having And a plurality of fourth connection terminals corresponding to the plurality of first connection terminals, each of the fourth connection terminal surfaces is printed with a conductive paste, and each of the fourth connection terminals and the conductive paste on the surface thereof constitute a first connection protrusion. The first film has a third opening corresponding to the exposed area, the first film is bonded to the first conductive line pattern of the first nip and the fourth conductive line pattern, the exposed area is from the first opening and the third The opening is exposed, the first film has a plurality of fifth through holes corresponding to the plurality of first connecting terminals, and each of the first connecting protrusions is electrically connected to a corresponding first connecting terminal through a corresponding fifth through hole. .

In the manufacturing method of the soft and hard combined circuit board of the embodiment, the flexible circuit board and the rigid circuit board can be simultaneously fabricated, and then pressed together to form a soft and hard combined circuit board, which takes a short time, and the manufacturing efficiency of the soft and hard combined circuit board is effective. improve.

Referring to FIG. 1 , a first embodiment of the present invention provides a method for fabricating a soft and hard combined circuit board, including the following steps:

In the first step, referring to Figures 1 and 2, a flexible circuit board 110 is provided.

The flexible circuit board 110 is a circuit board on which conductive lines are formed. In this embodiment, the flexible circuit board 110 is a double-sided circuit board. The flexible circuit board 110 includes a first base layer 111, a first conductive trace pattern 112, a second conductive trace pattern 113, a first cover film 116, and a second cover film 117. The first base layer 111 is a flexible resin layer such as Polyimide (PI), Polyethylene Terephthalate (PET) or Polythylene Naphthalate (Polythylene Naphthalate). PEN). The first base layer 111 includes an opposite first surface 1111 and a second surface 1112. The first conductive trace pattern 112 is formed on the first surface 1111 of the first base layer 111, and the second conductive trace pattern 113 is formed on the first base layer. The second surface 1112 of the 111. The first conductive line pattern 112 and the second conductive line pattern 113 may be formed by selective etching of a copper layer.

It can be understood that the flexible circuit board 110 can also be a single panel. Of course, the flexible circuit board 110 can also be a multi-layer board with more than two layers of conductive lines, that is, the first base layer 111 can be a multi-layer substrate, including a plurality of layers of resin layers and a plurality of layers of conductive lines.

The flexible circuit board 110 includes a first product zone 119 and a first waste zone 118 that is coupled around the first product zone 119. The first product zone 119 has an exposed area 114 and a first nip 115 connected to opposite sides of the exposed area 114. The first waste area 118 is formed at the periphery of the exposed area 114 and the first nip 115. The first waste area 118 is used to protect the exposed area 114 and the first nip 115 during the fabrication of the hard and hard bonded circuit board, and is removed after the hard and soft bonded circuit board is completed. The exposed area 114 is used to form a bending zone of the hard and soft bonding circuit board, and the first pressing area 115 is used for fixed connection with the rigid circuit board. A first conductive trace pattern 112 and a second conductive trace pattern 113 are distributed in both the exposed region 114 and the first nip 115.

Each of the first conductive trace patterns 112 in each of the first nip regions 115 has a plurality of lines and a plurality of first connection terminals 1122. In this embodiment, the number of the first connection terminals 1122 in each of the first nips 115 is three. The second conductive line pattern 113 in each of the first nips 115 has a plurality of lines and a plurality of second connection terminals 1132. In this embodiment, the second connection terminals 1132 in each of the first nips 115 are The number is three. The first connection terminal 1122 and the second connection terminal 1132 are respectively used for electrically conducting with a circuit layer of a rigid circuit board, and the first connection terminal 1122 and the second connection terminal 1132 are generally pads.

FIG. 1 only schematically depicts the line pattern in the first nip 115, and the line pattern in the exposed area 114 is not depicted. Those skilled in the art will appreciate that the line pattern in the first nip 115 may have other The design of the circuit pattern in the exposed area 114 can be designed according to actual needs, and generally includes a plurality of lines.

The first cover film 116 covers the surface of the first conductive line pattern 112 and the first surface 1111 of the first substrate layer 111 exposed from the first conductive line pattern 112, completely covering the first surface exposed from the first conductive line pattern 112. 1111, and partially covering the first conductive line pattern 112, exposing the first connection terminal 1122 of the first conductive line pattern 112. That is, the first cover film 116 is formed with a plurality of first through holes 1161 corresponding to the plurality of first connection terminals 1122, and each of the first connection terminals 1122 is exposed from a corresponding first through hole 1161. In this embodiment, the first cover film 116 completely covers one side of the exposed region 114 and partially covers the same side of each of the first nip regions 115. The second cover film 117 covers the surface of the second conductive trace pattern 113 and the second surface 1112 of the first base layer 111 exposed from the second conductive trace pattern 113, completely covering the second surface exposed from the second conductive trace pattern 113 1112, and partially covering the second conductive line pattern 113, exposing the second connection terminal 1132 of the second conductive line pattern 113. That is, the second cover film 117 is formed with a plurality of second through holes 1171 corresponding to the plurality of second connection terminals 1132, and each of the second connection terminals 1132 is exposed from a corresponding second through hole 1171. In this embodiment, the second cover film 117 completely covers the other side of the exposed region 114 with respect to the first cover film 116 and partially covers the same side of each of the first nip regions 115. Generally, the first and second cover films 116 and 117 are solder resist layers, which may be formed by a method of screen printing solder resist ink or a method of directly bonding a solder resist film.

In the second step, referring to FIG. 3 to FIG. 5 together, the first rigid circuit board 120 and the second rigid circuit board 130 are provided. The first rigid circuit board 120 includes a second product area 129 and a second waste area 127 connected around the second product area 129. The second product area 129 has a first opening 128 corresponding to the exposed area 114 and is located at the first Two second nips 126 respectively on the two sides of the opening 128 corresponding to the two first nips 115 are formed on the periphery of the first opening 128 and the second nip 126. The second rigid circuit board 130 includes a third product area 139 and a third waste area 137 connected around the third product area 139. The third product area 139 has a second opening 138 corresponding to the exposed area 114 and is located at the second Two third nips 136 respectively on the two sides of the opening 138 corresponding to the two first nips 115 are formed on the periphery of the second opening 138 and the third nip 136. The second waste area 127 and the third waste area 137 have the same contour shape and size as the first waste area 118, and are used for connecting and protecting the product area during the hard and soft circuit board manufacturing process, and are fabricated on the soft and hard circuit board. It is removed after completion. The shape and size of the first opening 128 and the second opening 138 are the same as the shape and size of the exposed area 114.

The first rigid circuit board 120 includes a second base layer 121, a third conductive line pattern 122, a fourth conductive line pattern 123, and a third cover film 124. The second base layer 121 is a hard resin layer such as an epoxy resin, a fiberglass cloth, or the like. The second substrate layer 121 includes an opposite third surface 1211 and a fourth surface 1212. The third conductive trace pattern 122 is formed on the third surface 1211. The fourth conductive trace pattern 123 is formed on the fourth surface 1212. The third conductive line pattern 122 and the fourth conductive line pattern 123 may be formed by selective etching of a copper layer. The third conductive line pattern 122 and the fourth conductive line pattern 123 are electrically connected to each other through the plurality of first via holes 125. The third conductive line pattern 122 has a plurality of lines and a plurality of third connection terminals 1222. In this embodiment, the third connection terminal 1222 is located at one end opening of the first via hole 125, and the third connection terminal 1222 and the The first via holes 125 are in one-to-one correspondence. It can be understood that the first via hole 125 can also be connected to other portions of the third conductive line pattern 122 without being connected to the third connection terminal 1222. The fourth conductive line pattern 123 has a fourth connection terminal 1232. In this embodiment, the fourth connection terminal 1232 is located at the other end opening of the first via hole 125, and the number and position of the fourth connection terminal 1232 are the same. A number and a position of a connection terminal 1122 respectively correspond to the first connection terminal 1122 for electrical connection. The third conductive line pattern 122 and the fourth conductive line pattern 123 in FIG. 3 only schematically depict the third connection terminal 1222 and the fourth connection terminal 1232. As will be understood by those skilled in the art, the third conductive line pattern 122 and The fourth conductive line pattern 123 may have other designs and is not limited to the structure shown in FIG.

The first via hole 125 may be formed before selectively etching the copper layer to form the third conductive line pattern 122 and the fourth conductive line pattern 123. The first via hole 125 may be formed by using a mechanical drilling process. Forming a through hole penetrating through the copper layer for forming the third conductive line pattern 122, the second substrate layer 121, and the copper layer for forming the fourth conductive line pattern 123; depositing a conductive material on the sidewall of the via hole by electroplating; The via hole is filled with the plug hole material; and the conductive material is deposited again on the surface of the plug hole material, thereby forming the first via hole 125. Of course, as shown in FIG. 12, the first via hole 125 can also be replaced with a first blind via hole 125a. The first blind via hole 125a can be formed by using a laser drilling process to form only the through hole for forming the The copper layer of the fourth conductive line pattern 123 and the second base layer 121 do not penetrate the blind holes of the copper layer for forming the third conductive line pattern 122; the conductive material is deposited on the wall of the blind via hole by electroplating, thereby forming the first A blind via 125a. As shown in FIG. 13, the first blind via hole 125a may further fill the plug hole material in the first blind via hole 125a, and deposit a conductive material on the surface of the plug hole material to form a first blind via hole 125b having a hole filling material.

The third cover film 124 covers the surface of the third conductive line pattern 122 and the third surface 1211 of the second base layer 121 exposed from the third conductive line pattern 122, partially covering the third conductive line pattern 122, exposing the third The third connection terminal 1222 of the conductive line pattern 122. That is, the third cover film 124 is formed with a plurality of third through holes 1241 corresponding to the region of the plurality of third connection terminals 1222 , and each of the third connection terminals 1222 is exposed from a corresponding third through hole 1241 . In this embodiment, the third cover film 124 does not cover the first opening 128 of the first rigid circuit board 120 and partially covers the same side of the first rigid circuit board 120. Generally, the third cover film 124 is a solder resist layer, which is formed after the first via hole 125, the third conductive line pattern 122, and the fourth conductive line pattern 123 are completed. The third cover film 124 can be screen-printed. A method of printing a solder resist ink or a method of directly bonding a solder mask.

The second rigid circuit board 130 includes a third base layer 131, a fifth conductive line pattern 132, a sixth conductive line pattern 133, and a fourth cover film 134. The third base layer 131 is a hard resin layer such as an epoxy resin, a fiberglass cloth, or the like. The third substrate layer 131 includes an opposite fifth surface 1311 and a sixth surface 1312. The fifth conductive trace pattern 132 is formed on the fifth surface 1311. The sixth conductive trace pattern 133 is formed on the sixth surface 1312. The fifth conductive line pattern 132 and the sixth conductive line pattern 133 may be formed by selective etching of the copper layer. The fifth conductive line pattern 132 and the sixth conductive line pattern 133 are electrically connected to each other through a plurality of second via holes 135. The fifth conductive line pattern 132 has a plurality of lines and a plurality of fifth connection terminals 1322. In this embodiment, the fifth connection terminal 1322 is located at one end opening of the second conduction hole 135, and the fifth connection terminal 1322 and the The second via holes 135 are in one-to-one correspondence. It can be understood that the second via hole 135 can also be connected to other portions of the fifth conductive line pattern 132 without being connected to the fifth connection terminal 1322. The sixth conductive line pattern 133 has a sixth connection terminal 1332. In the embodiment, the sixth connection terminal 1332 is located at the other end opening of the second via hole 135. The number and position of the sixth connection terminal 1332 and the first The number and position of the two connection terminals 1132 respectively correspond to be electrically connected to the second connection terminal 1132. The fifth conductive line pattern 132 and the sixth conductive line pattern 133 in FIG. 3 only schematically depict the fifth connection terminal 1322 and the sixth connection terminal 1332. As will be understood by those skilled in the art, the fifth conductive line pattern 132 and The sixth conductive line pattern 133 may also have other designs and is not limited to the structure shown in FIG.

The second via hole 135 may be formed before selectively etching the copper layer to form the fifth conductive line pattern 132 and the sixth conductive line pattern 133. The second via hole 135 may be formed by using a mechanical drilling process. Forming a through hole penetrating the copper layer for forming the fifth conductive line pattern 132, the third substrate layer 131, and the copper layer for forming the sixth conductive line pattern 133; depositing a conductive material on the sidewall of the via hole by electroplating; The via hole is filled with the plug hole material; and the conductive material is deposited again on the surface of the plug hole material to form the second via hole 135. It can be understood that, as shown in FIG. 12, the second via hole 135 can also be replaced with a second blind via hole 135a. The second blind via hole 135a can be formed by using a laser drilling process to form only through the through hole for forming. The copper layer of the sixth conductive line pattern 133 and the third base layer 131 do not penetrate through the blind holes for forming the copper layer of the fifth conductive line pattern 132; the conductive material is deposited on the wall of the blind via hole by electroplating, thereby forming the first Two blind vias 135a. As shown in FIG. 13, the second blind via hole 135a may further fill the plug hole material in the second blind via hole 135a, and deposit a conductive material on the surface of the plug hole material to form a second blind via hole 135b having a hole filling material.

The fourth cover film 134 covers the surface of the fifth conductive line pattern 132 and the fifth surface 1311 exposed from the fifth conductive line pattern 132. The fourth cover film 134 is formed corresponding to the area of the fifth connection terminal 1322. The four through holes 1341 are exposed from the fourth through holes 1341. Generally, the fourth cover film 134 is a solder resist layer, which is formed after the second via hole 135, the fifth conductive line pattern 132, and the sixth conductive line pattern 133 are completed. The fourth cover film 134 can be screen-printed. A method of printing a solder resist ink or a method of directly bonding a solder mask.

In this embodiment, the first rigid circuit board 120 and the second rigid circuit board 130 are rigid circuit boards including two layers of conductive lines. It can be understood that the first rigid circuit board 120 and the second rigid circuit board 130 can also be a multi-layer rigid circuit board with more than two layers of conductive lines, that is, the second base layer 121 and the third base layer 131 can each be a multi-layer substrate. The multilayer resin layer and the multilayer conductive wiring pattern are alternately arranged.

In the third step, referring to FIG. 6, the first film 140 and the first protective film 150 are sequentially attached on the fourth conductive line pattern 123 of the first rigid circuit board 120. The second film 160 and the second protective film 170 are sequentially attached to the sixth conductive line pattern 133 of the second rigid circuit board 130.

The first film 140 and the second film 160 may be made of a less fluid type 2116 type prepreg. The first protective film 150 and the second protective film 170 are respectively used to protect the first film 140 and the second film 160 before the first film 140 and the second film 160 are attached to the flexible circuit board 110. The first protective film 150 And the second protective film 170 may be a protective release film, and the material thereof may be PET. A third opening 1401 corresponding to the exposed area 114 is defined in the first film 140 and the first protective film 150, and a fourth opening 1601 corresponding to the exposed area 114 is opened in the second film 160 and the second protective film 170.

In the fourth step, referring to FIG. 7, the fifth through hole 142 penetrating the first film 140 and the first protective film 150 is formed by a laser drilling method, and the number and position of the fifth through hole 142 are respectively corresponding to the fourth The connection terminal 1232 corresponds to the fifth connection hole 1222 exposing the fourth connection terminal 1232. A sixth through hole 162 penetrating the second film 160 and the second protective film 170 is formed by a laser drilling method, and the number and position of the sixth through hole 162 respectively correspond to the sixth connecting terminal 1332, the sixth The through hole 162 exposes the sixth connection terminal 1332.

After the laser drilling, the steps of cleaning the holes of the fifth through hole 142 and the sixth through hole 162 and the surfaces of the first rigid circuit board 120 and the second rigid circuit board 130 are also required to be erased. Debris left on the surface of the board and the walls of the holes.

In the fifth step, referring to FIG. 8 , the fifth via hole 142 and the sixth via hole 162 are filled with a conductive paste and the conductive paste is cured, and the first protective film 150 and the second protective film 170 are removed, thereby A first connecting protrusion 143 formed of a fourth connecting terminal 1232 and a conductive paste printed on the surface thereof is formed in the fifth through hole 142, and a conductive printed by the sixth connecting terminal 1332 and its surface is formed in the sixth through hole 162. The second connecting protrusion 163 is formed by the paste.

The conductive paste may be a copper conductive paste, a silver conductive paste or other paste conductive material having a low electrical resistivity, and generally includes a resin, a curing agent, and a conductive powder mixed in the resin. Since the conductive paste is relatively viscous and has a certain fluidity, the conductive paste can be printed in a predetermined place by screen printing, thereby forming a solid conductive material by curing the conductive paste. The conductive paste may be filled into the surface of the fourth connection terminal 1232 in the fifth through hole 142 by screen printing, thereby forming the first connection protrusion 143: providing a screen, the pattern of the screen and the Corresponding to the fifth through hole 142; the conductive paste is scraped from the pattern on the screen to the surface of the fourth connection terminal 1232 in the fifth through hole 142 by using a doctor blade, and the first connection protrusion is formed after the conductive paste is further cured. 143. The method of forming the second connecting protrusion 163 is similar to the method of forming the first connecting protrusion 143. When the first via hole 125 and the second via hole 135 are replaced with the first blind via hole 125a and the second blind via hole 135a as shown in FIG. 12, when the conductive paste is filled in this step, the first blind via hole 125a and The conductive paste is also filled in the second blind via 135a.

In a sixth step, referring to FIG. 9, a first spacer 18 and a second spacer 19 corresponding to the shape of the exposed region 114 are provided, and the shapes of the first rigid circuit board 120 and the second rigid circuit board 130 are respectively different. Corresponding third gasket 20 and fourth gasket 21.

The first spacer 18, the second spacer 19, the third spacer 20, and the fourth spacer 21 are all made of peelable film. The thickness of the first spacer 18 is substantially equal to the thickness of the first rigid circuit board 120 and the first film 140, and the thickness of the second spacer 19 is substantially equal to the thickness and the thickness of the second rigid circuit board 130 and the second film 160. . The size of the first spacer 18 and the second spacer 19 should be smaller than the size of the exposed region 114. For example, when the exposed area 114 is rectangular, the shapes of the first spacer 18 and the second spacer 19 are also rectangular, but the length of the first spacer 18 and the second spacer 19 is 50 micrometers smaller than the length of the exposed region 114. Up to 100 microns, the width of the first spacer 18 and the second spacer 19 is 50 microns to 100 microns smaller than the width of the exposed region 114. The third spacer 20 is the same size as the first rigid circuit board 120, and the fourth spacer 21 has the same size as the second rigid circuit board 130.

The seventh step, referring to FIG. 10, sequentially aligns and presses the third spacer 20, the first rigid circuit board 120, the flexible circuit board 110, the second rigid circuit board 130, and the fourth spacer 21 to make the flexible circuit The first nip 115 and the second nip 126 and the third nip 136 of the panel 11 are bonded to each other through the first film 140 and the second film 160, respectively. The first opening 128 of the first rigid circuit board 120 is in communication with the third opening 1401 of the first film 140, and the second opening 138 of the second rigid circuit board is connected to the fourth opening 1601 of the second film 160. The first spacer 18 is received in the first opening 128 and the third opening 1401, and the second spacer 19 is received in the second opening 138 and the fourth opening 1601.

When the first spacer 18 is received in the first opening 128 and the third opening 1401 of the first rigid circuit board 120, the first spacer 18 should be placed at the center of the exposed region 114 of the flexible circuit board 110, thereby There is a gap between the first spacer 18 and the first rigid circuit board 120 and the first film 140. When the second spacer 19 is received in the second opening 138 and the fourth opening 1601, the second spacer 19 should be placed at the center of the exposed area 114 of the flexible circuit board 110, so that the second spacer 19 and the second There is a gap between the two rigid circuit board 130 and the second film 160. In addition, the second scrap region 127 of the first rigid circuit board 120, the first scrap region 118 of the flexible circuit board 110, and the third scrap region 137 of the second rigid circuit board 130 are aligned with each other and sequentially stacked.

After being pressed, the conductive paste material in the first connecting protrusion 143 enters the first through hole 1161 by the pressing force and is electrically connected to the first connecting terminal 1122 of the first conductive line pattern 112, and the second connection The conductive paste material in the bumps 163 enters the second via hole 1171 by the pressing force and is in electrical communication with the second connection terminal 1132 of the second conductive trace pattern 113. Moreover, since the first rigid circuit board 120 and the second rigid circuit board 130 are provided with via holes, the layers between the first rigid circuit board 120, the flexible circuit board 110, and the second rigid circuit board 130 can be realized. Electrically conductive to each other.

In the eighth step, referring to FIG. 11, the third spacer 20, the fourth spacer 21, the first spacer 18, and the second spacer 19 are removed, and the second waste region 127 of the first rigid circuit board 120 is removed, and the flexibility is removed. The first waste area 118 of the circuit board 110, the third waste area 137 of the second rigid circuit board 130, the portion of the first film 140 corresponding to the second waste area 127, and the second film 160 correspond to the third waste area 137. The part thus gets the soft and hard combined circuit board 100.

Since the third spacer 20 and the fourth spacer 21 are strippable films, they can be easily peeled off from the first rigid circuit board 120 and the second rigid circuit board 130. After the third spacer 20 and the fourth spacer 21 are peeled off, the first spacer 18 and the second spacer 19 can be exposed, so that the first spacer 18 and the second spacer 19 can be taken out. The cascading of the first rigid circuit board 120, the first film 140, the flexible circuit board 110, the second film 160, and the second rigid circuit board may be cut along the boundary of the second scrap area 127 by laser cutting. Structure 100a, such that second waste zone 127, first waste zone 118, third waste zone 137, first film 140 correspond to portions of second waste zone 127, and second film 160 corresponds to third waste zone 137 Part of the removal.

It can be understood that, after removing the first spacer 18, the second spacer 19, the third spacer 20, and the fourth spacer 21, before removing the second waste area 127, the first waste area 118, and the third waste area 137, It is also possible to perform steps of soldering electronic components on the third connection terminal 1222 and the fifth connection terminal 1322, and then removing the second waste area 127, the first waste area 118, and the third waste after the soft and hard circuit board 100 is completely formed. The area 137, the first film 140 corresponds to a portion of the second waste area 127, and the second film 160 corresponds to a portion of the third waste area 137.

The soft-hard bonded circuit board 100 formed by the manufacturing method of the present embodiment includes a flexible region 102 formed by the exposed regions 114 of the flexible circuit board 110, and a rigid region 104 on opposite sides of the flexible region 102. In this embodiment, the hard and soft bonding circuit board 100 includes two rigid regions 104, each of which includes a first nip 115 of the flexible circuit board 110 at a central position and a first nip 115. The second nip area 126 of the first rigid circuit board 120 and the third nip area 136 of the second rigid circuit board 130 on opposite sides.

It can be understood that the manufacturing method of the soft and hard combined circuit board provided by the technical solution can also be used to fabricate the soft and hard combined circuit board of other structures, as shown in FIG. 14 to FIG. 18 , which are the second to sixth embodiments of the present invention. There are provided five other hard and soft bonded circuit boards which are manufactured by a method similar to the manufacturing method of the soft and hard bonded circuit board of the first embodiment.

As shown in FIG. 14, a second embodiment of the present invention provides a soft and hard bonded circuit board 200. The structure of the hard and soft combined circuit board 200 is similar to that of the soft and hard combined circuit board 100, except that the soft and hard is made. A rigid circuit board is used in combination with the circuit board 200. The first rigid circuit board 120a and the second hard circuit board 130a shown in FIG. 12 replace the first rigid circuit board 120 and the second rigid circuit board 130, respectively. In this embodiment, the conductive paste material of the first connection protrusion 243 is filled in the first blind via hole 125a, and the conductive paste material of the second connection protrusion 263 is filled in the second blind via hole 135a.

As shown in FIG. 15, a third embodiment of the present invention provides a soft and hard combined circuit board 300. The structure of the hard and soft combined circuit board 300 is similar to that of the soft and hard combined circuit board 100, except that the soft and hard is made. When the circuit board 300 is combined, the first rigid circuit board 120b and the second hard circuit board 130b shown in FIG. 13 are used to replace the first rigid circuit board 120 and the second rigid circuit board 130, respectively.

As shown in FIG. 16, a fourth embodiment of the present invention provides a soft and hard bonding circuit board 400 for forming a second nip region 126c and a second rigid circuit in the first rigid circuit board 120c of the soft and hard circuit board 400. The number of the third nips 136c in the plate 130c is only one, respectively, formed on opposite sides of one of the first nips 115c of the flexible circuit board 110c.

As shown in FIG. 17, a fifth embodiment of the present invention provides a soft and hard circuit board 500. The rigid circuit board in the formed hard and soft circuit board 500 includes only the first rigid circuit board 120d. The first rigid circuit The plate 120d has the same structure as the first rigid circuit board 120 in the above embodiment, and the number of the second pressing regions 126d of the first rigid circuit board 120d is two, respectively formed on the same side of the flexible circuit board 110d. A press-fit area 115d. The flexible and hard-bonding circuit board 500 further includes two reinforcing sheets 180a respectively attached to the two first nips 115d of the flexible circuit board 110d facing away from the first rigid circuit board 120d. To support and protect the flexible circuit board 110d. The material of the reinforcing sheet 180a may be PI, a glass fiber laminate or a metal such as copper or the like.

As shown in FIG. 18, a sixth embodiment of the present invention provides a soft and hard bonding circuit board 600. The rigid circuit board in the formed soft and hard bonding circuit board 600 includes only the first rigid circuit board 120e, and the first rigid circuit board. The number of the second nips 126e in 120e is one, formed on one side of one of the first nips 115e of the flexible circuit board 110e. The flexible and hard-bonding circuit board 500 further includes two reinforcing sheets 180b respectively attached to the two first nips 115e of the flexible circuit board 110e facing away from the first rigid circuit board 120e. To support and protect the flexible circuit board 110e. The material of the reinforcing sheet 180b may be PI, a glass fiber laminate or a metal such as copper or the like.

In the method for manufacturing a soft and hard circuit board according to the embodiment of the present invention, the flexible circuit board and the rigid circuit board can be simultaneously fabricated, and then pressed together to form a soft and hard combined circuit board, which takes a short time, and the manufacturing efficiency of the soft and hard combined circuit board is effectively effective. improve.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

110, 110c, 110d, 110e. . . Flexible circuit board

111. . . First substrate layer

112. . . First conductive line pattern

113. . . Second conductive line pattern

116. . . First cover film

117. . . Second cover film

1111. . . First surface

1112. . . Second surface

114. . . Exposed area

115, 115c, 115d, 115e. . . First nip

118. . . First waste area

119. . . First product area

1122. . . First connection terminal

1132. . . Second connection terminal

1161. . . First through hole

1171. . . Second through hole

120, 120a, 120b, 120c, 120d, 120e. . . First rigid board

130, 130a, 130b, 130c. . . Second rigid board

128. . . First opening

129. . . Second product area

126, 126c, 126d, 126e. . . Second nip

127. . . Second waste area

138. . . Second opening

139. . . Third product area

136,136a. . . Third nip

137. . . Third waste area

121. . . Second base layer

122. . . Third conductive line pattern

123. . . Fourth conductive line pattern

124. . . Third cover film

1211. . . Third surface

1212. . . Fourth surface

125. . . First via

1222. . . Third connection terminal

1232. . . Fourth connection terminal

125a, 125b. . . First blind via

1241. . . Third through hole

131. . . Third base layer

132. . . Fifth conductive line pattern

133. . . Sixth conductive line pattern

134. . . Fourth cover film

1311. . . Fifth surface

1312. . . Sixth surface

135. . . Second via

1322. . . Fifth connection terminal

1332. . . Sixth connection terminal

135a, 135b. . . Second blind via

1341. . . Fourth through hole

140. . . First film

150. . . First protective film

160. . . Second film

170. . . Second protective film

1401. . . Third opening

1601. . . Fourth opening

142. . . Fifth through hole

162. . . Sixth through hole

143,243. . . First connecting protrusion

163,263. . . Second connecting protrusion

18. . . First gasket

19. . . Second gasket

20. . . Third gasket

twenty one. . . Fourth gasket

100,200,300,400,500,600. . . Soft and hard combined circuit board

102. . . Flexible zone

104. . . Rigid zone

180a, 180b. . . Strengthening piece

100a. . . Cascading structure

1 is a cross-sectional view of a flexible circuit board according to a first embodiment of the present invention.

2 is a top plan view of the flexible circuit board of FIG. 1.

3 is a cross-sectional view showing a first rigid circuit board and a second rigid circuit board according to a first embodiment of the present invention.

4 is a top plan view of the first rigid circuit board of FIG.

Figure 5 is a bottom plan view of the second rigid circuit board of Figure 3.

Figure 6 is a cross-sectional view showing the first rigid circuit board and the second rigid circuit board attached to the film and the protective film in Figure 3.

Figure 7 is a cross-sectional view of the first rigid circuit board and the second rigid circuit board of Figure 6 after drilling of the film and protective film.

Figure 8 is a cross-sectional view showing the filling of the conductive paste into the holes of the film on the first rigid board and the second rigid board in Fig. 7 and removing the protective film.

Figure 9 is a cross-sectional view showing first to fourth spacers provided by the first embodiment of the present invention.

Figure 10 is a cross-sectional view showing the flexible circuit board of Figure 1, the first rigid circuit board and the second rigid circuit board of Figure 8, and the first to fourth pads of Figure 9 being pressed together.

11 is a cross-sectional view showing a soft-hardened circuit board formed by removing the first to fourth pads of FIG. 10 and the scrap regions of the first rigid circuit board, the second rigid circuit board, and the flexible circuit board.

Figure 12 is a cross-sectional view showing another embodiment of the first rigid circuit board and the second rigid circuit board shown in Figure 3.

Figure 13 is a cross-sectional view showing still another embodiment of the first rigid circuit board and the second rigid circuit board shown in Figure 3.

Figure 14 is a cross-sectional view showing a soft and hard bonded circuit board according to a second embodiment of the present invention.

Figure 15 is a cross-sectional view showing a soft-hardened circuit board according to a third embodiment of the present invention.

Figure 16 is a cross-sectional view showing a soft and hard bonded circuit board according to a fourth embodiment of the present invention.

Figure 17 is a cross-sectional view showing a soft and hard bonded circuit board according to a fifth embodiment of the present invention.

Figure 18 is a cross-sectional view showing a soft-hardened circuit board according to a sixth embodiment of the present invention.

120. . . First rigid board

110. . . Flexible circuit board

130. . . Second rigid board

138. . . Second opening

19. . . Second gasket

1601. . . Fourth opening

163. . . Second connecting protrusion

1332. . . Sixth connection terminal

1132. . . Second connection terminal

twenty one. . . Fourth gasket

160. . . Second film

140. . . First film

20. . . Third gasket

128. . . First opening

18. . . First gasket

1401. . . Third opening

1122. . . First connection terminal

143. . . First connecting protrusion

1232. . . Fourth connection terminal

100a. . . Cascading structure

Claims (30)

A method for manufacturing a soft and hard combined circuit board, comprising the steps of:
Providing a flexible circuit board comprising a first substrate layer and a first conductive trace pattern disposed on a surface of the first substrate layer, the flexible circuit board comprising a first product region having connected exposed regions And a first nip area;
Providing a rigid circuit board, the rigid circuit board comprising a second substrate layer and a fourth conductive line pattern disposed on a surface of the second substrate layer, the rigid circuit board comprising a second product area corresponding to the first product area, the second The product area has an adjacent second pressing area and a first opening, the first opening corresponding to the exposed area;
Attaching a first film having a third opening corresponding to the exposed area on the rigid circuit board to cover the surface of the fourth conductive line pattern and the surface of the rigid circuit board exposed from the fourth conductive line pattern, and exposing Part of the fourth conductive line pattern to form a plurality of fourth connection terminals;
Conductive paste is printed on the surface of the plurality of fourth connection terminals, each of the fourth connection terminals and the conductive paste printed on the surface thereof constitute a first connection protrusion; and the rigid circuit board and the flexible circuit board are aligned and pressed to make a pressing area and a second pressing area are bonded to each other through the first film, and the exposed area is exposed by the first opening and the third opening, and each of the first connecting protrusions is electrically connected to the first conductive line pattern . The method of fabricating a soft-hardened circuit board according to claim 1, wherein the flexible circuit board further comprises a first waste area connected around the first product area, the rigid circuit board further comprising a connection around the second product area. The second waste area, after aligning and pressing the rigid circuit board and the flexible circuit board, removes the first waste area, the second waste area, and the portion of the first film corresponding to the second waste area. The method of fabricating a soft-hardened circuit board according to claim 1, wherein the first substrate layer comprises an opposite first surface and a second surface, and the first conductive trace pattern is formed on the first surface, the first The first conductive line pattern of the nip has a plurality of first connection terminals, the flexible circuit board further comprising a first cover film covering the surface of the first conductive line pattern and exposed from the first conductive line pattern a first surface and exposing a plurality of first connection terminals; the second substrate layer has opposite third and fourth surfaces, the fourth conductive line pattern is formed on the fourth surface, and the plurality of fourth connection terminals The plurality of first connection terminals are in one-to-one correspondence, and after aligning and pressing the rigid circuit board and the flexible circuit board, each of the first connection terminals is electrically connected to a corresponding first connection protrusion. The method of fabricating a soft-hardened circuit board according to claim 3, wherein the rigid circuit board further comprises a third conductive line pattern and a third cover film, the third conductive line pattern being formed on the third surface and passing The plurality of conductive holes are electrically connected to the fourth conductive line pattern, and the third cover film covers the third conductive line pattern surface and the third surface exposed from the third conductive line pattern. The method of fabricating a soft-hardened circuit board according to claim 1, wherein the thickness of the first connecting protrusion is greater than the thickness of the first film. The method for fabricating a soft-hardened circuit board according to claim 4, wherein the conductive hole is a via hole or a blind via hole. The method for manufacturing a soft-hardened circuit board according to claim 6, wherein the via hole or the blind via hole is filled with a plug material. The method of fabricating a soft-hardened circuit board according to claim 1, wherein the first base layer is a single-layer flexible resin layer or a multi-layer substrate comprising a plurality of alternately arranged insulating layers and a plurality of conductive line patterns, the second The base layer is a single layer of a hard resin layer or a multilayer substrate including a plurality of alternately arranged insulating layers and a plurality of conductive line patterns. The method of fabricating a soft-hardened circuit board according to claim 1, wherein before aligning and pressing the rigid circuit board and the flexible circuit board, a first spacer corresponding to the exposed area and one and the same are provided a third gasket corresponding to the rigid circuit board, the first gasket is received in the first opening and the third opening when the rigid circuit board and the flexible circuit board are aligned and pressed, the third gasket and the third gasket The rigid circuit board is attached away from one side of the flexible circuit board, and after aligning and pressing the rigid circuit board and the flexible circuit board, the third spacer and the first spacer are also removed. The method of manufacturing a soft-hardened circuit board according to claim 9, wherein the thickness of the first spacer is equal to the sum of the thicknesses of the rigid circuit board and the first film, and the cross-sectional area of the first spacer is smaller than The cross-sectional area of the exposed region has a gap between the first spacer and an edge at the first opening of the rigid circuit board and an edge at the third opening of the first film. The method of fabricating a soft-hardened circuit board according to claim 9, wherein the material of the first gasket and the third gasket is a peelable film. The manufacturing method of the soft and hard bonding circuit board of claim 3, wherein the flexible circuit board further comprises a second conductive line pattern, a second cover film and a reinforcing sheet, wherein the second conductive line pattern is formed on the second surface The second cover film covers a surface of the second conductive trace pattern and a second surface exposed from the second conductive trace pattern, the reinforcement sheet being attached to the second cover film surface for supporting and protecting the flexible circuit board . A method for manufacturing a soft and hard combined circuit board, comprising the steps of:
Providing a flexible circuit board including a first substrate layer, a first conductive line pattern, and a second conductive line pattern, the first substrate layer having opposite first and second surfaces, the first conductive line pattern and The second conductive circuit pattern is respectively disposed on the first surface and the second surface, the flexible circuit board includes a first product area, the first product area has a connected exposed area and a first pressing area;
Providing a first rigid circuit board, the first rigid circuit board comprising a second base layer and a fourth conductive line pattern disposed on a surface of the second base layer, the first rigid circuit board including a second corresponding to the first product area a product area, the second product area has an adjacent second pressing area and a first opening, the first opening corresponding to the exposed area;
Providing a second rigid circuit board, the second rigid circuit board comprising a third base layer and a sixth conductive line pattern disposed on a surface of the second base layer, the second rigid circuit board including a third corresponding to the first product area a product area, the third product area has an adjacent third pressing area and a second opening, the second opening corresponding to the exposed area;
Attaching a first film having a third opening corresponding to the exposed area on the first rigid circuit board to cover the surface of the fourth conductive line pattern and the surface of the first rigid circuit board exposed from the fourth conductive line pattern And exposing a portion of the fourth conductive line pattern to form a plurality of fourth connection terminals, and attaching a second film having a fourth opening corresponding to the exposed area on the second rigid circuit board to cover the sixth conductive line pattern surface And exposing a surface of the second rigid circuit board from the sixth conductive line pattern, and exposing a portion of the sixth conductive line pattern to form a plurality of sixth connection terminals;
Conductive paste is printed on the surface of the plurality of fourth connection terminals and the plurality of sixth connection terminals, and each of the fourth connection terminals and the conductive paste printed on the surface thereof constitute a first connection protrusion, and each of the sixth connection terminals and the surface thereof The printed conductive paste constitutes a second connecting protrusion; and aligns and presses the first rigid circuit board, the flexible circuit board and the second rigid circuit board to pass the first nip area and the second nip area through the first The film is bonded to each other, and the first pressing area and the third pressing area are bonded to each other through the second film, and one side of the exposed area is exposed by the first opening and the third opening, and the opposite side of the exposed area is by the same The second opening and the fourth opening are exposed, and each of the first connecting protrusions is electrically connected to the first conductive line pattern, and each of the second connecting protrusions is electrically connected to the second conductive line pattern. The method of fabricating a soft-hardened circuit board according to claim 13, wherein the flexible circuit board further comprises a first waste area connected around the first product area, the first rigid circuit board further comprising a second product a second waste circuit area around the area, the second rigid circuit board further comprising a third waste area connected around the third product area, aligning and pressing the first rigid circuit board, the flexible circuit board and the second rigid circuit board Thereafter, the first scrap zone, the second scrap zone, the portion of the first film corresponding to the second scrap zone, and the portion of the second film corresponding to the third scrap zone are removed. The method of manufacturing the soft-hardened circuit board of claim 13, wherein the first conductive line pattern of the first nip has a plurality of first connection terminals, the flexible circuit board further comprising a first cover film, The first cover film covers the surface of the first conductive trace pattern and the first surface exposed from the first conductive trace pattern, and exposes a plurality of first connection terminals, wherein the second conductive trace pattern of the first nip has a plurality of a second connection terminal, the flexible circuit board further comprising a second cover film covering the surface of the second conductive line pattern and the second surface exposed from the second conductive line pattern, and exposing the plurality of second connection terminals The second base layer has opposite third and fourth surfaces, the fourth conductive trace pattern is formed on the fourth surface, and the fourth connection terminal is in one-to-one correspondence with the first connection terminal, the third base layer The sixth conductive circuit pattern is formed on the sixth surface, and the sixth connection terminal has a one-to-one correspondence with the second connection terminal. After aligning and pressing the first rigid circuit board, the flexible circuit board and the second rigid circuit board, each of the first connection terminals is electrically connected to a corresponding first connection protrusion, and each of the second connection terminals corresponds to a corresponding one. The second connecting protrusions are electrically connected. The method of manufacturing the soft-hardened circuit board of claim 15, wherein the first rigid circuit board further comprises a third conductive line pattern and a third cover film, the third conductive line pattern being formed on the third surface, And electrically connecting to the fourth conductive line pattern through the plurality of first conductive holes, the third cover film covering the third conductive line pattern surface and the third surface exposed from the third conductive line pattern, the second rigid circuit board Further comprising a fifth conductive line pattern and a fourth cover film formed on the fifth surface, and electrically connected to the sixth conductive line pattern through a plurality of second conductive holes, the fourth cover film covering the a third conductive line pattern surface and a fifth surface exposed from the fifth conductive line pattern. The method of fabricating a soft-hardened circuit board according to claim 13, wherein the thickness of the first connecting protrusion is greater than the thickness of the first film, and the thickness of the second connecting protrusion is greater than the thickness of the second film. The method of fabricating a soft-hardened circuit board according to claim 16, wherein the first conductive via and the second conductive via are via holes or blind via holes. The method of fabricating a soft-hardened circuit board according to claim 18, wherein the via hole or the blind via hole is filled with a plug material. The method of fabricating a soft-hardened circuit board according to claim 13, wherein before the first rigid circuit board, the flexible circuit board, and the second rigid circuit board are aligned and pressed, a corresponding portion corresponding to the exposed area is further provided a spacer and a second spacer, a third spacer corresponding to the first rigid circuit board, and a fourth spacer corresponding to the second rigid circuit board, aligning and pressing the first rigid circuit board, In the flexible circuit board and the second rigid circuit board, the first gasket is received in the first opening and the third opening, and the second gasket is received in the second opening and the fourth opening, the third gasket Adhering to a side of the first rigid circuit board away from the flexible circuit board, the fourth pad is attached to a side of the second rigid circuit board away from the flexible circuit board, and aligning and pressing the first rigid After the circuit board, the flexible circuit board and the second rigid circuit board, the third gasket, the fourth gasket, the first gasket and the second gasket are also removed. The method of manufacturing the soft-hardened circuit board of claim 20, wherein the thickness of the first spacer is equal to the sum of thicknesses of the first rigid circuit board and the first film, and the thickness of the second spacer is equal to The sum of the thicknesses of the second rigid circuit board and the second film, the cross-sectional areas of the first spacer and the second spacer are both smaller than the cross-sectional area of the exposed area, the first spacer and the first rigid a gap between an edge at the first opening of the circuit board and an edge at the third opening of the first film, an edge of the second pad and the second opening of the second rigid circuit board, and There is a gap between the edges of the fourth opening of the second film. The method for manufacturing a soft-hardened circuit board according to claim 20, wherein the materials of the first spacer, the second spacer, the third spacer, and the fourth spacer are strippable films. The method of fabricating a soft-hardened circuit board according to claim 13, wherein the attaching the first film having the third opening corresponding to the exposed area on the first rigid circuit board comprises the step of: in the first rigid circuit a first film and a first protective film are sequentially attached to the board, the first film and the first protective film covering the fourth conductive line pattern surface and the fourth surface exposed from the fourth conductive line pattern, in the first film and the first film a third opening corresponding to the exposed area is formed on the protective film, and a fifth through hole corresponding to the plurality of the fourth connecting terminals is formed on the first film and the first protective film to expose the plurality of fourth connections a second film attached to the second rigid circuit board having a fourth opening corresponding to the exposed area includes the steps of: sequentially attaching the second film and the second protective film to the second rigid circuit board, and second The film and the second protective film cover the sixth conductive line pattern surface and the sixth surface exposed from the sixth conductive line pattern, and a fourth opening corresponding to the exposed area is formed on the second film and the second protective film, and a sixth through hole corresponding to the plurality of sixth connecting terminals is formed on the second film and the second protective film to expose a plurality of sixth connecting terminals; and conductive is printed on the surface of the plurality of fourth connecting terminals and the sixth connecting terminal After the paste, the first protective film and the second protective film are removed. A soft and hard combination circuit board, comprising:
a flexible circuit board comprising a first substrate layer and a first conductive line pattern disposed on a surface of the first substrate layer, the flexible circuit board comprising a first nip area and an exposed area, the first nip area a conductive line pattern having a plurality of first connection terminals;
a first rigid circuit board having a first opening corresponding to the exposed area, the first rigid circuit board comprising a second substrate layer and a fourth conductive line pattern disposed on a surface of the second substrate layer, the fourth conductive line pattern having a plurality of fourth connection terminals corresponding to the plurality of first connection terminals, each of the fourth connection terminal surfaces is printed with a conductive paste, and each of the fourth connection terminals and the conductive paste on the surface thereof constitute a first connection protrusion; And a first film having a third opening corresponding to the exposed area, the first conductive line pattern and the fourth conductive line pattern of the first nip area being bonded, the exposed area being exposed from the first opening and the third opening The first film has a plurality of fifth through holes corresponding to the plurality of first connecting terminals, and each of the first connecting protrusions is electrically connected to a corresponding first connecting terminal through a corresponding fifth through hole. The soft-hardened circuit board of claim 24, wherein the first substrate layer comprises opposing first and second surfaces, the first conductive trace pattern being formed on the first surface, the second substrate layer having The fourth conductive line pattern is formed on the fourth surface, and the flexible circuit board further includes a first cover film covering the surface of the first conductive line pattern and The first conductive line pattern exposes the first surface and exposes the plurality of first connection terminals. The soft-hardened circuit board of claim 25, wherein the first rigid circuit board further comprises a third conductive line pattern and a third cover film, the third conductive line pattern is formed on the third surface, and passes through the plurality The first conductive via is electrically connected to the fourth conductive trace pattern, and the third cover film covers the third conductive trace pattern surface and the third surface exposed from the third conductive trace pattern. The soft-hardened circuit board of claim 25, wherein the flexible circuit board further comprises a second conductive line pattern formed on the second surface, the second conductive line pattern of the first nip area having a plurality of second The connection terminal, the soft and hard combination circuit board further comprises:
a second rigid circuit board having a second opening corresponding to the exposed area, the second rigid circuit board comprising a third base layer and a sixth conductive trace pattern disposed on a surface of the third base layer, the sixth conductive trace pattern having a plurality of sixth connection terminals corresponding to the plurality of first connection terminals, each of the sixth connection terminal surfaces is printed with a conductive paste, and each of the sixth connection terminals and the conductive paste on the surface thereof constitute a second connection protrusion; And a second film having a fourth opening corresponding to the exposed area, the second conductive line pattern of the first nip and the sixth conductive line pattern being bonded, the exposed area being exposed from the second opening and the fourth opening The second film has a plurality of sixth through holes corresponding to the plurality of second connecting terminals, and each of the second connecting protrusions is electrically connected to a corresponding second connecting terminal through a corresponding sixth through hole. The soft-hardened circuit board of claim 27, wherein the third base layer has opposite fifth and sixth surfaces, the sixth conductive trace pattern is formed on the sixth surface, the flexible circuit board further comprising a second cover film covering a surface of the second conductive trace pattern and a second surface exposed from the second conductive trace pattern and exposing the plurality of second connection terminals. The soft-hardened circuit board of claim 28, wherein the second rigid circuit board further comprises a fifth conductive line pattern and a fourth cover film, the fifth conductive line pattern is formed on the fifth surface, and passes through the plurality The second conductive via is electrically connected to the sixth conductive trace pattern, and the fourth cover film covers the fifth conductive trace pattern surface and a fifth surface exposed from the fifth conductive trace pattern. The soft-hardened circuit board according to claim 27, wherein the first base layer is a single-layer flexible resin layer or a multi-layer substrate including a plurality of alternately arranged insulating layers and a plurality of conductive line patterns, the second substrate layer and The third substrate layer is a single-layered hard resin layer or a multilayer substrate including a plurality of alternately arranged insulating layers and a plurality of conductive wiring patterns.