TWI445154B - A shielding structure with anti-emi function - Google Patents
A shielding structure with anti-emi function Download PDFInfo
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- TWI445154B TWI445154B TW98143879A TW98143879A TWI445154B TW I445154 B TWI445154 B TW I445154B TW 98143879 A TW98143879 A TW 98143879A TW 98143879 A TW98143879 A TW 98143879A TW I445154 B TWI445154 B TW I445154B
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- 239000000758 substrate Substances 0.000 claims description 53
- 239000010408 film Substances 0.000 claims description 45
- 239000004020 conductor Substances 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000001465 metallisation Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 239000002966 varnish Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本發明係有關於一種具有電磁防護之屏蔽結構，尤指一種將導電薄膜結構成型於基板而達成具有電磁防護效果之屏蔽結構。The invention relates to a shielding structure with electromagnetic protection, in particular to a shielding structure which has a conductive film structure formed on a substrate to achieve an electromagnetic protection effect.
電子產品的技術快速發展，相關產品特性大多要求重量輕、體積小、高品質、低價位、低消耗功率及高可靠度等特點，上述特點促進了通訊、多媒體等技術的開發與市場成長，而電子產品中的電磁屏蔽結構及抗電磁干擾之品質要求相對顯得重要，以避免環境電磁波對於晶片產生干擾而影響到產品的操作品質。The technology of electronic products is developing rapidly. Most of the related product features require light weight, small size, high quality, low price, low power consumption and high reliability. These features promote the development and market growth of communication and multimedia technologies. The electromagnetic shielding structure and the anti-electromagnetic interference quality requirements in electronic products are relatively important to avoid the interference of environmental electromagnetic waves on the wafer and affect the operation quality of the product.
在傳統屏蔽結構中，金屬蓋體會罩蓋於IC晶片及一般周邊元件上，以達到抗電磁干擾的效果。然而，電子元件所散射(Scattering)之電磁波並未消散，反而在屏蔽結構中亂竄而間接或直接干擾敏感之電子電路，以致於影響到產品的特性。In the conventional shielding structure, the metal cover is covered on the IC chip and the general peripheral components to achieve electromagnetic interference resistance. However, the electromagnetic waves scattered by the electronic components do not dissipate, but instead smash in the shielding structure and indirectly or directly interfere with the sensitive electronic circuits, so as to affect the characteristics of the product.
另一方面，在傳統製程中，該金屬蓋體係以焊接方式連接於電路板，產品必須經過高溫迴焊步驟(Reflow)，造成產品隱藏性破壞，例如防焊漆膠落(peeling)的現象，造成錫竄流而短路；或是導電凸點承受不住高溫而導致對接接觸品質不佳等等問題；再者，上述迴焊步驟亦造成生產端的工時增加、成本上升等缺失。On the other hand, in the conventional process, the metal cover system is soldered to the circuit board, and the product must undergo a high temperature reflow step (Reflow), resulting in hidden damage of the product, such as the phenomenon of peeling of the solder resist paint. The problem of causing the turbulence of the tin to be short-circuited; or the problem that the conductive bumps cannot withstand the high temperature and the quality of the butt contact is poor; further, the above-mentioned reflowing step also causes an increase in the working hours of the production end and an increase in the cost.
再一方面，為了組裝上述金屬蓋體，在必須加大產品的空間，例如增加Layout空間，導致產品尺寸增加至少15%以上。On the other hand, in order to assemble the above metal cover, it is necessary to increase the space of the product, for example, to increase the layout space, resulting in an increase in product size of at least 15% or more.
本案發明人有鑑於上述習用的抗電磁結構於實際施用時的缺失，且積累個人從事相關產業開發實務上多年之經驗，精心研究，終於提出一種設計合理且有效改善上述問題之結構。In view of the lack of the above-mentioned conventional anti-electromagnetic structure in actual application, and the accumulated experience of individuals engaged in relevant industry development practice, the inventors of the present invention have finally proposed a structure that is reasonable in design and effective in improving the above problems.
本發明之主要目的，在於提供一種具有電磁防護之屏蔽結構，其係直接將導電薄膜結構成型於基板，使本發明之結構具有抗電磁干擾之特性，而不需外加金屬蓋體，故可節省工序、成本，同時提高良率與模組之可信賴性(Reliability)。The main object of the present invention is to provide a shielding structure with electromagnetic protection, which directly forms a conductive film structure on a substrate, so that the structure of the invention has the characteristics of anti-electromagnetic interference, and does not need to be externally added with a metal cover, thereby saving Process, cost, and increase the yield and reliability of the module.
本發明之另一目的，在於提供一種具有電磁防護之屏蔽結構，其係利用較低溫的製程，例如常溫下進行噴塗或貼附將導電薄膜結構成型於基板，因此不會對元件、基板造成熱影響，故可提高產品之可靠度。Another object of the present invention is to provide a shielding structure with electromagnetic protection, which is formed by using a relatively low temperature process, such as spraying or attaching at a normal temperature to form a conductive film structure on a substrate, thereby causing no heat to components or substrates. The impact can improve the reliability of the product.
為了達到上述目的，本發明係提供一種具有電磁防護之屏蔽結構，其包含：一基板，其包含至少一個電連接區域及一個接地區域；以及一導電薄膜結構，其係成形於該基板上且電性連接於該接地區域；藉此，該導電薄膜結構係用以將電磁干擾傳導至該接地區域。In order to achieve the above object, the present invention provides a shielding structure having electromagnetic shielding, comprising: a substrate including at least one electrical connection region and a grounding region; and a conductive film structure formed on the substrate and electrically The conductive film structure is used to conduct electromagnetic interference to the ground region.
本發明更提供一種具有電磁防護之屏蔽結構，其包含：一基板，其包含至少一個電連接區域及一個接地區 域，該基板上設有一積體電路元件，其中該積體電路元件具有一本體部、一形成於該本體部之金屬化結構及一由該本體部延伸出之連接部，該金屬化結構係電連接於該接地區域，而該連接部係電連接於該電連接區域；以及一導電薄膜結構，其係成形於該基板上且電性連接於該接地區域；藉此，該金屬化結構與該導電薄膜結構係用以將電磁干擾傳導至該接地區域。The invention further provides a shielding structure with electromagnetic protection, comprising: a substrate comprising at least one electrical connection region and one connection region The substrate is provided with an integrated circuit component, wherein the integrated circuit component has a body portion, a metallization structure formed on the body portion, and a connection portion extending from the body portion, the metallization structure Electrically connected to the grounding region, the connecting portion is electrically connected to the electrical connecting region; and a conductive film structure formed on the substrate and electrically connected to the grounding region; thereby, the metallized structure and The conductive film structure is used to conduct electromagnetic interference to the grounded region.
本發明具有以下有益的效果：本發明直接將導電薄膜結構成型於基板，因此基板本身即具有抗電磁干擾的特性，故可省略傳統的金屬蓋體，使得整體的製程具有較少的工序，以節省時間、成本；另外，由於本發明不需以高溫迴焊的方式組裝金屬蓋體，故可達成避免元件受到熱影響，以提高元件可靠度之效果。The invention has the following beneficial effects: the invention directly forms the conductive film structure on the substrate, so the substrate itself has the characteristics of anti-electromagnetic interference, so the traditional metal cover can be omitted, so that the overall process has fewer processes, The invention saves time and cost; in addition, since the invention does not need to assemble the metal cover by high-temperature reflow, it is possible to avoid the influence of heat on the components to improve the reliability of the components.
為使能更進一步瞭解本發明之特徵及技術內容，請參閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
首先，請參閱第一圖所示，其為本發明之第一實施例，本發明提出一種具有電磁防護之屏蔽結構，其主要係在電路基板上成型一導電膜，以達成抗電磁干擾之功效，並解決傳統利用金屬蓋體所衍生出的問題。該具有電磁防護之屏蔽結構係包含：一基板10以及一成型於該基板10上之導電薄膜結構11。First, referring to the first figure, which is a first embodiment of the present invention, the present invention provides a shielding structure with electromagnetic protection, which mainly forms a conductive film on a circuit substrate to achieve anti-electromagnetic interference effect. And solve the problems caused by the traditional use of metal cover. The shielding structure with electromagnetic protection comprises: a substrate 10 and a conductive film structure 11 formed on the substrate 10.
請復參考第一圖，該基板10具有一承載面10A及 一相對於該承載面10A的背面10B，在本具體實施例中，該承載面10A包含一個或一個以上的電連接區域101，故電子元件12係固設於該承載面10A上且電連接於電連接區域101，且該電連接區域101可包括複數個銲墊，而該電子元件12係以表面黏著技術(SMT)固接於該銲墊，但不以此為限，該電子元件12可用打線(wire bonding)、錫球、導電凸塊等等結構電連接於該銲墊。此外，導電薄膜結構11係成型於該基板10之承載面10A上，而該導電薄膜結構11係電連接於一接地區域102，以使該導電薄膜結構11將電磁干擾(EMI)傳導至該接地區域102。Referring to the first figure, the substrate 10 has a bearing surface 10A and With respect to the back surface 10B of the bearing surface 10A, in the embodiment, the bearing surface 10A includes one or more electrical connection regions 101, so that the electronic component 12 is fixed on the bearing surface 10A and electrically connected to Electrical connection region 101, and the electrical connection region 101 can include a plurality of pads, and the electronic component 12 is fixed to the pad by surface mount technology (SMT), but not limited thereto, the electronic component 12 can be used. Wire bonding, solder balls, conductive bumps, and the like are electrically connected to the pad. In addition, the conductive film structure 11 is formed on the bearing surface 10A of the substrate 10, and the conductive film structure 11 is electrically connected to a grounding region 102, so that the conductive film structure 11 conducts electromagnetic interference (EMI) to the ground. Area 102.
另一方面，該接地區域102係成型於該基板10之背面10B，並且該接地區域面積102係可涵蓋該基板10背面的大部分面積，可提供基板10背面的電磁干擾屏蔽，且該基板10的外側邊緣更設有至少一個接地導體結構103，例如，在本具體實施例中，該基板10的外圍兩側位置設有接地孔位(即接地導體結構103)，而該導電薄膜結構11即可藉由上述之接地孔位電連接於該接地區域102，藉此，電磁干擾(EMI)即可由導電薄膜結構11傳遞至接地孔位(即接地導體結構103)，再傳導至接地區域102，進而消散電磁干擾，以達成抗電磁干擾、具有電磁防護之功效。On the other hand, the grounding region 102 is formed on the back surface 10B of the substrate 10, and the grounding area 102 can cover most of the area of the back surface of the substrate 10, and can provide electromagnetic interference shielding on the back surface of the substrate 10, and the substrate 10 The outer edge of the substrate is further provided with at least one grounding conductor structure 103. For example, in the embodiment, the grounding hole position (ie, the grounding conductor structure 103) is disposed on both sides of the periphery of the substrate 10, and the conductive film structure 11 is The grounding region 102 can be electrically connected to the grounding region 102, whereby electromagnetic interference (EMI) can be transmitted from the conductive film structure 11 to the grounding hole position (ie, the grounding conductor structure 103), and then conducted to the grounding region 102. In turn, the electromagnetic interference is dissipated to achieve anti-electromagnetic interference and electromagnetic protection.
再者，在電路的設計上，為了避免電子元件12電性接觸到該接地區域102，該基板10上更成形有絕緣結構104，其係用以絕緣阻隔該電連接區域101與該導 電薄膜結構11。例如，在本具體實施例中，可利用絕緣漆或類似材料塗佈於該基板10上，以成型焊接點遮罩(Solder mask，即上述之絕緣結構104)，以裸露出該銲墊(即電連接區域101)，使電子元件12電連接於該銲墊而不電接觸於該導電薄膜結構11與接地區域102。Furthermore, in the design of the circuit, in order to prevent the electronic component 12 from electrically contacting the grounding region 102, the substrate 10 is further formed with an insulating structure 104 for insulating and blocking the electrical connection region 101 and the guiding Electrical film structure 11. For example, in this embodiment, an insulating varnish or the like may be applied to the substrate 10 to form a solder mask (ie, the insulating structure 104 described above) to expose the pad (ie, The electrical connection region 101) electrically connects the electronic component 12 to the bonding pad without electrically contacting the conductive thin film structure 11 and the grounding region 102.
再一方面，導電薄膜結構11可以利用各種方式成型於該基板10上，例如將一種導電膜貼附固定於該基板10上或是將一種導電材料噴塗於該基板10上，但不以上述為限。值得注意的是，該絕緣結構104及導電薄膜結構11都是成型在基板10的表面，更進一步地說該絕緣結構104及導電薄膜結構11都是以鄰近且順形的方式設置於基板10表面，因此可達到使遮蔽結構扁平化，並且可以將基板10本身產生的電磁干擾加以遮蔽的效果。In another aspect, the conductive film structure 11 can be formed on the substrate 10 by various means, such as attaching a conductive film to the substrate 10 or spraying a conductive material on the substrate 10, but not limit. It should be noted that the insulating structure 104 and the conductive film structure 11 are both formed on the surface of the substrate 10. Further, the insulating structure 104 and the conductive film structure 11 are disposed on the surface of the substrate 10 in an adjacent and conformal manner. Therefore, it is possible to flatten the shielding structure and to shield the electromagnetic interference generated by the substrate 10 itself.
請參考第二圖，其為本發明之第二實施例，與第一實施例不同之處在於：該基板10上更設有一積體電路元件(IC)13，該積體電路元件13具有一本體部131及一形成於該本體部131之金屬化結構132。該金屬化結構132係電連接於該導電薄膜結構11與接地區域102，以使積體電路元件13本身所產生的電磁干擾或是外來的電磁干擾均可加以消散，以達成抗電磁干擾、具有電磁防護之功效。Please refer to the second figure, which is a second embodiment of the present invention, which is different from the first embodiment in that the substrate 10 is further provided with an integrated circuit component (IC) 13, which has a The body portion 131 and a metallization structure 132 formed on the body portion 131. The metallization structure 132 is electrically connected to the conductive film structure 11 and the grounding region 102, so that electromagnetic interference generated by the integrated circuit component 13 itself or external electromagnetic interference can be dissipated to achieve electromagnetic interference resistance. The effect of electromagnetic protection.
同於第一實施例，該基板10具有一承載面10A及一相對於該承載面10A的背面10B，在本具體實施例 中，該承載面10A包含一個或一個以上的電連接區域101，故電子元件12與積體電路元件13係固設於該承載面10A上且電連接於電連接區域101，且該電連接區域101可包括複數個銲墊，而該電子元件12係以表面黏著技術(SMT)固接於該銲墊，積體電路元件13則以打線形式之連接部133連接於銲墊，但不以此為限，例如可為錫球、導電凸塊等等結構。此外，導電薄膜結構11係成型於該基板10之承載面10A上，而該導電薄膜結構11係電連接於一接地區域102，以使該導電薄膜結構11將電磁干擾傳導至該接地區域102。As in the first embodiment, the substrate 10 has a bearing surface 10A and a back surface 10B opposite to the bearing surface 10A, in this embodiment. The carrying surface 10A includes one or more electrical connection regions 101, so that the electronic component 12 and the integrated circuit component 13 are fixed on the bearing surface 10A and electrically connected to the electrical connection region 101, and the electrical connection region The 101 may include a plurality of pads, and the electronic component 12 is fixed to the pad by a surface mount technology (SMT), and the integrated circuit component 13 is connected to the pad by a connection portion 133 in the form of a wire, but not For example, it may be a solder ball, a conductive bump, or the like. In addition, the conductive film structure 11 is formed on the bearing surface 10A of the substrate 10, and the conductive film structure 11 is electrically connected to a grounding region 102, so that the conductive film structure 11 conducts electromagnetic interference to the grounding region 102.
為了達成較佳的抗電磁干擾效果，該積體電路元件13之金屬化結構132係圍設於該本體部131，但不與上述之連接部133形成電接觸。藉此，該金屬化結構132係電連接於該接地區域102，且藉由接地孔位(即接地導體結構103)將積體電路元件13所激發的電磁干擾或外來的電磁干擾傳導至接地區域102，並予以消散。In order to achieve a better anti-electromagnetic interference effect, the metallization structure 132 of the integrated circuit component 13 is disposed around the body portion 131, but does not make electrical contact with the connection portion 133 described above. Thereby, the metallization structure 132 is electrically connected to the grounding region 102, and the electromagnetic interference or external electromagnetic interference excited by the integrated circuit component 13 is conducted to the grounding region by the grounding hole position (ie, the grounding conductor structure 103). 102, and dissipated.
而在本實施例中，該導電薄膜結構11與金屬化結構132係可以下方法製成，將一種導電膜貼附固定於該基板10、本體部131上或是將一種導電材料噴塗於該基板10、本體部131上，但不以上述為限。In this embodiment, the conductive film structure 11 and the metallization structure 132 can be formed by attaching a conductive film to the substrate 10, the body portion 131 or spraying a conductive material on the substrate. 10. On the body portion 131, but not limited to the above.
另一方面，第二圖所示之結構，如絕緣結構104等均可參考第一實施例的說明，在此不加以贅述。On the other hand, the structure shown in the second figure, such as the insulating structure 104 and the like, can be referred to the description of the first embodiment, and will not be described herein.
綜上所述，本發明具有下列諸項優點：In summary, the present invention has the following advantages:
1、本發明係將導電薄膜結構成型於基板上，例如利用貼 附或噴塗的方式成型上述導電薄膜結構，以達成良好的抗電磁干擾的功效，且可避免傳統利用金屬蓋所造成的製程上的可靠度問題。另外，該導電薄膜結構可將干擾元件之電磁輻射傳導至接地端，以使其消散，進而避免電磁輻射在傳統的金屬蓋中亂竄，造成電子產品之特性不佳的問題。1. The present invention forms a conductive film structure on a substrate, for example, using a sticker The above-mentioned conductive film structure is formed by spraying or spraying to achieve good anti-electromagnetic interference effect, and the reliability problem in the process caused by the conventional use of the metal cover can be avoided. In addition, the conductive film structure can conduct electromagnetic radiation of the interference component to the ground end to dissipate it, thereby avoiding the problem that the electromagnetic radiation is scrambled in the conventional metal cover, resulting in poor characteristics of the electronic product.
2、本發明利用導電薄膜結構及積體電路元件周圍的金屬化結構，以達成抗電磁干擾之效果，且本發明的導電薄膜結構及金屬化結構並不會提高整體的屏蔽結構之體積，換言之，本發明之具有電磁防護之屏蔽結構具有縮小整體屏蔽結構之體積的功效。2. The present invention utilizes a conductive film structure and a metallization structure around the integrated circuit component to achieve an anti-electromagnetic interference effect, and the conductive film structure and the metallization structure of the present invention do not increase the volume of the overall shielding structure, in other words. The shielding structure with electromagnetic protection of the invention has the effect of reducing the volume of the overall shielding structure.
3、Layout設計時可以省下傳統金屬蓋體焊接所佔用的空間，因此本發明可減少產品面積5至10%，而體積則可減少17至20%或以上。3, Layout design can save the space occupied by the traditional metal cover welding, so the invention can reduce the product area by 5 to 10%, and the volume can be reduced by 17 to 20% or more.
以上所述僅為本發明之較佳可行實施例，非因此侷限本發明之專利範圍，故舉凡運用本發明說明書及圖示內容所為之等效技術變化，均包含於本發明之範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.
10‧‧‧基板10‧‧‧Substrate
10A‧‧‧承載面10A‧‧‧ bearing surface
10B‧‧‧背面10B‧‧‧Back
101‧‧‧電連接區域101‧‧‧Electrical connection area
102‧‧‧接地區域102‧‧‧ Grounding area
103‧‧‧接地導體結構103‧‧‧Ground conductor structure
104‧‧‧絕緣結構104‧‧‧Insulation structure
11‧‧‧導電薄膜結構11‧‧‧Electrical film structure
12‧‧‧電子元件12‧‧‧Electronic components
13‧‧‧積體電路元件13‧‧‧Integrated circuit components
131‧‧‧本體部131‧‧‧ Body Department
132‧‧‧金屬化結構132‧‧‧Metalized structure
133‧‧‧連接部133‧‧‧Connecting Department
第一圖係為本發明第一實施例之具有電磁防護之屏蔽結構的示意圖。The first figure is a schematic view of a shielding structure with electromagnetic protection according to a first embodiment of the present invention.
第二圖係為本發明第二實施例之具有電磁防護之屏蔽結構的示意圖。The second figure is a schematic view of a shielding structure with electromagnetic protection according to a second embodiment of the present invention.
10‧‧‧基板10‧‧‧Substrate
10A‧‧‧承載面10A‧‧‧ bearing surface
10B‧‧‧背面10B‧‧‧Back
101‧‧‧電連接區域101‧‧‧Electrical connection area
102‧‧‧接地區域102‧‧‧ Grounding area
103‧‧‧接地導體結構103‧‧‧Ground conductor structure
104‧‧‧絕緣結構104‧‧‧Insulation structure
11‧‧‧導電薄膜結構11‧‧‧Electrical film structure
12‧‧‧電子元件12‧‧‧Electronic components
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98143879A TWI445154B (en) | 2009-12-21 | 2009-12-21 | A shielding structure with anti-emi function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98143879A TWI445154B (en) | 2009-12-21 | 2009-12-21 | A shielding structure with anti-emi function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201123395A TW201123395A (en) | 2011-07-01 |
| TWI445154B true TWI445154B (en) | 2014-07-11 |
Family
ID=45046668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98143879A TWI445154B (en) | 2009-12-21 | 2009-12-21 | A shielding structure with anti-emi function |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI445154B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI553817B (en) | 2014-06-17 | 2016-10-11 | 瑞昱半導體股份有限公司 | Integrated circuit with electromagnetic protection function and manufacturing method thereof |
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2009
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| Publication number | Publication date |
|---|---|
| TW201123395A (en) | 2011-07-01 |
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