TWI444613B - Camera inspection device and camera inspection method - Google Patents

Description

Camera inspection device and camera inspection method

The present invention relates to an apparatus and method for performing imaging inspection of a shape of a pattern formed on a substrate.

In the manufacture of a plasma display device, a liquid crystal display device, a solar cell, or the like, the shape of the pattern formed on the substrate substrate 109 which is the object to be inspected is imaged by the inspection optical system 203, and the shape of the pattern is checked. In this imaging and inspection, the imaging inspection apparatus shown in Fig. 31 is used.

There is a case where the inspection optical system 204 provided separately from the inspection optical system 203 is used to photograph a portion which is determined to be a defect of the first defect group by the inspection. By doing so again, more detailed information can be obtained.

Here, the periphery of the first defect group is imaged by the inspection optical system 204, and the defect is detected with higher accuracy as the second defect group based on the imaging result, which is referred to as a review.

The review optical system 204 may be different from the optical resolution of the inspection optical system 203, or the numerical aperture of the lens constituting the optical system may be different, or may be a camera capable of color imaging. The table on both sides of the substrate 109 of the inspection apparatus is provided with an X-axis rail 207. The inspection optical system 203 and the inspection optical system 204 are mounted to the Y-axis movable member 201. A Y-axis rail 206 that becomes a moving path of the Y-axis movable member 201 is provided to the X-axis movable member 208. The X-axis movable member 208 moves along the X-axis rail 207 at a position above the substrate 109 between the X-axis rails 207.

By using the image obtained by the review, more detailed information on the portion determined to be the defect of the first defect group by the inspection optical system 203 can be obtained. Then, using the obtained information, as the second defect group, it is judged more accurately whether or not the portion is actually a defect or a type of defect.

However, in this inspection apparatus, since the review operation is performed after the inspection operation by the inspection optical system 203 is completed, there is a problem that the total time for inspection and review is long. For example, Patent Document 1 discloses an apparatus having a function of detecting a defect by optical means using a semiconductor LSI as a target, and observing the detection result by another electron optical system in the same apparatus.

In order to solve this problem, as shown in FIG. 32, in the inspection apparatus 210 of the patent document 1, the substrate 109 of the inspection object is photographed and inspected by the inspection optical system 203, and is transferred to and provided with the inspection optical system 204. The inspection device 210 is a different review device 211. By such a shift, two kinds of operations are virtually performed in parallel in a pipeline type, and the inspection of the inspection optical system 203 and the review of the optical system 204 are performed. Patent Document 2 discloses a device having a function of detecting a defect optically by using a semiconductor LSI as a target, and transmitting the junction to the same device or transmitting the detection information to another device, and using another electro-optical system. Make observations.

[Patent Document 1] JP-A-60-218845

[Patent Document 2] JP-A-58-33154

In Patent Document 2, although the inspection time can be shortened, since the area of the inspection apparatus needs to be approximately doubled, there is a problem that the apparatus is enlarged as a whole. As the object to be inspected becomes larger, it will become difficult to solve by this method.

An object of the present invention is to provide an imaging inspection apparatus and an imaging inspection method which can shorten the time of the inspection operation after the inspection and can cope with an increase in the size of the inspection object.

An imaging inspection apparatus according to the present invention includes: a mounting portion on which an inspection object is placed; and an inspection optical system that images the inspection object and detects a defect as a first defect group; and inspects an optical system moving mechanism The inspection object and the inspection optical system move relative to each other in the X direction; the inspection optical system captures the first defect group detected by the inspection optical system, and detects the defect as the second defect group; and inspects the optical system The moving mechanism moves the inspection optical system and the inspection optical system in the Y direction orthogonal to the X direction while relatively moving the inspection object and the inspection optical system in the X direction; and controlling The mechanism causes the inspection optical system to capture the first defect group during imaging of the inspection optical system, and detects the second defect group and the first defect group not photographed by the inspection optical system as defects.

Specifically, the feature is: the relative direction of the Y direction of the review optical system The amount of movement is equal to the relative movement amount of the inspection optical system in the Y direction. Further, it is characterized in that it has a plurality of the inspection optical systems and a plurality of the inspection optical systems; in the Y direction, the inspection optical system is independent from the inspection optical system and is movable over the entire width of the inspection object. Further, it is characterized in that it has a plurality of the inspection optical systems and a review optical system; in the Y direction, the inspection optical system is independent from the inspection optical system and is movable over the entire width of the inspection object. Further, the method includes a plurality of the inspection optical systems and a plurality of the inspection optical systems; and in the Y direction, the plurality of inspection optical systems can relatively move the inspection optical system.

In the imaging inspection method of the present invention, the inspection optical system and the inspection optical system are relatively moved in the X direction on the inspection object while moving in the Y direction, and the inspection optical system is used to image the optical system according to the inspection optical system. The defect of the first defect group is detected by the imaging result, and the defect of the second defect group is detected. The image inspection method is characterized in that each time the inspection optical system ends a scan in the Y direction, it is detected until then. The defect in the first defect group that is not captured by the review optical system is used to calculate the image by the inspection optical system in such a manner that the number of defects that can be captured by the inspection optical system becomes the largest. The review program table; the next scan in the Y direction of the inspection optical system is used to capture the review optical system based on the review schedule.

Specifically, the method is characterized in that the calculation of the review program table determines a priority order based on the detected feature quantity of the defect, and calculates an evaluation value based on the priority order and the number of defects, and becomes the evaluation value. Largest party The formula is calculated. Further, it is characterized in that the feature quantity of the defect includes at least one of a reflectance, an area, a shape, and a coordinate of the defect. Further, the method is characterized in that the calculation of the review program table compares the first program table and the second program table, and calculates a program table having a high evaluation value as a review program table, and the first program table is detected according to the The feature quantity of the defect of the first defect group is determined as a priority order, and the evaluation value of the program table is calculated according to the priority order and the number of defects, and is calculated in such a manner that the evaluation value becomes maximum, the second program table After the defect having the highest priority is excluded from the first program table, the evaluation value is calculated based on the priority order and the number of defects, and is calculated such that the evaluation value becomes maximum. Further, the feature is that the total of the detected feature amounts of the plurality of defects is P, and the number of detected defects is N, according to E=k. P+j. N

Further, k is a weighting coefficient of P, and j is a weighting coefficient of N.

The evaluation value E of the program table is calculated, and the program table having the large evaluation value E is calculated as the review program table.

In the imaging inspection method of the present invention, the first defect group detecting step is characterized in that the inspection object and the inspection optical system are relatively moved in the X direction, and the inspection object is imaged by the inspection optical system, and the inspection is performed. The defect is the first defect group; and the reviewing step is performed by the inspection optical system to detect the first defect group detecting step by moving the inspection object and the inspection optical system relative to each other in the X direction. Defects, and detecting defects as a second defect group; and defect detection steps, detecting the first a second defect group and the first defect group not captured in the review step as a defect; the inspection optical system and the inspection optical system are independently moved in the X direction, and are orthogonal to the X direction The directions are relatively moved in cooperation while the first defect group detecting step and the review step are performed simultaneously.

According to this configuration, the inspection optical system and the inspection optical system are relatively moved in the Y direction by the inspection optical system moving mechanism while moving the inspection object and the inspection optical system in the X direction. In the image scanning, the periphery of the defect in the optical system is inspected, so that the time of the inspection operation after the inspection can be shortened compared with the prior art.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same components are denoted by the same reference numerals.

(First embodiment)

Fig. 1 through Fig. 17 show a first embodiment of the present invention.

An X-axis rail 107 is provided on both sides of the table of the image-inspecting apparatus 200 on which the substrate 109 of the object to be inspected is placed. The X-axis movable member 108 is disposed to span the X-axis rails 107 on both sides.

Specifically, the X-axis rail 107 is constituted by a feed screw, and a nut screwed with the feed screw is provided to the X-axis movable member 108. The feed screw as the X-axis rail 107 is rotationally driven by the motor in response to the amount of movement of the X-axis movable member 108.

On the X-axis movable member 108, a first Y-axis rail 106 and a second Y-axis rail 105 are disposed in a direction crossing the X-axis rail 107. The first Y-axis movable member 101 is disposed on the first Y-axis rail 106. On the first Y-axis movable member 101, the inspection optical system 103 is mounted to photograph the substrate 109. The second Y-axis movable member 102 is disposed on the second Y-axis rail 105. On the second Y-axis movable member 102, the inspection optical system 104 is mounted as the imaging substrate 109.

Specifically, the first and second Y-axis rails 106, 105 are constituted by a feed screw, and the nut screwed to the feed screw is disposed on the first Y-axis movable member 101 and the second Y-axis movable member 102. The feed screw as the first Y-axis rail 106 is rotationally driven by the motor in response to the amount of movement of the first Y-axis movable member 101. The feed screw as the second Y-axis rail 105 is rotationally driven by the motor in response to the amount of movement of the second Y-axis movable member 102.

In the present invention, the inspection optical system 104 detects that the first defect group which is a defect detected by the inspection optical system 103 is more important as the second defect group. Then, as a result of the inspection by the computing device 301, the second defect group and the undetected first defect group are regarded as defects in the inspection.

The control unit 300 controls the inspection optical system moving mechanism that relatively moves the substrate 109 and the inspection optical system 103 placed on the placing portion in the X direction, and relatively moves the inspection optical system 103 and the inspection optical system 104 in the Y direction. Review the movement of the optical system moving mechanism. By the control of the control unit 300, the substrate 109 and the inspection optical system 104 are relatively moved in the X direction, and the position control of the inspection optical system 104 is performed in the imaging scan of the inspection optical system 103, and imaging is performed. This control mechanism 300 is composed of a computing device 301 having a microcomputer as a main part.

The composition of the computing device will be specifically described in terms of actions.

First, the operation of the imaging inspection apparatus 200 in the X direction will be described.

As shown in FIGS. 2(a) and 2(b), the inspection operation is performed by fixing the substrate 109 to the table of the imaging inspection apparatus 200, and moving the X-axis movable member 108 along 107 to cause the inspection optical system 103 and the overlay. The inspection optical system 104 moves in the X direction.

Here, the imaging inspection apparatus 200 will be described with reference to the configuration shown in Fig. 1, but the inspection optical system 103 and the inspection are fixed as shown in Fig. 3 and Figs. 4(a) and 4(b). The same applies to the case where the optical system 104 drives the substrate 109 to form the imaging inspection device 200. In the imaging inspection apparatus 200 of FIG. 3, the X-axis rail 112 is provided at intervals in the vicinity of the center of the table in the Y-axis direction, and the substrate 109 moves in the X-axis direction along the X-axis rail 112. The X-axis movable member 108 of the loading inspection optical system 103 and the inspection optical system 104 is fixed near the center of the table in the X-axis direction. On the other hand, imaging is performed while the substrate 109 passes through the inside of the X-axis movable member 108.

Further, in the case where the imaging inspection apparatus 200 moves the substrate 109 in the X-axis direction as shown in the fifth (a) and (b), the X-axis movable member 108 is moved in the X-axis direction. The inspection optical system 103 and the inspection optical system 104 are driven in the X-axis direction.

As shown in FIGS. 1 to 5, the substrate 109 and the inspection optical system 103 are relatively moved, and the substrate 109 is scanned in the X-axis direction.

Next, the operation of the imaging inspection apparatus 200 in the Y direction will be described.

Since the field of view of the inspection optical system 103 is generally smaller than the width of the substrate 109, the entire surface of the substrate 109 cannot be scanned in one operation. Therefore, in the imaging inspection apparatus 200 of the present invention, the X-axis mover 108 is moved in the X-axis direction while performing the pitch feed operation in the Y direction, and the entire surface of the substrate 109 is scanned by performing a plurality of scans. Therefore, the imaging inspection apparatus 200 of the present invention has a mechanism required for the inspection optical system 103 and the inspection optical system 104 to move in the Y direction.

The review optical system 104 of the imaging inspection device 200 will be described.

The review optical system 104 is disposed integrally with the inspection optical system 103 in the X direction. As shown in FIGS. 1 to 5, the review optical system 104 is provided separately from the inspection optical system 103 to have a mechanism movable in the Y direction. The movable range of the review optical system 104 is larger than the width of the substrate 109 in the Y direction.

Next, the operation of the review will be described.

The imaging of the inspection optical system 104 can be performed simultaneously with the inspection operation in the inspection optical system 103. When the scanning of the inspection in the inspection optical system 103 is in progress, as described above, in the X direction, the scanning inspection range is moved in a state where the substrate 109 and the inspection optical system 103 have relative speeds (hereinafter, the relative speed in the X direction). . Here, since the inspection optical system 104 is integrated with the inspection optical system 103 in the X direction, the inspection optical system 104 also moves in the inspection range in the same state as the relative speed of the substrate 109. That is, in the X direction, the field of view of the optical system 104 is examined to pass through the entire width of the substrate 109.

Further, in the case where the inspection optical system 103 and the inspection optical system 104 are disposed at positions shifted in the X direction, it is necessary to increase the range of movement of the inspection optical system 104 in the X direction by only the offset amount. Further, in the Y direction, the inspection optical system 104 itself has a moving mechanism, and since the movable range is larger than the substrate 109, the inspection optical system 104 can be moved to any position of the substrate 109.

In this manner, the review optical system 104 can capture any position of the substrate 109 into the field of view and take a picture. In the present embodiment, the inspection optical system 104 can perform imaging while being stationary in the Y direction, but cannot pass relatively statically between the substrate and the substrate 109 in the X direction. Therefore, imaging is performed by measuring the timing to obtain the first image. An image of a defect in a defect group.

Fig. 6 is a flow chart showing an example of the operation at this time.

First, in step S601, the inspection scan of the first row of the substrate 109 is performed using the inspection optical system 103. Depending on the configuration of the device, the position of the defect can also be grasped at an instant when the inspection optical system 103 passes over the defect of the substrate 109. However, here, in order to simplify the description, it is considered that the position of the defect located on the scanning line can be grasped at the time point when the inspection of the first line is completed. In step S601, the position of the defect is grasped and detected as the first defect group.

In step S602, and inspecting the scanning of the second line of the substrate 109 by the optical system 103, the position of the defect of the first defect group detected in step S601 is used to calculate the order in which the inspection optics is to be used. System 104 performs a review of the first row.

In addition, it is not necessary to review all the defects of the first defect group, and it is not necessary to review the defects of all the first defect groups. Therefore, in the defect of the first defect group to be inspected, the defect of the first defect group that can be checked is set with priority, and a review program table for moving the inspection optical system 104 is created. Specific examples of the production of the review program table will be described later.

When the preparation of the review schedule in step S602 is completed, in step S603, the inspection optical system 103 performs the inspection scan of the second row of the substrate 109 (step S603-a). In parallel with this inspection scan (step S603-a), the first defect group detected in the first row is overwritten based on the program table calculated and created in step S602 (step S603-b). After step S604, this repeating operation is performed while shifting one line one by one.

That is, in step S604, the defect of the first defect group that needs to be checked in the first defect group of the second row detected in step S603, and the defect detected in step S601 but not in step S603-a are not covered. The set of the first defect group merged by the defects of the first defect group in the first row is checked, and the review procedure table is calculated. Here, although it is detected in step S601, the defect of the first defect group in the first row which is not checked in step S603-a is the first defect which is not checked due to the relationship of the program table despite the need for review. group.

In step S605, the inspection scan of the third row (step S605-a) and the review of the first row and the second row of the schedule created in step S604 are simultaneously performed (step S605-b). The same applies to step S606 and step S607.

That is, in step S606, the reviewer is required in the first defect group of the third row detected in step S605, and the detected in step S601, step S603-a, and step S605-a is required to be overwritten. The set of the first defect group combined with the first defect group of the first to third rows that have not been checked due to the relationship of the program table is checked, and the review procedure table is calculated.

In step S607, the inspection scan of the fourth row (step S607-a) and the review of the first to third rows of the schedule created in step S606 are simultaneously performed (step S607-b).

Step S608 indicates the action of the last line (Nth line) in the checking operation.

In the present embodiment, since the position of the defect of the first defect group in the last row cannot be determined until the end of the inspection scan, the defect of the first defect group detected by the scanning line cannot be checked at the same time as the inspection. Therefore, in the first defective group to be checked after the end of the scan inspection in the last row, there is a case where the unfinished defect is overwritten, and in step S609, a general review which is not performed in parallel with the inspection scan is performed.

The locus of the operation of the inspection optical system 103 is shown in Fig. 8(a).

Reference numeral 701 denotes a locus of the scanning first line of the inspection optical system 103, 706 denotes an area inspected by scanning the first line, and 705 indicated by a black circle indicates the detected first defect group. Similarly, 702 to 704 are tracks of the second to fourth lines of the scanning of the inspection optical system 103, and 707 to 709 are areas examined by the second to fourth lines of scanning.

The trajectory of the operation of the inspection optical system 104 is shown in Fig. 8(b).

710 is the trajectory of the second line of the scanning of the optical system 104, 711 is the trajectory of the third line of the scanning of the optical system 104, and 712 is the trajectory of the fourth line of the scanning of the optical system 104.

Further, in the eighth (a) and (b) drawings, the inspection is performed by scanning four times in total four times. As in the example shown in Fig. 6, at the time point when each scan ends, it is regarded as the position at which the defect of the first defect group of the previous scan line can be grasped. In this case, the first defect group that can be checked simultaneously with the scan of the Nth line is the one detected before the Nth line (the (N-1)th line). In fact, the timing at which the position of the defect of the first defect group can be grasped is various in accordance with the configuration.

Explain the specific examples of the production review schedule.

From the purpose of performing the review simultaneously with the scan of the inspection, it is understood that the order of the review is uniquely determined by the coordinates of the first defect group. Regarding each of the first defect groups, since there are two types of review or no review, there are 2 ^N combinations in the review program table when the N first defect groups are reviewed. That is, using the mark O of Landau, it can be said that the calculation amount for obtaining the review program table is O(2 ^N ). In general, when it is considered that the number of defects of the first defect group to be created in the review program table is about 1000, it is not practical to check the program list for all the inspections, and it is necessary to emphasize some high-efficiency means. As the high-efficiency means, first, it is indicated that the calculation procedure for N times is used, that is, the method of determining the defect schedule for the defects of the N first defect groups by the calculation amount of the level of O(n).

The detected defects each have a feature amount. The feature quantity is a numerical value indicating the various properties of the defect. This feature amount is, for example, a reflectance or area of a defect, a shape, a coordinate of a defect, or the like. Based on this feature amount, it is determined in advance which defects are preferentially checked in the first defect group. For example, a defect having a large area is prioritized, a defect having a small reflectance is prioritized, and the like. Then, a path that maximizes the number of defects that can be examined in the first defect group can be obtained.

In the case where it is not desired to set a priority order for the defect to be inspected, that is, if it is desired to randomly determine the defect of the review regardless of the feature amount, the random number is previously taken as the feature amount. Therefore, it is considered that the defect having a large feature amount according to the random number is prioritized. Further, two or more feature quantities may be used to determine the priority order. In the following, for the sake of convenience of explanation, an example of a review program table in which a defect having a large value of the feature amount is preferentially checked is created for only one type of feature amount.

A list of the first defect group that has not been detected in the first defect group that has been detected (hereinafter referred to as a list of the review program table) is as shown in FIG. 9, indicating that the first defect group is defective 801, 802, 803, An example of a situation in which four of 804 are formed. The priority of shooting defects is also in this order.

Fig. 7 shows an example of the first half of the processing flow of the program creation shown in Fig. 6.

Here, the processing is performed from the defect with the highest priority. Initially, nothing is included in the list of review schedules (step S1). First, in the first defect group, the defect 801 which is the defect with the highest priority is added to the list of the review program table. Thus, the list of review schedules consists of only one defect 801. Fig. 10 shows the situation at this time. If the object to be reviewed is only one, the object can of course be reviewed. This is because the inspection optical system 104 is moved to the position of the defect in advance. At this time, the trajectory taken by the inspection optical system 104 is indicated by an arrow 901.

Next, the defect 802 of the second priority is added to the list of the check program table (step S2). That is, the list of review programs is composed of two defects 801 and 802. This list is shown in Figure 11. In the case where a new defect is added to the list of the check program table, the coordinates of the inspection scan axis in which the defect is made become the order of the position of the inspection optical system 104 at the time of starting the review. Before and after the added defect 802, it is determined whether or not the inspection optical system 104 is movable (step S3). Reviewing whether the optical system 104 is movable is determined based on the motion performance of the axis to which the inspection optical system 104 is mounted, that is, the maximum speed or acceleration, the speed of the inspection scan axis, and the distance between the defects. That is, the distance from the axial direction of the inspection optical system 104 and the inspection opticals from the two defects are obtained as the arrival time (set to t1) with respect to the distance from the inspection scan direction of the two defects and the speed of the inspection scan axis. The relationship between the arrival time (set to t2) obtained by the exercise performance of the system 104 is the following equation (1), and the review optical system 104 is movable. In addition, d is the marginal time.

T1>t2+d Equation (1)

In the example shown in FIG. 11, the review optical system 104 can move from the defect 801 to the defect 802. In the case where the defect of the list of the added procedure table is added before and after (in the case where only one of the front or the back is present), the added optical system 104 can also move, and the added defects remain in the list of the review program table ( Step S6). At this time, the trajectory taken by the inspection optical system 104 is indicated by an arrow 1001.

Similarly, the defect 803 of the third priority is added to the list of review procedures. That is, the list of review programs is composed of three defects 801, 803, and 802. This list is shown in Figure 12.

As before, it is determined whether or not the inspection optical system 104 is movable before and after the defect 803 added to the list of review schedules. In this example, since the defect 801 and the defect 803 have a short distance in the inspection scanning direction, the inspection optical system 104 cannot move from the defect 801 to the defect 803. Conversely, the inspection optical system 104 can be moved from the defect 803 to the defect 802. The trajectory taken by the inspection optical system 104 is indicated by an arrow 1101. The trajectory that cannot be moved is indicated by a broken line.

In the case where the review optical system 104 cannot move one or both of the defects before joining the defect list list, the added defect (here, 803) is deleted from the review program list (step S4). That is, the list of the review program table is returned to the state of Fig. 11.

By repeating this processing (step S5), a list of review procedures for N defects in the first defect group can be obtained by the loop processing of N times. The result of the processing is shown in Fig. 13. At this time, the trajectory taken by the inspection optical system 104 is indicated by an arrow 1201.

However, the program table obtained by this method is bound by the priority order of the feature quantity. For example, as shown in FIG. 14, by reviewing the defect 1301 whose priority order is the fifth, it is assumed that the priority is the sixth defect 1302, the priority order is the seventh defect 1303, and the priority order is the eighth defect 1304. The priority is the ninth defect 1305, and the five defects having the priority order of the 10th defect 1308 are all undetectable. In the above-described method, a program table shown by the track 1307 in which the priority order of the fifth defect 1301 is checked is obtained. However, since the opportunity to review the defect is repeated several times per round trip in the inspection optical system, the overlay of the five defects 1302, 1303, 1304, 1305, 1308 from the sixth to the tenth is performed as indicated by the trace 1308. Check, and the defect of the fifth priority, 1301, is checked in the next time or after the inspection scan, and there are cases where many defects can be checked as a whole (can be covered in the first defect group) The number of defects found becomes the largest case).

In order to review more defects, an example is shown which can be improved by recalculating the schedule for the temporarily obtained review schedule.

First, an example is given to quantitatively evaluate the merits of the obtained review schedule, and in order to compare several review schedules, the evaluation value of the review schedule is calculated. As the evaluation value of the review program table, for example, there is a sum of the feature amounts of the defects of the review object. In the case of a priority review of a defect with a large feature amount, it can be said that the larger the evaluation value is, the more excellent the schedule is. In addition, if the number of defects of the object to be inspected is more and more excellent, the number can be used as an evaluation value. Of course, you can combine them. If the sum of the feature quantities is P and the number of defects of the review object is N, the evaluation value E of the review procedure table is defined as the following formula (2), and can be combined by appropriately determining the coefficients k and j. Both.

E=k×P+j×N Equation (2)

In the case of preferentially reviewing a defect having a large feature amount, k is set to a positive number, and k is set to a negative number in the case of preferentially overseeing a defect having a small feature amount. j is always set to 0 or a positive number. In this way, it can be said that the review program table in which the evaluation value E is larger is the more excellent the program table.

Fig. 15 shows a specific example of using the quantitative evaluation review procedure table to efficiently obtain a review procedure table with high evaluation. This flow will be described in the case where the number of defects of the first defect group is 20. Further, this flow is executed in steps S604, S606, and S609 shown in FIG.

In step S1401, the program table is calculated based on the above-described seventh map for these 20 defects, and the obtained program table is set to S1. This situation is shown in Fig. 16. Here, there are six defects that are to be examined, and each is set to 1501 to 1506 in the order of review. The remaining 14 defects that are not the object of the review are collectively referred to as the first defect group 1507.

In step S1402, the evaluation value of the program table S1 is calculated based on the formula (2). The calculated result is set to E1.

In step S1402-1, in step S1403, a review program table in which the defect 1501 of the first review target is excluded (when the defect 1501 does not exist) is created as described above. Set the created program table to S2.

In step S1404, the evaluation value of the program table S2 is calculated based on the equation (2). The calculated result is set to E2.

At step S1405, E1 and E2 are compared. Thereby, the case where the defect 1501 is checked is stopped, and several of the first defect group 1507 can be checked, and as a result, it is investigated whether or not the review program table having the higher evaluation value cannot be obtained. Fig. 17 shows the situation at this time. In this example, the defects 1601, 1602, 1603 can be re-examined by stopping the review of the defect 1501.

In the comparison result of step S1405, in the case where the program table S1 is a program table superior to the program table S2, the review of the defect 1501 should not be stopped. In this case, the process returns to step S1403 via steps S1405-1 and S1405-2, and the next defect 1502 is processed in the same manner.

Further, in step S1405-1, N is incremented by one, and in step S1405-2, it is determined whether N at that time is the number of defects to be the object of the review program table, and N is not the number of defects of the object of the review program table. In the case, it returns to step S1403.

In the comparison result of step S1405, in the case where the program table S1 is a program table superior to the program table S2, it is preferable to stop the inspection of the defect 1501. In this case, the process returns to step S1402-1 via steps S1406 and S1407.

In step S1406, the defect 1501 is deleted from the first defect group which is the object of the review program table.

In step S1407, the program table S1 is replaced with the program table S2, and the evaluation value E1 is replaced with the evaluation value E2, and the processing is again performed from the initial defect.

By sequentially processing to the final defect 1506, an excellent review schedule can be obtained. The number of defects to be the object of the program table is n, and the number of defects that can be checked in the initial inspection program table is m, and the calculation amount of the means shown here is O(n×m). . Customization knows, n≧m. Since the axis moving speed of the review optical system 104 is a determined rate, it is generally n>>m. However, in the case where n is a small value, this is not limited. That is, although the case where the calculation amount is the worst is the level of O(n ² ), since most of the cases are close to the level of O(n), the algorithm shown here can be excellent with a small amount of calculation. Program table.

While the opportunity to review the optical system 104 for photographing defects is related to the location of defects on the substrate 109, it is generally a plurality of times. This is because the inspection optical system 103 and the inspection optical system 104 scan the substrate 109 a plurality of times in the X direction. Since the chances of the inspection optical system 104 being able to take a defect detected by scanning at an earlier time are more than the chance of detecting a defect detected at a later time, it can be simultaneously with the inspection of the inspection. The possibility of review is high. That is, the defect detected in the last scan (the defect of the last line) is less likely to be checked at the same time as the scan of the inspection.

Moreover, it is difficult for the review optical system 104 to capture defects on the same line that are close to each other in the X direction between scans. This is because the speed or acceleration of the Y-direction moving mechanism of the review optical system 104 is a prescribed rate. That is, the degree of completion of the inspection at the end of the inspection scan is mainly dependent on the distribution state of the defect on the substrate 109, the inspection scanning speed in the X direction, and the motion performance of the inspection optical system 104 in the Y direction. In the first defect group, the defects that cannot be checked at the same time as the inspection scan may be photographed one by one by the inspection optical system 104 after the inspection is completed as in the past.

As also mentioned before, when the inspection optical system 104 is photographed, it is photographed while moving in the X direction. If the movement can be temporarily stopped, although it is advantageous for the inspection optical system 104, it is often difficult. This is because, in the case where the inspection optical system 103 uses an image sensor of a line sensor or a TDI (Time Delay Integration) operation, the relative speeds of the substrate 109 and the inspection optical system 103 are kept constant. The nature is better. In the method of not affecting the image obtained by the inspection optical system 103, it is difficult to stop the operation in the X direction or slow down the speed in the middle of scanning. Also, if the speed is slowed down, of course, the time required for the inspection increases.

When shooting is performed with the relative speed in the imaging of the review optical system 104 (photographed while moving), the subject vibrates in the captured image. Therefore, countermeasures against the vibration of the subject are required. Here, the degree of vibration of the subject is determined based on the relative speed in the X direction, the resolution of the inspection optical system 104, and the exposure time of the inspection optical system 104. The greater the relative velocity in the X direction, the smaller the resolution of the optical system 104 is examined, and the longer the exposure time, the greater the vibration of the subject that occurs.

On the contrary, as long as the relative speed in the X direction is not zero, the subject vibration cannot be eliminated. The countermeasure against the vibration of the subject means that the influence of the vibration of the subject is not perceived, or is reduced to such an extent that it can be regarded as having no effect in practical use.

As a result of various experiments, it is found that if the relative speed is V [m/s], the resolution of the inspection optical system 104 is R [m/pix], and the exposure time of the camera of the optical system 104 is checked (or in the camera) The time during which the illumination is illuminated during exposure is the same as T[s], and the upper limit of the relative speed of the inspection optical system 104 and the substrate 109, which is incapable of detecting the vibration of the subject, is expressed by the following formula (3).

V=(0.5×R)/T Equation (3)

For example, if the resolution R of the inspection optical system 104 is 0.5 × 10 ^-6 [m/pix] (= 0.5 [μm / pix]), the exposure time T is 1 × 10 ^-3 [s] (=1 [ Ms]), if the relative speed is made larger than the relative speed V = 0.00025 [m/s], that is, V = 0.25 [mm/s], the subject vibrates.

However, since the inspection optical system 103 generally operates at a relative speed of 100 [m/s] or more, the subject is vibrated, and some countermeasure is required. As a countermeasure against this, it is known from the above formula (3) that it is thought possible to shorten the exposure time of the camera that reviews the optical system 104. When the exposure time is shortened, it is possible to capture an image in which the subject is not vibrated while satisfying the relative speed V required for the inspection operation. For example, when 100 [m/s] is obtained as the relative speed V, the exposure time T may be 2.5 [μs] or less calculated from the equation (3). Specifically, a short exposure time can be achieved by using an electronic shutter or the like for the camera that reviews the optical system 104.

However, simply shortening the exposure time will result in a darker image. Regarding this problem, it can be seen that it can be solved by using a high-sensitivity camera or using high-intensity illumination, but it is expensive to obtain a camera with high sensitivity, and even if the camera is used, it is difficult to set the exposure time to 10 [μs]. the following. Moreover, the high-intensity illumination is still the same, and there is also concern about improving the adverse effect of the illumination on the object to be inspected.

Therefore, in the present embodiment, not only the exposure time is shortened but also the flash illumination represented by the flash is used. If this flash illumination is used, since the illumination time can be shortened, the same effect as in the case of shortening the exposure time can be obtained in continuous light illumination. In the case where the flash has a flash speed of about 1 [μs], the amount of light per unit time is also large. Therefore, by combining such a flash lamp and a camera of general sensitivity, an image in which the subject is not vibrated can be photographed even at a relative speed V = about 500 [mm/s]. Also, for the same purpose, it is also possible to use a laser in illumination. In this case, a shorter flash time can be achieved, and the amount of light per unit time is also large.

Further, it is also possible to adopt a configuration in which the defect can be corrected simultaneously with the inspection by using laser light or a device which can correct the defect of the object to be inspected.

(Second embodiment)

Fig. 18 and Figs. 19(a) and (b) show a second embodiment of the present invention.

In the first embodiment described above, as shown in FIGS. 1 to 5, the inspection optical system 103 and the inspection optical system 104 are configured to independently move in the Y direction, and the inspection optical system 104 is configured to move the substrate 109. The entire width is different in the second embodiment in that the inspection optical system 104 is relatively moved in the Y direction with respect to the inspection optical system 103.

That is, on the first Y-axis movable member 101 of the loading inspection optical system 103, the inspection optical system 104 is mounted to move in the Y direction within the range of the first Y-axis movable member 101. Further, the moving mechanism in the Y direction of the inspection optical system 104 is larger than the range in the Y direction in which the inspection optical system 103 can scan at one time.

According to this configuration, even if the movable range of the Y-direction moving mechanism included in the optical system 104 is narrow, the entire width of the substrate 109 can be photographed by the inspection optical system. Therefore, even in the inspection optical system 104, When the moving range of the moving mechanism in the Y direction is small, the chance that the inspection optical system 104 can capture the defect of the first defect group is not reduced.

(Third embodiment)

20(a) and (b) show a third embodiment of the present invention.

In the second embodiment, the moving mechanism of the inspection optical system 104 in the Y direction is larger than the range in the Y direction in which the inspection optical system 103 can scan at one time. However, in the third embodiment, the inspection optical system 104 should be the minimum. The Y-direction moving mechanism and the inspection optical system 103 have the same range of the Y direction that can be scanned at one time.

According to this configuration, the chance that the review optical system 104 can take a defect of the first defect group is once.

(Fourth embodiment)

Fig. 21 and Figs. 22(a), (b), 23, and 24(a), (b), 25, and 26 show a fourth embodiment of the present invention, respectively.

In each of the above-described embodiments, the inspection optical system 103 and the inspection optical system 104 are each singular. However, in the fourth embodiment, the inspection optical system 103 and the plurality of inspection optical systems 104 are provided. different.

In the first embodiment of the fourth embodiment shown in Fig. 21 and Figs. 22(a) and (b), four Y-axis movable members 101-1, 101-2, 101-3, and 101-4 are provided. Above the X-axis movable member 108, the first inspection optical system 103-1 is disposed on the Y-axis movable member 101-1. The second inspection optical system 103-2 is disposed on the Y-axis movable member 101-1. The third inspection optical system 103-3 is disposed on the Y-axis movable member 101-1. The fourth inspection optical system 103-4 is disposed on the Y-axis movable member 101-4. Further, two Y-axis movable members 102-1 and 102-2 are provided on the X-axis movable member 108. The first review optical system 104-1 is disposed on the Y-axis movable member 102-1. The second review optical system 104-2 is disposed on the Y-axis movable member 102-2.

In the first embodiment, the Y-axis movers 102-1 and 102-2 of the fourth embodiment are configured to move over the common inspection optical system Y-axis 105, but in FIGS. 23 and 24(a), (b) In the second embodiment of the fourth embodiment shown in the drawing, the inspection optical systems Y-axis 105-1 and 105-2 are arranged side by side at intervals. The Y-axis movable member 102-1 is configured to move over the inspection optical system Y-axis 105-1, and the Y-axis movable member 102-2 is configured to move over the inspection optical system Y-axis 105-2. It is different from the first embodiment. In this case, by moving the Y-axis movable members 102-1, 102-2, the first review optical system 104-1 and the second review optical system 104-2 can sequentially photograph the entire width of the substrate 109.

In the third embodiment shown in Figs. 25(a) and (b), the inspection optical systems Y-axis 105-1 and 105-2 are arranged to be shifted in the Y-axis direction, and the first inspection optical is used. System 104-1 and second review optical system 104-2 cover the entire width of cover substrate 109.

As shown in the first to third embodiments of the fourth embodiment, the actual inspection apparatus includes a plurality of inspection optical systems 103 and a plurality of inspection optical systems 104, and is configured as an inspection optical system 103 and The review optical system 104 may be independently movable in the Y direction, and may have a mechanism that can move the entire width of the substrate 109 as a whole. Further, it is also possible to check that the number of the optical system 103 and the inspection optical system 104 are different.

Further, as shown in the fourth embodiment of the fourth embodiment shown in Figs. 26(a) and (b), the second review optical system 104-2 and the third review optical system 104- may be used. A plurality of review optical systems 104 are disposed on the Y-axis 105-2 of the inspection optical system. In the case where a plurality of review optical systems 104 are disposed on the same axis, it is necessary to consider that the inspection optical systems 104 do not collide with each other.

To this end, a plurality of review optical systems 104 may determine the range of the respective inspections of the substrate 109 in advance, or may be controlled by electrical or mechanical methods so as not to collide. Of course, in the case where the inspection optical system 103 is one set, it is also possible to increase the probability of simultaneous inspection with the inspection scan by providing a plurality of inspection optical systems 104 as described above.

(Fifth Embodiment)

Fig. 27 is a view showing a fifth embodiment of the present invention.

In the first embodiment of the fourth embodiment shown in FIG. 20 and FIGS. 21(a) and (b), the review optical system Y-axis 105 is provided with a plurality of inspection optical systems 104, but In the fifth embodiment of the fifth embodiment, only the single inspection optical system 104 is provided on the inspection optical system Y-axis 105, and the inspection optical system 104 can move over the entire width of the substrate 109. Different.

(Sixth embodiment)

The 28th (a), (b), and 29th (a) and (b) drawings each show a sixth embodiment of the present invention.

In the sixth embodiment of the sixth embodiment shown in Figs. 28(a) and (b), the Y-axis movable member 101 is moved along the first Y-axis rail 106 provided on the upper surface of the X-axis movable member 108, The first inspection optical system 103-1 and the second inspection optical system 103-2 are disposed at intervals. The first and second inspection optical systems Y-axis 105-1 and 105-2 are arranged side by side in the Y-axis movable member 101 at intervals. The first review optical system 104-1 is disposed on the Y-axis 105-1 of the first review optical system. The second review optical system 104-2 is disposed on the second review optical system Y-axis 105-2.

In the seventh embodiment of the sixth embodiment shown in Figs. 29(a) and (b), the first and second review optical systems 104-1 and 104-2 are configured along a common first review. The movement of the optical system Y-axis 105-1 is different from that of the sixth embodiment of the sixth embodiment.

In the sixth embodiment and the seventh embodiment of the sixth embodiment, when the first and second inspection optical systems 104-1 and 104-2 are mounted as a plurality of inspection optical systems, Similarly to the description of the second embodiment shown in Fig. 18 and Figs. 19(a) and (b), a moving mechanism having a narrow moving range can be used.

(Seventh embodiment)

Fig. 30 is a view showing a seventh embodiment of the present invention.

As described in the first embodiment shown in FIGS. 1 to 17 , in order to check that the optical system 104 is photographed without causing the substrate 109 to stand still, it is necessary to measure the vibration of the subject. The method described in the first embodiment can be used as a countermeasure. However, in the seventh embodiment, in order to reduce the influence of the vibration of the subject, the moving optical system 104 is provided with a moving mechanism in the X direction. It is different from the first embodiment.

The moving mechanism for reviewing the optical system 104 in the X direction is to drive the moving mechanism in a direction toward the relative speed of the offset substrate 109 and the inspection optical system 104 during the imaging of the inspection optical system 104.

In Fig. 30, 111 shows the relative speed and direction of the substrate 109 and the inspection optical system 104. Since the relative speed and the direction 111 are known, in the seventh embodiment, in order to reduce the influence of the vibration of the subject, the inspection optical system 104 has the same speed and relative speed and the direction 111 and the direction is opposite 110. The offset speed can be driven.

Specifically, the moving mechanism can be realized by a mechanism that drives both the substrate 109 and the optical system as shown in FIG. Further, since the moving mechanism can move in the X direction by reviewing the center of the field of view of the optical system 104, it is not necessary to use a parallel moving mechanism in the X-axis direction, and for example, the tilting of the inspection optical system 104 can be utilized. A mechanism that enables the center of the field of view to be realized.

Industrial applicability

The present invention can contribute to an increase in productivity of a large substrate used in a liquid crystal display device, a plasma display device, a solar cell, or the like.

200. . . Camera inspection device

300. . . Control mechanism

301. . . Computing device

101. . . First Y-axis movable member

102. . . Second Y-axis movable member

103. . . Inspection optical system

104. . . Review optical system

105. . . Second Y-axis orbit

106. . . First Y-axis

107. . . X-axis track

108. . . X-axis movable parts

109. . . Substrate

110. . . Offset speed and direction

111. . . The relative speed and direction of the substrate 109 and the review optical system 104

701. . . Check the trace of the first line of the scan of the optical system

702~704. . . Check the trajectory of the 2nd to 4th lines of the scanning of the optical system

705. . . defect

706. . . In the area checked by the first line of the scan

707~709. . . Scanning the area checked in the 2nd to 4th lines

710. . . Review the trace of the second line of the scan of the optical system

711. . . Review the trace of the third line of the scan of the optical system

712. . . Review the trace of the fourth line of the scan of the optical system

801, 802, 803, 804. . . defect

901, 1001, 1101, 1201. . . Review the trajectory of the optical system

P. . . Sum of feature quantities

N. . . Review the number of first defect groups of the object

E. . . Appraised value of the program table

Fig. 1 is a perspective view of an imaging inspection apparatus in which an inspection optical system according to a first embodiment of the present invention is moved.

2(a) and 2(b) are a schematic view and a side view of the front side of the imaging inspection apparatus according to the first embodiment of the first embodiment.

Fig. 3 is a perspective view of the imaging inspection apparatus in which the object to be inspected is moved in the first embodiment.

4(a) and 4(b) are a schematic view and a side view of the front surface of the image-inspecting apparatus of the third embodiment of the first embodiment.

5(a) and 5(b) are a schematic view and a side view of the front surface of the image inspecting apparatus of the first embodiment.

Fig. 6 is a flow chart at the time of inspection and review in the first embodiment.

Figure 7 is a flow chart showing the first half of the processing flow of the program creation.

Figs. 8(a) and 8(b) are views showing the trajectory of the inspection optical system and the inspection optical system of the first embodiment.

Figure 9 is a diagram showing a list of the first defect groups that have not been closed.

Fig. 10 is a view showing a state of the first defect group list (one defect number) in the middle of the creation of the program table.

Fig. 11 is a view showing a state of the first defect group list (two defects) in the middle of the creation of the program table.

Fig. 12 is a view showing a state of the first defect group list (three defects) in the middle of the creation of the program table.

Figure 13 is a state diagram showing a list of the first defect groups in which the program table creation has ended.

Fig. 14 is an explanatory diagram showing an example in which many first defect groups cannot be inspected by reviewing a certain defect group.

Figure 15 is a flow chart of a program for calculating higher efficiency.

Fig. 16 is an explanatory diagram of a program table to be improved.

Fig. 17 is an explanatory diagram showing a state in which the program table is improved.

Figure 18 is a perspective view of an imaging inspection apparatus according to a second embodiment of the present invention.

19(a) and 9(b) are a schematic view and a side view of the front side of the imaging inspection apparatus according to the second embodiment.

20(a) and (b) are a schematic view and a side view of the front side of the imaging inspection apparatus according to the third embodiment of the present invention.

Figure 21 is a perspective view of an imaging inspection apparatus according to a first embodiment of the fourth embodiment of the present invention.

22(a) and (b) are a schematic view and a side view of the front surface of the image pickup inspection apparatus according to the first embodiment of the fourth embodiment.

Fig. 23 is a perspective view of the imaging inspection apparatus according to the second embodiment of the fourth embodiment.

Figs. 24(a) and (b) are a schematic view and a side view of the front surface of the image pickup inspection device according to the second embodiment of the fourth embodiment.

25(a) and (b) are perspective views of the imaging inspection apparatus according to the third embodiment of the fourth embodiment.

26(a) and (b) are a schematic view and a side view of the front surface of the image-inspecting apparatus according to the third embodiment of the fourth embodiment.

(a) and (b) are a schematic view and a side view of the front surface of the imaging inspection apparatus according to the fifth embodiment of the present invention.

(a) and (b) are a schematic view and a side view of the front surface of the imaging inspection apparatus according to the sixth embodiment of the sixth embodiment of the present invention.

(a) and (b) are a schematic view and a side view of the front surface of the imaging inspection apparatus according to the seventh embodiment of the sixth embodiment.

Figure 30 is a view for explaining control of a moving mechanism in a seventh embodiment of the present invention.

Figure 31 is a perspective view of a conventional imaging inspection apparatus.

Fig. 32 is a perspective view showing a conventional imaging inspection apparatus of a conventional example.

101. . . First Y-axis movable member

102. . . Second Y-axis movable member

103. . . Inspection optical system

104. . . Review optical system

105. . . Second Y-axis orbit

106. . . First Y-axis

107. . . X-axis track

108. . . X-axis movable parts

109. . . Substrate

200. . . Camera inspection device

300. . . Control mechanism

301. . . Computing device

Claims (11)

An imaging inspection apparatus comprising: a mounting portion on which an inspection object is placed; and an inspection optical system that images the inspection object and detects defects as a first defect group; and inspects an optical system moving mechanism to check the optical system And the inspection optical system relatively move in the X direction; the inspection optical system captures the first defect group detected by the inspection optical system, and detects the defect as the second defect group; and reviews the optical system moving mechanism, And moving the inspection optical system and the inspection optical system relative to each other in the Y direction orthogonal to the X direction while moving the inspection object and the inspection optical system in the X direction; and controlling the mechanism In the imaging of the inspection optical system, the inspection optical system captures the first defect group, and detects the second defect group and the first defect group photographed by the inspection optical system as a defect. The imaging inspection apparatus according to claim 1, wherein the relative movement amount of the inspection optical system in the Y direction is equal to the relative movement amount of the inspection optical system in the Y direction. The image inspection apparatus according to claim 1, wherein the inspection optical system and the plurality of inspection optical systems are provided; in the Y direction, the inspection optical system is independent from the inspection optical system The ground can move over the entire width of the object under inspection. The image inspection apparatus of claim 1, wherein the inspection optical system and the inspection optical system are; in the Y direction, the inspection optical system is independently detectable from the inspection optical system The entire width of the object moves. The image inspection apparatus of claim 1, comprising a plurality of the inspection optical system and the plurality of inspection optical systems; in the Y direction, the plurality of inspection optical systems can relatively move the inspection optical system . An imaging inspection method for moving an inspection optical system and a review optical system relatively in the X direction on the inspection object while moving in the Y direction, and photographing the imaging result according to the inspection optical system by the inspection optical system Detecting a defect of the first defect group to detect a defect of the second defect group, and in the imaging inspection method, each time the inspection optical system ends a scan in the Y direction, the first detected is up to that time A defect in the defect group that is not photographed by the inspection optical system is used to calculate a camera image by the inspection optical system in such a manner that the number of defects that can be captured by the inspection optical system becomes the largest. a program table; the next scan in the Y direction of the inspection optical system causes the review optical system to perform imaging based on the review schedule. For example, the camera inspection method of claim 6 of the patent scope, wherein the review process The calculation of the sequence table determines the priority order based on the detected feature quantity of the defect of the first defect group, and then calculates the evaluation value according to the priority order and the number of defects, and is maximized by the evaluation value. Calculation. The image inspection method of claim 6, wherein the feature quantity of the defect of the first defect group includes at least one of a reflectance, an area, a shape, and a coordinate of the defect. For example, in the image inspection method of claim 6, wherein the calculation of the review program table compares the first program table and the second program table, and calculates a program table having a high evaluation value as a review program table, and The first program table determines a priority order based on the detected feature quantity of the defect of the first defect group, and then calculates an evaluation value of the program table according to the priority order and the number of defects, and is maximized by the evaluation value. It is calculated that the second program table excludes the defect having the higher priority from the first program table, and then calculates the evaluation value based on the priority order and the number of defects, and calculates the evaluation value to be the largest. The image inspection method of claim 7, wherein the sum of the detected feature amounts of the plurality of defects is P, and the number of detected defects is N, according to The evaluation value E of the program table is calculated by the following formula (2), and the program table having the large evaluation value E is calculated as the review program table, E=k×P+j×N (2), and k is P The weighting factor, j is the weighting factor of N. A camera inspection method, a first defect group detecting step of photographing the object to be inspected by the inspection optical system while detecting the object and the inspection optical system in the X direction, and detecting the defect as the first defect group; While the object to be inspected and the inspection optical system are relatively moved in the X direction, the defect detected by the first defect group detecting step is captured by the inspection optical system, and the defect is detected as the second defect group; a defect detecting step of detecting the second defect group and the first defect group not photographed in the review step as a defect; the inspection optical system and the inspection optical system independently moving relative to each other in the X direction, The Y direction orthogonal to the X direction is relatively moved cooperatively, and the first defect group detecting step and the review step are simultaneously performed.