TWI444121B - Method for manufacturing printed circuit board - Google Patents

Description

Circuit board manufacturing method

The present invention relates to the field of circuit board manufacturing, and in particular, to a method for fabricating a circuit board.

Printed circuit boards have been widely used due to their high assembly density. For application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima,M.Res.Lab,High density multilayer printed circuit board for HITAC M-880,IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425.

In the manufacturing process of the flexible circuit board, it is necessary to fit the accessories in some areas of the flexible circuit board, such as steel sheets, reinforcing sheets or adhesives. However, since a flexible circuit board is usually fabricated using a substrate including a plurality of circuit board units during fabrication. The plurality of circuit board units are typeset in the substrate to achieve the purpose that the substrate can be arranged with more circuit board units. The accessories are usually only attached to a portion of each board unit, so the size of the accessory is typically smaller than the size of the board unit. Before the parts are molded, in order to realize the one-to-one correspondence with the circuit board units in the whole substrate, the distance between adjacent parts is large, the typesetting utilization rate is not high, and the manufacturing cost of the circuit board is relatively high. high. Intensive typesetting means that the parts need to be formed by hand and then attached to the corresponding circuit board unit, which wastes a lot of labor and time, and the board production efficiency is low.

In view of this, it is necessary to provide a method of manufacturing a circuit board to improve the efficiency of board fabrication and reduce the cost of board production.

A method of manufacturing a circuit board, comprising: providing at least two circuit board substrates, the circuit board substrate comprising a plurality of circuit board units, each of the circuit board units having a bonding area; providing a circuit board substrate One surface of the circuit board substrate is adhered with an adhesive layer, and the other opposite surface is bonded with a carrier sheet, and the circuit board substrate has a molding area corresponding to a plurality of the circuit board units, one for each The molding area includes at least a first bonding unit and a second bonding unit, and the first bonding unit and the second bonding unit have the same shape as the bonding area of the corresponding circuit board unit, and each of the forming units is formed. The arrangement manner of the first bonding unit in the area and the arrangement manner of the second bonding unit are the same as the arrangement of the bonding area; the circuit board substrate to which the adhesive layer and the carrier sheet are attached is punched Forming an opening in the circuit board substrate and the adhesive layer along an edge of each of the first bonding unit and the second bonding unit, such that each first bonding unit and each second bonding unit Separated from the board substrate but still adhered to the carrier Providing a first jig and a second jig, the first jig and the second jig respectively corresponding to a shape of the circuit board substrate, wherein the first jig is used for positioning the circuit board substrate and the circuit board substrate, The second jig is formed with a plurality of pressing protrusions corresponding to the plurality of bonding areas; positioning a circuit board substrate and the circuit board substrate on the first jig so that the bonding area of the circuit board substrate And the first bonding unit of the circuit board substrate overlaps one by one, the adhesive layer is in contact with the circuit board substrate; and the second jig is placed on the circuit board substrate and the circuit board substrate on the first jig And applying pressure, each pressing protrusion corresponds to one bonding area, so that each first bonding unit is correspondingly attached to one bonding area and separated from the carrier sheet to obtain a fitting-attached component. a circuit board substrate; positioning another circuit board substrate and the circuit board substrate on the first jig, so that the bonding area of the circuit board substrate And the second bonding unit of the circuit board substrate overlaps one by one, the adhesive layer of the circuit board substrate is in contact with the circuit board substrate; and the circuit board substrate of the second jig is placed on the first jig and Pressure is applied to the substrate of the circuit board, and each of the pressing protrusions corresponds to one of the bonding areas, so that each of the second bonding units is correspondingly attached to one of the bonding areas, and is separated from the carrier sheet to obtain another A circuit board substrate with accessories attached.

The manufacturing method of the circuit board provided by the technical solution is based on the layout of the circuit board unit. By using the first jig and the second jig for alignment, it is realized that the arrangement of the components and the arrangement of the circuit board units are not one-to-one correspondence, and the entire circuit board substrate can be simultaneously bonded. Compared with the manual one-to-one bonding method, the efficiency of circuit board production is improved. Compared with the arrangement of the components and the arrangement of the circuit board unit, the whole substrate is used for the simultaneous bonding, which increases the utilization rate of the component layout and reduces the cost of the circuit board production.

110‧‧‧Circuit board

111‧‧‧Circuit unit

1111‧‧‧Fitting area

112‧‧‧ scrap area

113‧‧‧First alignment hole

120‧‧‧Circuit board substrate

1201‧‧‧ first surface

1202‧‧‧ second surface

121‧‧‧Adhesive layer

122‧‧‧Carrier

1221‧‧‧ base

1222‧‧‧bonded layer

123‧‧‧ molding area

1231‧‧‧First fitting unit

1232‧‧‧Second fitting unit

1233‧‧‧3rd fitting unit

1234‧‧‧4th fitting unit

124‧‧‧Second registration hole

125‧‧‧ incision

130‧‧‧First fixture

131‧‧‧ first plane

132‧‧‧Locating pin

140‧‧‧Second fixture

141‧‧‧ second plane

143‧‧‧Compression bumps

144‧‧‧ Pressing surface

145‧‧‧ Reception trough

FIG. 1 is a schematic plan view of a circuit board substrate provided by an embodiment of the present technical solution.

Figure 2 is an enlarged view of a portion I of Figure 1.

FIG. 3 is a schematic plan view of a circuit board substrate provided by an embodiment of the present technical solution.

Figure 4 is an enlarged view of a portion IV of Figure 3.

Figure 5 is a cross-sectional view taken along line V-V of Figure 3.

FIG. 6 is a schematic cross-sectional view showing a circuit board substrate provided with a slit in the embodiment of the present technical solution.

FIG. 7 is a schematic plan view of a first jig provided by an embodiment of the present technical solution.

FIG. 8 is a schematic plan view of a second jig provided by an embodiment of the present technical solution.

FIG. 9 is a schematic cross-sectional view showing the circuit board substrate and the circuit board substrate positioned on the first jig provided by the embodiment of the present technical solution.

FIG. 10 is a schematic cross-sectional view showing a second fixture having a laminated circuit board substrate and a circuit board substrate according to an embodiment of the present technical solution.

Figure 11 is a cross-sectional view showing the first bonding unit after the circuit board substrate of Figure 10 is pressed.

FIG. 12 is a schematic cross-sectional view showing a method of pressing another circuit board substrate and a circuit board substrate by using a second jig according to an embodiment of the present technical solution.

The manufacturing method of the circuit board provided by the embodiment of the technical solution includes the following steps:

In the first step, please refer to FIG. 1 and FIG. 2 together to provide a plurality of identical circuit board substrates 110.

Each of the circuit board substrates 110 is a circuit board substrate that needs to be attached to a component such as a reinforcing sheet after the conductive line is formed. The circuit board substrate 110 includes a waste area 112 and a plurality of arrayed circuit board units 111. The waste area 112 is distributed between adjacent circuit board units 111 and around the circuit board unit 111. Each of the circuit board units 111 has the same shape. In this embodiment, the plurality of circuit board units 111 are arranged in four rows and eight columns in the circuit board substrate 110. The distance between two adjacent circuit board units 111 in each row is equal, and the distance between adjacent two circuit board units 111 in each column is equal. Each of the circuit board units 111 has a bonding area 1111 that requires a fitting. The plurality of circuit board units 111 are arranged in the same manner such that the distance between the bonding regions 1111 of the adjacent two circuit board units 111 in each row is equal, and the stickers of the adjacent two circuit board units 111 in each column The distance between the combined areas 1111 is equal.

A plurality of first alignment holes 113 are formed in the circuit board substrate 110. In this embodiment, at least one first alignment hole 113 is distributed in the bonding area 1111 of each circuit board unit 111, and the distribution of the first alignment holes 113 in the bonding area 1111 of the plurality of circuit board units 111 is distributed. The form is the same.

In the second step, please refer to FIG. 3, FIG. 4 and FIG. 5 together to provide a circuit board substrate 120 to which the adhesive layer 121 and the carrier sheet 122 are bonded.

The circuit board substrate 120 may be a reinforcing sheet or a steel sheet or the like. The shape of the circuit board substrate 120 is the same as that of the circuit board substrate 110. The circuit board substrate 120 has opposing first and second surfaces 1201, 1202. On the first surface 1201 of the circuit board substrate 120, an adhesive layer 121 is formed. The adhesive layer 121 is made of a usual pressure sensitive adhesive material. The pressure sensitive adhesive is a type of pressure sensitive adhesive which, when applied to it, produces a viscous bond to the object. A carrier sheet 122 is attached to the second surface 1202 of the circuit board substrate 120. The carrier sheet 122 includes a base 1221 and a bonding layer 1222. The adhesive layer 1222 is made of an acrylate-based adhesive, and its adhesive force is small, and as the temperature increases, the adhesive force decreases, and when the external pressure is applied, the adhesive force does not change significantly. The substrate 1221 may be polyethylene terephthalate (PET).

The circuit board substrate 120 includes a plurality of molding regions 123, each of which corresponds to a circuit board unit 111. A plurality of bonding units having the same shape as the bonding region 1111 of the board unit 111 are included in each of the molding regions 123. The bonding units in the plurality of molding regions 123 are arranged in the same manner. In this embodiment, the plurality of molding regions 123 are arranged in four rows and eight columns in the circuit board substrate 120. The distance between two adjacent molding regions 123 in each row is equal, and the distance between adjacent molding regions 123 in each column is equal. Each of the molding regions 123 has four bonding units, which are a first bonding unit 1231, a second bonding unit 1232, a third bonding unit 1233, and a fourth Bonding unit 1234. The distance between the first bonding units 1231 in the adjacent two molding regions 123 in each row, the distance between the second bonding units 1232 in the adjacent two molding regions 123, and the adjacent two The distance between the third bonding unit 1233 in the molding region 123 and the distance between the fourth bonding units 1234 in the adjacent two molding regions 123 are both adjacent to each of the adjacent rows in the circuit board substrate 110. The distance between the bonding regions 1111 of the board units 111 is equal. The distance between the first bonding units 1231 in the adjacent two molding regions 123 in each column, the distance between the second bonding units 1232 in the adjacent two molding regions 123, and the adjacent two The distance between the third bonding unit 1233 in the molding region 123 and the distance between the fourth bonding units 1234 in the adjacent two molding regions 123 are both adjacent to each of the adjacent columns in the circuit board substrate 110. The distance between the bonding regions 1111 of the board units 111 is equal.

A plurality of second alignment holes 124 are formed in the circuit board substrate 120. At least one second alignment hole 124 is distributed in each of the bonding units in the molding region 123. The distribution of the second alignment holes 124 in each of the bonding units is formed in the same manner as the distribution of the first alignment holes 113 in the bonding region 1111 of each of the circuit board units 111.

In the third step, referring to FIG. 6 , the circuit board substrate 120 to which the adhesive layer 121 and the carrier sheet 122 are bonded is punched, and the circuit board substrate 120 corresponding to the plurality of bonding units is adhered. Openings are formed in the glue layer 121 such that each of the bonding units is separated from the remaining circuit board substrate 120.

The circuit board substrate 120 of the adhesive layer 121 and the carrier sheet 122 is punched by a steel knife composite mold. By precise control, the slits 125 formed along the edges of each of the bonding units are formed only in the adhesive layer 121 and the circuit board substrate 120. Since the cutout 125 is not formed in the carrier sheet 122, the carrier sheet 122 is still a one-piece structure, and the adhesive layer of the carrier sheet 122 is formed. The 1222 is viscous so that the splicing unit under cutting remains in its original position.

In the fourth step, referring to FIG. 7 and FIG. 8, the first jig 130 and the second jig 140 are provided to cooperate with each other.

The shapes of the first jig 130 and the second jig 140 correspond to the shape of the circuit board substrate 110. The first jig 130 has a first plane 131, and a plurality of positioning pins 132 are formed from the first plane 131 in a direction away from the first plane 131. The plurality of positioning pins 132 respectively correspond to the plurality of first alignment holes 113 in the circuit board substrate 110.

The second jig 140 has a second flat surface 141, and a plurality of pressing bumps 143 that are in one-to-one correspondence with the bonding regions 1111 of the circuit board substrate 110 are formed from the second flat surface 141 in a direction away from the second flat surface 141. Each of the pressing protrusions 143 has a pressing surface 144 parallel to the second plane 141, and each of the pressing surfaces 144 has the same shape as the corresponding bonding area 1111. Preferably, the area of each of the pressing faces 144 is slightly smaller than the area of the corresponding fitting area 1111. Each of the embossing protrusions 143 is formed with a plurality of receiving slots 145 corresponding to the positioning pins 132 for receiving the corresponding positioning pins 132 when the first jig 130 and the second jig 140 are mated with each other. . In the fifth step, referring to FIG. 9, a circuit board substrate 110 and a circuit board substrate 120 are positioned on the first plane 131 such that the adhesive layer 121 of the circuit board substrate 120 is adjacent to the circuit board substrate 110.

First, the first alignment hole 113 in the circuit board substrate 110 is correspondingly fitted into the positioning pin 132 of the first jig 130, so that the circuit board substrate 110 is fixed to the first jig 130. Then, the second alignment hole 124 of the first bonding unit 1231 in each of the molding regions 123 of the circuit board substrate 120 is fitted into the positioning pin 132 of the corresponding first jig 130, and the circuit board substrate 120 is Fixed to the first jig 130. Therefore, one first bonding unit 1231 is superposed on each of the bonding regions 1111.

In the sixth step, referring to FIG. 10 and FIG. 11 , the circuit board substrate 110 and the circuit board substrate 120 positioned on the first jig 130 are pressed by the second jig 140 , so that each of the first bonding units 1231 Correspondingly attached to the bonding area 1111.

The second jig 140 is placed on the circuit board substrate 110 and the circuit board substrate 120 positioned on the first jig 130 such that each of the pressing protrusions 143 corresponds to one bonding area 1111, and each positioning pin 132 Correspondingly accommodated in a receiving groove 145. By pressing the second jig 140, the adhesive force of the adhesive layer 121 is enhanced by the pressure, so that the adhesive layer 121 on each of the first bonding units 1231 is attached to the corresponding bonding area 1111. Moreover, under the action of the pressure, the adhesion between the adhesive layer 121 and each of the first bonding units 1231 is much greater than the bonding force between each of the first bonding units 1231 and the carrier sheet 122, so that the first bonding unit After being attached to the surface of the circuit board substrate 110, the 1231 is easily separated from the carrier sheet 122.

In the seventh step, referring to FIG. 12, another circuit board substrate 110 and the circuit board substrate 120 are positioned on the first plane 131 such that the adhesive layer 121 of the circuit board substrate 120 is adjacent to the circuit board substrate 110.

First, the first alignment hole 113 in the unbonded circuit board substrate 110 is correspondingly fitted into the positioning pin 132 of the first jig 130, so that the circuit board substrate 110 is fixed to the first jig 130. Then, the second alignment hole 124 of the second bonding unit 1232 in each of the molding regions 123 of the circuit board substrate 120 is fitted into the positioning pin 132 of the corresponding first jig 130, and the circuit board substrate 120 is Fixed to the first jig 130. Therefore, one second bonding unit 1232 is superposed on each of the bonding regions 1111.

In the eighth step, the second bonding unit 1232 is correspondingly attached to the circuit board substrate 110 according to the method of the sixth step.

Repeating the methods of the seventh step and the eighth step, respectively, bonding the third bonding unit 1233 and the fourth bonding unit 1234 to another unbonded circuit board substrate 110, thereby obtaining a plurality of bonded components. Circuit board substrate.

The manufacturing method of the circuit board provided by the technical solution is based on the layout of the circuit board unit. By using the first jig and the second jig for alignment, it is realized that the arrangement of the components and the arrangement of the circuit board units are not one-to-one correspondence, and the entire circuit board substrate can be simultaneously bonded. Compared with the manual one-to-one bonding method, the efficiency of circuit board production is improved. Compared with the arrangement of the components and the arrangement of the circuit board unit, the whole substrate is used for the simultaneous bonding, which increases the utilization rate of the component layout and reduces the cost of the circuit board production.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

110‧‧‧Circuit board

120‧‧‧Circuit board substrate

121‧‧‧Adhesive layer

1231‧‧‧First fitting unit

125‧‧‧ incision

130‧‧‧First fixture

132‧‧‧Locating pin

140‧‧‧Second fixture

143‧‧‧Compression bumps

144‧‧‧ Pressing surface

145‧‧‧ Reception trough

Claims (7)

A method of manufacturing a circuit board, comprising the steps of: providing at least two circuit board substrates, the circuit board substrate comprising a plurality of circuit board units, each of the circuit board units having a bonding area; providing a circuit board substrate One surface of the circuit board substrate is adhered with an adhesive layer, and the other surface is bonded with a carrier sheet. The adhesive layer is made of pressure sensitive adhesive, and the circuit board substrate has a plurality of a one-to-one corresponding molding area of the circuit board unit, each of the molding areas includes at least a first bonding unit and a second bonding unit, the first bonding unit and the second bonding unit and the corresponding circuit board unit The shape of the bonding area is the same, and the arrangement manner of the first bonding unit and the arrangement manner of the second bonding unit in each of the molding regions are the same as the arrangement of the bonding area; The circuit board substrate of the adhesive layer and the carrier sheet is punched, and openings are formed in the circuit board substrate and the adhesive layer along the edges of each of the first bonding unit and the second bonding unit, so that each of the first a bonding unit and each second bonding unit from the circuit board base Separating, but still adhering to the carrier sheet; providing a first jig and a second jig, the first jig and the second jig respectively corresponding to the shape of the circuit board substrate, the first jig being used for positioning a circuit board substrate and a circuit board substrate, wherein the second jig is formed with a plurality of pressing protrusions corresponding to the plurality of bonding areas; and positioning a circuit board substrate and the circuit board substrate on the first jig So that the bonding area of the circuit board substrate overlaps with the first bonding unit of the circuit board substrate one by one, the adhesive layer is in contact with the circuit board substrate; and the second jig is placed on the first jig Pressure is applied to the circuit board substrate and the circuit board substrate, and each of the pressing protrusions corresponds to one bonding area, so that each first bonding unit is correspondingly attached Cooperating with one bonding area and separating from the carrier sheet to obtain a circuit board substrate with a fitting attached; positioning another circuit board substrate and the circuit board substrate to the first fixture, so that the other circuit board substrate The bonding area overlaps with the second bonding unit of the circuit board substrate one by one, the adhesive layer is in contact with the other circuit board substrate; and the second jig is placed on the first jig Pressure is applied to the other circuit board substrate and the circuit board substrate, and each of the pressing protrusions corresponds to one bonding area, so that each second bonding unit is correspondingly attached to one bonding area. And separated from the carrier sheet to obtain another circuit board substrate to which the accessory is attached. The method of manufacturing the circuit board according to the first aspect of the invention, wherein a plurality of first alignment holes are formed in each of the circuit board substrates, and the first alignment is formed in the circuit board substrate. a second alignment hole corresponding to the hole, the first fixture has a positioning pin with a plurality of positions corresponding to the first alignment hole, and the positioning pin is matched to the corresponding first alignment hole and the second alignment position Inside the hole, the circuit board substrate and the circuit board substrate are positioned on the first jig. The method of manufacturing the circuit board of claim 2, wherein at least one of the first alignment holes is distributed in each of the bonding regions, and each of the first bonding units and the second bonding The unit correspondingly distributes at least one second alignment hole corresponding to at least one first alignment hole in the bonding unit. The method of manufacturing a circuit board according to the first aspect of the invention, wherein the circuit board substrate comprises a plurality of arrayed circuit board units, each of the circuit board substrates comprising a plurality of arrays arranged in an array a region, a distance between the first bonding units in the adjacent two molding regions in each row and a distance between the second bonding units in the adjacent two molding regions in each row are adjacent to each row The distance between the bonding areas in the two circuit board units is equal, the distance between the first bonding units in the adjacent two molding regions in each column and the second bonding in the adjacent two molding regions in each column The distance between the units is the same as the bonding area in the adjacent two circuit board units in each column. The distance is equal. The manufacturing method of the circuit board of claim 1, wherein the carrier sheet comprises a base body and a bonding layer, and the bonding layer is located between the base body and the circuit board substrate, and each of the first bonding units Or the second bonding unit is correspondingly attached to one bonding area, and the bonding force between the adhesive layer on the first bonding unit or the second bonding unit and the circuit board substrate is greater than the first bonding unit or the first bonding unit The bonding force between the second bonding unit and the bonding layer. The method of manufacturing a circuit board according to claim 5, wherein the adhesive layer is made of an acrylate-based adhesive. The manufacturing method of the circuit board of claim 1, wherein each of the pressing protrusions of the second jig has a pressing surface for pressing, and the shape and corresponding shape of each pressing surface The conforming areas have the same shape, and the area of each of the pressing surfaces is smaller than the area of the corresponding bonding area.