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TWI337971B - Substrate carrier - Google Patents

Substrate carrier Download PDF

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Publication number
TWI337971B
TWI337971B TW97101046A TW97101046A TWI337971B TW I337971 B TWI337971 B TW I337971B TW 97101046 A TW97101046 A TW 97101046A TW 97101046 A TW97101046 A TW 97101046A TW I337971 B TWI337971 B TW I337971B
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TW
Taiwan
Prior art keywords
substrate
substrate transport
plate
transport carrier
carrier
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TW97101046A
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Chinese (zh)
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TW200930637A (en
Inventor
Yujen Chang
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Chimei Innolux Corp
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Priority to TW97101046A priority Critical patent/TWI337971B/en
Publication of TW200930637A publication Critical patent/TW200930637A/en
Application granted granted Critical
Publication of TWI337971B publication Critical patent/TWI337971B/en

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Description

1337971 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種基板運輸載具,且特別是有關於 用以直立式地運輸基板的基板運輸載具。 【先前技術】 現今各家液晶顯示器(LCD)業者,莫不以發展下一世代 面板生產線為其主要目標。目前平面顯示器所使用的基板 材料主要以玻璃基板為主,尺寸愈大之玻璃基板代表可以 為業者帶來!ij產能、低成本及大尺寸面板顯示器等產業效 益。但大型基板同時亦會對量產技術及設備帶來許多困 難’例如基板之搬運即成為令業者頭痛的技術瓶頸。一般 基板之運輸載具’例如卡匣(Cassette)、塑膠盒(pp Box)或 搬運箱(Hard Case),已無法符合大尺寸基板對於運輸的要 求。 請參考第1圖,其繪示習知基板運輸載具的剖面示意 圖。習知的基板運輸載具900包括承載座910和封箱920, 承載座910設有基座911、立板912、底板913、壓板914 及束扣環915。立板912係垂直組合於底板913,而呈L形 結構,並傾斜地設置於基座911上,以承置大型基板930。 在基板930重疊承置於立板912和底板913上後,可藉由 壓板914和束扣環915來壓掣和環束基板930。然後,利用 封箱920封閉,而可進行運輸。 然而’當進行運輸時,由於基板930係呈傾斜狀態, 因而在於近立板912處之基板930會承受較大之側壓力, 5 而谷易發生損傷之情形。再者,由於大型基板930具有較 大之負載,因而在運輸過程中束扣環915容易斷裂尤其 容易發生在束扣環915與壓板914之交界處。、 ” 【發明内容】 因此本發明之-方面係在於提供一種基板運輸載呈, 藉以減少緩和束帶在運輸時所產生之應力集中,因而; 少束帶在運輸過程中斷裂的情形。 ' 本發明之又-方面係在於提供一種基板運輪載具,藉 以利用緩衝層來提供基板在運輸過程中的緩衝吸震。 本發明之又-方面係在於提供一種基板運輸栽具,藉 以在封箱上設有透視孔’且設置打束器於封箱之外側,因a 而可方便在運輸過程中確認束帶是否鬆脫。 根據本發明之實施例,本發明之基板運輸載具係用以 承載基板,其中此基板運輸載具至少包含有基座、底板、 支撐背板、壓板、束帶、至少二滾輪及弧形突出結構。底 板係設置於基座上’支律背板係、垂直組合於底板,以承栽 基板’壓板翻以當基板承載於底板和支射板上時㈣ 基板,束帶㈣以當承載基板時環束基板和壓板,滚輪係 分別設置於壓板之兩端’且位於束帶在進行環束時的路徑 上’弧形突出結構係形成㈣板上,且位於束帶在進行環 束時的路徑上。 & 因此,本發明之 中所產生之應力集中 的情形。 基板運輸載具可緩和束帶在運輸過程 ,因而可減少束帶在運輸過程中斷裂 1337971 【實施方式】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易僅’本說明書將特舉出一系列實施例來加以說 :。但值得注意的是,此些實施例只是用以說明本發明之 實施方式,而非用以限定本發明。1337971 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate transport carrier, and more particularly to a substrate transport carrier for transporting substrates in an upright manner. [Prior Art] Today's liquid crystal display (LCD) companies do not aim to develop next-generation panel production lines. At present, the substrate materials used in flat panel displays are mainly glass substrates, and the larger the size of the glass substrates, the industrial benefits of the ij production capacity, low cost and large-sized panel displays. However, large substrates also bring many difficulties to mass production technology and equipment. For example, the handling of substrates has become a technical bottleneck for the industry. A general substrate transport vehicle, such as a Cassette, a pp Box, or a Hard Case, has been unable to meet the transportation requirements of a large-sized substrate. Please refer to Fig. 1, which shows a schematic cross-sectional view of a conventional substrate transport carrier. The conventional substrate transport carrier 900 includes a carrier 910 and a sealing 920. The carrier 910 is provided with a base 911, a vertical plate 912, a bottom plate 913, a pressure plate 914, and a buckle ring 915. The vertical plate 912 is vertically combined with the bottom plate 913 and has an L-shaped structure and is disposed obliquely on the base 911 to receive the large substrate 930. After the substrate 930 is overlaid on the vertical plate 912 and the bottom plate 913, the substrate 930 can be compressed and looped by the pressing plate 914 and the buckle ring 915. Then, it is closed by the sealing box 920 and can be transported. However, when transporting, since the substrate 930 is inclined, the substrate 930 at the near vertical plate 912 is subjected to a large side pressure, and the valley is liable to be damaged. Moreover, since the large substrate 930 has a relatively large load, the bundle buckle 915 is easily broken during transportation, particularly at the boundary between the buckle ring 915 and the pressure plate 914. SUMMARY OF THE INVENTION Accordingly, it is an aspect of the present invention to provide a substrate transport carrier that reduces the stress concentration that occurs when a belt is transported, and thus, the less belt breaks during transportation. A further aspect of the invention is to provide a substrate carrier carrier for utilizing a buffer layer to provide buffer shock absorption during transport of the substrate. A further aspect of the present invention is to provide a substrate transporting device for sealing on a container The see-through hole is provided and the beam breaker is disposed on the outer side of the sealing box, and it is convenient to confirm whether the band is loose during transportation due to a. According to an embodiment of the present invention, the substrate transporting carrier of the present invention is used for carrying The substrate, wherein the substrate transporting carrier comprises at least a base, a bottom plate, a supporting back plate, a pressing plate, a strap, at least two rollers and a curved protruding structure. The bottom plate is disposed on the base, the branching system, the vertical combination In the bottom plate, the bearing substrate 'platen is turned over when the substrate is carried on the bottom plate and the support plate (4) the substrate, the band (4) is used to carry the substrate when the ring beam substrate and the pressure plate, the roller system The arcuate protruding structure is formed on the path of the band on the both ends of the platen and is located on the path of the band on the (four) plate, and is located on the path of the band when the loop is performed. The situation in which the stress generated is concentrated. The substrate transport carrier can alleviate the belt during transportation, thereby reducing the breakage of the belt during transportation. 133971 [Embodiment] To achieve the above and other objects, features and advantages of the present invention The present invention will be described in detail with reference to the accompanying drawings. invention.

—請參照第2圖和第3圖’第2圖係、繪示依照本發明第 -實施例之基板運輸載具的立體示意圖,帛3圖係繪示依 照本發明第-實施例之基板運輸載具的分解立體示意圖。 本實施例之基板運輸載具100係用以承載基板2〇〇,例如 為.液晶顯示器(Liquid Crystal Display ; LCD)的玻璃基板、 塑膠基板或液晶面板^基板運輸載具1〇〇至少包含有基座 110、底板120、支撐背板130 '壓板14〇 '束帶15〇、至少 二滾輪160、至少一弧形突出結構17〇、緩衝層18〇、防護 架190及封箱101。- Referring to Figures 2 and 3, Figure 2 is a perspective view of a substrate transport carrier in accordance with a first embodiment of the present invention, and Figure 3 is a diagram showing substrate transport in accordance with a first embodiment of the present invention. An exploded perspective view of the vehicle. The substrate transport carrier 100 of the present embodiment is used to carry the substrate 2, for example, a liquid crystal display (LCD) glass substrate, a plastic substrate or a liquid crystal panel. The substrate transport carrier 1 includes at least The base 110, the bottom plate 120, the supporting back plate 130 'pressing plate 14'' belt 15 〇, at least two rollers 160, at least one curved protruding structure 17 〇, a buffer layer 18 〇, a protective frame 190 and a sealing box 101.

如第2圖和第3圖所示,本實施例之基座11〇例如為 一梭板,其中基座1 1 0可具有二插入孔1 1 1,藉以供例如堆 高機(未繪示)來進行搬運’而二插入孔1丨丨之間的距離係介 於255mm和1340mm之間。底板120係設置於基座110上, 支撐背板130係垂直組合於底板12〇,藉以形成l形結構 來承載基板200,因而基板200可直立置放於底板120和支 撐背板130上。在本實施例中,支撐背板130設有至少二 束帶穿孔131,藉以供束帶150來穿過。 當基板200承載於底板120和支撐背板130上時,壓 板140可壓掣基板200,並藉由束帶150(較佳為可束重4000 7 1337971 公斤以上之束帶)來環束基板2〇〇和壓板14〇。滾輪16〇係 設置於壓板140之兩端’弧形突出結構17〇係設置於壓板 140相對於基板2〇〇的—側上,且滾輪} 6〇和弧形突出結構 170係位於束帶150在進行環束時的路徑上,用以緩和束帶 150在進行環束時的應力集中’特別可避免在銳角處(例如 壓板140的兩端)所產生的應力集中,因而可大幅減少束帶 150在運輸過程中斷裂的情形。在本實施例,弧形突出結構 170例如為一弧形凸塊’並在運輸過程中接觸於束帶丨5〇, 以缓和束帶丨5 〇的應力集中情形。 請參照第4圖至第6圖,第4圖係繪示依照本發明第 一實施例之基板運輸載具的側視示意圖,第5圖係繪示依 照本發明第一實施例之基板運輸載具的俯視示意圖,第6 圖係緣示依照本發明第一實施例之基板運輸載具之支撐背 板與緩衝層的部分示意圖。本實施例之緩衝層1係設於 底板120、支撐背板130及壓板140接觸於基板2〇〇的一 側,用以提供基板200在運輸過程中的緩衝吸震。在本實 施例中,緩衝層180較佳為複合緩衝結構,其可包含複合 緩衝墊(例如發泡聚丙烯)、工程塑膠板(例如EVA)、緩衝材 及紹塑複合板。其中’緩衝層180具有至少一凹槽181,其 形成於接合於底板120、支撐背板13〇及壓板14〇的一側, 用以增加緩衝層〗80對於底板120、支撐背板130及壓板 140的貼合性’並提供彈性變形空間和釋放應力之功能。本 實施例之防護架190係設置於支撐背板13〇和壓板14〇之 間’用以在不同軸向上抵掣基板200 ’避免基板2〇〇在運輸 過程中產生震動,而導致損壞。 8 1337971 一請參照第3圖和第7圖,第7圖係繪示依照本發明第 只施例之基板運輸載具的側視示意圖。當利用本實施例 之基板運輸載具來承載基板細肖,首先,承載基板· 於底板120和支推背板130上,接著,藉由屢板M0和束 帶150來進行壓擎和環束,接著,組裝上防護架190後, 然後’利用封们01來進行包裝封閉,以方便搬運。本實 施例之封箱1G1可設有透視孔1〇2>透視孔如係開設於束 帶150在進打環束時的路徑上,用以監視束冑⑼是否有 鬆脫之情形’因而可確保束冑15G的束缚效果。再者,束 帶150設有打束器⑸,以調整束帶15〇的環束鬆緊程度。 在封箱101形成包裝後,打束器15]可設於封箱]〇丨之外 側’例如可設置於支律背板13〇之相對於基板細的一侧 上,用以在運輸過程中進一步確認束帶15〇是否鬆脫以 增加基板運輸的安全性。 因此,當進行基板運輸時,可藉由束帶15〇來穩固地 環束基板200於支撐背板130和壓板14〇之間,再藉由封 箱101來進行包裝。在運輸過程中,可藉由本實施例之滾 輪160和弧形突出結構170來緩和束帶15〇所產生之應力 集中,因而可減少束帶150在運輸過程中斷裂的情形。 請參照第8A圖和第8B圖,其繪示依照本發明第二實 施例之基板運輸載具之部分麗板和弧形突出結構的俯視示 意圖。以下僅就本實施例與第一實施例之相異處進行說 明’關於相似處在此不再贅述。相較於第—實施例,第一 實施例之基板運輸載具100設有複數個弧形突出結構i7〇a 於壓板140相對於基板200的一側上,且位於束帶15〇在 9As shown in FIG. 2 and FIG. 3, the base 11 of the embodiment is, for example, a shuttle plate, wherein the base 110 may have two insertion holes 1 1 1 for, for example, a stacker (not shown) ) for carrying 'the distance between the two insertion holes 1丨丨 is between 255mm and 1340mm. The bottom plate 120 is disposed on the base 110. The support back plate 130 is vertically combined with the bottom plate 12b to form an l-shaped structure for carrying the substrate 200. Therefore, the substrate 200 can be placed upright on the bottom plate 120 and the support back plate 130. In the present embodiment, the support backing plate 130 is provided with at least two strap perforations 131 for the straps 150 to pass through. When the substrate 200 is carried on the bottom plate 120 and the supporting back plate 130, the pressing plate 140 can press the substrate 200, and the substrate 2 is looped by the band 150 (preferably a bundle of 4000 7 1337971 kg or more). 〇〇 and pressure plate 14 〇. The roller 16 is disposed at both ends of the pressing plate 140. The curved protruding structure 17 is disposed on the side of the pressing plate 140 with respect to the substrate 2, and the roller and the curved protruding structure 170 are located at the belt 150. In the path when the loop is performed, the stress concentration of the band 150 in the loop beam is alleviated', in particular, the stress concentration generated at the acute angle (for example, both ends of the platen 140) can be avoided, so that the band can be greatly reduced. 150 cases of breakage during transportation. In the present embodiment, the arcuate projecting structure 170 is, for example, an arcuate bump ' and is in contact with the band 丨 5 运输 during transportation to alleviate the stress concentration of the band 丨 5 。. Please refer to FIG. 4 to FIG. 6 , FIG. 4 is a schematic side view showing a substrate transporting carrier according to a first embodiment of the present invention, and FIG. 5 is a diagram showing a substrate transporting load according to a first embodiment of the present invention. FIG. 6 is a schematic partial plan view showing a supporting back plate and a buffer layer of the substrate transporting carrier according to the first embodiment of the present invention. The buffer layer 1 of the embodiment is disposed on a side of the bottom plate 120, the supporting back plate 130, and the pressing plate 140 contacting the substrate 2 to provide buffer shock absorption of the substrate 200 during transportation. In the present embodiment, the buffer layer 180 is preferably a composite buffer structure, which may comprise a composite cushion (e.g., expanded polypropylene), an engineering plastic sheet (e.g., EVA), a cushioning material, and a plastic composite panel. The buffer layer 180 has at least one groove 181 formed on the side of the bottom plate 120, the supporting back plate 13〇 and the pressing plate 14〇 for adding the buffer layer 80 to the bottom plate 120, the supporting back plate 130 and the pressing plate. The fit of 140' provides the function of elastic deformation space and stress relief. The protective frame 190 of the present embodiment is disposed between the supporting back plate 13A and the pressing plate 14' to abut the substrate 200' in different axial directions to prevent the substrate 2 from vibrating during transportation and causing damage. 8 1337971 Referring to Figures 3 and 7, Figure 7 is a side elevational view of a substrate transport carrier in accordance with a first embodiment of the present invention. When the substrate transport carrier of the embodiment is used to carry the substrate, first, the substrate is supported on the bottom plate 120 and the support back plate 130, and then the pressure plate and the loop bundle are performed by the multiple plates M0 and the strap 150. Next, after the protective frame 190 is assembled, the package is closed by the seal 01 to facilitate the handling. The sealing box 1G1 of the embodiment may be provided with a see-through hole 1〇2> the see-through hole is formed on the path of the band 150 when the bundled bundle is in the loop to monitor whether the bundle (9) is loose. Make sure that the binding effect of the bundle is 15G. Further, the band 150 is provided with a winder (5) to adjust the tightness of the loop bundle of the band 15 turns. After the package 101 is formed into a package, the beam breaker 15] may be disposed on the outer side of the sealing box ', for example, may be disposed on the side of the branch back plate 13 相对 relative to the substrate for transportation. It is further confirmed whether the band 15 is loose to increase the safety of substrate transportation. Therefore, when the substrate is transported, the loop substrate 200 can be firmly held between the support back plate 130 and the press plate 14A by the band 15 ,, and then packaged by the package 101. During transportation, the roller 160 and the curved protruding structure 170 of the present embodiment can be used to alleviate the stress concentration generated by the band 15 ,, thereby reducing the breakage of the band 150 during transportation. Referring to Figures 8A and 8B, there are shown top plan views of a portion of the slab and curved projection of the substrate transport carrier in accordance with the second embodiment of the present invention. In the following, only the differences between the embodiment and the first embodiment will be described, and the details are not described herein again. Compared with the first embodiment, the substrate transporting carrier 100 of the first embodiment is provided with a plurality of curved protruding structures i7〇a on the side of the pressing plate 140 with respect to the substrate 200, and is located at the band 15 at 9

Claims (1)

1337971 十、申請專利範圍: 1,一種基板運輸載具,用以承載至少一基板,其中該 基板運輸載具至少包含: —基座; —底板,設置於該基座上; 一支樓背板,垂直組合於該底板,以承載該基板; 壓板’用以當該基板承載於該底板和該支撐背板上 時壓掣該基板; 至少一束帶’用以當承載該基板時環束該基板和該壓 板; 至少二滾輪’位於該束帶在進行環束時的路徑上;以 及 至少一弧形突出結構,形成於該壓板上,且位於該束 帶在進行環束時的路徑上。 2·如申請專利範圍第1項所述之基板運輸載具,其中 該基座具有二插入孔,該些插入孔之間的距離係介於 255mm 和 1340mm 之間。 3.如申請專利範圍第1項所述之基板運輸載具,其中 該至少二滾輪位於該壓板之兩端。 ^ 4.如申請專利範圍第1項所述之基板運輸載具,其中 該至少二滾輪位於該支撐背板之兩端。 13 1337971 5·如申請專利範圍第】項所述之基板運輸載具 該支樓背板設有至少:束帶穿孔,藉以供該束帶來穿過。 6_如申研專利範圍第1項所述之基板運輸載具,其中 該弧形大出結構係一弧形凸塊。 7. 如申請專利範圍第1項所述之基板運輸載具,其中 該基板運輸載具包含複數個弧形突出結構。 8. 如申凊專利範圍第7項所述之基板運輸載具,其中 該些弧形突出結構在該壓板上具有相同高度。 、 9*如申凊專利範圍帛7項所述之基板運輸載具,其中 該二弧形大出結構在該壓板上具有不同高度。 1〇·如中請專利範圍第1項所述之基板運輸載具,其 中該弧形突出結構係藉由二半弧形結構所形成。 U.如申請專利範圍帛1項所述之基板運輸載具,更 至少包含: 至少-緩衝層,分別設於該底板、該支樓背板及該壓 板接觸於該基板的一側。 如申請專利範圍第丨1項所述之基板運輸載具,其 14 1337971 •中該緩衝層為複合緩衝結構。 13如申明專利範圍第u項所述之基板運輸載具其 中該緩衝層至少包含複合緩衝墊、工程塑膠板、煖衝材及 銘塑複合板。 如申明專利範圍第1〇項所述之基板運輸載具其 中該緩衝層具有至少__凹槽’其形成於接合於該底板、該 .支撐背板及該壓板的一側。 15.如申凊專利範圍第丨項所述之基板運輸載具,更 至少包含: ' 至乂一防護架,設置於該支撐背板和該壓板之間。 更 16·如申請專利範圍帛1項所述之基板運氣載具, 至少包含: 〃 一封箱,用以包裝封閉該基板。 17.如申請專利範圍第16項所述之基板運輸載具’其 中該封相没有至少一透視孔,該透視孔係開設於該束帶在 進行環束時的路徑上。 Λ ▲ 18.如申請專利範圍第“項所述之基板運輪栽具,其 中該束帶設有至少—打束器,用以調整該束帶走、緊 权度’在該封箱形成包裝後,該打東器係、設於該封箱之外 15 19. 一種基板運輸載具’用以承載至少一基板,其中 該基板運輸載具至少包含: 一基座; 一底板,設置於該基座上; 一支撐背板’垂直組合於該底板,以承載該基板; 一壓板,用以當該基板承載於該底板和該支撐背板上 時壓掣該基板; 至少一緩衝層’分別設於該底板、該支撐背板及該壓 板接觸於該基板的一側; 至少一防護架’設置於該支撐背板和該壓板之間; 至少一束帶,用以當承載該基板時環束該基板和該壓 板; 至少二滾輪,位於該束帶在進行環束時的路徑上;以 及 至少一弧形突出結構,形成於該壓板上,且位於該束 帶在進行環束時的路徑上。 20. 如申請專利範圍第19項所述之基板運輸載具,其 中該基座具有二插入孔,該些插入孔之間的距離係介於 255mm 和 i34〇mm 之間。 21. 如申請專利範圍第19項所述之基板運輪載具其 中該至少二滾輪位於該壓板之兩端。 1337971 22·如申請專,範圍第19項所述之基板運輪 中該至少二滾輪位於該支撐背板之兩端。 /、其 23.如申請專利範圍第19項所述之基板運輸 中該支樓背板設有至少二束帶穿孔,藉以供該束帶來穿過其 24·如申請專利範圍第19項所述之基板運輸裁且 中該弧形突出結構係一弧形凸塊。 /、其 Μ‘如巾請專利範圍第19項所述之基板運 中該基板運輸載具包含複數個弧形突出結構。 " 26·如申請專利範圍第23項所述之基板運 中該t弧形犬出結構在該壓板上具有相同高度。 、 27·如中請專利㈣第23項所述之基板運輸載呈 中該些弧形犬出結構在該壓板上具有不同高度。 、 认如_料賴㈣19項料之基㈣輸載且发 中該弧形突出結構係藉由二半弧形結構所形成。’…、 中令^如申請專利範㈣19項所述之基㈣輪載具,其 ^緩衝層為複合緩衝結構。 17 1337971 jv/· yp τ明乾圍第19項所述之基板運 中該緩衝層至少包含複合 ’H 紹塑複合板。 ㈣工知塑膠板、緩衝材及 具,其 板、該 ”緩衝二Γ:範圍第19項所述之基板運輸載 中該域層具有至少1槽,其形成於接合於該底 支撐背板及該壓板的一側。 _1337971 X. Patent Application Range: 1. A substrate transport carrier for carrying at least one substrate, wherein the substrate transport carrier comprises at least: a base; a bottom plate disposed on the base; Vertically assembled to the bottom plate to carry the substrate; the pressing plate 'for pressing the substrate when the substrate is carried on the bottom plate and the supporting back plate; at least one strap 'for looping the substrate when carrying the substrate a substrate and the platen; at least two rollers' are located on the path of the band when performing the loop bundle; and at least one arcuate projecting structure is formed on the platen and located in the path of the band when the loop is performed. 2. The substrate transport carrier of claim 1, wherein the base has two insertion holes, the distance between the insertion holes being between 255 mm and 1340 mm. 3. The substrate transport carrier of claim 1, wherein the at least two rollers are located at opposite ends of the platen. 4. The substrate transport carrier of claim 1, wherein the at least two rollers are located at opposite ends of the support backplane. 13 1337971 5. The substrate transport carrier as described in the scope of the patent application. The back panel of the building is provided with at least: a belt perforation for the bundle to pass through. The substrate transporting vehicle of claim 1, wherein the curved large-out structure is an arc-shaped bump. 7. The substrate transport carrier of claim 1, wherein the substrate transport carrier comprises a plurality of curved protruding structures. 8. The substrate transport carrier of claim 7, wherein the arcuate projection structures have the same height on the platen. 9. The substrate transport carrier of claim 7, wherein the two curved large-out structures have different heights on the platen. The substrate transport carrier of claim 1, wherein the curved protruding structure is formed by a two-half arc structure. U. The substrate transport carrier of claim 1, further comprising: at least a buffer layer disposed on the bottom plate, the back plate of the branch, and a side of the press plate contacting the substrate. The substrate transport vehicle of claim 1, wherein the buffer layer is a composite buffer structure. The substrate transporting vehicle of claim 5, wherein the buffer layer comprises at least a composite cushion, an engineering plastic sheet, a warm stamping material, and a plastic-molded composite panel. The substrate transport carrier of claim 1, wherein the buffer layer has at least a groove formed on a side joined to the bottom plate, the support back plate, and the pressure plate. 15. The substrate transporting vehicle of claim 3, further comprising: 'to a first protective frame disposed between the supporting backing plate and the pressure plate. 16. The substrate transport vehicle of claim 1, wherein the substrate transport vehicle comprises at least: 一封 a box for enclosing the substrate. 17. The substrate transport carrier of claim 16, wherein the enclosing phase has no at least one see-through aperture, the see-through aperture being in the path of the strap when the loop is being bundled. ▲ ▲ 18. The substrate transport wheel plant according to the above-mentioned patent application, wherein the belt is provided with at least a beam breaker for adjusting the belt take-up and tightness to form a package in the sealed box. And the substrate transporting device is configured to carry at least one substrate, wherein the substrate transporting carrier comprises at least: a base; a bottom plate disposed on the a supporting back plate erected vertically to the bottom plate to carry the substrate; a pressing plate for pressing the substrate when the substrate is carried on the bottom plate and the supporting back plate; at least one buffer layer 'respectively Provided on the bottom plate, the supporting back plate and the side of the pressing plate contacting the substrate; at least one protective frame ' disposed between the supporting back plate and the pressing plate; at least one strap for carrying the substrate And the at least two rollers are located on the path of the bundle when the loop is performed; and at least one arcuate projection is formed on the platen and located at a path of the bundle when the loop is performed Above. 20. If you apply for The substrate transport carrier of claim 19, wherein the base has two insertion holes, and the distance between the insertion holes is between 255 mm and i34 mm. 21. As claimed in claim 19 The at least two rollers are located at the two ends of the support plate. /, 23. In the substrate transportation according to claim 19, the back panel of the branch is provided with at least two belt perforations, so that the bundle can pass through it. 24, as claimed in claim 19 The substrate is transported and the arc-shaped protruding structure is an arc-shaped protruding block. /, and the substrate is transported as described in claim 19 of the patent scope. The substrate transporting vehicle comprises a plurality of curved protruding structures. < 26· The substrate of the t-shaped dog-out structure has the same height on the platen as described in claim 23 of the patent application scope. 27, the substrate transport load described in item 23 of the patent (4) The curved dog-out structures are different on the platen It is recognized as the base of the 19th item of the material (4) and the arc-shaped protruding structure is formed by the two-half arc structure. '..., Zhong Ling ^ as described in the application patent (4) 19 The base (four) wheel carrier, the buffer layer is a composite buffer structure. 17 1337971 jv / · yp τ Ming dry circumference of the substrate transport described in item 19, the buffer layer contains at least composite 'H Shao plastic composite board. The plastic sheet, the cushioning material and the tool, the board, the substrate transporting load according to the item 19, wherein the domain layer has at least one groove formed on the bottom supporting back plate and the pressing plate. One side. _ 32.如申請專利範圍第19 至少包含: 項所述之基板運輪載具 更 封箱’用以包裝封閉該基板。 33’如申請專利範圍第32項所述之基板運輸載具,其 中該封箱設有至少一透視孔,該透視孔係開設於該束帶= 進行環束時的路徑上。 34.如申請專利範圍第32項所述之基板運輸載具,其 中該束帶設有至少一打束器,用以調整該束帶的環東慧緊 &度’在該封箱形成包裝後,該打束器係設於該封 側。 夕卜 1832. The scope of claim 19 includes at least: the substrate carrier carrier described in the item is further sealed to package the substrate. 33. The substrate transport carrier of claim 32, wherein the enclosure is provided with at least one see-through aperture that is formed in the path of the strap = loop bundle. 34. The substrate transport carrier of claim 32, wherein the strap is provided with at least one beam breaker for adjusting the loop of the strap and forming a package in the enclosure. Thereafter, the winder is attached to the seal side.夕卜 18
TW97101046A 2008-01-10 2008-01-10 Substrate carrier TWI337971B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647161B (en) * 2015-10-19 2019-01-11 南韓商康寧精密素材股份有限公司 Glass substrates transporting structure and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647161B (en) * 2015-10-19 2019-01-11 南韓商康寧精密素材股份有限公司 Glass substrates transporting structure and method
TWI728276B (en) * 2015-10-19 2021-05-21 南韓商康寧精密素材股份有限公司 Glass substrates transporting structure

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