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TWI337786B - Method of antenna manufacturing for rfid tag - Google Patents

Method of antenna manufacturing for rfid tag Download PDF

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Publication number
TWI337786B
TWI337786B TW95100029A TW95100029A TWI337786B TW I337786 B TWI337786 B TW I337786B TW 95100029 A TW95100029 A TW 95100029A TW 95100029 A TW95100029 A TW 95100029A TW I337786 B TWI337786 B TW I337786B
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Taiwan
Prior art keywords
antenna
radio frequency
layer
conductive layer
item
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TW95100029A
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Chinese (zh)
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TW200727531A (en
Inventor
Wen Wang
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Wen Wang
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Priority to TW95100029A priority Critical patent/TWI337786B/en
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Publication of TWI337786B publication Critical patent/TWI337786B/en

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Description

1337786 ⑷明之次一目的係在於提供一無線射頻標籤(RFID)天線之 製=主術’以真空蒸鍍之方式將導電金屬材料附著於可撓式塑膠 載# 作為天線之用途,並提供作為無線射頻晶片(_ChiPS) 構體;因可撓式載體的導人_,提供糾物品表面 之無線射頻標籤(RFID)貼著。 & 明之次_目的係在於提H物頻賴(RFID)天線之 二以多層次印刷之概念’提供作為天線圖型之遮蔽層及 保^層’母個天線均可料線線路保護於其中而不錄外界 破壞,並可減少天線圖案被模仿複製之可能性 ,本發明之無線射頻標籤(RFID)天線製造技術,包含: I二式塑膠载體(flexible piastic SUpp〇rt),該載體 以印刷附著方式形成-天線線路圖案之遮以該ΐ ΐϊΐ案内並無印刷附著油墨,而其餘周圍則印滿油墨;接著, 漿f ?ipl讓treatment)進行塑膠載體表面之清潔處理; •νί 道 iiit_VaC:UUmdeP〇Siti〇n)或 _(s_ering)方 式m金屬或合金㈣把_天線線路之表面層全面附蓋, 隨後’利用水洗方式,並藉由蒸鍍金屬膜與 有機油墨對可撓式卿_之_性差異與水雜差显 ϊίίίϊϋίί以乾式黏著之方式,以朦輪類之材料依據印 二之導電性天線線路金㈣膜表面,進行抗氧 須與無線射頻晶片進行峨構裝之接 伴靜㈣’,、餘部分則全面以耐候性佳之油墨層覆蓋;待完成 ΐ :ί’以習知之接點表面抗氧化藥劑(〇sp)將接觸導電接點 進灯塗佈處理’以概續之晶片構裝或封裝。 1337786 【實施方式】 參閱本發明所附之圖示,以下將列舉實施例說明: ,本㈣之—具體實補,—種絲侧識別㈣卩)標鐵天 (=D 第1 Ϊ之_製造流程所示,錢無線射頻標藏 =i 圖如第2圖所示;在無線射頻識別(_) ^戡天線之造上,係先提供—可换式之轉載體211,並以盆一 程之产構基礎’如第3A圖所示,而該可撓式塑膠 * '選自非導電性材㈣成之緩騎或縣雜脂材料之 -種’且於製關糾先進行轉健表面之潔淨化,以去 •能影響後續製程之油污或顆粒;又再參閱第3B ,以印 ' (Printing)或塗佈(coat ing)或轉印(transfer)等方式進 天線圖案之遮罩層材料的附著,在可撓式塑膠載體211之 ' 鏤空之遮植罩圖案;再參閱第况圖,於已完成遮罩層 cle ·者膠載體2U ·面,以電聚清洗(plasma Ϊ:ηί或本電^ 〇醜如伽⑽)或臭氧氧化(_a^ ^驟進订表面活化(surface activati〇n),產生一表面活化層 L *二提ί严續製程之顺、附著與加讀;另又相第3D圖, 乂真工瘵鍍(vacuumd印osition)、真空濺鍍(vacuumsputteri ,電子束蒸鍍(EBd印osition)等方式在先前已附著遮罩層217並 響進行活化層218處理之可撓式塑膠載體211表面, 著、’該導電層之材㈣選自可導電之金屬及相關聯 f電性化&物或合金材料之其中之一;再請參閱第㈣,以渴 式選擇性溶解則之方式,藉由溶解_ 了導電層之遮罩層材 料,將天線線路圖案顯影於可撓式塑膠載體211表面,戋以乾式 之膠輪黏著,將遮罩層加以從可撓式塑膠載體表面211剝離 成為一具有天線導電層212圖案之無線射頻識別天線,豆中,該 導電層212將可作為後續製程中無線射頻晶片216之^ : 用;再參閱$ 3F ΒΙ ,為防止導電層可能在一般製程環境“ 而導致天線之阻抗提高,遂利用印刷、塗佈或轉印方式在附著導 1337,786 電廣212天線圖案之可撓式塑膠211載體表面進行 材料之附者,而為便於進行後續與無線射 ^ 行部分導電層212之覆蓋與附著,而針 蓋;又參_3G圖,前_製程不覆 天線圖案未進仃抗氧化層213處理 電層212 處理之位置,予以附著並當作無線化層213 之訊號傳導接觸點2U或其他電路線與導電層212間 電訊號傳導接觸點214之接觸面積可tm,此外,此-導 215 ’以確健佳之接解確財與電 ' =晶>|構裝載體 之構裝良率並降低無線射 何^請“朗鄉枝為準,任 變化與修改,均屬於本發明之保護^^精神和範固内所作之任何 1337786 L圖式簡單說明】 Ϊ.2® : 之天線製造流裎圖; 第3A至3G 截面示意圖;1337786 (4) The second purpose of the Ming Dynasty is to provide a radio frequency tag (RFID) antenna system. The main function is to attach a conductive metal material to the flexible plastic carrier as a antenna by vacuum evaporation. A radio frequency chip (_ChiPS) structure; a radio frequency tag (RFID) attached to the surface of the object due to the guidance of the flexible carrier. & Ming _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The invention does not record external damage, and can reduce the possibility that the antenna pattern is copied and copied. The radio frequency tag (RFID) antenna manufacturing technology of the present invention comprises: a flexible piastic SUpp〇rt, which is The printing attachment method is formed - the antenna line pattern is covered by the ΐ ΐϊΐ 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 ; ; ; ; ; ; ; ; ; ; ; ; :UUmdeP〇Siti〇n) or _(s_ering) mode m metal or alloy (4) The surface layer of the _ antenna line is fully covered, and then 'water washing method, and by evaporation of metal film and organic ink to the flexible _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Carrying the connection of the 峨 装 ( ( ( ( ( ( ( ( ( ( ( ( ( ( , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Coating process 'to complete wafer fabrication or packaging. 1337786 [Embodiment] Referring to the drawings attached to the present invention, the following description will be given of the examples: (4) - specific compensation, - silk side identification (four) 卩) standard iron days (=D 1st Ϊ _ manufacturing As shown in the process, the money radio frequency standard = i picture is shown in Figure 2; in the radio frequency identification (_) ^ 戡 antenna, the first to provide - exchangeable carrier 211, and a pot The basis of the production structure is as shown in Figure 3A, and the flexible plastic material* is selected from the non-conductive material (4) into the slow-riding or the county-like grease material-- Cleansing to remove oil stains or granules from subsequent processes; see also section 3B, Printing (printing) or coating (transfer) or transfer (transfer) into the mask layer of the antenna pattern Adhesion of the material, in the flexible plastic carrier 211 'empty cover pattern; see the conditional picture, on the finished mask layer cle · plastic carrier 2U · face, with electropolymer cleaning (plasma Ϊ: ίί Or the electric ^ 如 如 伽 伽 (10) or ozone oxidation (_a ^ ^ surface activation surface activation (surface activati〇n), produce a surface activation layer L * 2 ί 严 严 严 严 严 严 、 附着 附着 附着 附着 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; In the manner of the surface of the flexible plastic carrier 211 to which the mask layer 217 has been attached and which is processed by the activation layer 218, the material of the conductive layer (4) is selected from the group consisting of conductive metals and associated materials. Or one of the alloy materials; see also (4), in a thirsty selective dissolution manner, the antenna line pattern is developed on the surface of the flexible plastic carrier 211 by dissolving the mask layer material of the conductive layer The 遮 is adhered by a dry rubber wheel, and the mask layer is peeled off from the flexible plastic carrier surface 211 into a radio frequency identification antenna having a pattern of the antenna conductive layer 212. In the bean, the conductive layer 212 can be used as a subsequent process. The radio frequency chip 216 ^ : used; see $ 3F ΒΙ , in order to prevent the conductive layer may be in the general process environment "caused the impedance of the antenna is improved, 遂 using printing, coating or transfer method in the adhesion guide 1337, 786 212 antenna pattern The surface of the flexible plastic 211 carrier is attached to the material, and the cover and the adhesion of the portion of the conductive layer 212 are facilitated for subsequent follow-up and the wireless capping, and the needle cover is also included; the front-process does not cover the antenna pattern. The anti-oxidation layer 213 processes the location of the electrical layer 212 treatment, and is attached as the contact area of the signal conduction contact 2U of the wireless layer 213 or the electrical conduction contact point 214 between the other circuit lines and the conductive layer 212, and , this - guide 215 'to ensure the health of the good solution to the power and electricity ' = crystal> | construction load of the construction of the load and reduce the wireless shot ^ ^ "Langxiang branch shall prevail, change and modify, both A brief description of any 1337786 L diagrams made in the protection of the present invention and in the context of the invention. Ϊ.2®: antenna manufacturing flow diagram; 3A to 3G cross-sectional schematic;

:二:頸知鐵(RFID tag)之截面示意圖; •=據本發明之無線軸(RFID)天線製造方 法’-天線結構在製程中之截面示意圖; 【主要元件符號說明】 211 可撓式塑膠載體 212 .導電層 213 抗氧化層 214 訊號傳導接觸點 215 射頻晶片構裝載體 216 射頻晶片 217 遮罩油墨層 218 表面活化層: 2: a schematic cross-sectional view of the RFID tag; • = a wireless axis (RFID) antenna manufacturing method according to the present invention' - a schematic cross-sectional view of the antenna structure in the process; [Major component symbol description] 211 flexible plastic Carrier 212. Conductive layer 213 Anti-oxidation layer 214 Signal conduction contact point 215 RF wafer carrier 216 RF wafer 217 Mask ink layer 218 Surface activation layer

Claims (1)

rm 十、申請專利範園: i· 識賴之天線製造方法,包含: 著載體1 m’賴n面係作為天線結構之附 空之开=圖避案軍層唯=載體之一端表面,其遮罩層為续 處理^氧氧性塑膠載體,利用電漿清洗或電晕 以提高後績製程之^熱、^著^f=^rface actiVation),藉 塑膠載输之可挽式 解,同時將’把附著了導電層之遮罩層溶 之膠輪點著方式,將遮罩層表面,或以乾式 可作為後續製“頻朗天線,其卜該導電層將 开4一 = ?無線射頻晶片之訊號收發之用; 在-般製程環境線路上n防止導電層可能 後續與無線射頻晶片構—線之阻抗提高,而為便於進行 對部分金屬圖案表面,二t部分導電層覆蓋與附著,而針 置,則予以鏤空、不覆蓋;/.....連接無線射頻晶片之對應銲點位 層處上,錢行抗氧化 當作無線射頻晶片與導二==,予以選擇性附著並 連接之用;冤層間之讯唬傳導接觸點或其他電路線路 導電訊號傳導接觸酐•憎& _ 體,以確保較佳接面積可大於射頻晶月構裝载 缝之_準確程度與電性連接_。 2·如申請專利範圍第—項所述之無線射頻辨識標藏之天線製造 1337786 方^ ’其中該可撓式塑膠載體之材料可包含聚乙烯(PE)、聚氯 =(PVC)、聚苯乙烯⑽、聚丙稀(pp)、聚對苯二甲酸乙二 、聚碳酸脂(pc)、聚甲基丙稀酸甲醋(pmma)、聚酰亞 wpi) 〇 =申請,範園第-項所述之無線射頻辨識標籤之天線製造 方,,其中該遮罩層形成方法可包含絲網印刷、凹版印刷、凸 :二:柔版印刷、移印、轉印、雷射印刷、噴墨 4. 請ίΓ範圍第三項所述之無線射麵識標籤之天線製造 =法’其中該遮罩層形成所使用之遮罩層材料包含可溶於 祕值水溶液或有機溶劑之有機或無機㈣,舉凡油累、黑 ΐ皆t在:顏料、有機聚合蝴體類化合物及二和: 5.=申請專利制第-項所述之無線射頻辨識 方法,其中該導電層形成方法可包含乾式之 ϋ = 鍍、電子束絲等賴紅魏或無電電轉方=、真^ • ^請專利範圍第-項所述之無線射頻辨識標 Ζ法’其中該導電層形成材料可包含金、銀、銅天錄線^ 7. 銦、錫、錯、銘、絡等金屬或相關之合金im、 導體材料等。 導電之乳化物半 如申請專利範圍第-項所述之無線射頻 方法,其中該濕式選擇性溶解_可天線製造 ::性或驗性水溶液 '純水 '有機溶劑或有機;= & =申請專利範圍第-項所述之無線射頻 方法,其中該乾式膠輪黏著法所採取之方、戴之天線製造 黏著再分離之方式或多個膠輪直接黏著膠帶壓合 9·如申請專利範圍第-項所述之無線式進行。 方法’其中該形成抗氧化層所使用之方法包含=織·^天線製造 吞以申清專利範圍 11Rm X. Applying for a patent garden: i· The method of manufacturing the antenna, including: The carrier 1 m' Lai n-face is used as the open structure of the antenna structure = Figure avoidance layer end surface of the carrier, The mask layer is a continuous treatment of oxygen-oxygen plastic carrier, which is cleaned by plasma or corona to improve the process of heat production, ^f=^rface actiVation), and the plastic solution can be used for the solution. Putting the rubber wheel with the conductive layer on the conductive layer in a dotted manner, or using the dry layer as a follow-up system, the conductive layer will open 4 The signal transmission and reception of the chip is used to prevent the conductive layer from subsequently increasing the impedance of the wireless RF chip structure on the line of the general process environment, and to facilitate the coverage and adhesion of the two t-part conductive layers on the surface of the partial metal pattern. When the needle is placed, it is hollowed out and not covered; /... is connected to the corresponding solder joint layer of the radio frequency chip, and the money is treated as a radio frequency wafer and the second electrode ==, which is selectively attached and Connection for use; Or other circuit line conductive signals conduct contact with the anhydride • 憎 & _ body to ensure that the preferred joint area can be greater than the accuracy and electrical connection of the RF crystal structure loading seam. 2 · If the scope of patent application - Item The antenna of the radio frequency identification standard is manufactured by 1337786 squares, wherein the material of the flexible plastic carrier may comprise polyethylene (PE), polychlorine = (PVC), polystyrene (10), polypropylene (pp), Polyethylene terephthalate, polycarbonate (pc), polymethyl methacrylate (pmma), polyacryl wpi) 〇 = application, the antenna of the radio frequency identification tag described in Fan Park The manufacturing method, wherein the mask layer forming method may comprise screen printing, gravure printing, convex: two: flexographic printing, pad printing, transfer, laser printing, inkjet 4. Please refer to the third item The antenna of the wireless surface recognition tag is manufactured by the method of the method. The mask layer material used for the formation of the mask layer comprises an organic or inorganic solution which is soluble in a secret aqueous solution or an organic solvent (4). : Pigments, organic polymeric compounds and dimers: 5.= Patent application The method for forming a radio frequency according to the above-mentioned item, wherein the method for forming the conductive layer may include a dry type of ϋ = plating, electron beam, etc., or a non-electrical power conversion = true ^ ^ ^ The radio frequency identification standard method is described in which the conductive layer forming material may include gold, silver, copper, and the like. 7. Indium, tin, erroneous, indium, complex, etc. metal or related alloy im, conductor material, etc. Conductive The emulsion is half of the radio frequency method described in the above-mentioned patent scope, wherein the wet selective dissolution _ can be made by:: a sexual or aqueous solution of 'pure water' organic solvent or organic; = & The radio frequency method according to the above-mentioned patent item, wherein the method of the dry rubber wheel adhesion method, the wearing antenna, the adhesion and the separation method, or the plurality of rubber wheels directly bonding the adhesive tape are as follows: - The wireless method described in the item. Method 'The method used to form the oxidation resistant layer includes the manufacture of the woven antenna.
TW95100029A 2006-01-02 2006-01-02 Method of antenna manufacturing for rfid tag TWI337786B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10426343B2 (en) 2016-03-17 2019-10-01 Industrial Technology Research Institute Physiology detecting garment, physiology detecting monitoring system and manufacturing method of textile antenna

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508366B (en) * 2011-06-20 2015-11-11 Jieng Tai Internat Electric Corp Method of forming antenna

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10426343B2 (en) 2016-03-17 2019-10-01 Industrial Technology Research Institute Physiology detecting garment, physiology detecting monitoring system and manufacturing method of textile antenna

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