TWI337786B - Method of antenna manufacturing for rfid tag - Google Patents
Method of antenna manufacturing for rfid tag Download PDFInfo
- Publication number
- TWI337786B TWI337786B TW95100029A TW95100029A TWI337786B TW I337786 B TWI337786 B TW I337786B TW 95100029 A TW95100029 A TW 95100029A TW 95100029 A TW95100029 A TW 95100029A TW I337786 B TWI337786 B TW I337786B
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- Taiwan
- Prior art keywords
- antenna
- radio frequency
- layer
- conductive layer
- item
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229920002457 flexible plastic Polymers 0.000 claims description 9
- 230000004913 activation Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 claims description 2
- 230000008570 general process Effects 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims 4
- 239000000243 solution Substances 0.000 claims 3
- 239000004698 Polyethylene Substances 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- QRSFFHRCBYCWBS-UHFFFAOYSA-N [O].[O] Chemical compound [O].[O] QRSFFHRCBYCWBS-UHFFFAOYSA-N 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000539 dimer Substances 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
- 239000000839 emulsion Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000007646 gravure printing Methods 0.000 claims 1
- 238000007648 laser printing Methods 0.000 claims 1
- 229920000620 organic polymer Polymers 0.000 claims 1
- 238000007649 pad printing Methods 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 230000001568 sexual effect Effects 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010561 standard procedure Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Details Of Aerials (AREA)
Description
1337786 ⑷明之次一目的係在於提供一無線射頻標籤(RFID)天線之 製=主術’以真空蒸鍍之方式將導電金屬材料附著於可撓式塑膠 載# 作為天線之用途,並提供作為無線射頻晶片(_ChiPS) 構體;因可撓式載體的導人_,提供糾物品表面 之無線射頻標籤(RFID)貼著。 & 明之次_目的係在於提H物頻賴(RFID)天線之 二以多層次印刷之概念’提供作為天線圖型之遮蔽層及 保^層’母個天線均可料線線路保護於其中而不錄外界 破壞,並可減少天線圖案被模仿複製之可能性 ,本發明之無線射頻標籤(RFID)天線製造技術,包含: I二式塑膠载體(flexible piastic SUpp〇rt),該載體 以印刷附著方式形成-天線線路圖案之遮以該ΐ ΐϊΐ案内並無印刷附著油墨,而其餘周圍則印滿油墨;接著, 漿f ?ipl讓treatment)進行塑膠載體表面之清潔處理; •νί 道 iiit_VaC:UUmdeP〇Siti〇n)或 _(s_ering)方 式m金屬或合金㈣把_天線線路之表面層全面附蓋, 隨後’利用水洗方式,並藉由蒸鍍金屬膜與 有機油墨對可撓式卿_之_性差異與水雜差显 ϊίίίϊϋίί以乾式黏著之方式,以朦輪類之材料依據印 二之導電性天線線路金㈣膜表面,進行抗氧 須與無線射頻晶片進行峨構裝之接 伴靜㈣’,、餘部分則全面以耐候性佳之油墨層覆蓋;待完成 ΐ :ί’以習知之接點表面抗氧化藥劑(〇sp)將接觸導電接點 進灯塗佈處理’以概續之晶片構裝或封裝。 1337786 【實施方式】 參閱本發明所附之圖示,以下將列舉實施例說明: ,本㈣之—具體實補,—種絲侧識別㈣卩)標鐵天 (=D 第1 Ϊ之_製造流程所示,錢無線射頻標藏 =i 圖如第2圖所示;在無線射頻識別(_) ^戡天線之造上,係先提供—可换式之轉載體211,並以盆一 程之产構基礎’如第3A圖所示,而該可撓式塑膠 * '選自非導電性材㈣成之緩騎或縣雜脂材料之 -種’且於製關糾先進行轉健表面之潔淨化,以去 •能影響後續製程之油污或顆粒;又再參閱第3B ,以印 ' (Printing)或塗佈(coat ing)或轉印(transfer)等方式進 天線圖案之遮罩層材料的附著,在可撓式塑膠載體211之 ' 鏤空之遮植罩圖案;再參閱第况圖,於已完成遮罩層 cle ·者膠載體2U ·面,以電聚清洗(plasma Ϊ:ηί或本電^ 〇醜如伽⑽)或臭氧氧化(_a^ ^驟進订表面活化(surface activati〇n),產生一表面活化層 L *二提ί严續製程之顺、附著與加讀;另又相第3D圖, 乂真工瘵鍍(vacuumd印osition)、真空濺鍍(vacuumsputteri ,電子束蒸鍍(EBd印osition)等方式在先前已附著遮罩層217並 響進行活化層218處理之可撓式塑膠載體211表面, 著、’該導電層之材㈣選自可導電之金屬及相關聯 f電性化&物或合金材料之其中之一;再請參閱第㈣,以渴 式選擇性溶解則之方式,藉由溶解_ 了導電層之遮罩層材 料,將天線線路圖案顯影於可撓式塑膠載體211表面,戋以乾式 之膠輪黏著,將遮罩層加以從可撓式塑膠載體表面211剝離 成為一具有天線導電層212圖案之無線射頻識別天線,豆中,該 導電層212將可作為後續製程中無線射頻晶片216之^ : 用;再參閱$ 3F ΒΙ ,為防止導電層可能在一般製程環境“ 而導致天線之阻抗提高,遂利用印刷、塗佈或轉印方式在附著導 1337,786 電廣212天線圖案之可撓式塑膠211載體表面進行 材料之附者,而為便於進行後續與無線射 ^ 行部分導電層212之覆蓋與附著,而針 蓋;又參_3G圖,前_製程不覆 天線圖案未進仃抗氧化層213處理 電層212 處理之位置,予以附著並當作無線化層213 之訊號傳導接觸點2U或其他電路線與導電層212間 電訊號傳導接觸點214之接觸面積可tm,此外,此-導 215 ’以確健佳之接解確財與電 ' =晶>|構裝載體 之構裝良率並降低無線射 何^請“朗鄉枝為準,任 變化與修改,均屬於本發明之保護^^精神和範固内所作之任何 1337786 L圖式簡單說明】 Ϊ.2® : 之天線製造流裎圖; 第3A至3G 截面示意圖;1337786 (4) The second purpose of the Ming Dynasty is to provide a radio frequency tag (RFID) antenna system. The main function is to attach a conductive metal material to the flexible plastic carrier as a antenna by vacuum evaporation. A radio frequency chip (_ChiPS) structure; a radio frequency tag (RFID) attached to the surface of the object due to the guidance of the flexible carrier. & Ming _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The invention does not record external damage, and can reduce the possibility that the antenna pattern is copied and copied. The radio frequency tag (RFID) antenna manufacturing technology of the present invention comprises: a flexible piastic SUpp〇rt, which is The printing attachment method is formed - the antenna line pattern is covered by the ΐ ΐϊΐ 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 并无 ; ; ; ; ; ; ; ; ; ; ; ; :UUmdeP〇Siti〇n) or _(s_ering) mode m metal or alloy (4) The surface layer of the _ antenna line is fully covered, and then 'water washing method, and by evaporation of metal film and organic ink to the flexible _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Carrying the connection of the 峨 装 ( ( ( ( ( ( ( ( ( ( ( ( ( ( , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Coating process 'to complete wafer fabrication or packaging. 1337786 [Embodiment] Referring to the drawings attached to the present invention, the following description will be given of the examples: (4) - specific compensation, - silk side identification (four) 卩) standard iron days (=D 1st Ϊ _ manufacturing As shown in the process, the money radio frequency standard = i picture is shown in Figure 2; in the radio frequency identification (_) ^ 戡 antenna, the first to provide - exchangeable carrier 211, and a pot The basis of the production structure is as shown in Figure 3A, and the flexible plastic material* is selected from the non-conductive material (4) into the slow-riding or the county-like grease material-- Cleansing to remove oil stains or granules from subsequent processes; see also section 3B, Printing (printing) or coating (transfer) or transfer (transfer) into the mask layer of the antenna pattern Adhesion of the material, in the flexible plastic carrier 211 'empty cover pattern; see the conditional picture, on the finished mask layer cle · plastic carrier 2U · face, with electropolymer cleaning (plasma Ϊ: ίί Or the electric ^ 如 如 伽 伽 (10) or ozone oxidation (_a ^ ^ surface activation surface activation (surface activati〇n), produce a surface activation layer L * 2 ί 严 严 严 严 严 严 、 附着 附着 附着 附着 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; In the manner of the surface of the flexible plastic carrier 211 to which the mask layer 217 has been attached and which is processed by the activation layer 218, the material of the conductive layer (4) is selected from the group consisting of conductive metals and associated materials. Or one of the alloy materials; see also (4), in a thirsty selective dissolution manner, the antenna line pattern is developed on the surface of the flexible plastic carrier 211 by dissolving the mask layer material of the conductive layer The 遮 is adhered by a dry rubber wheel, and the mask layer is peeled off from the flexible plastic carrier surface 211 into a radio frequency identification antenna having a pattern of the antenna conductive layer 212. In the bean, the conductive layer 212 can be used as a subsequent process. The radio frequency chip 216 ^ : used; see $ 3F ΒΙ , in order to prevent the conductive layer may be in the general process environment "caused the impedance of the antenna is improved, 遂 using printing, coating or transfer method in the adhesion guide 1337, 786 212 antenna pattern The surface of the flexible plastic 211 carrier is attached to the material, and the cover and the adhesion of the portion of the conductive layer 212 are facilitated for subsequent follow-up and the wireless capping, and the needle cover is also included; the front-process does not cover the antenna pattern. The anti-oxidation layer 213 processes the location of the electrical layer 212 treatment, and is attached as the contact area of the signal conduction contact 2U of the wireless layer 213 or the electrical conduction contact point 214 between the other circuit lines and the conductive layer 212, and , this - guide 215 'to ensure the health of the good solution to the power and electricity ' = crystal> | construction load of the construction of the load and reduce the wireless shot ^ ^ "Langxiang branch shall prevail, change and modify, both A brief description of any 1337786 L diagrams made in the protection of the present invention and in the context of the invention. Ϊ.2®: antenna manufacturing flow diagram; 3A to 3G cross-sectional schematic;
:二:頸知鐵(RFID tag)之截面示意圖; •=據本發明之無線軸(RFID)天線製造方 法’-天線結構在製程中之截面示意圖; 【主要元件符號說明】 211 可撓式塑膠載體 212 .導電層 213 抗氧化層 214 訊號傳導接觸點 215 射頻晶片構裝載體 216 射頻晶片 217 遮罩油墨層 218 表面活化層: 2: a schematic cross-sectional view of the RFID tag; • = a wireless axis (RFID) antenna manufacturing method according to the present invention' - a schematic cross-sectional view of the antenna structure in the process; [Major component symbol description] 211 flexible plastic Carrier 212. Conductive layer 213 Anti-oxidation layer 214 Signal conduction contact point 215 RF wafer carrier 216 RF wafer 217 Mask ink layer 218 Surface activation layer
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95100029A TWI337786B (en) | 2006-01-02 | 2006-01-02 | Method of antenna manufacturing for rfid tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95100029A TWI337786B (en) | 2006-01-02 | 2006-01-02 | Method of antenna manufacturing for rfid tag |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200727531A TW200727531A (en) | 2007-07-16 |
| TWI337786B true TWI337786B (en) | 2011-02-21 |
Family
ID=45075151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95100029A TWI337786B (en) | 2006-01-02 | 2006-01-02 | Method of antenna manufacturing for rfid tag |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI337786B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10426343B2 (en) | 2016-03-17 | 2019-10-01 | Industrial Technology Research Institute | Physiology detecting garment, physiology detecting monitoring system and manufacturing method of textile antenna |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI508366B (en) * | 2011-06-20 | 2015-11-11 | Jieng Tai Internat Electric Corp | Method of forming antenna |
-
2006
- 2006-01-02 TW TW95100029A patent/TWI337786B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10426343B2 (en) | 2016-03-17 | 2019-10-01 | Industrial Technology Research Institute | Physiology detecting garment, physiology detecting monitoring system and manufacturing method of textile antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200727531A (en) | 2007-07-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees | ||
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