1334079 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種散熱架構，尤指一種電子設備中藉 傳導熱源於外界者。 【先前技術】1334079 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation structure, and more particularly to an electronic device that transmits heat to an outside world. [Prior Art]
電子科技技術日益精進，廣泛運用於不同領域，其中作為運算處理中 心的電腦設備，伴隨處理資訊日趨龐大與複雜，電腦之效能與速度亦為消 費者與業界所重視。除了高效能外，搭配材料科技之進步，電腦之體積趨 於輕薄短小，尤其是微電腦或者車㈣電腦，在相#有限之内部空間中搭 載複雜之電子元件’但由於該電子元件運作t不可避免之熱源產生，將^ 響正常運作之穩定性，因此散熱技術因應而生。Electronic technology is becoming more and more sophisticated and is widely used in different fields. Among them, computer equipment as an arithmetic processing center is becoming more and more complicated with the processing information. The efficiency and speed of computers are also valued by consumers and the industry. In addition to high-performance, with the advancement of materials technology, the size of the computer tends to be thin and light, especially for microcomputers or cars (four) computers, which carry complex electronic components in the inner space of the phase # but because the operation of the electronic components is inevitable The heat source is generated, which will stabilize the stability of normal operation, so the heat dissipation technology will be born.
由導熱元件直接 電子设備之散熱技術包含主動型散熱(active c〇〇ling)與被動型散熱 (passive coding);主動型為利用外界動力源以驅動散熱之進行，如散熱風扇' 或水冷循環等，而被動型則利用導熱材料傳導熱源之特性，將熱源由電子 裝置導引於空氣中進行散熱，如散熱鰭片或熱導管等。為求增進散熱效果， 目前普遍於單一電子裝置上同時設置主被動型散熱元件，若僅以單一電子 裝置而言或許可以提高散熱效率，但於一電子設備中具有複數且排列複雜 之電子裝置環境下，眾多的散熱元件勢必限制該電子設備達到微型化之目 標。此外，若架設複數高轉速散熱風扇同時運轉將產生極大之噪音或震動， 亦可Hb造成内部氣流之紊亂，形成亂流，反而無法將熱源有效排出甚至積 滞0 為解決因架設複數高轉速散熱風扇所造成之問題，習知美國專利第 7’Π7,154號以及第2006/0056155號分別揭露兩種不使用冷卻風扇之電腦； 前者係利用至少一熱傳導單元將熱產生元件所產生之熱能傳導至機殼上， 並藉此達到散熱效果；而後者之發熱元件熱連接於該外置於機殼之散熱 板’將熱量藉由該散熱板排出於機殼；上述兩習知技術，因不使用冷卻風 扇可以無噪音之方式來降低機殼的内部溫度。然而此種純被動式散熱技 術’因散熱材料所能達到散熱效率之限制，若使用於高熱源產生電子裝置 或是微型化電子裝置，極可能因散熱速度不如產熱速度而積滯熱源，並無 5 1334079 法廣泛使用於各種電子裝置之上。 【發明内容】 办本發明之主要目的’在於改善電子設備過去因架設過多散熱裝置’導 致工間上之限贼者散熱效果之低落，因此欲簡化散熱設備之裝設，以運 用於微型電腦或車用型電腦，或縮小電腦之使用體積。 為達^述目的，本發明提供一種電子設備之散熱架構，該散熱架構包 有，成導熱體與一風扇，該機殼包^^一上蓋與一下蓋，並於内部 形成-谷置空間以容設至少—熱源產生元件，該導触亦裝設於該容置空 間内該導熱體包含—與該熱源產生元件相接之導熱塊，以及複數第一散 熱鰭片，其巾’該機殼為導紐質，其上設有與該第—散触片平行之複 第散”、、韓片該上蓋開设一對應於該導熱體位置之開口，使該導熱體 之第-散細片向上延伸出該開口並露出於該機殼，該熱源產生元件所產 生之熱源藉由該導熱體傳導，直接散失於電子裝置之外，上蓋另設有—相 對於該風扇位置之贼口，該風扇可抽吸該容置空間内之熱空氣，其驅動 該空氣流經料-散細促進散熱速率；此外，該機殼上設有一封蓋， 該封蓋同時齡·σ與該風壯方，藉由該封蓋與該驗相結合後，形 成一出風口並定義出一導風通道，使該風扇驅動之氣流進入該導風通道， 以單方向引流之方式流經該導熱體，最後由該出風口將熱空氣導出。 本發明電子設備之散熱架構，透過將導熱體露出於機殼外之設計，達 到直接散熱之效果，並僅裝設單一風扇以加強散熱之效率，可有=減少風 扇之架設，應用於微型化電腦設備内部空間之限制，防止因多散熱方 導致的亂流現象，以及架設過多風扇所造成的噪音及振動等問題，、此外， 亦可達到高效率之散熱目的。 【實施方式】 有關本發明之詳細說明及技術内容，現就配合圖式說明如下： 請參閱『第i圖』、『第2圖』以及『第3圖』所示，係本發 實施例之外觀立體、結構分解以及結構剖面示意圖，如圖所示： 為一種電子設備之散熱架構，包括有一機殼10、一導熱體20以及一明係 30，該機殼10包含一上蓋101與一下蓋102 ,兩者結合後内部形成一，扇 6 Π34079 工間11以容設至少一熱源產生亓杜I ^ 應器等(於本實酬中係以中央處理單央^單元41、顯示卡或電源供 裝置，如主機板42、硬碟43、輸出乍為散熱之目標)以及其他電子 容置空間11内，該導轉2G八A⑧44等’該賴體2G亦裝設於該 以及：與該中央處理單元41接觸之導熱塊21， 及接又該導熱塊21熱源之複數第一散 散熱材質，當該中央處理單元41運作時了 ，、，以機殼10為 效率之4㈣#〜政' 時會產生熱源，該繼1G僅提供低 於該上蓋1G1開設—對應於該導熱體2〇位 該中央處理單元41所產生之崎，m2部_於該上蓋101，The heat dissipation technology of the direct electronic device by the heat conduction element includes active heat dissipation (passive coding) and passive heat dissipation (active coding); the active type uses an external power source to drive heat dissipation, such as a cooling fan' or a water cooling cycle. Etc., while the passive type uses the characteristics of the heat-conducting material to conduct the heat source, and the heat source is guided by the electronic device to the air for heat dissipation, such as heat sink fins or heat pipes. In order to improve the heat dissipation effect, the active and passive heat dissipating components are generally disposed on a single electronic device at the same time. If the heat dissipation efficiency may be improved only by a single electronic device, the electronic device environment having multiple and complicated arrangements in an electronic device Under the circumstance, a large number of heat dissipating components are bound to limit the goal of miniaturization of the electronic device. In addition, if multiple high-speed cooling fans are installed at the same time, it will generate great noise or vibration. Hb can also cause internal airflow disorder, resulting in turbulent flow. Instead, it can not effectively discharge or even accumulate heat source to solve the problem. A problem caused by a fan is disclosed in U.S. Patent Nos. 7', 7, 154, and No. 2006/0056155, each of which discloses a computer that does not use a cooling fan; the former utilizes at least one heat conducting unit to conduct heat energy generated by the heat generating element. To the casing, and thereby achieving the heat dissipation effect; and the latter heating element is thermally connected to the heat dissipation plate externally disposed on the casing, and the heat is discharged to the casing through the heat dissipation plate; the above two conventional techniques, because The cooling fan can be used to reduce the internal temperature of the cabinet in a noise-free manner. However, this kind of pure passive heat-dissipation technology is limited by the heat-dissipating efficiency of the heat-dissipating material. If it is used in a high-heat source to generate an electronic device or a miniaturized electronic device, it is likely that the heat dissipation rate is not as good as the heat generation rate, and there is no heat source. 5 1334079 The method is widely used on various electronic devices. SUMMARY OF THE INVENTION The main purpose of the present invention is to improve the low-heat dissipation effect of electronic devices in the past due to the installation of too many heat-dissipating devices. Therefore, it is desirable to simplify the installation of heat-dissipating devices for use in microcomputers or Car type computer, or reduce the size of the computer. For the purpose of the present invention, the present invention provides a heat dissipation structure of an electronic device. The heat dissipation structure includes a heat conductor and a fan. The casing includes an upper cover and a lower cover, and a space is formed inside the valley. Having at least a heat generating element, the conductive contact is also disposed in the accommodating space, the heat conducting body comprises: a heat conducting block connected to the heat generating element, and a plurality of first heat radiating fins, the towel a guiding material, which is provided with a plurality of repeating portions parallel to the first-scattering sheet, and a Korean piece of the upper cover opening an opening corresponding to the position of the heat-conducting body, so that the first-scattering piece of the heat-conducting body Extending the opening upwardly and exposing to the casing, the heat source generated by the heat source generating component is directly transmitted to the outside of the electronic device by the heat conducting body, and the upper cover is further provided with a thief mouth relative to the fan position. The fan can suck the hot air in the accommodating space, and the air is driven to flow through the material to promote the heat dissipation rate; in addition, the casing is provided with a cover, and the cover is simultaneously sigma and the wind and the square Formed by combining the cover with the test The air outlet defines a wind guiding passage, so that the fan-driven airflow enters the air guiding passage, flows through the heat conducting body in a unidirectional drainage manner, and finally the hot air is led out by the air outlet. The heat dissipation of the electronic device of the present invention The architecture achieves the effect of direct heat dissipation by exposing the heat conductor to the outside of the casing, and only installs a single fan to enhance the efficiency of heat dissipation. It can reduce the erection of the fan and is used to limit the internal space of the computer equipment. In order to prevent turbulence caused by multiple heat dissipation, noise and vibration caused by erecting too many fans, and also to achieve high efficiency heat dissipation. [Embodiment] Detailed Description and Technical Contents of the Invention Now, the following diagrams are described as follows: Please refer to the "figure i", "second" and "figure 3", which are the three-dimensional appearance, structural decomposition and structural cross-section of the embodiment of the present invention. The heat dissipation structure of an electronic device includes a casing 10, a heat conductor 20, and a Ming system 30. The casing 10 includes an upper cover 101 and a lower portion. 102, the combination of the two forms an internal, fan 6 Π 34079 work room 11 to accommodate at least one heat source to generate 亓 Du I ^ device, etc. (in this remuneration, the central processing unit 41, display card or power supply The device, such as the motherboard 42, the hard disk 43, the output port is the target of heat dissipation, and the other electronic housing space 11, the guiding 2G eight A844, etc., the body 2G is also installed in the same as: The heat conducting block 21 that the processing unit 41 contacts, and the plurality of first heat dissipating materials of the heat source of the heat conducting block 21, when the central processing unit 41 is operated, and the casing 10 is used as the efficiency of 4 (four) #〜政' A heat source is generated, and the subsequent 1G is only provided to be lower than the upper cover 1G1, and the m2 portion is generated corresponding to the heat treatment body 2, and the m2 portion is disposed on the upper cover 101.
之傳導，直紐头於雷導熱塊21以及第一散熱鰭片22 得等直接散失於電子裝置之外；機殼10之 因此使該導熱體20外露於機殼1〇外邱 ㈠叹的風扇30’ 間，該風㈣驅域献觸3G _風流區 3〇之位iir7 政…鰭片22,該上盍101對應於該風扇 3〇之位置開故-抽風口 13，將容置空間u 該風扇30 一方面強制抽出積滯 : 抽出’ 流流經該導鍾20之第—_以22，^1之麻ϋ面驅動氣 產吐夕刼、s m 政…、鰭片22 M放失來自該中央處理單元41所 產生U，大巾§促進錄電子設備之散熱速率。 體2(^3 之散熱架構對於該第一散熱藉片22 ’針對該導熱 果，賴殼1〇之上蓋1〇1亦可設有與該第一 散細14爾：散細i4a可位於該第 機殼10表面〉雜置，或者料二雜_1413柯設置於該 機双10表面之其他位置；於該上蓋1〇1上方另設有一導熱 =封^^時覆蓋於該第—散_ 22露出之開口 12以及該風扇30上 上蓋:所5與該上蓋101、结合後形成一出風口151，並藉由該封蓋15斑 上盍101所限制出的空間定義為一導風通道。 /、 容置室外㈣’如車用電腦等，為防止水氣進入 界虛，如戶影響其正常運作，因此分別於該導熱體20與該上蓋101交 交界處Γ皆該上ΐ ί01之交界處’以及該封蓋15與該上蓋101之 , ^ 一防水氣密件16&、1615、16。，該防水氣密件16&、161)、 C 口為彈性橡谬圈或者密封膠等；此防水氣密件1加、1册、16c除了達到 7 1334079 防水之效果’亦可限制藉由風扇30所驅動之氣流方向，防止氣流外洩加強 單一引流之效果。 以下利用『第3圖』’說明本發明之氣流流動方向，圖中箭頭所示為熱 源氣流之方向，當電子設翻運作所產生之熱源，藉由該風扇3()之抽吸作 用’透過該抽風口 13 it入該風扇3〇，此時，熱源因風扇3〇驅動以及封蓋 15和第二散熱^14a之空間限制流入該導顧道，成為單一引流之散熱 方式’被驅動之氣流流經該第_散_片22，將來自該中央處理單元41之 熱源散失’最後熱滿氣流由該出風口 151排出。The conduction, the straight head of the lightning heat conducting block 21 and the first heat radiating fin 22 are directly lost outside the electronic device; the casing 10 thus exposes the heat conducting body 20 to the outer casing of the casing 1 (1) Between the 30's, the wind (4) drive area touches the 3G _ the wind flow area 3〇 iir7 政...the fin 22, the upper 盍101 corresponds to the position of the fan 3〇, the exhaust vent 13 will accommodate the space u The fan 30 forces the extraction of the accumulation on the one hand: the extraction of the flow through the first of the guide clocks 20 - _ with 22, ^ 1 of the paralyzed surface to drive the gas production 吐 刼 刼, sm politics ..., the fins 22 M lost from The central processing unit 41 generates U, and the large towel § promotes the heat dissipation rate of the recorded electronic device. The heat dissipation structure of the body 2 (for the first heat sink 22 ' is for the heat conduction fruit, and the cover 1 〇 1 of the cover 1 亦可 can also be provided with the first scatter: the scatter i4a can be located The surface of the first casing 10 is miscellaneous, or the material is mixed with other parts of the surface of the double 10 of the machine; and a heat conduction = sealing ^ ^ is placed over the upper cover 1 〇 1 to cover the first _ _ The exposed opening 12 and the upper cover of the fan 30 are combined with the upper cover 101 to form an air outlet 151, and the space defined by the upper cover 101 of the cover 15 is defined as an air guiding passage. /, accommodating outdoor (four) 'such as car computer, etc., in order to prevent water vapor from entering the boundary, if the household affects its normal operation, so the junction between the thermal conductor 20 and the upper cover 101 respectively is at the junction of the upper ΐ ί01 And the cover 15 and the upper cover 101, a waterproof airtight member 16&, 1615, 16. The waterproof airtight member 16&, 161), C is an elastic rubber ring or a sealant; Airtight parts 1 plus, 1 volume, 16c in addition to the 7 1334079 waterproof effect 'can also limit the air flow driven by the fan 30 To prevent the leakage of airflow and enhance the effect of single drainage. Hereinafter, the flow direction of the airflow according to the present invention will be described using "Fig. 3", and the arrow in the figure indicates the direction of the heat source airflow. When the heat source generated by the electronic turn-over operation is transmitted through the suction function of the fan 3() The air outlet 13 is inserted into the fan 3〇. At this time, the heat source flows into the guide channel due to the fan 3〇 drive and the space of the cover 15 and the second heat sink 14a, and becomes a single drain heat dissipation mode. Flowing through the first scatter sheet 22, the heat source from the central processing unit 41 is dissipated 'the last hot full airflow is discharged from the air outlet 151.
综上所述’本㈣電子賴讀練構彻賴體2G直祕出於電子 設，表面達到直接散熱之效果，更彻—風扇3G之驅動，搭配導風通道所 向’同時抽吸電子設備容置空間11内之熱源，以及協同 之散執Μ理單70 41料至第―散熱則22之熱源，大幅提升電子設備 及齡設置，目此有鱗聽數風扇如 到古效率η3振動’#至因氣流紊亂所造成之熱源積滯等_，亦可達 要:果之目的。因此本發明極具進步性及符合f請發明專利之 要件，爰依法提出申請，祈鈞局早日賜准專利，實.便。 實施2已將本發觀-詳細綱，惟以上所述者，縣本發明之一較佳In summary, the 'four (4) electronic Lai reading practice 2G straight secret for electronic design, the surface achieves the effect of direct heat dissipation, more thoroughly - the fan 3G drive, with the guide channel to the 'simultaneous suction electronic equipment The heat source in the accommodating space 11 and the heat source of the synergistic processing unit 70 to the heat-dissipating 22 greatly increase the electronic equipment and age setting, so that the scaly number fan can reach the ancient efficiency η3 vibration' #至的热源积滞 caused by airflow disorder, etc., can also achieve the purpose of: fruit. Therefore, the present invention is highly progressive and conforms to the requirements of the invention patent, and the application is made according to law, and the prayer bureau will grant the patent as soon as possible. Implementation 2 has taken this view - a detailed outline, but the above is one of the preferred embodiments of the present invention.
之均等定本㈣倾之軸。即驗本侧帽範圍所作 等變化娜料’應韻本發明之專利驢範圍内。 8 1334079 【圖式簡單說明】 第1圖，係本發明電子設備之散熱架構一較佳實施例之外觀立體示意圖 第2圖，係本發明電子設備之散熱架構一較佳實施例之結構分解示意圖 第3圖，係本發明電子設備之散熱架構一較佳實施例之結構剖面示意圖 【主要元件符號說明】 10 .............機殼 101 .............上蓋 102 .............下蓋 11 .............容置空間 12 .............開口The equalization of the (four) tilting axis. Immediately, the scope of the side cap is changed, and the material is within the scope of the patent of the invention. 8 1334079 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of a heat dissipation structure of an electronic device according to the present invention. FIG. 2 is a schematic exploded view of a preferred embodiment of a heat dissipation structure of an electronic device of the present invention. FIG. 3 is a cross-sectional view showing the structure of a heat dissipation structure of an electronic device according to the present invention. [Main component symbol description] 10 . . . ... casing 101 ... .......Upper cover 102 ............. Lower cover 11 .............Receiving space 12 ........ ..... opening
13.............抽風口 14、14a、14b.............第二散熱鰭片 15.............封蓋 151.............出風口 16a、16b、16c.............防水氣密件 2〇.............導熱體 21 .............導熱塊 22 .............第一散熱鰭片 30.............風扇13.............Exhaust vents 14, 14a, 14b.............The second heat sink fins 15.......... ...cover 151.............air outlets 16a,16b,16c.............watertight airtight parts 2〇... .......thermal conductor 21..................thermal block 22..................first heat sink fin 30..... ........fan
41 .............中央處理單元 42 .............主機板 43 .............硬碟 44 .............輸出入介面 941 ............. central processing unit 42 ............. motherboard 43 . . ....... hard disk 44 .............Import and export interface 9