Λ、發明說明： 【發明所屬之技術領域】 具'有改良銲盤且町防止 電路板。 帝t發明涉及—種電路板’尤指一種 :子二件的官_成锡橋而造成短路的 【先前技術】 件，例1^般包子装置均具有電路板’其上可裝設許多插件元 • Package，阻、插件電容、雙列直插式（Dual In_line 要焊接在 ♦件等類型的電子零件，雜類型的電子零件 目，電：板上’必須要使電路板上具有插孔。 用;^ ％子產品越來越小’呈小型化發展的趨勢，相對地 从述電子產品的電路板上的電子零件也越來越小，造成相 :;的電路板上電子零件間的管腳間的腳距（pitch)也越來越 雷牧部分電子零件的腳距甚至等於或小於⑺毫米（娜），對 鲁 ^上的銲盤（Pad)的尺寸以及結構提出很高的要求。 過、、古all考圖1與圖2 ’係習知電路板與具有插腳的電子零件 焊接機的不意圖。該電子零件2具有複數管腳，管腳9 鲜且具有相同的結構。電路…具有複數圓形的 =3’鲜盤3中間具有用於插接該電子零件2的管腳8的通 礼6。銲盤5與銲盤3相鄰，盆 *插接該電子零件2的管腳二=3相同的結構’用 過波峰焊接機進行電子零件2焊^有電子零件2的電路板1 n ^ 坪接時，由於該電子零件2管腳 間的卿距過小，且承載電路板工的輪送帶（未圖示^㈣于 6 波峰焊接機，隨著電路板 管腳9上過量的還處1在波峰焊接機移動，電子零件2的 各二 蜒、熔嘁狀態的銲料力 會向電路板移動的相反方 抖在 相連形成錫橋4,導致# °移動’與其相鄰的管腳8上的銲料 使電路板1無法正常使8、9短路’造成該電子零件2失效， 電子裝置失效，嚴重而報廢’從而造成含有該電路板i的 【發明内容】〜響電子產品的品質。Λ, invention description: [Technical field to which the invention pertains] Having a modified pad and preventing the circuit board. Emperor t's invention involves a kind of circuit board, especially one type: the former two parts of the official _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ • Package, resistance, plug-in capacitor, dual in-line (Dual In_line to solder electronic components such as ♦ parts, miscellaneous types of electronic parts, electricity: board must have a jack on the board. With the trend that the product is getting smaller and smaller, the electronic components on the circuit board of the electronic product are getting smaller and smaller, causing the tube between the electronic components on the circuit board. The pitch between the feet is also increasing. The pitch of the electronic parts of the ramie is even equal to or less than (7) millimeters (Na), which places high demands on the size and structure of the pads on the slab. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , =3' fresh disk 3 with multiple rounds The gift 6 of the pin 8 of the electronic component 2 is inserted. The pad 5 is adjacent to the pad 3, and the pad* is inserted into the pin 2 of the electronic component 2 to have the same structure. The electron is soldered by a wave soldering machine. When the part 2 is soldered to the circuit board with the electronic component 2 1 n ^, the distance between the pins of the electronic component 2 is too small, and the carrier tape carrying the circuit board is not shown (not shown) (6) in 6 wave soldering Machine, as the excess of the board pin 9 is still moving in the wave soldering machine, the soldering force of each of the two parts of the electronic component 2, the molten state will be shaken to the opposite side of the board to form a tin bridge 4 , causing # ° to move 'the solder on the adjacent pin 8 to make the circuit board 1 unable to properly short the terminals 8, 9 'causing the electronic component 2 to fail, the electronic device fails, severely scrapped' resulting in the inclusion of the circuit board i [Summary of the invention] ~ The quality of the electronic products.
有鑑於此，雲接徂— 銲盤過錫時相知g種具有改良銲可防止電路板相鄰 一種且而造成短路的電路板。 過錫時相連〒成^盤的電路板，係用於防止電路板相鄰銲盤In view of this, the cloud interface - when the pad is over tin, is known to have a modified circuit to prevent the circuit board from being adjacent to one another and causing a short circuit. When the tin is over, the circuit board connected to the disk is used to prevent the adjacent pads of the circuit board.
自身重力的作用下將 數第—銲•及成短路，該電路板包括複數通孔、複 ..銲盤，料第m職於·通孔的 ° 5κ等第一銲盤分別包括一第一焊接區及一鱼兮第一焊接 區相連通並向外延伸形成㈣二料區，該第二銲=於該電 路板的一尾端且大於第一銲盤。 口第—焊接區和電路板尾端的第二銲盤’可以將過量鮮料 導弓丨預先设定好的弟二焊接區和尾端銲盤，從而可以避免因 過重的銲料造成相鄰銲盤相互接觸引起電子零件短路而造成 各有~電子零件的電路板失效’提南電子產品的生產良率和效 率。 【實施方式】 °月參考圖3 ’本發明主要是提供一種具有改良的複數第一 7 第二銲盤190的電路板100，該電路板_ 的舰隐要是祕容置痛”子零件 =:〇包括位於最尾端的管卿212和其餘管腳214。該等 -銲盤110以防止該電子零件的相鄰管腳 =焊接Γ由於該管腳210上過量的銲料可能造成兩者 二株引起电子零件200相鄰管卿210短路而造成含有該電 的電子裝置失效。同時，電路板尾端過量的銲料導 入設計在尾端的第二料⑽上，Μ止該電子零件的尾 端管腳加相互之間短路而造錢子零件失效，同時也可 以防止尾端管腳212與其相鄰排管聊214之間短路而造成電子 零件200失效。 請-併參考圖4和圖5，為本發明具有改良銲盤的電路板 100的第貝施方式。如圖4所示，該電路板⑽具有複數通 孔140 ’該等通孔14〇主要用於容置插腳類的電子零件2⑻的 管腳210,圍繞該等通孔14〇為本發明改良的第一銲盤ιι〇, 該4第一銲盤110包括位於最尾端的複數銲盤12〇和其餘複數 銲盤130。其中，該第一銲盤11〇呈淚滴形並設計於該電路板 1〇〇的表面’該等第一銲盤110分別包括一第一谭接區112及 一與該第一焊接區112相連通並向外延伸形成的第二焊接區 114 ’該第一焊接區112和第二焊接區114的表面是可以進行 焊接的。 若以電路板100在波♦焊接機（圖未示）的移動方向為參 8 1332376 考方向’該第一銲盤n〇的軸線與該電路板100移動的反方向 形成一個夾角α，該夾角α範圍在15度到9〇度之間。其中， 位於最尾端的銲盤120的夾角α的最適宜角度為45度，其餘 鮮盤130的夾角《的最適宜角度為90度。其中，位於最邊緣 的橫向兩排的第一銲盤110的第二焊接區114的延伸方向相 反。 本發明的電路板100還包括位於最尾端的第二銲盤19〇， 該第二銲盤190的中心軸線與該第一銲盤11〇所圍成的區域的 中。線重豐。該第一銲盤190呈扇形，扇形中心角為120-180 度。在本實施方式中，第二銲盤19〇的中心角為18〇度。 現以電路板1〇〇的兩相鄰的第一銲盤11〇來說明本發明的 主要原理。當該插有電子零件2〇〇的電路板1〇〇被放入到波峰 焊接機進行電子零件200焊接並被移動時，放于波峰焊接機中 的銲料會將電路板100上的電子零件200的管腳21〇分別焊接 於電路板100的第一銲盤110上，由於承載電路板1〇〇的輸送 帶（未圖示）是傾斜于波峰焊接機，銲料在自身的吸附力和表 面張力的作用下將會沾附於電子零件的管腳21〇上，管腳21〇 上過量的還處於熔融狀態的銲料在自身重力及慣性的作用下 將會向後流動，亦即流向具有一定夾角α的第二焊接區114， 以避免管腳210上過置的銲料流向相鄰的管腳並與其焊接 在一起，從而防止管腳210相互接觸而造成短路，避免造成電 路板100報廢而使相應的電子裝置無法使用。同時，電路板尾 9 1332376 .端的過！銲料流向最尾端的第二銲盤19Q，以免該電子零件的 尾端官腳212相互之間短路而造成電子零件200失效，也可防 止尾端s腳212與其相鄰排管腳214之間短路而造成電子零件 200失效。Under the action of self-gravity, the number of the first-weld and the short-circuit, the circuit board includes a plurality of through-holes, a plurality of pads, and the first pads of the first 5th, etc., respectively, include a first The soldering zone and the first soldering zone of the fishing rod are connected to each other and extend outward to form a (four) two-material zone, and the second soldering is at a tail end of the circuit board and larger than the first pad. The second pad of the mouth-welding area and the end of the circuit board can guide the excess fresh material to the pre-set pad and the tail pad of the pre-set, so as to avoid the adjacent pads from being caused by the excessive solder. The contact causes the short circuit of the electronic parts to cause the failure of the circuit board of each electronic part. The production yield and efficiency of the electronic products of the company. [Embodiment] Referring to FIG. 3 of the present invention, the present invention mainly provides a circuit board 100 having an improved plurality of first 7 second pads 190, the board of which is implicitly a painful sub-part ==: The crucible includes the gland 212 and the remaining pins 214 at the extreme end. The pad-110 prevents the adjacent pins of the electronic component from being soldered, and the solder may be caused by excessive solder on the pin 210. The electronic component 200 is short-circuited by the adjacent gabette 210 to cause the electronic device containing the electric device to fail. At the same time, excessive solder is introduced into the second material (10) at the trailing end of the circuit board, and the tail end pins of the electronic component are added to each other. The short circuit between the money-making parts fails, and at the same time, the short circuit between the tail pin 212 and its adjacent pipe 214 can be prevented from causing the electronic component 200 to fail. Please - and refer to FIG. 4 and FIG. The first embodiment of the circuit board 100 for improving the pad. As shown in FIG. 4, the circuit board (10) has a plurality of through holes 140'. The through holes 14 are mainly used to accommodate the pin 210 of the electronic component 2 (8) of the pin type. , around the through holes 14 〇 for the invention The first pad ι, the 4 first pad 110 includes a plurality of pads 12 位于 at the end and a remaining plurality of pads 130. The first pad 11 is in the shape of a teardrop and is designed in the circuit. The first pads 110 of the first surface 110 include a first lands 112 and a second lands 114 that are connected to the first lands 112 and extend outwardly. The surface of the region 112 and the second land 114 can be soldered. If the direction of movement of the board 100 in the wave soldering machine (not shown) is the reference axis 1 1332376, the direction of the first pad n〇 Forming an angle α with the opposite direction of the movement of the circuit board 100, the angle α ranges from 15 degrees to 9 degrees. The optimum angle of the angle α of the pad 120 at the rearmost end is 45 degrees, and the rest is fresh. The optimum angle of the angle of the disk 130 is 90 degrees. The second soldering regions 114 of the first pads 110 in the laterally two rows of the outermost edges extend in opposite directions. The circuit board 100 of the present invention further includes the a second pad 19〇 of the end, a central axis of the second pad 190 and the first The first pad 190 has a fan shape with a fan-shaped central angle of 120-180 degrees. In the present embodiment, the central angle of the second pad 19〇 is a circle. It is 18 degrees. The main principle of the present invention will now be described by two adjacent first pads 11A of the board 1. When the board 1 with the electronic component 2 is inserted, When the wave soldering machine performs the soldering of the electronic component 200 and is moved, the solder placed in the wave soldering machine solders the pins 21 of the electronic component 200 on the circuit board 100 to the first pads 110 of the circuit board 100, respectively. Since the conveyor belt (not shown) carrying the circuit board 1 is inclined to the wave soldering machine, the solder will adhere to the pin 21 of the electronic component under the action of its own adsorption force and surface tension, and the pin The excess solder which is still in the molten state will flow backward under the action of its own gravity and inertia, that is, to the second soldering region 114 having a certain angle α, so as to avoid the solder flowing to the phase on the pin 210. Adjacent pins are soldered together to prevent pin 210 Contact with each other causes a short circuit, which prevents the circuit board 100 from being discarded and renders the corresponding electronic device unusable. At the same time, the end of the circuit board 9 1332376 . The solder flows to the rearmost second pad 19Q to prevent the electronic component 200 from being short-circuited by short-circuiting the tail end legs of the electronic component, and also prevents short-circuit between the trailing end s-pin 212 and its adjacent row of pins 214. The electronic component 200 is disabled.
"月參閱圖6，為本發明具有改良銲盤的電路板400的第二 只知方式。該第二實施方式與第—實施方式的結構和原理相 同，其主要區別在於，該第二實施方式的電子零件3〇〇的管腳 1 有兩排同理，電路板400的第一銲盤41〇也只有兩排。 其中，該第一銲盤410的轴線的偏移方向是朝電路板400移動 —向I伸失角α的角度範圍與第一實施方式的夹角α的 角度範圍相同。尾端扇形第二銲盤490的中心角為120度。"Month Referring to Figure 6, a second known manner of a circuit board 400 having improved pads is shown. The second embodiment is identical to the structure and principle of the first embodiment, and the main difference is that the pin 1 of the electronic component 3 of the second embodiment has two rows of the same, and the first pad of the circuit board 400 There are only two rows in 41〇. The offset direction of the axis of the first pad 410 is the same as the angle range of the angle α of the first embodiment. The center angle of the trailing sector second pad 490 is 120 degrees.
在其他實施方式中，如果電子零件.2〇〇的管腳21〇之間的 距離料小’則電路板財間的銲㈣沒有第二焊接區，只有 =最邊緣的橫向兩排的銲盤設有第二焊接區，而域最邊緣 、只向兩排銲盤的第二焊接區的延伸方向相反。 4综上該’本發明符合發日轉利要件，奚依法提出專利申 惟’以上財僅為本發明之較佳實施例，舉凡熟悉本案技 -之人士’在纽本祕明料所作之等效師或變化，皆靡 包含於以下之申請專利範圍内。 〜 【圖式簡單說明】 圖1係習知的電路板與電子零件未焊接時的立體分解圖。 圖2係習知的電路板與電子零件焊接時的立體圖。 1332376 圖3係本發明第一實施方式具有改良銲盤的電路板與電子 零件未焊接時的立體分解圖。 圖4係圖3的局部放大圖。 圖5係本發明第一實施方式具有改良銲盤的電路板與電子 零件焊接時的立體圖。 圖6係本發明第二實施方式具有改良銲盤的電路板與電子 零件未焊接時的立體分解圖。 圖7係本發明第二實施方式具有改良銲盤的電路板與電子 零件焊接時的立體圖。 【主要元件符號說明】 • 電路板 100 、 400 第一銲盤 110、410 第一焊接區 112 第二焊接區 114 銲盤 120 > 130 通孔 140 第二銲盤 190 、 490 電子零件 200 、 300 管腳 210、212、214、310 11In other embodiments, if the distance between the pins 21 of the electronic component .2 is small, then the soldering of the circuit board (four) has no second pad, only the pad of the laterally two rows of the most edge A second land is provided, and the second edge of the domain is opposite to the second land of the two rows of pads. 4 In summary, the invention conforms to the daily transfer requirements, and the patent application is filed according to law. 'The above financial resources are only preferred embodiments of the present invention, and those who are familiar with the present technology' are made in New Zealand's secret materials. Physicians or changes are included in the scope of the following patent application. ~ [Simple description of the drawings] Fig. 1 is an exploded perspective view of a conventional circuit board and electronic components when they are not soldered. 2 is a perspective view of a conventional circuit board and an electronic component when soldered. 1332376 Fig. 3 is an exploded perspective view showing a circuit board having an improved pad and an electronic component which are not soldered according to the first embodiment of the present invention. Figure 4 is a partial enlarged view of Figure 3. Fig. 5 is a perspective view showing a state in which a circuit board having an improved pad and an electronic component are welded according to the first embodiment of the present invention. Fig. 6 is an exploded perspective view showing a circuit board having an improved pad and an electronic component which are not soldered according to a second embodiment of the present invention. Fig. 7 is a perspective view showing a state in which a circuit board having an improved pad and an electronic component are welded according to a second embodiment of the present invention. [Major component symbol description] • Circuit board 100, 400 First pad 110, 410 First pad 112 Second pad 114 Pad 120 > 130 Via 140 Second pad 190, 490 Electronic parts 200, 300 Pins 210, 212, 214, 310 11