1331346 九、發明說明： 【發明所屬之技術領域】 本發明係一種具有過電流或過熱保護功能之微小型 積層電容器，尤指一種其陽電極、陰電極之間含有聚合 物正溫度係數材料（PPTC)之電解質層，而使電容器^ 有過電流或過熱保護之功能者。 【先前技術】 按，由於半導體技術的演進，使得半導體構裝的產 vm在市場需求提高下，不斷發展出更精密、更先進的電 子元件。以目前的半導體技術而言，比如覆晶構裝的技 術、積層基板的設計及被動元件的設計等，均在半導體 產業中，佔有不可或缺的地位。以覆晶/球格陣列封裝結 構為例，晶片係配置於封裝基板的表面上，並且晶 封裝基板電性連接，而封裝基板係為多層圖案化^路層 ^乂及多層絕緣層積集而成，其中圖案化電路層可經: 微如蝕刻的方式加以定義而成，而絕緣層配置於相 圖:化電路層之間。此外，為了得到更佳的電氣特性τ 2基板之表面上還配置有電容、電感以及電阻等被動 其可藉由封裝基板之内部線路，而電性 片以及其他電子元件。 按於阳 在被動元件之設計上，由於晶片在高速運算下，合 傳且晶片所產生之熱能會傳至封裝基板上，i 傳至破動元件上。為了使被動元件即使在高溫的環= 5 1331346 下，也不會影響其電氣特性，因此必須設計具有耐高溫 以及高穩定性的被動元件，而微小型積層電容器即是其 中一例。 一般習知之微小型積層電容器，主要係由多層介電 層與多層金屬層堆疊而成，其中，介電層係由高介電常 數之材質，如：鋇鈦酸鹽所組成，而金屬層係由如：銀、 銀鈀合金之導電材質所組成，且多層金屬層形成多個 魯 陽、陰極交替之内電極（Internal electrode )，而内電 極與介電層係構成一電容結構，其兩側還配置有一對終 鈿電極，分別電性連接陽、陰極之内電極，形成陽極及 陰極，且該等陽極及陰極表面可形成一表面金屬層，如： 鎳，以防止氧化。 習見之微小型積層電容器雖可因由多層介電層與多 層金屬層堆疊構成’而體積可微小型化，增加運用範圍， 但是，其溫度特性差，而且漏電流和介質損失大，當陽 • 極與陰極之間所流過的電流，或者是兩極之間的電壓超 出規格時，其安全特性將被破壞，造成介電層及金屬層 之損壞，並波及與其連接之電子電路，導致主機板等電 子裝置的損壞。因此，如何能開發設計出一種具有過電 流或過熱保護功能之積層電容器，將是相關業界亟待努 力之課題。 【發明内容】 發明人有鑑於前述先前技術之缺點，乃依其從事各 6 1331346 種積層電容ϋ之製造經驗和技術累積，針對上述缺失承 心研究各種解決的方法，在經過不斷的研究、實驗與= 良後’終於開發設計出本發明之—種全新具有過電流 過熱保護功能之微小型積層電容器之發明，以期能摒降 先前技術所產生之缺失。 '1331346 IX. Description of the Invention: [Technical Field] The present invention relates to a micro-layered multilayer capacitor having an overcurrent or overheat protection function, and more particularly to a material having a polymer positive temperature coefficient between a positive electrode and a cathode electrode (PPTC) The electrolyte layer, so that the capacitor ^ has the function of overcurrent or overheat protection. [Prior Art] According to the evolution of semiconductor technology, the production of semiconductor components is increasing, and more sophisticated and more advanced electronic components are being developed. In the current semiconductor technology, technologies such as flip chip mounting, design of laminated substrates, and design of passive components are indispensable in the semiconductor industry. Taking a flip chip/ball grid array package structure as an example, the wafer system is disposed on the surface of the package substrate, and the crystal package substrate is electrically connected, and the package substrate is a multi-layer patterned circuit layer and a plurality of insulation layers. The patterned circuit layer can be defined by: micro-etching, and the insulating layer is disposed between the phase diagrams and the circuit layers. In addition, in order to obtain better electrical characteristics τ 2, the surface of the substrate is further provided with a capacitor, an inductor, a resistor, etc., which can be passively used to encapsulate the internal wiring of the substrate, and an electrical sheet and other electronic components. According to the design of the passive component, since the wafer is transferred at high speed, the thermal energy generated by the wafer is transferred to the package substrate, and i is transmitted to the broken component. In order to make the passive component not under the high temperature of the ring = 5 1331346, its electrical characteristics are not affected. Therefore, passive components with high temperature resistance and high stability must be designed, and a micro-sized multilayer capacitor is one of them. Generally, a micro-sized multilayer capacitor is mainly composed of a multilayer dielectric layer and a plurality of metal layers, wherein the dielectric layer is composed of a material having a high dielectric constant, such as barium titanate, and the metal layer is It is composed of a conductive material such as silver or silver-palladium alloy, and the multi-layer metal layer forms a plurality of internal electrodes of alternating anodes and cathodes, and the inner electrodes and the dielectric layers form a capacitor structure on both sides thereof. A pair of terminal electrodes are also disposed, which are electrically connected to the inner electrodes of the anode and the cathode respectively to form an anode and a cathode, and the surface of the anode and the cathode can form a surface metal layer such as nickel to prevent oxidation. Although the micro-sized multilayer capacitors can be formed by stacking multiple dielectric layers and multiple metal layers, the volume can be miniaturized and the application range can be increased. However, the temperature characteristics are poor, and the leakage current and the dielectric loss are large. When the current flowing between the cathode and the cathode, or the voltage between the two poles exceeds the specification, the safety characteristics will be destroyed, causing damage to the dielectric layer and the metal layer, and affecting the electronic circuit connected thereto, resulting in a motherboard, etc. Damage to the electronic device. Therefore, how to develop and design a multilayer capacitor with overcurrent or overheat protection will be an urgent task for the industry. SUMMARY OF THE INVENTION The inventors have in view of the above-mentioned shortcomings of the prior art, and according to the manufacturing experience and technical accumulation of each of the 6 1331346 laminated capacitors, the methods for solving the above-mentioned problems are studied in the past, and after continuous research and experiment. = 良后' finally developed and designed the invention of a new type of micro-layered capacitor with overcurrent protection function, in order to reduce the lack of prior art. '
因此本發明即旨在提供一種具有過電流或過熱保 功能之微小型積層電容器，依本發明之此種電容器，其 陽極金屬層與陰極金屬層之間為聚合物正溫度係數祖 (附c)之電解質層，俾㈣行過熱或過電流保護1 改善習見之電容器的缺失，此為本發明之主要目的。 為便貴審查委員能對本發明之目的、形狀、構造裝 置特徵及其功效，做更進一步之認識與瞭解，茲舉實施 例配合圖式，詳細說明如下： 【實施方式】 本發明乃有關於「一種具有過電流或/及過熱保護功 能之微小型積層電容器」，乃如第工圖所示，必需先予陳 明者，為了說明上的清楚起見，第i圖係將實物放大了數 十倍之多，該微小型積層電容器主要係由多層介電層” =多層金屬層12堆疊而成，其中，介電層打係由高二電 常數之材料，例如：鋇鈦酸鹽所組成，而金屬層係由 例如··銀、銀鈀合金.銅.鎳.鋁及其合金或複合金屬等之 導電材質所組成，且多層金屬層12形成多個陽、陰極交 替之内電極（lnternal electrode)，而内電極與介電層 7 11係構成一電容結構，其兩側還配置有一對終端電極， π別電性連接陽、陰極之内電極，形成陽極14及陰極15 ，且該等陽極14與陰極15表面可形成一表面金屬層，如 .鎳，以防止氧化；電容器本體表面，又可形成一保護 層，以防止電容器本體受傷。 本發明之積層電容器可依以下步驟製成：首先，將 夕種介電粉末及聚合物正溫度係數材料（PPTC)之粉末 魯 岣勻混合，經製粒抽板以形成一介電層11之生胚；接著 ，利用網版印刷之方式將金屬粉末與有機黏劑轉印在生 胚上’以形成一金屬層12，再將上述之介電層η生胚經 過堆疊、壓合的步驟，而形成至少一層之介電層U及金 屬層12的結構，並於陽極金屬層引出陽極14，陰極金 屬層123引出陰極15,使陽極金屬層與陰極金屬層123 之間’所形成之電解質層13，令電容器能夠具有過電流 或過熱保護之功能。 • 本發明之積層電容器的另一種製造方法，係將多種 介電粉末均勻混合，再混入具有聚合物正溫度係數材料 (PPTC )之粉末中，經過製粒及抽板後以形成一介電層 11之生胚，接著，將金屬箔結合於上述之介電層Η生胚 上，以形成一金屬層12,再將上述之介電層11生胚經過 堆疊、厘合的步驟，而形成至少一層之介電層及金屬 層12的結構，並於陽極金屬層121引出陽極14’陰極金屬 層123引出陰極15，使陽極金屬層121與陰極金屬層123 8 1331346 之間，所形成之電解質層13，令電交哭―私 令态忐夠具有在通過 的電&過大或溫度過熱時，均可造成斷路而保 與電子電路之功能者。 °Therefore, the present invention is directed to providing a micro-sized multilayer capacitor having an overcurrent or overheat protection function. According to the capacitor of the present invention, a positive temperature coefficient ancestor between the anode metal layer and the cathode metal layer (attached c) The electrolyte layer, 俾 (4) line overheating or overcurrent protection 1 to improve the lack of capacitors, which is the main purpose of the present invention. For the purpose of the present invention, the present invention can be further understood and understood. A micro-layered capacitor with overcurrent or / and overheat protection function, as shown in the figure, must be clearly stated. For the sake of clarity, the i-th image will magnify the object for several decades. In many cases, the micro-layered multilayer capacitor is mainly composed of a plurality of dielectric layers "=multi-layer metal layer 12, wherein the dielectric layer is composed of a material having a high electric constant, such as barium titanate, and The metal layer is composed of a conductive material such as silver, silver-palladium alloy, copper, nickel, aluminum, an alloy thereof or a composite metal, and the multilayer metal layer 12 forms a plurality of alternating electrodes of anode and cathode. The inner electrode and the dielectric layer 7 11 form a capacitor structure, and a pair of terminal electrodes are disposed on both sides thereof, and π is electrically connected to the inner electrodes of the anode and the cathode to form the anode 14 and the cathode 15, and the anodes are The surface of the electrode 14 and the cathode 15 may form a surface metal layer such as nickel to prevent oxidation; and the surface of the capacitor body may further form a protective layer to prevent the capacitor body from being damaged. The multilayer capacitor of the present invention can be made according to the following steps: First, the powder of the dielectric powder and the polymer positive temperature coefficient material (PPTC) are uniformly mixed, and the plate is granulated to form a green layer of the dielectric layer 11; then, by screen printing The metal powder and the organic adhesive are transferred onto the green embryo to form a metal layer 12, and then the dielectric layer η raw embryo is stacked and pressed to form at least one dielectric layer U and metal layer. The structure of 12, and the anode 14 is taken out from the anode metal layer, and the cathode metal layer 123 leads out the cathode 15 to form an electrolyte layer 13 between the anode metal layer and the cathode metal layer 123, so that the capacitor can have overcurrent or overheat protection. Function: Another manufacturing method of the multilayer capacitor of the present invention is to uniformly mix a plurality of dielectric powders and mix them into a powder having a polymer positive temperature coefficient material (PPTC). After the particles and the plate are formed to form a green layer of the dielectric layer 11, then the metal foil is bonded to the dielectric layer of the above-mentioned dielectric layer to form a metal layer 12, and then the dielectric layer 11 is formed. After the steps of stacking and thawing, at least one layer of the dielectric layer and the metal layer 12 are formed, and the anode 14' is taken out from the anode metal layer 121. The cathode metal layer 123 leads out the cathode 15 to make the anode metal layer 121 and the cathode metal layer. Between 123 8 1331346, the electrolyte layer 13 is formed so that the electric crying-private state can have the function of breaking the circuit and protecting the electronic circuit when the electric power is too large or the temperature is overheated.
紅合上所述，本發明之具有過電流或過熱保護功能 之微小型積層電容器，確實具有前所未有之創新構造， 其既未見於任何刊物’且市面上亦未見有任何類似的產 品，是以，其具有新穎性應無疑慮。另外，本發明所具 有之獨特特徵以及功能遠非習用所可比擬，所以其確實 比習用更具有其進步性，而符合我國專利法有關發明專 利之申請要件之規定，乃依法提起專利申請。 以上所述，僅為本發明最佳具體實施例，惟本發明 之構造特徵並不侷限於此，任何熟悉該項技藝者在本發 明領域内，可輕易思及之變化或修飾，皆可涵蓋在以下 本案之專利範圍。 1331346 【圖式簡單說明】 第1圖為本發明積層電容器之剖面圖 【主要元件符號說明】 11 :介電層 12 :金屬層 13 :電解質層 14 :陽極 15 :陰極 121 :陽極金屬層 123 :陰極金屬層As described above, the micro-layered capacitor with overcurrent or overheat protection function of the present invention does have an unprecedented innovative structure, which is neither found in any publication' nor has any similar products on the market. Its novelty should be undoubted. In addition, the unique features and functions of the present invention are far from comparable to the conventional ones, so it is indeed more progressive than the conventional ones, and the patent application is in accordance with the provisions of the application requirements of the patent law of the Chinese Patent Law. The above description is only the best embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any change or modification that can be easily considered by those skilled in the art can be covered. In the following patent scope of this case. 1331346 [Simple description of the drawings] Fig. 1 is a cross-sectional view of a multilayer capacitor of the present invention [Description of main components] 11: dielectric layer 12: metal layer 13: electrolyte layer 14: anode 15: cathode 121: anode metal layer 123: Cathode metal layer