TWI330660B - Halogen-free, thermal resistant composition - Google Patents
Halogen-free, thermal resistant composition Download PDFInfo
- Publication number
- TWI330660B TWI330660B TW095146836A TW95146836A TWI330660B TW I330660 B TWI330660 B TW I330660B TW 095146836 A TW095146836 A TW 095146836A TW 95146836 A TW95146836 A TW 95146836A TW I330660 B TWI330660 B TW I330660B
- Authority
- TW
- Taiwan
- Prior art keywords
- halogen
- temperature resistant
- maleimide
- high temperature
- epoxy resin
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 31
- 239000003822 epoxy resin Substances 0.000 claims description 22
- 229920000647 polyepoxide Polymers 0.000 claims description 22
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 7
- -1 maleic acid amines Chemical class 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000004848 polyfunctional curative Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920006295 polythiol Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- HNYOPLTXPVRDBG-UHFFFAOYSA-N barbituric acid Chemical compound O=C1CC(=O)NC(=O)N1 HNYOPLTXPVRDBG-UHFFFAOYSA-N 0.000 claims 8
- 229920000642 polymer Polymers 0.000 claims 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 2
- 229920000768 polyamine Polymers 0.000 claims 2
- KCFXNGDHQPMIAQ-UHFFFAOYSA-N 1-(4-methylphenyl)pyrrole-2,5-dione Chemical compound C1=CC(C)=CC=C1N1C(=O)C=CC1=O KCFXNGDHQPMIAQ-UHFFFAOYSA-N 0.000 claims 1
- CAFYFLBQEYTUIN-UHFFFAOYSA-N 1-[2-(oxan-2-yloxy)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1OC1OCCCC1 CAFYFLBQEYTUIN-UHFFFAOYSA-N 0.000 claims 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims 1
- PPQRFOFHENJYMN-UHFFFAOYSA-N 3-(2,6-dimethylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(C)=C1C1=CC(=O)NC1=O PPQRFOFHENJYMN-UHFFFAOYSA-N 0.000 claims 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 claims 1
- BTQLWKNIJDKIAB-UHFFFAOYSA-N 6-methylidene-n-phenylcyclohexa-2,4-dien-1-amine Chemical compound C=C1C=CC=CC1NC1=CC=CC=C1 BTQLWKNIJDKIAB-UHFFFAOYSA-N 0.000 claims 1
- XPCLMDCFFWFALR-UHFFFAOYSA-N 7a-sulfanyl-4,5-dihydro-3aH-2-benzofuran-1,3-dione Chemical compound SC12C(=O)OC(C1CCC=C2)=O XPCLMDCFFWFALR-UHFFFAOYSA-N 0.000 claims 1
- LOYNWBQVIASMES-UHFFFAOYSA-N C(#N)C(C)C1=C(N=C(N1)CC)S Chemical compound C(#N)C(C)C1=C(N=C(N1)CC)S LOYNWBQVIASMES-UHFFFAOYSA-N 0.000 claims 1
- 229920000877 Melamine resin Polymers 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 1
- SBJCMTYLUFDUGC-UHFFFAOYSA-N SC12C(=O)OC(C1CCCC2)=O Chemical compound SC12C(=O)OC(C1CCCC2)=O SBJCMTYLUFDUGC-UHFFFAOYSA-N 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 claims 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 claims 1
- 230000003111 delayed effect Effects 0.000 claims 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 1
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 claims 1
- 239000011976 maleic acid Substances 0.000 claims 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- REQWLBJZLWQEIQ-UHFFFAOYSA-N phosphoric acid;pyrrole-2,5-dione Chemical compound OP(O)(O)=O.O=C1NC(=O)C=C1 REQWLBJZLWQEIQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000002689 soil Substances 0.000 claims 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 7
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3462—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
Description
1330660 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種無由耐高溫級成物，更特別關於應 用於硬式I路板、軟式電路板、封裝、封裝、或 .LED封裝等領域之無函奈高溫組成物。 【先前技#f】 • 近成年來’全世界光電產業的大量投資加速了消費市 場對質與量的需求’特別是在輕薄短小的尺寸要求上。由 於電子產品的開發主軸之一為高密度封裝，多種封裝材料 與封裝技術已被開發如下：捲帶式自動接合（Tape
Automated Bonding，TAB)與薄膜覆晶（chip 〇n Film，c〇F) 可應用於消費性電子3C產品、大型電腦、液晶顯示器、 A 1C 卡，了撓式印刷電路板（Fiexibie Printed Circuit Board，FPC)可應用於筆記型電腦、汽車工業、通信工業、 # 或引線膠 T(lead frame tape)。上述之 tab、COF、或 FPC 均需焊錫製程將電子元件黏著於印刷電路板之銅鉑上，而 焊錫的瞬間高熱可達288°C以上，故封裝材料的耐熱性可 .提高尺寸穩定性，同時減少電子線路在對準上的誤差《此 外，由於積體電路層數的增加，在通電時產生的熱量亦會 造成電子兀件溫度提高，故接著劑與封裝材料需具有高耐 熱性如南Tg以提高電子元件操作時的穩定度。 一般多層軟性印刷電路板或多層卷帶式自動接合所用 之接著劑多為壓克力或環氧樹脂，但兩者之耐熱性及抗藥 0954-A21849TWF(N2)；P54950035TW；hsuhuche 5 1.330660 縮水甘油峻(diglycidyl ether of bisphenol A)、或環氧曱苯盼 醛（epoxy cresol novolac)。在此，環氧樹脂的作用如同溶 劑，可避免使用高沸點的溶劑如T -丁基内酯的缺點。將上 述的混合物以110〜130°C反應約2〜7小時，藉以形成馬 * 來亞醯胺改質之環氧樹脂。本組成物將來在聚合反應後可 * 交聯形成互穿式共聚物。雙馬來亞醯胺與馬來亞醯胺交聯 之共聚物與環氧樹脂之間不會產生交聯反應，各自獨立但 彼此交錯形成本發明之無鹵耐高溫組成物。 • 取100重量份上述之無鹵耐高溫組成物，配合添加 0.5〜1.5重量份之催化劑、30〜70重量份之硬化劑、或 100〜300重量份之無機粉體，可作為印刷電路板基板材 料。催化劑可加快環氧樹脂交聯速度，如三氟化硼單乙胺 (borontrifluoride monoethylamine，BF3.MEA)或 1-氰基乙 基-2-乙基-4-曱基口米 υ坐（i-cyanoethyl-2-ethyl-4-methyl-imidazole，2E4Mz-CN)。硬化劑可與環氧樹脂進行交聯反 應，增加環氧樹脂交聯度，如乙二胺、間二胺化苯、對二 春胺化笨、曱基四氫苯 Sf (methyl tetrahydrophthalic anhydride ’ ΜΤΗΡΑ)、甲基六氫苯酐（methyl hexahydrophthalic anhydride，MHHPA)、二胺基二苯基石風 (4,4’-Diamino-diphenyl sulfone，DDS)、或聚硫醇。為提高 . 組成物之難燃性質，可添加無機粉體如氫氧化鋁、氧化鋁、 . 二氧化矽或其混合物。 為提高上述組成物之韌度，可視情況添加50〜300重量 份 之叛化 丙稀猜 （carboxyl-terminated butadiene-acrylonitrile，CTBN)。羧化丙烯腈一般溶於低沸 0954-»A21849TWF(N2)；P54950035TW；hsuhuche 9 L330660 著放至烘箱以12(TC/1小時、20(TC/2小時的條件硬化。 實施例3 將5g改質之環氧樹脂（SHELL CHEMICAL Co.所售之 EPON-828,含i〇%雙馬來亞醯胺與馬來亞醯胺混合物）、 1.5gDDS、以及〇.〇5gBF3*MEA加入100mL燒杯，於室溫 下攪拌均勻10分鐘後真空脫泡20分鐘，接著放至烘箱以 120°C/1小時、200°C/2小時的條件硬化。 實施例4 將5g改質之環氧樹脂（SHELL CHEMICAL Co·所售之 EPON-828’含15%雙馬來亞醯胺與馬來亞醯胺混合物）、 1.5gDDS、以及〇.〇5gBF3.MEA加入100mL燒杯，於室溫 下授拌均勻10分鐘後真空脫泡20分鐘，接著放至烘箱以 120°C/1小時、200°C/2小時的條件硬化。 比較例2
將5g環氧樹脂（SHELL CHEMICAL Co.所售之 EPON-828)、1.5g DDS、以及 〇.〇5g BF3.MEA 加入 l〇〇mL 燒杯’於室溫下攪拌均勻l〇分鐘後真空脫泡20分鐘，接 • 著放至烘箱以120°C/1小時、200°C/2小時的條件硬化。 實施例5 將5g改質之環氧樹脂（SHELL CHEMICAL Co.所售之 EPON-828’含5%雙馬來亞醯胺與馬來亞醯胺混合物）、3.5g MHHPA、以及 0_05g SA-l〇2(Air Products 所售之觸媒）加入 ' 1⑻mL燒杯，於室溫下攪拌均勻10分鐘後真空脫泡2〇分 鐘’接著放至烘箱以12CTC/1小時、180°C/2小時的條件硬 化。 實施例6 0954-A2 ί 849TWF(N2) ；P54950035TW；hsuhuche 13 1-330660 將5g改貝之每氣樹脂（SHELL CHEMICAL Co.所售之 EPON-828，含 1〇。/储 w °又馬來亞醯胺與馬來亞醯胺混合物）、 3.5g MHHPA、以及〇 〇5g sa_i〇2加入1〇〇此燒杯，於室 ，皿下授拌均句1G分鐘後真空脫、泡2Q >鐘，接著放至烘箱 以 120C/1 小時、 ^ 1⑽C/2小時的條件硬化。 實施例7 將5g改質气環氧樹脂（SHELL CHEMICAL Co.所售之 EPON-828 ’含15%雙馬來亞醯胺與馬來亞醯胺混合物）、 3.5g MHHPA、以及 0 〇5g SA_1〇2 加入 1〇〇mL 燒杯，於室 溫下授摔均勾10分鐘後真空脫泡2〇分鐘，接著放至烘箱 以120。(：/1小時、i8〇〇C/2小時的條件硬化。 比較例3 將5g環氧樹脂（ShELl CHEMICAL Co.所售之
EPON-828)、3.5g MHHPA、以及 0.05g SA-102 加入 i〇〇mL 燒杯’於室溫下攪拌均勻l〇分鐘後真空脫泡2〇分鐘，接 著放至烘箱以120。(：/1小時、180。(：/2小時的條件硬化。 第2表 改質之環 828 DDS MHHPA BF3.MEA SA-102 Tg(°C) Swt%裂解 371 實施例2 5g __ 1.5R 0.05g 205 實施例3 5g 1.5s 0.05g ___ 226 實施例4 5g — 1.5g .. 〇.〇5g 245 比較例2 •響 1.5g _ 0.05g 180 實施例5 5g — 3.5g _ _ _ 〇.〇5g 155 實施例6 5g 3.5g _ 0.05g 167 —----- —~—. 實施例7 5g 3.5g 0.05g 180 ------- 0954-A21849TWF(N2)；P54950035TW；hsuhuche 14 1330660 比較例3 5g 3.5g — 0.05g 145 ____ 由第2表可知，以馬來亞醯胺改質之環氧樹脂具有較 高之裂解溫度與Tg，比未改質之環氧樹脂更適用於電子材 料的接著及絕緣。 • 雖然本發明已以數個較佳實施例揭露如上，然其並非 . 用以限定本發明，任何所屬技術領域中具有通常知識者， 在不脫離本發明之精神和範圍内，當可作任意之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利範圍所界 φ 定者為準。
0954-A21849TWF(N2)；P54950035TW：hsuhuche 15 L330660 【圖式簡單說明】 無。 【主要元件符號說明】 無0
0954-A21849TWF(N2)；P54950035TW；hsuhuche 16
Claims (1)
1330660 f ，第 95146836 號十、申請專利範圍： 修正日期:9?
磨正本 1. 一種無鹵耐高溫組成物，包括： 一混合物，包括一雙馬來亞酸胺與一馬來亞醯胺，該 雙馬來亞醯胺與該馬來亞醯胺之莫耳比為99: 1〜50: 50; ' 一巴比土酸（Barbituric acid，BTA )，該混合物與該 . 巴比土酸之莫耳比為93 : 7〜80 : 20 ;以及 一環氧樹脂，其中（該混合物與該巴比土酸）對該環氧樹 脂之重量比為5 : 95 ~ 50 : 50 ; • 其中該無鹵耐高溫組成物不含環氧樹脂以外的溶劑。 2. 如申請專利範圍第1項所述之無鹵耐高溫組成物， 其中該雙馬來亞醯胺之結構式如下：
CH3 CH3 I I (CH2)i2一，一CH2—丫一CH2-CH—CH2—CH2—, ch3
3.如申請專利範圍第1項所述之無鹵耐高溫組成物， 其中該馬來亞醯胺包括N-苯基馬來亞醯胺、N-(鄰曱基苯 17 1330660 « ，第 95146836 號 矜年f月"Bnh楚，止替佚頁 修正日期:99·8^1-修i本 基)-馬來亞醯胺、N-(間曱基苯基)-馬來亞醯胺、N-(對甲基 苯基)-馬來亞醯胺、N-環己烷基馬來亞醯胺、馬來亞醯胺、 馬來亞醯胺基酚、馬來亞醯胺基苯并環丁烯、含磷馬來亞 醯胺、磷酸基馬來亞醯胺、氧矽烷基馬來亞醯胺、N-(四氫 吡喃基-氧基苯基）馬來亞醯胺、或2,6-二甲苯基馬來亞醯 胺。 4.如申請專利範圍第1項所述之無齒耐高溫組成物， 其中該巴比土酸之結構式如下：
HN NH
其中R!、Ri各自獨立，包括： 一Η , —ch3 ，—> 一CH(CH3)2，-ch2ch(ch3)2，一CH2CH2CH(CH3)2， 或一 ch(ch2)2ch3 。 • CH3 5.如申請專利範圍第1項所述之無鹵耐高溫組成物，其 中該環氧樹脂包括驗醒·縮水甘油醚、四縮水甘油基亞甲基 二苯胺、二縮水甘油鄰苯二酸、雙苯酚A縮水甘油醚、或 « 環氧甲苯酚醛。 ' 6. —種無鹵耐高溫接著劑，包括： 100重量份之無鹵耐高溫組成物，包括： 一混合物，包括一雙馬來亞醯胺與一馬來亞醯胺，該 雙馬來亞醯胺與該馬來亞醯胺之莫耳比為99: 1〜50: 50; 18 月"曰晗(更)i替換頁 "济正本j 1330660 ^ 第95146836號 修正日期:99.8.11 • 一巴比土酸（Barbituric acid，BTA )，該混合物與該 巴比土酸之莫耳比為93 : 7〜80 : 20 ;以及 一環氧樹脂，其中（該混合物與該巴比土酸)對該環氧樹 脂之重量比為5 : 95〜50 : 50 ; ' 其中該無鹵耐高溫組成物不含環氧樹脂以外的溶劑； , 30〜70重量份之硬化劑，包括乙二胺、間二胺化苯、 對二胺化苯、曱基四氫苯酐、曱基六氫苯酐、二胺基二苯 基砜、或聚硫醇； • 0.5-1.5重量份之催化劑，包括三氟化硼單乙胺、或1- 氰基乙基-2-乙基-4-曱基咪唑； 100〜300重量份之無機粉體，包括氫氧化鋁、氧化鋁、 • 二氧化矽或其混合物。 • 7.如申請專利範圍第6項所述之無鹵耐高溫接著劑， 係作為印刷電路板基板材料。 8.如申請專利範圍第6項所述之無鹵耐高溫接著劑，更包 括50〜300重量份之緩化丙稀腈。 ® 9.如申請專利範圍第8項所述之無鹵耐高溫接著劑， 係作為1C封裝、LCD封裝、LED封裝、或高分子聚合物 之接著劑。 . 10.如申請專利範圍第9項所述之無鹵耐高溫接著劑， 其中該高分子聚合物包括聚醯亞胺、聚醯亞胺醚、聚醯胺 酯、聚胺醯亞胺、液晶高分子、聚對苯二曱酸乙二醇酯、 或上述之組合。
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| TWI468502B (zh) * | 2012-07-04 | 2015-01-11 | Uniplus Electronics Co Ltd | 高耐熱、低剛性、難燃性樹脂及其組合物 |
| CN102838962A (zh) * | 2012-09-24 | 2012-12-26 | 云南云天化股份有限公司 | 一种环氧树脂胶粘剂及其制备方法 |
| CN103833958B (zh) * | 2014-03-11 | 2016-08-17 | 固德电材系统（苏州）股份有限公司 | 环保型单组份无溶剂环氧浸渍树脂的制备方法 |
| TWI744302B (zh) * | 2016-05-19 | 2021-11-01 | 日商捷恩智股份有限公司 | 聚合性組成物、液晶複合體、光學各向異性體、液晶顯示元件及其用途 |
| JP2022138683A (ja) * | 2021-03-10 | 2022-09-26 | 味の素株式会社 | 樹脂組成物、硬化物、樹脂シート、プリント配線板及び半導体装置 |
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| JPH1095898A (ja) * | 1996-09-25 | 1998-04-14 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物およびこれを用いた積層板 |
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