1324724 九、發明說明： 【發明所屬之技術領域】 特別係指一種用於冷卻顯 本發明涉及一種散熱裝置， 卡上之電子元件之顯卡散熱裝置 【先前技術】1324724 IX. Description of the invention: [Technical field to which the invention pertains] particularly relates to a graphics card heat sink for use in a cooling device, an electronic component on a card [Prior Art]
隨著電腦產業不斷發展’電子元件尤其係安裝在顯 卡、視頻圖像卡上之處理器運行頻率和速度不斷提升，發 熱量越來越大’若不及時排除，其運行中產生之熱 ^ 引起之溫度升高，將會影響發熱電子元件之正常運行。'、貝 通常業界通常係將-散熱器安裝在處理器上對 散熱。為進-步滿足—些電子元件日益增長散熱需要，^ 可在散熱器-側安裝一風扇來加速周圍之空氣流動，以帶 走散熱器之熱量而提高散熱效率。但由於顯卡或視頻圖: 卡兩側狹小之空間限制了安裝在其上之散熱器之尺寸，尤 其係散熱ϋ之高度，故風扇—般係平行電路板放置在散熱 器一側。然而，平放之風扇佔用散熱器本來就狹小之空間 而極大限制散熱器之有效散熱面積，同時也無法為熱^ 較集中之散熱器底座提供足夠之風壓。因而，平放之風扇 尺寸受到很大之限制，無法採用大型之風扇來為散熱器搓 供足夠之氣流量及氣壓。 ° 【發明内容】 之顯卡散 本發明旨在提供一種有效提高風扇散熱效率 熱裝置。 1324724 • 一種顯卡散熱裝置，其包括一基座、一設置於基座上 _之散熱鰭片組及一固定於散熱鰭片組一側之風扇，所述散 熱鰭片組之一端形成一傾斜面，所述風扇貼設在所述傾斜 面上。 上述顯卡散熱裝置之風扇傾斜地放置在散熱鰭片組之 一侧，根據實際應用中顯卡散熱裝置被其所處空間允許之 最大兩度來選取風扇之傾斜角度，以實現散熱鰭片散熱面 積及風扇尺寸之最大化。此外，傾斜設置在散熱鰭片組一 侧之風扇產生之強大氣流直接吹向與熱源接觸之基座中部 上方對應之散熱鰭片組高溫區，將風扇產生之強制氣流及 其風壓主要分佈在顯卡散熱裝置之高溫區，從而有效之提 高散熱效率。 【實施方式】 請參閱圖1和圖2’本發明顯卡散熱裝置用於對安裝顯 卡80上之處理器82進行散熱。 上述顯卡散熱裝置包括一位於顯卡8〇下方之背板1〇、 一位於顯卡80上方之導熱基座（未標號）、-放置在該導 熱基座上之熱管組4〇、一放置在熱管組40上面之散熱鯖片 組5〇、-覆蓋散熱If片5〇之導風㈣和安裝在該散熱籍片 組50—侧之風扇7〇。 上述顯卡8〇在該處理器82周圍開設有安裝孔84,用於 供螺釘⑽穿設謂該顯卡散熱裝置固定到該顯㈣上。 述皮板10由金屬片一體成型，該背板10包括-本 7 1324724 -體及由該本體四個角落向外延伸之固定腳12,每一固定腳 _ 12之近末端處設置有一穿孔120，該穿孔120與顯卡80之安 裝孔84對應。 上述導熱基座包括一第一導熱基板20及一鑲置在第一 導熱基板20内之第二導熱基板30。該第一導熱基板20由導 '熱材料如鋁製成，其大致呈矩形。該第一導熱基板20靠向 一長側邊處自上向下衝壓形成一容置熱管組40之容置槽 22，該容置槽22平行該第一導熱基板20長側邊貫穿兩端， 籲並在第一導熱基板20上表面向下凹陷而在其下表面突起。 該第一導熱基板20設置有一切口 24，該切口 24切斷容置槽 22及靠近容置槽22之長側邊，用於容置第二導熱基板30。 該第一導熱基板20上面在四個分別臨近該切口 24四個角落 之位置，向下衝壓形成凹陷之矩形梯台26,每一梯台26上 開設有透孔260。該第一導熱基板20在切口24兩側靠近側邊 處開設有二固定螺孔220，並且在靠近另一側邊對應之位置 $上也開設有同樣之固定螺孔220。 上述第二導熱基板30由熱傳導率較紹高之導熱材料如 銅製成，該第二導熱基板30大致呈矩形，其形狀大小與第 一導熱基板10之切口 24—致，以容置在切口 24内。該第二 導熱基板30之中部設置有容置槽32，該容置槽32與第一導 熱基板20之容置槽22對應連通。該第二導熱基板30之四個 角落各開設--階梯孔34，該階梯孔34用於卡置與螺釘100螺 合之螺筒300。該第二導熱基板30在兩側兩端平行容置槽32 之方向各向外延伸一凸耳36,該凸耳36之形狀大小與第一 1324724 -導熱基板20之階台26相適配，且承接在該階台26之上，使 _第一導熱基板20和第二導熱基板30之頂面在同一平面上。 該凸耳36開設有與階台26透孔260對應之螺合孔360，該螺 合孔360與穿過透孔26之螺釘200螺合，以將第二導熱基板 30與第一導熱基板20固定在一起。 上述導熱基座在使用時，該螺釘100穿過背板10之穿孔 120及顯卡80之安裝孔84而與卡置在第二導熱基板30之階 梯孔360上之螺筒300配合，以將第一導熱基板20和第二導 鲁熱基板30組成之導熱基座固定到顯卡80上。該導熱基座在 與處理器82接觸之高熱區使用導熱高但品質重之銅制第二 導熱基座30，而在其他地方使用品質較輕之鋁制第一導熱 基板20。 上述熱管組40包括三一字型扁平熱管42,該等熱管42 平行容置在第一導熱基板22和第二導熱基板30之容置槽 22、32内，它們扁平之底面及頂面分別形成與容置槽22、 $ 32表面及散熱鰭片組50底面接觸之平面。 上述散熱鰭片組50包括複數散熱鰭片52，每一散熱鰭 片52均為一呈直角梯形之金屬片體，其上下平行邊緣同向 垂直彎折延伸有折邊520,該直角梯形之散熱鰭片52之斜邊 與底邊形成夾角，該夾角之角度優選為介於30與60之間之 銳角。該等散熱鰭片52平行間隔之排列在一起，相鄰之兩 散熱鰭片之間形成空氣流道（未標號），所有散熱鰭片52 之斜邊形成供氣流流入及安裝風扇70之傾斜面，所有折邊 520形成散熱鰭片組50之頂面及與熱管組40接觸之底面。在 1324724 -其他實施列中散熱鰭片52之斜邊可以設置為各種彎曲之弧 形邊，而所有該等散熱鰭片52之弧形邊也形成一供安裝風 扇70之弧形面。 上述導風罩60覆蓋在散熱鰭片組50上面，其包括一頂 壁62及有該頂壁62兩側緣垂直向下延伸之側壁64。該側壁 _ 64呈直角梯形與散熱鰭片52形狀一致，該兩側壁64之斜邊 兩端邊緣處分別向内延伸一固定耳642，該固定耳642上設 置固定孔6420，用於與風扇固定件（圖未示）配合以將風 籲扇70到散熱鰭片組50—側之斜面上。該風扇70貼設在散熱 鰭片組50之斜邊形成之斜面上，其與導熱基座形成之夾角 介於30至60度之間。該兩側壁64底邊邊緣之各外水準延伸 有兩相隔之固定耳644，該固定耳644上開設有通孔6440， 該通孔6440與第一導熱基板20上之螺孔220對應，以供螺釘 600穿過與第一導熱基板20之螺孔220螺合，從而將殼體60 固定到第一導熱基板10上。 φ 上述顯卡散熱裝置之風扇70傾斜地放置在散熱鰭片組 50之一側，根據實際應用中安裝在顯卡80上之顯卡散熱裝 置被其所處空間允許之最大高度來選取風扇70之傾斜角 度，以實現散熱鰭片52散熱面積及風扇70尺寸之最大化。 此外，傾斜設置在散熱鰭片組50—側之風扇70產生之強大 氣流直接吹向與熱源接觸之第二導熱基板30上方對應之散 熱鰭片52高溫區，將風扇70產生之強制氣流及其風壓主要 分佈在顯卡散熱裝置之高溫區，從而有效地提高散熱效率。 綜上所述，本發明符合發明專利要件，爰依法提出專 1324724 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明顯卡散熱裝置之立體組合圖。 圖2係本發明顯卡散熱裝置之立體分解圖。 【主要元件符號說明】 背板 10 固定腳 12 通槽 122 穿孔 120 第一導熱基板 20 容置槽 22、32 固定螺孔 220 切口 24 梯台 26 透孔 260 第二導熱基板 30 階梯孔 34 凸耳 36 螺合孔 360 熱管組 40 熱管 42 散熱鰭片組 50 散熱鰭片 52 折邊 520 導風罩 60 頂壁 62 側壁 64 固定耳 642 、 644 固定子L 6420 通孔 6440 風扇 70 螺釘 100 、 200 螺筒 300 11With the continuous development of the computer industry, the operating frequency and speed of the electronic components, especially those installed on the graphics card and video image card, are increasing, and the heat is getting larger and larger. If not eliminated in time, the heat generated in the operation is caused by ^ The increase in temperature will affect the normal operation of the heating electronic components. ', Bay Usually the industry usually installs a heat sink on the processor to dissipate heat. In order to meet the step-by-step requirements - the increasing heat dissipation of some electronic components, ^ a fan can be installed on the radiator side to accelerate the flow of air around to take away the heat of the radiator to improve the heat dissipation efficiency. However, due to the graphics card or video picture: The small space on both sides of the card limits the size of the heat sink mounted on it, especially the height of the heat sink, so the fan-like parallel circuit board is placed on the side of the heat sink. However, the fan placed flatly occupies a small space in the heat sink, which greatly limits the effective heat dissipation area of the heat sink, and does not provide sufficient wind pressure for the heat sink base that is more concentrated. As a result, the size of the fan that is placed flat is greatly limited, and a large fan cannot be used to supply sufficient airflow and air pressure to the radiator. [Disclosed Summary] The present invention aims to provide a heat device that effectively increases the efficiency of fan heat dissipation. 1324724: A graphics card heat dissipation device comprising a base, a heat dissipation fin set disposed on the base, and a fan fixed to one side of the heat dissipation fin set, wherein one end of the heat dissipation fin set forms an inclined surface The fan is attached to the inclined surface. The fan of the above-mentioned graphics card heat dissipating device is placed obliquely on one side of the heat dissipating fin set. According to the actual application, the heat dissipating device of the graphics card is selected by the space allowed by the space of the fan to select the tilt angle of the fan to realize the heat dissipating area of the fin and the fan. Maximize size. In addition, the powerful airflow generated by the fan disposed on one side of the heat dissipation fin group is directly blown to the high temperature region of the heat dissipation fin group corresponding to the upper portion of the base in contact with the heat source, and the forced airflow generated by the fan and the wind pressure thereof are mainly distributed. The high temperature zone of the graphics card heat sink effectively increases the heat dissipation efficiency. [Embodiment] Referring to Figures 1 and 2', the graphics card heat sink of the present invention is used to dissipate heat from the processor 82 mounted on the graphics card 80. The graphics card heat sink comprises a backplane 1 〇 under the graphics card 8 〇, a thermally conductive pedestal (not labeled) above the graphics card 80, a heat pipe set 4 放置 placed on the thermally conductive pedestal, and a heat pipe set The heat-dissipating cymbal group of the upper surface of the heat-dissipating slab is 5 〇, the wind guiding (4) covering the heat-dissipating If sheet, and the fan 7 安装 installed on the side of the heat-dissipating film group 50. The display card 8 is provided with a mounting hole 84 around the processor 82 for the screw (10) to be inserted into the display (4). The skin board 10 is integrally formed from a metal sheet, and the back board 10 includes a body and a fixing leg 12 extending outward from four corners of the body, and a perforation 120 is disposed at a proximal end of each fixing leg -12 The through hole 120 corresponds to the mounting hole 84 of the graphics card 80. The thermally conductive base includes a first thermally conductive substrate 20 and a second thermally conductive substrate 30 embedded in the first thermally conductive substrate 20. The first thermally conductive substrate 20 is made of a conductive material such as aluminum which is substantially rectangular. The first heat-conducting substrate 20 is pressed from the top to the bottom to form a receiving groove 22 for accommodating the heat pipe group 40. The receiving groove 22 extends through the long sides of the first heat-conducting substrate 20 to penetrate the two ends. The upper surface of the first heat-conducting substrate 20 is recessed downward and protrudes on the lower surface thereof. The first heat-conducting substrate 20 is provided with a slit 24 for cutting the accommodating groove 22 and the long side of the accommodating groove 22 for accommodating the second heat-conducting substrate 30. The first heat-conducting substrate 20 is punched downwardly at four positions adjacent to the four corners of the slit 24 to form a recessed rectangular step 26, and each of the steps 26 is provided with a through hole 260. The first heat-conducting substrate 20 is provided with two fixing screw holes 220 at two sides of the slit 24 near the side, and the same fixing screw hole 220 is also opened at a position corresponding to the other side. The second heat conductive substrate 30 is made of a heat conductive material having a higher thermal conductivity, such as copper. The second heat conductive substrate 30 has a substantially rectangular shape and is shaped like the slit 24 of the first heat conductive substrate 10 to be received in the slit 24 . Inside. A receiving groove 32 is disposed in the middle of the second heat conducting substrate 30, and the receiving groove 32 is in communication with the receiving groove 22 of the first heat conducting substrate 20. The four corners of the second heat-conducting substrate 30 are each provided with a stepped hole 34 for latching the screw 300 screwed to the screw 100. The second heat-conducting substrate 30 has a lug 36 extending outwardly from the two sides of the two sides of the parallel receiving groove 32. The shape of the lug 36 is matched with the step 13 of the first 1324724 - the heat-conducting substrate 20 . And receiving on the stage 26, the top surfaces of the first heat conductive substrate 20 and the second heat conductive substrate 30 are on the same plane. The lug 36 defines a screwing hole 360 corresponding to the through hole 260 of the step 26 , and the screw hole 360 is screwed with the screw 200 passing through the through hole 26 to connect the second heat conductive substrate 30 and the first heat conductive substrate 20 . Fixed together. When the heat conducting base is in use, the screw 100 passes through the through hole 120 of the back plate 10 and the mounting hole 84 of the graphics card 80 to cooperate with the screw 300 that is placed on the stepped hole 360 of the second heat conductive substrate 30 to A heat conducting base composed of a heat conductive substrate 20 and a second conductive heat substrate 30 is fixed to the graphics card 80. The thermally conductive pedestal uses a second thermally conductive base 30 of high thermal conductivity but of high quality in the high temperature zone in contact with the processor 82, and a first thermally conductive substrate 20 of aluminum of a lower quality is used elsewhere. The heat pipe group 40 includes a three-shaped flat heat pipe 42. The heat pipes 42 are disposed in parallel in the accommodating grooves 22 and 32 of the first heat conductive substrate 22 and the second heat conductive substrate 30, and the flat bottom surface and the top surface thereof are respectively formed. A plane that contacts the bottom surface of the accommodating groove 22, the surface 32, and the heat sink fin group 50. The heat dissipation fin assembly 50 includes a plurality of heat dissipation fins 52. Each of the heat dissipation fins 52 is a metal sheet body having a right-angled trapezoidal shape. The upper and lower parallel edges are vertically bent and extended with a flange 520. The beveled edge of the fin 52 forms an angle with the bottom edge, and the angle of the included angle is preferably an acute angle between 30 and 60. The heat dissipation fins 52 are arranged in parallel at intervals, and air flow paths (not labeled) are formed between the adjacent two heat dissipation fins, and the oblique sides of all the heat dissipation fins 52 form an inclined surface for the airflow to flow and the fan 70 to be installed. All of the flanges 520 form a top surface of the heat dissipation fin set 50 and a bottom surface in contact with the heat pipe group 40. In 1324724 - other embodiments, the beveled edges of the fins 52 may be provided with various curved arcuate edges, and the arcuate edges of all of the fins 52 also form an arcuate face for the mounting fan 70. The air hood 60 is overlaid on the heat dissipation fin assembly 50 and includes a top wall 62 and side walls 64 extending perpendicularly downward from opposite sides of the top wall 62. The side wall _ 64 has a right-angled trapezoidal shape and a shape of the heat-dissipating fin 52. The two ends of the two side walls 64 extend inwardly at a fixed edge 642. The fixing ear 642 is provided with a fixing hole 6420 for fixing with the fan. A piece (not shown) cooperates to wind the fan 70 to the inclined surface of the heat sink fin group 50 side. The fan 70 is attached to the inclined surface formed by the oblique side of the heat dissipating fin set 50, and forms an angle of between 30 and 60 degrees with the thermally conductive base. The outer side of the bottom edge of the two side walls 64 has two spaced apart fixing ears 644. The fixing ear 644 defines a through hole 6440 corresponding to the screw hole 220 of the first heat conducting substrate 20 for The screw 600 is threaded through the screw hole 220 of the first heat conductive substrate 20 to fix the housing 60 to the first heat conductive substrate 10. φ The fan 70 of the above-mentioned graphics card heat dissipating device is obliquely placed on one side of the heat dissipating fin group 50, and the tilting angle of the fan 70 is selected according to the maximum height allowed by the space in which the video card heat dissipating device mounted on the graphics card 80 is actually used. To maximize the heat dissipation area of the heat sink fins 52 and the size of the fan 70. In addition, the powerful airflow generated by the fan 70 disposed on the side of the heat dissipation fin group 50 is directly blown to the high temperature region of the heat dissipation fin 52 corresponding to the upper surface of the second heat conduction substrate 30 in contact with the heat source, and the forced airflow generated by the fan 70 and The wind pressure is mainly distributed in the high temperature zone of the graphics card heat sink, thereby effectively improving the heat dissipation efficiency. In summary, the present invention complies with the requirements of the invention patent, and the application for the special 1324724 is filed according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat sink of a graphics card of the present invention. 2 is an exploded perspective view of the heat sink of the graphics card of the present invention. [Main component symbol description] Back plate 10 Fixing foot 12 Passing groove 122 Perforation 120 First heat conducting substrate 20 accommodating groove 22, 32 Fixing screw hole 220 Cutting 24 Ladder 26 Through hole 260 Second heat conducting substrate 30 Stepped hole 34 Lug 36 Screw hole 360 Heat pipe set 40 Heat pipe 42 Heat sink fin set 50 Heat sink fin 52 Flange 520 Air hood 60 Top wall 62 Side wall 64 Fixing ear 642, 644 Fixer L 6420 Through hole 6440 Fan 70 Screw 100, 200 Screw Cartridge 300 11