-1^23607 一 八 咐年丨。月K日修正替換頁 - 九、發明說明： ·. 【發明所屬之技術領域】 本發明關於一種數位相機模組，特別係關於一種成像品 質較高及產品可靠度較高之數位相機模組。 【先前技術】 目前，行動電話向著多功能之趨勢發展，具有照相功能 • 之行動電話一經推出即倍受歡迎。應用於行動電話之數位相 . 機模組不僅需具有較好的照相性能，亦須滿足輕薄短小之要 •求以配合行動電話之輕薄短小之發展趨勢。數位相機模組中 用以獲取影像之影像感測器封裝之尺寸及性能係決定數位 相機模組尺寸大小及照相性能優劣之一重要因素。 請參閱圖2，一種習知之數位相機模組80，包括一基板 81、一凸緣層82、一晶片84、多數條導線85、一第一接著 劑86、一蓋體87、一第二接著劑88及一鏡頭89。該基板 81設有一上表面（圖未標）及一下表面（圖未標），下表面 φ 上形成有訊號輸出端812。該凸緣層82係固設於基板81之 上表面，而與基板81共同形成一凹槽83。該凸緣層82頂面 形成有訊號連接端822,該訊號連接端822與基板81之訊號 輸出端812電性連接。該晶片84係設置於基板81之上表面， 並位於凹槽83内，其上表面形成有焊墊841及感測區843。 該導線85係電連接晶片84之焊墊841至凸緣層82之訊號 連接端822。該第一接著劑86係塗佈於凸緣層82上，並將 導線85與訊號連接端822之銜接處覆蓋住。該蓋體87係由 透明材料製成，其藉由第一接著劑86黏著於凸緣層82上， 7 嘬年Ιο月蜷日修正替換頁 從而將晶片84封閉於凹槽囟 # > 蓋體87夕…？ 亥第二接著劑88塗佈於 也87之上表面。鏡頭89将拉士货 體87上。 ’、错由苐二接著劑88黏著於蓋 惟，該蓋體87係黏荖於筮吐从七 u么 弟一接者劑86上，再於蓋體87 上塗佈第二接著劑88,使镑涵如益山 體87卜U , 猎由第二接著劑88黏著蓋 較大如此’無形中增加了封裝之高度，使其封裝尺寸 冉者’基板81之上表面及样 到晶片84之感測區843,是以：乂3内存在的塵灰將污染 ή 糾3疋以，如何使晶片84之感測區843 7朱降程度至最低以提高數位相機模組之影像品質，成為 數位相機模組之重要課題。 、 ”·、 另’第-接著劑86在供烤製程中會大量釋放揮發性氣 ::二凹槽83内產生内壓’因而蓋體们容易在使用中移位 或剝洛，致使產品之可靠性不高。 【發明内容】 一馨於上述問題，有必要提供—種成像品質較高且可靠性 較向之數位相機模組。 ^ 一種數位相機模組，包括一影像感測器封裝、一鏡頭 模組及一用於容置該鏡頭模組之鏡座。該影像感測器封裝 包括-承載體、一晶片、複數導線、一第一黏著物、—蓋 體及一第二黏著物。該承載體呈平板狀，具有一頂面，頂 面上設置有複數上焊墊。該晶片固設於承載體頂面上，曰 T 1 * _1 I 曰日 片之頂面具有—感測區及複數晶片焊墊。該導線電性連接 晶片焊墊與承載體之上焊墊。該第一黏著物佈設於晶片之 J^23607 、頂面’且環繞晶片感測區體藉由該第一黏 .·物黏設於晶片上並封閉晶片之感測區。該第二黏著物佈設 於該蓋體頂面外周緣。該鏡頭模組設置於影像感測器封裝 之光路中。所述鏡座包括一座部，所述座部之内壁凸対 •-凸框，該凸框藉由該第二黏著物與蓋體黏接。°又 相較習知技術，所述影像感測器封裝之蓋體藉由塗佈 .於晶片頂面周緣之第一黏著物固設於晶片上以封閉晶片之 感測區，-方面，形成之封閉空間更小，封閉空間内存在 • ^粉塵、粒子f污染物較少’可以減少對晶片之感測區之 污染，從而提而該數位相機模组之影像品質；另一方面， 可減小第-黏著物在烘烤製程中之揮發出之氣體產生之内 壓，從而減小蓋體剝落或偏移的可能性，提高了產品之可靠 性。 【實施方式】-1^23607 One and eight years old. REDUCTION REPLACING PAGE OF THE DAY K. IX. INSTRUCTIONS: 1. Technical Field of the Invention The present invention relates to a digital camera module, and more particularly to a digital camera module having higher imaging quality and higher product reliability. [Prior Art] At present, mobile phones are moving toward a multi-functional trend, and the camera functions are popular as soon as they are launched. The digital phase applied to mobile phones. The machine module not only needs to have better photographic performance, but also needs to meet the requirements of lightness, thinness and shortness. The size and performance of the image sensor package used to capture images in a digital camera module is an important factor in determining the size and photographic performance of digital camera modules. Referring to FIG. 2 , a conventional digital camera module 80 includes a substrate 81 , a flange layer 82 , a wafer 84 , a plurality of wires 85 , a first adhesive 86 , a cover 87 , and a second substrate . Agent 88 and a lens 89. The substrate 81 is provided with an upper surface (not shown) and a lower surface (not shown), and a signal output end 812 is formed on the lower surface φ. The flange layer 82 is fixed to the upper surface of the substrate 81 to form a recess 83 together with the substrate 81. A signal connection end 822 is formed on the top surface of the flange layer 82. The signal connection end 822 is electrically connected to the signal output end 812 of the substrate 81. The wafer 84 is disposed on the upper surface of the substrate 81 and is located in the recess 83. The upper surface thereof is formed with a pad 841 and a sensing region 843. The wire 85 is electrically connected to the pad 841 of the wafer 84 to the signal connection end 822 of the flange layer 82. The first adhesive 86 is applied to the flange layer 82 and covers the junction of the wire 85 and the signal connection end 822. The cover body 87 is made of a transparent material, which is adhered to the flange layer 82 by the first adhesive 86, and the replacement page is corrected by the next year to seal the wafer 84 to the groove &# > Body 87 eve...? The second adhesive 88 is applied to the upper surface of also 87. The lens 89 will be on the cargo body 87. ', the second adhesive agent 88 is adhered to the cover, the cover 87 is adhered to the sputum from the seven-seat sitter agent 86, and then the second adhesive 88 is applied to the cover 87. Make the pound culverts such as the Yishan body 87 Bu U, the hunting by the second adhesive 88 is thicker, so the thickness of the package is increased invisibly, so that the package size is the same as the upper surface of the substrate 81 and the sample to the wafer 84. The measurement area 843 is such that: the dust present in the 乂3 will pollute the ή3疋, how to make the sensing area of the wafer 84 to the lowest level to improve the image quality of the digital camera module, and become a digital camera. An important topic of the module. "··, another 'the first-adhesive agent 86 will release a large amount of volatile gas during the baking process:: internal pressure is generated in the two grooves 83' so that the cover body is easily displaced or peeled off during use, resulting in a product The reliability is not high. [Summary of the Invention] In order to solve the above problems, it is necessary to provide a digital camera module with higher imaging quality and higher reliability. ^ A digital camera module including an image sensor package, a lens module and a lens holder for accommodating the lens module. The image sensor package comprises a carrier, a wafer, a plurality of wires, a first adhesive, a cover and a second adhesive The carrier has a flat shape and has a top surface, and a plurality of upper pads are disposed on the top surface. The wafer is fixed on the top surface of the carrier, and the top surface of the 曰T 1 * _1 I 具有 has a sensing a pad and a plurality of die pads. The wire is electrically connected to the pad of the die and the pad above the carrier. The first adhesive is disposed on the top surface of the chip and surrounds the sensing region of the wafer by the first A sticky material is attached to the wafer and closes the sensing region of the wafer. The second adhesive The lens module is disposed on the outer periphery of the top surface of the cover body. The lens module is disposed in the optical path of the image sensor package. The lens holder includes a portion, and the inner wall of the seat portion has a convex ridge and a convex frame. The second adhesive is adhered to the cover by the second adhesive. The cover of the image sensor package is fixed on the wafer by coating the first adhesive on the periphery of the top surface of the wafer. In the sensing area of the closed wafer, the closed space formed is smaller, and there is less dust in the closed space, and the particles f are less polluted, which can reduce the pollution of the sensing area of the chip, thereby raising the number The image quality of the camera module; on the other hand, the internal pressure generated by the volatilized gas of the first adhesive in the baking process can be reduced, thereby reducing the possibility of peeling or offset of the cover, and improving the product. Reliability. [Embodiment]
請參閱® 1戶斤示的本發明數位相機模組一較佳實施 例，該數位相機模組10包括一影像感 一 二黏著物40、-鏡頭模組50及一鏡座60，二0該鏡二 模組50設置於鏡座60内，該鏡座6〇藉由第二黏著物4〇 固定於影像感測器封裝2G上’且影像感測器封裝2〇處於 鏡頭模組50之光路中。 該影像感測器封裝20包括有一承載體21、一晶片23、 複數導線24、一支撐件25、一第一黏著物26及一蓋體28。 該承載體21里平板狀，具有一頂面（圖未標）及一底面 (圖未標）。該承载體21包括複數設置於頂面之上焊墊215， 9 货年/〇編修正替換Referring to a preferred embodiment of the digital camera module of the present invention, the digital camera module 10 includes an image sensor 12, a lens module 50 and a lens holder 60. The mirror module 50 is disposed in the lens holder 60. The lens holder 6 is fixed on the image sensor package 2G by the second adhesive 4' and the image sensor package 2 is in the optical path of the lens module 50. in. The image sensor package 20 includes a carrier 21, a wafer 23, a plurality of wires 24, a support member 25, a first adhesive member 26, and a cover member 28. The carrier 21 has a flat shape and has a top surface (not shown) and a bottom surface (not shown). The carrier 21 includes a plurality of pads 215 disposed on the top surface, 9
，:φ36〇7 * 及複數設置於底面之下焊墊216。該下焊墊216與上焊墊215 ； 電性連接，其用於與其他元件如印製電路板等相電性連接。 該晶片23係一影像感測器晶片，其藉由膠水或雙面膠 等黏著物固設於承載體21之頂面上。該晶片23之頂面上具 ' 有一感測區231，晶片23頂面周緣佈設有複數晶片焊墊 233。該晶片焊墊233用於輸出該晶片23產生之影像訊號。 * 該複數導線24之一端連接晶片焊墊233，另一端則連 . 接承載體21之上焊墊215。 ^ 該支撐件25為一框體，其設置於晶片23頂面，位於晶 片23之感測區231外。可以理解，該支撐件25亦可為複數 柱體，該柱體分別設置於晶片23頂面之四角處。 該第一黏著物26係環繞塗佈於晶片23之感測區231周 緣，並覆蓋該支撐件25，及覆蓋導線24與晶片焊墊233之 連接處以保護及加強導線24與晶片焊墊233之連接處。 該蓋體28由透明材料製成，其尺寸大於晶片23之感測 φ 區231之尺寸。該蓋體28設置於晶片23頂面上方，其由支 撐件25支撐住，且藉由第一黏著物26黏接於晶片23上， 從而將晶片23之感測區231封閉。 第二黏著物40係塗佈於承載體21之頂面，環繞上焊墊 215之周緣設置，並進一步覆蓋該導線24與承載體21之上 焊墊215之連接處以保護該連接處。該第二黏著物40亦塗 佈於蓋體28之頂面周緣。 該鏡頭模組50包括一鏡筒51、至少一鏡片52及一濾波 片53。該鏡筒51係一半封閉圓筒，其具有一半封閉端（圖未 -1^23607 _ ] 併年Μ 4日修正替換頁 - 標）及一開口端（圖未標）。該半封閉端中部具有一入射窗 ’·· 511，以使外部光線進入鏡筒51内。該鏡筒51外壁設置一 外螺紋513。該鏡片52固定於鏡筒51内，且其與入射窗511 共軸設計，以便被攝物反射之光線入射至鏡筒51内之鏡片 ^ 52上。該濾波片53，如紅外截止濾波片，固設於鏡筒51之 開口端，其可封閉鏡筒51以阻擋灰塵等雜質進入鏡筒51而 . 污染鏡片52且可濾去不需要之光線。 . 該鏡座60呈中空狀，其包括一筒部61及一座部63。該 •筒部61呈中空圓柱狀，其内壁設有與鏡筒51之外螺紋513 相配合之内螺紋612。該座部63呈矩形，其相對兩端分別軸 向凸設有一凸緣631及所述筒部61。該凸緣631内壁圍成一 容室633，該容室633用於容置影像感測器封裝20，該容室 633可收容承載體21之上焊墊215於其中。該座部63之内 壁還向内凸設有一凸框635，該凸框635之内緣之尺寸大於 晶片23之感測區231之尺寸而小於蓋體28之尺寸。 φ 該鏡座60設置於影像感測器封裝20上，其中，鏡座60 之凸緣631藉由第二黏著物40而固接於承載體21之頂面將 影像感測器封裝20收容於其中，包括承載體21之上焊墊 215，鏡座60之凸框635之底面藉由塗佈於蓋體28頂面周 緣之第二黏著物40固接於蓋體28之頂面上。該鏡頭摸組50 設置於鏡座60之筒部61内，其鏡筒51之外螺紋513與鏡 座60之筒部61之内螺紋612相配合。該鏡頭模組50之鏡 片52與影像感測器封裝20之晶片23之感測區231相對正。 可以理解，該鏡頭模組50可以省略，而該鏡座60之筒 11 一/ P年(。月(t日修正替換頁 :部61内可藉由黏合或卡配等方式固設至少—鏡片以滿足成 ·· 像需求。 • 所述影像感測ϋ封裝20之蓋體28與第—黏著物26配 合封閉晶片23之感測區231，其形成一更小的封閉空間，一 方，可以減少該封閉空間内之灰塵、粒子等污染物，從而減 i曰曰片23之感測區231之受污染程度以提高該影像感測器 ，封裝2〇之成像品質；$ 一方面，可減小第一黏著物26在供 ‘：製私中之揮發出之氣體產生之内壓’進而減小蓋體Μ剝 洛或偏移的可能性以提高該影像感測器封裝20之可靠性。 卜蓋體28藉由支樓件26的支撐可以更平穩的固設於晶 23上方，可以減小蓋體烈傾斜的可能性，因此可以進一 步提高成像品質。 另鏡座60藉由第二黏著物40直接黏著於承載體21 之頂面上，可有效降低該數位相機模組10之高度。而且， 該鏡座60之座部63之凸框奶黏著於蓋體烈之上表面， 鲁^時增加鏡座6G及蓋體28之結構強度，且亦可有效降低 谷=^33内之粉塵、粒子等污染物對該蓋體28之污染程度 以提高該數位相機模組10之成像品質。 又 綜上所述，本發明符合發明專利要件，爰依法提出專 ，申H以上所述者僅為本發明之較佳實施例，舉凡 女、心本案技藝之人士’在、援依本案創作精神所作之等效 ‘飾或變化，皆應包含於以下之申請專利範圍内。’ 【圖式簡單說明】 圖1係本發明數位相機模組一較佳實施例之剖示圖丨及 12 •卩23607 待ί。月名日修正替換頁, φ36〇7* and a plurality of pads 216 disposed under the bottom surface. The lower pad 216 is electrically connected to the upper pad 215 for electrically connecting with other components such as a printed circuit board or the like. The wafer 23 is an image sensor wafer which is fixed to the top surface of the carrier 21 by an adhesive such as glue or double-sided tape. The top surface of the wafer 23 has a sensing region 231, and a plurality of wafer pads 233 are disposed on the periphery of the top surface of the wafer 23. The wafer pad 233 is used to output an image signal generated by the wafer 23. * One end of the plurality of wires 24 is connected to the die pad 233, and the other end is connected to the pad 215 above the carrier 21. The support member 25 is a frame disposed on the top surface of the wafer 23 outside the sensing region 231 of the wafer 23. It can be understood that the support member 25 can also be a plurality of cylinders respectively disposed at four corners of the top surface of the wafer 23. The first adhesive 26 is applied around the periphery of the sensing region 231 of the wafer 23 and covers the support member 25, and covers the connection between the wire 24 and the die pad 233 to protect and strengthen the wire 24 and the wafer pad 233. Junction. The cover 28 is made of a transparent material having a size larger than the size of the sensing φ region 231 of the wafer 23. The cover 28 is disposed above the top surface of the wafer 23 and supported by the support member 25, and is adhered to the wafer 23 by the first adhesive 26 to close the sensing region 231 of the wafer 23. The second adhesive 40 is applied to the top surface of the carrier 21, disposed around the periphery of the upper pad 215, and further covers the connection of the wire 24 to the pad 215 above the carrier 21 to protect the connection. The second adhesive 40 is also applied to the periphery of the top surface of the cover 28. The lens module 50 includes a lens barrel 51, at least one lens 52, and a filter sheet 53. The lens barrel 51 is a half-closed cylinder having a half closed end (Fig. -1^23607 _) and a modified replacement page - mark) and an open end (not shown). The central portion of the semi-closed end has an entrance window 。 511 to allow external light to enter the lens barrel 51. An outer thread 513 is provided on the outer wall of the barrel 51. The lens 52 is fixed in the lens barrel 51, and is coaxially designed with the entrance window 511 so that the light reflected by the object is incident on the lens 52 in the lens barrel 51. The filter 53, such as an infrared cut filter, is fixed to the open end of the lens barrel 51, and can close the lens barrel 51 to block impurities such as dust from entering the lens barrel 51. The lens 52 is contaminated and unnecessary light can be filtered. The lens holder 60 is hollow and includes a tubular portion 61 and a portion 63. The cylindrical portion 61 has a hollow cylindrical shape, and an inner thread 612 is provided on the inner wall thereof to cooperate with the external thread 513 of the lens barrel 51. The seat portion 63 has a rectangular shape, and a flange 631 and the tubular portion 61 are axially protruded from opposite ends of the seat portion 63, respectively. The inner wall of the flange 631 encloses a cavity 633 for accommodating the image sensor package 20, and the chamber 633 can receive the pad 215 above the carrier 21. The inner wall of the seat portion 63 is also convexly provided with a convex frame 635. The inner edge of the convex frame 635 has a size larger than the size of the sensing region 231 of the wafer 23 and smaller than the size of the cover body 28. The lens holder 60 is disposed on the image sensor package 20, wherein the flange 631 of the lens holder 60 is fixed to the top surface of the carrier 21 by the second adhesive 40 to receive the image sensor package 20 The bottom surface of the frame 635 of the lens holder 60 is fixed to the top surface of the cover body 28 by a second adhesive 40 coated on the periphery of the top surface of the cover body 28. The lens assembly 50 is disposed in the cylindrical portion 61 of the lens holder 60, and the external thread 513 of the lens barrel 51 cooperates with the internal thread 612 of the cylindrical portion 61 of the lens holder 60. The lens 52 of the lens module 50 is aligned with the sensing region 231 of the wafer 23 of the image sensor package 20. It can be understood that the lens module 50 can be omitted, and the lens of the lens holder 60 is one/P years. (T-day correction replacement page: the portion 61 can be fixed by at least a lens by bonding or splicing, etc.) In order to meet the image requirements, the cover 28 of the image sensing package 20 and the first adhesive 26 cooperate to close the sensing area 231 of the wafer 23, which forms a smaller enclosed space, one of which can be reduced. Contaminants such as dust and particles in the enclosed space, thereby reducing the degree of contamination of the sensing region 231 of the cymbal 23 to improve the imaging quality of the image sensor and the package; 2, on the one hand, can be reduced The first adhesive 26 is used to reduce the possibility of peeling or offset of the cover body for the internal pressure generated by the volatilized gas in the manufacturing process to improve the reliability of the image sensor package 20. The cover body 28 can be more stably fixed on the crystal 23 by the support of the branch member 26, and the possibility of the body tilting can be reduced, so that the image quality can be further improved. The mirror holder 60 is further coated with the second adhesive. 40 directly adheres to the top surface of the carrier 21, which can effectively reduce the digital camera The height of the group 10. Moreover, the convex frame milk of the seat portion 63 of the lens holder 60 is adhered to the upper surface of the cover body, and the structural strength of the lens holder 6G and the cover body 28 is increased, and the valley can be effectively reduced. The degree of contamination of the cover body 28 by the dust, particles and the like in the ^33 is to improve the image quality of the digital camera module 10. In summary, the invention complies with the invention patent requirements, and is proposed according to law. The above is only the preferred embodiment of the present invention, and the equivalent 'decoration or change' of the actor and the person skilled in the art of the present invention should be included in the following patent application scope. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a preferred embodiment of a digital camera module of the present invention and 12 卩23607 待ί. Month name correction replacement page
圖2係一習知數位相機模組之示意圖。 【主要元件符號說明】2 is a schematic diagram of a conventional digital camera module. [Main component symbol description]
(本發明） 數位相機模組 10 承載體 21 下焊墊 216 感測區 231 導線 24 第一黏著物 26 第二黏著物 40 鏡1同 51 外螺紋 513 渡波片 53 筒部 61 座部 63 容室 633 (習知） 數位相機模組 80 訊號輸出端 812 訊號連接端 822 晶片 84 感測區 843 第一接著層 86 第二接著層 88 影像感測器封裝 20 上焊墊 215 晶片 23 晶片焊墊 233 支撐件 25 蓋體 28 鏡頭模組 50 入射窗 511 鏡片 52 鏡座 60 内螺紋 612 凸緣 631 凸框 635 基板 81 凸緣層 82 容室 83 焊墊 841 導線 85 蓋體 87 鏡頭 89 13(Invention) Digital Camera Module 10 Carrier 21 Lower Pad 216 Sensing Zone 231 Wire 24 First Adhesive 26 Second Adhesive 40 Mirror 1 Same 51 External Thread 513 Wave Plate 53 Cylinder 61 Seat 63 Room 633 (General) Digital Camera Module 80 Signal Output 812 Signal Connection 822 Wafer 84 Sensing Area 843 First Adjacent Layer 86 Second Adjacent Layer 88 Image Sensor Package 20 Upper Pad 215 Wafer 23 Wafer Pad 233 Support 25 Cover 28 Lens Module 50 Incident Window 511 Lens 52 Mirror Mount 60 Internal Thread 612 Flange 631 Bulge Frame 635 Substrate 81 Flange Layer 82 Housing 83 Pad 841 Wire 85 Cover 87 Lens 89 13