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TWI320693B - Circuit board having heat-dissipating structure and manufacturing method thereof - Google Patents

Circuit board having heat-dissipating structure and manufacturing method thereof

Info

Publication number
TWI320693B
TWI320693B TW96115447A TW96115447A TWI320693B TW I320693 B TWI320693 B TW I320693B TW 96115447 A TW96115447 A TW 96115447A TW 96115447 A TW96115447 A TW 96115447A TW I320693 B TWI320693 B TW I320693B
Authority
TW
Taiwan
Prior art keywords
manufacturing
heat
circuit board
dissipating structure
dissipating
Prior art date
Application number
TW96115447A
Other languages
Chinese (zh)
Other versions
TW200845874A (en
Inventor
Tsung Yin Lin
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW96115447A priority Critical patent/TWI320693B/en
Publication of TW200845874A publication Critical patent/TW200845874A/en
Application granted granted Critical
Publication of TWI320693B publication Critical patent/TWI320693B/en

Links

TW96115447A 2007-05-01 2007-05-01 Circuit board having heat-dissipating structure and manufacturing method thereof TWI320693B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96115447A TWI320693B (en) 2007-05-01 2007-05-01 Circuit board having heat-dissipating structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96115447A TWI320693B (en) 2007-05-01 2007-05-01 Circuit board having heat-dissipating structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200845874A TW200845874A (en) 2008-11-16
TWI320693B true TWI320693B (en) 2010-02-11

Family

ID=44822964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96115447A TWI320693B (en) 2007-05-01 2007-05-01 Circuit board having heat-dissipating structure and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI320693B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400998B (en) * 2010-08-20 2013-07-01 南亞電路板股份有限公司 Printed circuit board and method of manufacturing same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI753468B (en) * 2020-06-24 2022-01-21 欣興電子股份有限公司 Substrate structure with heat dissipation structure and manufacturing method thereof
CN114258183B (en) 2020-09-21 2024-07-05 鹏鼎控股(深圳)股份有限公司 Circuit board with heat radiation structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400998B (en) * 2010-08-20 2013-07-01 南亞電路板股份有限公司 Printed circuit board and method of manufacturing same

Also Published As

Publication number Publication date
TW200845874A (en) 2008-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees