[go: up one dir, main page]

TWI320014B - Stencil and method for manufacturing the same - Google Patents

Stencil and method for manufacturing the same Download PDF

Info

Publication number
TWI320014B
TWI320014B TW96122543A TW96122543A TWI320014B TW I320014 B TWI320014 B TW I320014B TW 96122543 A TW96122543 A TW 96122543A TW 96122543 A TW96122543 A TW 96122543A TW I320014 B TWI320014 B TW I320014B
Authority
TW
Taiwan
Prior art keywords
screen
printing
frame
pattern
metal sheet
Prior art date
Application number
TW96122543A
Other languages
Chinese (zh)
Other versions
TW200900247A (en
Inventor
Yong-Hong Zhang
Syu Min Huang
Chih Yi Tu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW96122543A priority Critical patent/TWI320014B/en
Publication of TW200900247A publication Critical patent/TW200900247A/en
Application granted granted Critical
Publication of TWI320014B publication Critical patent/TWI320014B/en

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)

Description

1320014 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種印刷網版及其製作方法。 【先前技術】 ’罔版印刷A種多用途印刷技術,其於電路板領域一 直♦刀廣著重要角色,匕係貫現電路板油墨、黏膠及焊錫等 精密塗佈之關鍵。於電路板製作過程中,網版印刷時,把 I電路板直接放置於具有網印圖案之印刷網版下面,讓油 墨、、黏膠及焊錫等於刮刀之掩壓作用下穿過網版之網印圖 案塗佈到電路板上預定區域。 印刷網版之網印㈣之製作精度與印制版之印刷精 ^二刀::。印刷網版通常由尼龍、聚酯、絲綢、金屬網 ,屬片‘作而成。於製作金屬片印刷網版時 學蝕刻與機械鑽孔兩種方法 j有化 _。化學_法,係於金:;:=印 之網 N + 连屬片上塗佈光阻劑層,么ΰ B異 光將底片之圖像轉移到光阻南 金屬片上m座 再經過顯影、蝕刻於 金屬片上形成相應之網印圖案。 低,製作過程中底片漲缩丄士 I作Ά長’效率 均會造成金屬片之網印=宰=渗光以及钱刻時側钱等 通過機械鑽孔機直接對金屬片加法係 網印圖案製作精度較低,於金屬片之案二該方法 毛邊,從而影響後續印刷之效果,…?案處谷易形成 且該方法無法加卫㈣網印“㈣應精密印刷,而 1320014 • 隨著電路板逐漸向微型化、高密度化方向發展,於電 ‘路板製作過程中需要進行高精度網版印刷,惟,習知印刷 _網版製作方法所製作之印刷網版由於網印圖案精度較低, 已經無法滿足高密度電路板製作需要,甚至會引起電路板 報廢,從而影響電路板製作良率。 【發明内容】 因此,有必要提供一種印刷網版及其製作方法,以適 >應高密度電路板之高精度網版印刷之需求。 以下將以實施例說明一種印刷網版及其製作方法。 一種印刷網版,其包括網框、絲網及具有網印圖案之 金屬片,該絲網繃設於網框,該金屬片固定於絲網表面, •該金屬片之網印圖案採用雷射燒蝕而成,網印圖案之精度 為+0.005〜+0.02毫米或_〇 〇2〜_〇.〇〇5毫米。 一種印刷網版之製作方法,其包括以下步驟:提供金 屬片,利用雷射燒蝕金屬片形成網印圖案,網印圖案之精 •度為+0.005〜+0.02毫米或_〇.〇2〜_〇 〇〇5毫米;提供網框及絲 網,將該絲網繃設於該網框;將具有網印圖案之金屬片固 定於絲網。 與先前技術相比,該印刷網版採用雷射燒蝕形成網印 Θ案°亥網印圖案之精度為+0.005〜+〇 〇2毫米或 -0.02〜-0.005毫米,該高精度印刷網版有利於高密度電路板 進行精密網版印刷,可有效防止由於網版印刷而引起之電 ^板報廢’提高電路板製作良率。該印刷網版製作方法簡 單’能有效節約成本,提高生產效率。 7 1320014 【實施方式】 • y面結合關及實施例對本技術方㈣供之印刷網版 - 及其製作方法作進一步說明。 請參閱圖1,所示為本技術方案實施例提供之印刷網版 _。該印刷網版包括網框110、絲網12〇及金屬片13〇。 ’ 該網框110可為金屬網框、木質網框或塑膠網框。該 網框110之形狀可根據使用過程中實際需要設計。本實施 鲁例中’該網框11G為矩形之金屬網框,例如紹合金網框。 〜該絲網120四周邊緣與網框11〇之内侧四周連接,使 得該絲網120繃設於網框11〇。該絲網12〇具有一定之彈性 與張力,可提供印刷網版100所需要之特定變形。該絲網 I20可為聚酯絲網、尼龍絲網或金屬絲網等。本實施例中, 該絲網120為聚酯絲網。 該金屬片130可為鋁片等,該金屬片13〇之形狀和厚 度可根據使用過程中實際需要設計。本實施例中,該金屬 §片130為矩形之鋁片,其尺寸小於網框11〇之尺寸,該金 屬片130之厚度範圍可為ο』毫米,其可用於電路板油墨塞 .孔印刷。該金屬片130具有網印圖案131,該網印圖案ΐ3ι 係形成於金屬片130上橫截面形狀不限定之通孔,其採用 雷射燒蝕金屬片130而形成。該網印圖案131之精度,即 雷射切割時,網印圖案131理論上於金屬板13〇上$應形 成之位置與網印圖案131實際於金屬板13〇上所形成之位 置之間之誤差,為+0.005〜+0.02毫米或_〇 〇2…〇 〇〇5毫米。 該金屬片130固定於絲網12〇,本實施例中’該金屬片13〇 l32〇〇i4 之表面直接貼合於絲網120表面,並通過膠水膠合固定。 優選地’該金屬片13〇可固定於絲網12〇表面之中央位置。 請一併參_ 2A至圖2C,本技術方案實施例提供之 印刷網版1〇〇之製作方法包括如下步驟。 第步,如圖2A所示,提供金屬片13〇,利用雷射燒 蝕金屬片130’形成網印圖案131,網印圖案i3i之精度為 +0.005〜+0.02 毫米或 _〇 〇2一〇 〇〇5 毫米。 鲁1320014 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a printing screen and a method of manufacturing the same. [Prior Art] A multi-purpose printing technology, which is widely used in the field of circuit boards, is the key to the precision coating of circuit board inks, adhesives and solders. In the process of circuit board production, in the screen printing, the I circuit board is directly placed under the printing screen with the screen printing pattern, so that the ink, the glue and the solder are equal to the masking action of the doctor blade and pass through the screen of the screen. The printed pattern is applied to a predetermined area on the board. Printed screen version of the screen printing (four) production precision and printed version of the printing fine ^ two knives::. Printing screens are usually made of nylon, polyester, silk, metal mesh, and slabs. In the production of sheet metal printing screens, two methods of etching and mechanical drilling are used. Chemistry_method, attached to gold:;:=Printed net N + attached on-chip coated photoresist layer, ΰ B B-light transfer the image of the negative film to the resistive south metal sheet, then develop and etch A corresponding screen printing pattern is formed on the metal sheet. Low, the film is shrinking and shrinking during the production process. The efficiency of the film will be caused by the screen printing of the metal sheet = slaughtering and the side money of the money, etc. The production precision is lower, in the case of the metal sheet, the method is burr, which affects the effect of subsequent printing,...? The case is easy to form and the method cannot be strengthened. (4) Screen printing “(4) should be precision printed, and 1320014 • As the board gradually develops toward miniaturization and high density, high precision is required in the process of making 'road board' Screen printing, however, the printing screen produced by the conventional printing _ screen printing method has been unable to meet the needs of high-density circuit board manufacturing due to the low precision of the screen printing pattern, and may even cause the circuit board to be scrapped, thereby affecting the board production. [Explanation] Therefore, it is necessary to provide a printing screen and a manufacturing method thereof, which are suitable for high-precision screen printing of high-density circuit boards. Hereinafter, a printing screen and an embodiment will be described by way of examples. The printing screen comprises a screen frame, a wire mesh and a metal sheet having a screen printing pattern, the screen is stretched on the frame, the metal piece is fixed on the surface of the screen, • the screen printing of the metal piece The pattern is formed by laser ablation, and the precision of the screen printing pattern is +0.005~+0.02 mm or _〇〇2~_〇.〇〇5 mm. A method for manufacturing a printing screen includes the following steps : Provide metal sheet, use laser to ablate metal sheet to form screen printing pattern, the precision of screen printing pattern is +0.005~+0.02 mm or _〇.〇2~_〇〇〇5 mm; provide frame and wire a mesh, the screen is stretched on the frame; the metal piece having the screen printing pattern is fixed to the screen. Compared with the prior art, the printing screen uses laser ablation to form a screen printing file. The precision of the pattern is +0.005~+〇〇2 mm or -0.02~-0.005 mm. This high-precision printing screen facilitates high-density circuit board for precision screen printing, which can effectively prevent the electricity caused by screen printing. The board scraps 'improves the board production yield. The printing screen version is simple to make' can effectively save costs and improve production efficiency. 7 1320014 [Embodiment] • y-face combination and embodiment for the technical side (4) for printing screen - and its manufacturing method for further explanation. Please refer to Fig. 1, which shows a printing screen _ provided by an embodiment of the technical solution. The printing screen comprises a frame 110, a screen 12 〇 and a metal sheet 13 〇. The frame 110 can be a metal frame or a wooden frame. Or the shape of the plastic frame. The shape of the frame 110 can be designed according to the actual needs during use. In the example of the embodiment, the frame 11G is a rectangular metal frame, such as a mesh frame of the alloy. It is connected to the inner side of the frame 11〇 so that the screen 120 is stretched over the frame 11. The screen 12 has a certain elasticity and tension, and can provide a specific deformation required for the printing screen 100. I20 may be a polyester mesh, a nylon mesh or a wire mesh, etc. In this embodiment, the mesh 120 is a polyester mesh. The metal piece 130 may be an aluminum piece or the like, and the shape of the metal piece 13 is The thickness of the metal piece 130 is a rectangular aluminum piece having a size smaller than the size of the frame 11 , and the thickness of the metal piece 130 may be ο 毫米 , which is designed according to actual needs in the process. Can be used for circuit board ink plugs. Hole printing. The metal piece 130 has a screen printing pattern 131 formed on a through hole of a metal piece 130 having a cross-sectional shape not limited, which is formed by laser ablating the metal piece 130. The precision of the screen printing pattern 131, that is, the position where the screen printing pattern 131 is theoretically formed on the metal plate 13〇 and the position where the screen printing pattern 131 is actually formed on the metal plate 13〇, during laser cutting. The error is +0.005~+0.02 mm or _〇〇2...〇〇〇5 mm. The metal piece 130 is fixed to the screen 12, and in the embodiment, the surface of the metal piece 13 〇 l32 〇〇 i4 is directly attached to the surface of the screen 120 and fixed by glue bonding. Preferably, the metal piece 13 is fixed to a central position of the surface of the screen 12 . Please refer to _ 2A to FIG. 2C. The manufacturing method of the printing screen 1 provided by the embodiment of the present technical solution includes the following steps. In the first step, as shown in FIG. 2A, the metal sheet 13 is provided, and the screen printing pattern 131 is formed by using the laser ablation metal sheet 130'. The precision of the screen printing pattern i3i is +0.005~+0.02 mm or _〇〇2. 〇〇 5 mm. Lu

採用雷射切割系統發射雷射光束於金屬片130上直接 進仃燒蝕,形成對應於電路板預定印刷區域之網印圖案 U1。雷射切割系統可通過影像感測器掃描電路板預定印刷 區域―:經過電腦處理後形成對應於電路板預定印刷區域之 圖像貝料,根據,亥圖像資料,雷射切割系統發射雷射光束 於金屬片13G上與電路板預定印刷區域對應之區域進行定 。並對孟屬片130進行燒蝕,以形成與電路板預定印刷 區域之®案相對應之網印圖案131。此過程可確保網印圖案 131開設之精度。該網印圖* 131之精度,即雷射切割時, 對應電路板預定印刷區域之網印圖案131理論上於金屬板 130上所應形成之位置與網印圖帛ΐ3ι實際於金屬板⑽ 上所形成之位置之間之誤差,為+〇 〇〇5〜+〇 〇2毫米或 〜-0.GG5㊣米。燒钱所用之雷射可為二氧化碳雷射或紫 卜田射如銳紀紹石權石(Ne〇dymium :Yttrium AluminuinThe laser beam is emitted by the laser cutting system to directly ablate on the metal piece 130 to form a screen printing pattern U1 corresponding to a predetermined printing area of the circuit board. The laser cutting system can scan the board to print the printing area through the image sensor: after processing by the computer to form an image corresponding to the predetermined printing area of the board, according to the image data, the laser cutting system emits the laser The light beam is fixed on the metal piece 13G in a region corresponding to a predetermined printing area of the board. The Meng pieces 130 are ablated to form a screen pattern 131 corresponding to the case of the predetermined printing area of the board. This process ensures the accuracy of the screen printing pattern 131. The accuracy of the screen printing * 131, that is, when laser cutting, the screen printing pattern 131 corresponding to the predetermined printing area of the circuit board is theoretically formed on the metal plate 130 and the screen printing pattern is actually on the metal plate (10). The error between the formed positions is +〇〇〇5~+〇〇2 mm or ~-0.GG5 square meters. The laser used for burning money can be a carbon dioxide laser or a purple field, such as the sharp 绍石石石 (Ne〇dymium: Yttrium Aluminuin

Garnet’ Nd:YAG)為介質之固體雷射。根據網印圖案131尺 寸和金屬Μ 130材料及厚度來控制雷射光束之能量密度, 使金屬片130直接經雷射燒蝕形成網印圖案131。 1320014 第二步,如圖2B所示,提供網框110及絲網120,將 . 該絲網120繃設於該網框110。 _ 將絲網120之四周邊緣與網框110之内側四周連接固 定,該絲網120可通過膠合方式連接固定於網框110内側 四周,亦可通過其他方式固定,從而使得絲網120繃設於 • 網框110。該絲網120繃設於網框110後,具有一定之彈性 與張力,可提供印刷網版100所需要之特定變形。 第三步,如圖2C所示,將具有網印圖案131之金屬片 ® 130固定於絲網120表面。 金屬片130通過膠合方式固定於絲網120,將該金屬片 130之一表面直接貼合於絲網120表面,並通過膠水膠合固 定,膠水可於金屬片130與絲網120貼合前,塗佈於金屬 « . 片130與絲網120貼合之表面,亦可塗佈於絲網120與金 屬片130貼合之表面,或者同時塗佈於金屬片130與絲網 120貼合之表面與絲網120與金屬片130貼合之表面。金屬 φ 片130固定之位置並無限定,優選地,可將該金屬片130 固定於絲網120之中央位置。 . 綜上所述,本發明確已符合發明專利之要件,遂依法 ' 提出專利申請。惟,以上所述者僅為本發明之較佳實施方 式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化,皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施例提供之印刷網版之不意圖。 1320014 圖2A-2C係本技術方案實施例提供之印刷網版之製作 方法示意圖。 【主要元件符號說明】 印刷網版 100 網框 110 絲網 120 金屬片 130 網印圖案 131Garnet’ Nd:YAG) is a solid laser of the medium. The energy density of the laser beam is controlled according to the size of the screen printing 131 and the material and thickness of the metal crucible 130, so that the metal sheet 130 is directly ablated by laser to form the screen printing pattern 131. 1320014 In the second step, as shown in FIG. 2B, a frame 110 and a screen 120 are provided, and the screen 120 is stretched over the frame 110. _ The peripheral edge of the screen 120 is fixedly connected to the inner side of the frame 110. The screen 120 can be fixedly attached to the inner side of the frame 110 by gluing, or can be fixed by other means, so that the screen 120 is stretched over • Frame 110. The screen 120 is stretched behind the frame 110 and has a certain elasticity and tension to provide a specific deformation required for the printing screen 100. In the third step, as shown in FIG. 2C, the metal piece ® 130 having the screen printing pattern 131 is fixed to the surface of the screen 120. The metal sheet 130 is fixed to the screen 120 by gluing, and one surface of the metal sheet 130 is directly attached to the surface of the screen 120 and fixed by glue glue. The glue can be applied before the metal sheet 130 is attached to the screen 120. The surface of the sheet 130 and the screen 120 may be applied to the surface of the screen 120 and the metal sheet 130, or may be applied to the surface of the metal sheet 130 and the screen 120. The surface of the screen 120 that is attached to the metal sheet 130. The position at which the metal φ sheet 130 is fixed is not limited, and preferably, the metal piece 130 can be fixed to the center of the screen 120. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a printing screen provided by an embodiment of the present technical solution. 1320014 FIGS. 2A-2C are schematic diagrams showing a method of fabricating a printing screen provided by an embodiment of the present technical solution. [Description of main component symbols] Printing screen 100 Frames 110 Screen 120 Metal sheet 130 Screen printing pattern 131

1111

Claims (1)

1320014 十、申請專利範圍: 卿1月如修(¾正替換頁 ,r—種印刷網版之製作方法,其包括以下步驟:提~供金屬 片,通過影像感測器掃描電路板預定印刷區域,經過電腦 處理後形成對應於電路板預定印刷區域之圖像資料,根據 邊圖像資料,雷射切割系統發射雷射光束於金屬片上與電 •路板預定印刷區域對應之區域進行定位,並對金屬片進行 燒蝕,以形成與電路板預定印刷區域之圖案相對應之網印 圖案’網印圖案之精度為+0 005〜+0 02毫米或_〇 〇2〜_〇 〇〇5 •毫米;提供網框及絲網,將所述之絲網繃設於該網框;將 具有網印圖案之金屬片固定於絲網。 2. 如申請專利範圍第1項所述之印刷網版之製作方法,其 + ’該雷射為紫外雷射或二氧化碳雷射。 3. 如申請專利範圍第1項所述之印刷網版之製作方法,其 中,該金屬片為鋁片。 4. 如申請專利範圍第1項所述之印刷網版之製作方法,其 中’將該絲網通過膠合方式連接固定於網框内侧四周,從 ®而繃設於該網框。 5. 如申請專利範圍第i項所述之印刷網版之製作方法,其 、 中,將該金屬片之一表面直接貼合於絲網表面,並通過膠 水膠合固定。 【S] 12 Ι3200Ϊ4 十^一、圖式. 汶年"月β日修(¾¾正替翻1320014 X. The scope of application for patents: Qing Qiu repair (3⁄4 positive replacement page, r-type printing screen version of the production method, which includes the following steps: to provide metal sheets, scan the board through the image sensor to print the printing area After processing by the computer to form image data corresponding to a predetermined printing area of the circuit board, according to the edge image data, the laser cutting system emits a laser beam on the metal sheet and is located in an area corresponding to the predetermined printing area of the electric circuit board, and The metal sheet is ablated to form a screen printing pattern corresponding to the pattern of the predetermined printing area of the circuit board. The accuracy of the screen printing pattern is +0 005~+0 02 mm or _〇〇2~_〇〇〇5. a millimeter; a frame and a wire mesh are provided, and the wire mesh is stretched on the frame; the metal piece having the screen printing pattern is fixed to the wire mesh. 2. The printing screen plate according to claim 1 of the patent application scope The method of manufacturing the +' the laser is an ultraviolet laser or a carbon dioxide laser. 3. The method for producing a printing screen according to claim 1, wherein the metal sheet is an aluminum sheet. Patent application scope The method for manufacturing a printing screen according to any one of the preceding claims, wherein the screen is fixed to the inner side of the frame by gluing, and is stretched from the frame to the frame. 5. As described in claim i The printing screen printing method, wherein, one surface of the metal sheet is directly attached to the surface of the screen, and is fixed by glue glue. [S] 12 Ι 3200 Ϊ 4 10^1, pattern. Wennian"日日修(3⁄43⁄4正翻翻 [S 1 13[S 1 13
TW96122543A 2007-06-22 2007-06-22 Stencil and method for manufacturing the same TWI320014B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96122543A TWI320014B (en) 2007-06-22 2007-06-22 Stencil and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96122543A TWI320014B (en) 2007-06-22 2007-06-22 Stencil and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200900247A TW200900247A (en) 2009-01-01
TWI320014B true TWI320014B (en) 2010-02-01

Family

ID=44721278

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96122543A TWI320014B (en) 2007-06-22 2007-06-22 Stencil and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI320014B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102848764A (en) * 2011-06-29 2013-01-02 群康科技(深圳)有限公司 Forme, circuit board printing method using same and manufactured printed circuit board
TWI477207B (en) * 2012-11-28 2015-03-11 Unimicron Technology Corp Circuit structure and fabricating process thereof

Also Published As

Publication number Publication date
TW200900247A (en) 2009-01-01

Similar Documents

Publication Publication Date Title
TWI223581B (en) Method for machining ceramic green sheet and apparatus for machining the same
TWI663898B (en) Manufacturing method of flexible printed wiring board
JP5574209B1 (en) Gravure offset printing method, gravure offset printing apparatus and gravure plate
JP2003124724A (en) Conductive electrical element and antenna with ink additive technology
CN104750311A (en) Manufacturing method of metal mesh conducting film, metal mesh conducting film and touch panel
JP4792224B2 (en) Method for forming a mask pattern on a substrate
CN108326435B (en) Laser marking method for die steel
TWI320014B (en) Stencil and method for manufacturing the same
CN105934106A (en) Processing method for improving bending performance of semi-rigid-flex board
JP2009231380A (en) Printed wiring board
WO2023216334A1 (en) Laser alignment method and system for micro-blind holes
CN103889159A (en) Landfill type conductive line preparation process
JP2005072539A (en) Method of manufacturing ceramic green sheet, and method of manufacturing electronic component using the ceramic green sheet
JP6079233B2 (en) Gravure offset printing method and gravure offset printing apparatus
CN115570281A (en) Method for processing copper-clad plate by laser
JP3497789B2 (en) Method for processing through holes in ceramic green sheets
WO2014051027A1 (en) Relief form film and method for manufacturing same, relief printing plate original and method for manufacturing same, and relief printing plate and plate-forming method for same
CN106455339A (en) Semi-flexible printed board with rupture function and manufacturing method thereof
CN115942636B (en) Circuit board processing method and circuit board
CN111083871A (en) Manufacturing method of printed circuit board and printed circuit board
JP7649534B2 (en) Printed circuit board manufacturing method
JP6022110B1 (en) Printed wiring board and method for manufacturing printed wiring board
JP2007329181A (en) Patterning method and equipment
CN103364847B (en) Protective lens for electronic device and manufacturing method thereof
JP2011031599A (en) Pasting sheet for printing visiting card and the like

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees