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TWI319913B - Optoelectronic component with radiation-transparent electrical contact-layer - Google Patents

Optoelectronic component with radiation-transparent electrical contact-layer

Info

Publication number
TWI319913B
TWI319913B TW092137032A TW92137032A TWI319913B TW I319913 B TWI319913 B TW I319913B TW 092137032 A TW092137032 A TW 092137032A TW 92137032 A TW92137032 A TW 92137032A TW I319913 B TWI319913 B TW I319913B
Authority
TW
Taiwan
Prior art keywords
radiation
layer
electrical contact
optoelectronic component
transparent electrical
Prior art date
Application number
TW092137032A
Other languages
English (en)
Other versions
TW200423435A (en
Inventor
Tony Albrecht
Wilhelm Stein
Ralph Wirth
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200423435A publication Critical patent/TW200423435A/zh
Application granted granted Critical
Publication of TWI319913B publication Critical patent/TWI319913B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
TW092137032A 2002-12-31 2003-12-26 Optoelectronic component with radiation-transparent electrical contact-layer TWI319913B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10261675A DE10261675B4 (de) 2002-12-31 2002-12-31 Optoelektronisches Bauelement mit strahlungsdurchlässiger elektrischer Kontaktschicht

Publications (2)

Publication Number Publication Date
TW200423435A TW200423435A (en) 2004-11-01
TWI319913B true TWI319913B (en) 2010-01-21

Family

ID=32519514

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092137032A TWI319913B (en) 2002-12-31 2003-12-26 Optoelectronic component with radiation-transparent electrical contact-layer

Country Status (4)

Country Link
US (1) US6979842B2 (zh)
JP (1) JP2004214680A (zh)
DE (1) DE10261675B4 (zh)
TW (1) TWI319913B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005008056A1 (de) * 2004-12-30 2006-07-13 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips
EP2259346B1 (en) * 2008-03-27 2019-07-03 LG Innotek Co., Ltd. Light-emitting element and a production method therefor
DE102015116865B4 (de) 2015-10-05 2025-07-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterchips und Halbleiterchip
DE102016103342A1 (de) * 2016-02-25 2017-08-31 Aesculap Ag Gasdurchlässige Filterkassette für einen Sterilbehälter

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA920285A (en) * 1970-11-30 1973-01-30 L. Hartman Robert Extending the operating life of light emitting p-n junction devices
JPH01265495A (ja) 1988-04-15 1989-10-23 Gunze Ltd エレクトロルミネッセンス素子
JP2752423B2 (ja) 1989-03-31 1998-05-18 三菱電機株式会社 化合物半導体へのZn拡散方法
JP2817590B2 (ja) * 1993-09-24 1998-10-30 信越半導体株式会社 発光素子の製造方法
JPH07263751A (ja) * 1994-03-24 1995-10-13 Sharp Corp Ii−vi族化合物半導体装置及びその製造方法
JPH07307490A (ja) 1994-05-10 1995-11-21 Daido Steel Co Ltd 半導体光電素子に対するZnO膜形成方法
US5889295A (en) * 1996-02-26 1999-03-30 Kabushiki Kaisha Toshiba Semiconductor device
US5789768A (en) 1997-06-23 1998-08-04 Epistar Corporation Light emitting diode having transparent conductive oxide formed on the contact layer
JPH11135834A (ja) * 1997-10-27 1999-05-21 Matsushita Electric Ind Co Ltd 発光ダイオード装置及びその製造方法
DE19829197C2 (de) * 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
US6207972B1 (en) 1999-01-12 2001-03-27 Super Epitaxial Products, Inc. Light emitting diode with transparent window layer
JP4285837B2 (ja) 1999-06-14 2009-06-24 昭和電工株式会社 窓層を備えたAlGaInP発光素子
JP4376361B2 (ja) * 1999-07-21 2009-12-02 昭和電工株式会社 AlGaInP発光ダイオード
JP4298861B2 (ja) * 1999-08-04 2009-07-22 昭和電工株式会社 AlGaInP発光ダイオード
JP4232281B2 (ja) 1999-08-04 2009-03-04 昭和電工株式会社 AlGaInP発光ダイオード
DE19955747A1 (de) 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur
JP2002016287A (ja) 2000-04-28 2002-01-18 Stanley Electric Co Ltd 半導体素子及び光半導体素子
US6255129B1 (en) * 2000-09-07 2001-07-03 Highlink Technology Corporation Light-emitting diode device and method of manufacturing the same
JP2002105625A (ja) 2000-09-27 2002-04-10 Japan Science & Technology Corp 低抵抗p型酸化亜鉛薄膜の製造方法
US6724013B2 (en) * 2001-12-21 2004-04-20 Xerox Corporation Edge-emitting nitride-based laser diode with p-n tunnel junction current injection

Also Published As

Publication number Publication date
DE10261675B4 (de) 2013-08-14
US6979842B2 (en) 2005-12-27
US20040256629A1 (en) 2004-12-23
DE10261675A1 (de) 2004-07-22
JP2004214680A (ja) 2004-07-29
TW200423435A (en) 2004-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees