TWI319625B - Image display system and manufacturing method of multi-gates thin film transistor - Google Patents
Image display system and manufacturing method of multi-gates thin film transistorInfo
- Publication number
- TWI319625B TWI319625B TW095144371A TW95144371A TWI319625B TW I319625 B TWI319625 B TW I319625B TW 095144371 A TW095144371 A TW 095144371A TW 95144371 A TW95144371 A TW 95144371A TW I319625 B TWI319625 B TW I319625B
- Authority
- TW
- Taiwan
- Prior art keywords
- gates
- manufacturing
- thin film
- image display
- film transistor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6708—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/425—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer having different crystal properties in different TFTs or within an individual TFT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095144371A TWI319625B (en) | 2006-11-30 | 2006-11-30 | Image display system and manufacturing method of multi-gates thin film transistor |
| US11/938,117 US7612379B2 (en) | 2006-11-30 | 2007-11-09 | Multi-gate thin film transistor having recrystallized channel regions with different grain sizes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095144371A TWI319625B (en) | 2006-11-30 | 2006-11-30 | Image display system and manufacturing method of multi-gates thin film transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200824126A TW200824126A (en) | 2008-06-01 |
| TWI319625B true TWI319625B (en) | 2010-01-11 |
Family
ID=39474670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095144371A TWI319625B (en) | 2006-11-30 | 2006-11-30 | Image display system and manufacturing method of multi-gates thin film transistor |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7612379B2 (zh) |
| TW (1) | TWI319625B (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201037769A (en) * | 2009-04-09 | 2010-10-16 | Chunghwa Picture Tubes Ltd | Thin film transistor and manufacturing method thereof |
| KR20120010043A (ko) * | 2010-07-23 | 2012-02-02 | 삼성모바일디스플레이주식회사 | 다결정 실리콘층의 제조 방법 및 상기 다결정 실리콘층 제조 방법을 포함하는 박막 트랜지스터의 제조 방법 |
| TWI513003B (zh) * | 2013-02-08 | 2015-12-11 | Innolux Corp | 液晶顯示面板及液晶顯示裝置 |
| CN103984168B (zh) * | 2013-02-08 | 2016-11-23 | 群创光电股份有限公司 | 液晶显示面板及液晶显示装置 |
| CN103915510B (zh) * | 2014-03-27 | 2017-08-04 | 京东方科技集团股份有限公司 | 一种多栅薄膜晶体管、阵列基板及显示装置 |
| CN105374882A (zh) * | 2015-12-21 | 2016-03-02 | 武汉华星光电技术有限公司 | 一种低温多晶硅薄膜晶体管及其制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5272369A (en) * | 1990-03-28 | 1993-12-21 | Interuniversitair Micro-Elektronica Centrum Vzw | Circuit element with elimination of kink effect |
| US5689618A (en) * | 1991-02-19 | 1997-11-18 | Bright Star Technology, Inc. | Advanced tools for speech synchronized animation |
| JPH05289103A (ja) * | 1992-04-08 | 1993-11-05 | Toshiba Corp | 液晶表示装置 |
| US5471330A (en) * | 1993-07-29 | 1995-11-28 | Honeywell Inc. | Polysilicon pixel electrode |
| JPH0982969A (ja) * | 1995-09-12 | 1997-03-28 | Toshiba Corp | 薄膜トランジスタおよび液晶表示装置 |
| US6014634A (en) * | 1995-12-26 | 2000-01-11 | Supermarkets Online, Inc. | System and method for providing shopping aids and incentives to customers through a computer network |
| US6069622A (en) * | 1996-03-08 | 2000-05-30 | Microsoft Corporation | Method and system for generating comic panels |
| JP3353875B2 (ja) * | 1997-01-20 | 2002-12-03 | シャープ株式会社 | Soi・mos電界効果トランジスタ |
| US5969721A (en) * | 1997-06-03 | 1999-10-19 | At&T Corp. | System and apparatus for customizing a computer animation wireframe |
| US6018774A (en) * | 1997-07-03 | 2000-01-25 | Yobaby Productions, Llc | Method and system for creating messages including image information |
| US6068183A (en) * | 1998-04-17 | 2000-05-30 | Viztec Inc. | Chip card system |
| US6602765B2 (en) * | 2000-06-12 | 2003-08-05 | Seiko Epson Corporation | Fabrication method of thin-film semiconductor device |
| US7159008B1 (en) * | 2000-06-30 | 2007-01-02 | Immersion Corporation | Chat interface with haptic feedback functionality |
| US6642085B1 (en) * | 2000-11-03 | 2003-11-04 | The Regents Of The University Of California | Thin film transistors on plastic substrates with reflective coatings for radiation protection |
| JP4190798B2 (ja) * | 2002-05-08 | 2008-12-03 | Nec液晶テクノロジー株式会社 | 薄膜トランジスタ及びその製造方法 |
| US7696031B2 (en) * | 2004-06-14 | 2010-04-13 | Semiconductor Energy Laboratory Co., Ltd | Method for manufacturing semiconductor device |
| JP2007005049A (ja) * | 2005-06-22 | 2007-01-11 | Hitachi Ltd | 画像表示装置 |
-
2006
- 2006-11-30 TW TW095144371A patent/TWI319625B/zh not_active IP Right Cessation
-
2007
- 2007-11-09 US US11/938,117 patent/US7612379B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20080128704A1 (en) | 2008-06-05 |
| US7612379B2 (en) | 2009-11-03 |
| TW200824126A (en) | 2008-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |