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TWI318789B - Method for making heat sink assembly - Google Patents

Method for making heat sink assembly

Info

Publication number
TWI318789B
TWI318789B TW93136496A TW93136496A TWI318789B TW I318789 B TWI318789 B TW I318789B TW 93136496 A TW93136496 A TW 93136496A TW 93136496 A TW93136496 A TW 93136496A TW I318789 B TWI318789 B TW I318789B
Authority
TW
Taiwan
Prior art keywords
heat sink
sink assembly
making heat
making
assembly
Prior art date
Application number
TW93136496A
Other languages
Chinese (zh)
Other versions
TW200618223A (en
Inventor
Shih-Chieh Yen
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW93136496A priority Critical patent/TWI318789B/en
Publication of TW200618223A publication Critical patent/TW200618223A/en
Application granted granted Critical
Publication of TWI318789B publication Critical patent/TWI318789B/en

Links

TW93136496A 2004-11-26 2004-11-26 Method for making heat sink assembly TWI318789B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93136496A TWI318789B (en) 2004-11-26 2004-11-26 Method for making heat sink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93136496A TWI318789B (en) 2004-11-26 2004-11-26 Method for making heat sink assembly

Publications (2)

Publication Number Publication Date
TW200618223A TW200618223A (en) 2006-06-01
TWI318789B true TWI318789B (en) 2009-12-21

Family

ID=45073551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93136496A TWI318789B (en) 2004-11-26 2004-11-26 Method for making heat sink assembly

Country Status (1)

Country Link
TW (1) TWI318789B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492003B2 (en) 2010-11-24 2013-07-23 Industrial Technology Research Institute Heat sinking element and method of treating a heat sinking element

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837514B (en) * 2021-09-27 2024-04-01 艾姆勒科技股份有限公司 Heat-dissipating substrate structure with high adhesion strength

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492003B2 (en) 2010-11-24 2013-07-23 Industrial Technology Research Institute Heat sinking element and method of treating a heat sinking element

Also Published As

Publication number Publication date
TW200618223A (en) 2006-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees