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TWI317995B - Anti-warpage structure of semiconductor device - Google Patents

Anti-warpage structure of semiconductor device

Info

Publication number
TWI317995B
TWI317995B TW095143176A TW95143176A TWI317995B TW I317995 B TWI317995 B TW I317995B TW 095143176 A TW095143176 A TW 095143176A TW 95143176 A TW95143176 A TW 95143176A TW I317995 B TWI317995 B TW I317995B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
warpage structure
warpage
semiconductor
Prior art date
Application number
TW095143176A
Other languages
Chinese (zh)
Other versions
TW200824062A (en
Inventor
Wei-Hua Lu
Hsun-Heng Tsai
Original Assignee
Lu Wei Hua
Tsai Hsun Heng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lu Wei Hua, Tsai Hsun Heng filed Critical Lu Wei Hua
Priority to TW095143176A priority Critical patent/TWI317995B/en
Publication of TW200824062A publication Critical patent/TW200824062A/en
Application granted granted Critical
Publication of TWI317995B publication Critical patent/TWI317995B/en

Links

Classifications

    • H10W72/877—
    • H10W90/724—
TW095143176A 2006-11-22 2006-11-22 Anti-warpage structure of semiconductor device TWI317995B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095143176A TWI317995B (en) 2006-11-22 2006-11-22 Anti-warpage structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095143176A TWI317995B (en) 2006-11-22 2006-11-22 Anti-warpage structure of semiconductor device

Publications (2)

Publication Number Publication Date
TW200824062A TW200824062A (en) 2008-06-01
TWI317995B true TWI317995B (en) 2009-12-01

Family

ID=44771390

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143176A TWI317995B (en) 2006-11-22 2006-11-22 Anti-warpage structure of semiconductor device

Country Status (1)

Country Link
TW (1) TWI317995B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9899238B2 (en) 2014-12-18 2018-02-20 Intel Corporation Low cost package warpage solution

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI800876B (en) * 2021-07-23 2023-05-01 新加坡商光寶科技新加坡私人有限公司 Thermal sensor package
CN115701268B (en) * 2021-07-23 2025-12-09 光宝科技新加坡私人有限公司 Thermal sensing package
CN119480808A (en) * 2024-11-27 2025-02-18 维沃移动通信有限公司 Chip assembly, electronic device and method for preparing chip assembly

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9899238B2 (en) 2014-12-18 2018-02-20 Intel Corporation Low cost package warpage solution
TWI620303B (en) * 2014-12-18 2018-04-01 英特爾公司 Low cost package warpage solution
US10741419B2 (en) 2014-12-18 2020-08-11 Intel Corporation Low cost package warpage solution
US11328937B2 (en) 2014-12-18 2022-05-10 Intel Corporation Low cost package warpage solution
US11764080B2 (en) 2014-12-18 2023-09-19 Intel Corporation Low cost package warpage solution
US12183596B2 (en) 2014-12-18 2024-12-31 Intel Corporation Low cost package warpage solution

Also Published As

Publication number Publication date
TW200824062A (en) 2008-06-01

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