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TWI317972B - Method of dicing wafer - Google Patents

Method of dicing wafer

Info

Publication number
TWI317972B
TWI317972B TW93134939A TW93134939A TWI317972B TW I317972 B TWI317972 B TW I317972B TW 93134939 A TW93134939 A TW 93134939A TW 93134939 A TW93134939 A TW 93134939A TW I317972 B TWI317972 B TW I317972B
Authority
TW
Taiwan
Prior art keywords
dicing wafer
dicing
wafer
Prior art date
Application number
TW93134939A
Other languages
Chinese (zh)
Other versions
TW200616062A (en
Inventor
Cheng-Cheng Liu
Yu-Lung Wen
Shi-Yuan Fu
Ji-Ping Teng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93134939A priority Critical patent/TWI317972B/en
Publication of TW200616062A publication Critical patent/TW200616062A/en
Application granted granted Critical
Publication of TWI317972B publication Critical patent/TWI317972B/en

Links

TW93134939A 2004-11-15 2004-11-15 Method of dicing wafer TWI317972B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93134939A TWI317972B (en) 2004-11-15 2004-11-15 Method of dicing wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93134939A TWI317972B (en) 2004-11-15 2004-11-15 Method of dicing wafer

Publications (2)

Publication Number Publication Date
TW200616062A TW200616062A (en) 2006-05-16
TWI317972B true TWI317972B (en) 2009-12-01

Family

ID=45073439

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93134939A TWI317972B (en) 2004-11-15 2004-11-15 Method of dicing wafer

Country Status (1)

Country Link
TW (1) TWI317972B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103345018A (en) * 2013-06-28 2013-10-09 武汉光迅科技股份有限公司 Cutting method of curve-type array waveguide optical grating chip and clamp for cutting same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493611B (en) * 2011-05-11 2015-07-21 隆達電子股份有限公司 Methods of laser cutting
US10070536B2 (en) 2016-07-05 2018-09-04 Unimicron Technology Corp. Manufacturing method of circuit board structure
TWI766271B (en) * 2020-04-30 2022-06-01 矽品精密工業股份有限公司 Electronic package and method for fabricating the same
CN115870641B (en) * 2023-02-20 2023-05-23 湖北三维半导体集成创新中心有限责任公司 Chip, manufacturing method thereof and packaging structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103345018A (en) * 2013-06-28 2013-10-09 武汉光迅科技股份有限公司 Cutting method of curve-type array waveguide optical grating chip and clamp for cutting same

Also Published As

Publication number Publication date
TW200616062A (en) 2006-05-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees