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TWI316379B - Method and apparatus for detecting circuit pattern, and method and apparatus for inspecting circuit pattern - Google Patents

Method and apparatus for detecting circuit pattern, and method and apparatus for inspecting circuit pattern

Info

Publication number
TWI316379B
TWI316379B TW092130167A TW92130167A TWI316379B TW I316379 B TWI316379 B TW I316379B TW 092130167 A TW092130167 A TW 092130167A TW 92130167 A TW92130167 A TW 92130167A TW I316379 B TWI316379 B TW I316379B
Authority
TW
Taiwan
Prior art keywords
circuit pattern
inspecting
detecting circuit
detecting
inspecting circuit
Prior art date
Application number
TW092130167A
Other languages
English (en)
Other versions
TW200415962A (en
Inventor
Mitsuyuki Mitsuhashi
Masao Saito
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of TW200415962A publication Critical patent/TW200415962A/zh
Application granted granted Critical
Publication of TWI316379B publication Critical patent/TWI316379B/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00—Details of colour television systems
    • H04N9/44—Colour synchronisation
    • H04N9/47—Colour synchronisation for sequential signals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW092130167A 2002-10-30 2003-10-30 Method and apparatus for detecting circuit pattern, and method and apparatus for inspecting circuit pattern TWI316379B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002315833 2002-10-30
JP2003162861 2003-06-06

Publications (2)

Publication Number Publication Date
TW200415962A TW200415962A (en) 2004-08-16
TWI316379B true TWI316379B (en) 2009-10-21

Family

ID=32232654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092130167A TWI316379B (en) 2002-10-30 2003-10-30 Method and apparatus for detecting circuit pattern, and method and apparatus for inspecting circuit pattern

Country Status (8)

Country Link
US (1) US7440103B2 (zh)
EP (1) EP1557661A1 (zh)
JP (1) JP4466560B2 (zh)
KR (1) KR20050071640A (zh)
AU (1) AU2003280602A1 (zh)
CA (1) CA2504335A1 (zh)
TW (1) TWI316379B (zh)
WO (1) WO2004040281A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513384B (zh) * 2012-06-26 2015-12-11 Seiko Precision Kk The hole position determining means, the opening position determining method and the program

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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JP2004079587A (ja) * 2002-08-09 2004-03-11 Reitetsukusu:Kk ウエハ回転装置とこれを有する端部傷検査装置
US7186981B2 (en) * 2003-07-29 2007-03-06 Thermal Wave Imaging, Inc. Method and apparatus for thermographic imaging using flash pulse truncation
JP2006078263A (ja) * 2004-09-08 2006-03-23 Toppan Printing Co Ltd 配線パターン検査装置及び配線パターン検査方法
JP2006084446A (ja) * 2004-09-17 2006-03-30 Toppan Printing Co Ltd 配線パターンの検出装置、検出方法、検査装置、及び検査方法
JP5068422B2 (ja) * 2004-10-05 2012-11-07 株式会社日立ハイテクノロジーズ 微細構造観察方法および欠陥検査装置
US7517995B2 (en) 2006-04-06 2009-04-14 Boehringer Ingelheim International Gmbh Thiazolyl-dihydro-cyclopentapyrazole
KR100853861B1 (ko) * 2007-02-12 2008-08-22 한국표준과학연구원 잉크젯 ｐｃｂ 회로패턴의 결함 검사 장치 및 방법
KR101021426B1 (ko) * 2008-07-07 2011-03-15 마이크로 인스펙션 주식회사 회로기판의 검사방법
CN101626518B (zh) * 2008-07-11 2011-06-29 比亚迪股份有限公司 一种摄像装置分辨率的检测方法及系统
MY159053A (en) * 2011-01-28 2016-12-15 Tt Vision Tech Sdn Bhd Multiple scan single pass line scan apparatus for solar cell inspection and methodology thereof
US8687192B2 (en) * 2011-03-29 2014-04-01 Intel Corporation Through silicon imaging and probing
KR20130125631A (ko) * 2012-05-09 2013-11-19 주식회사 탑 엔지니어링 액정 적하 상태 검사 장치, 및 이를 구비한 액정 디스펜서
CN103391685B (zh) * 2012-05-10 2016-08-31 深南电路有限公司 一种pcb板图形成形的方法及其自动光学检测设备
KR101362171B1 (ko) * 2012-06-26 2014-02-13 엘지디스플레이 주식회사 표시 장치의 검사 장치 및 방법
BR112018015948B1 (pt) * 2016-02-04 2023-02-23 Nova Biomedical Corporation Sistema de medição de absorbância ótica e método para utilizar um sistema de medição de absorbância ótica
JP6769766B2 (ja) * 2016-07-19 2020-10-14 株式会社ニューフレアテクノロジー パターン検査装置
KR102086411B1 (ko) * 2018-06-04 2020-03-09 주식회사 코엠에스 반도체 기판용 보호필름 박리 여부 감시 장치 및 방법
JP7704609B2 (ja) * 2021-08-05 2025-07-08 株式会社ディスコ 検査装置
JP7730686B2 (ja) 2021-08-11 2025-08-28 株式会社ディスコ 光照射装置
TWI866724B (zh) * 2023-12-27 2024-12-11 政美應用股份有限公司 檢測互連結構表面的方法及裝置

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JPS585636A (ja) * 1981-06-30 1983-01-13 Fujitsu Ltd 被検査物の検査方法
JPS60256945A (ja) * 1984-06-01 1985-12-18 Matsushita Electric Ind Co Ltd 光デイスク検査装置
JP2512050Y2 (ja) * 1986-02-18 1996-09-25 株式会社 東京精密 非接触検出装置における観察装置
JPS62291550A (ja) * 1986-06-12 1987-12-18 Canon Inc 光デイスク検査装置
JPH01263540A (ja) * 1988-04-15 1989-10-20 Hitachi Ltd パターン検出装置
JP2986025B2 (ja) * 1991-03-18 1999-12-06 富士通株式会社 基板の検査方法
JPH05196568A (ja) * 1992-01-17 1993-08-06 Japan Ii M Kk 鍍金検査装置
JP3091803B2 (ja) * 1993-03-12 2000-09-25 レーザーテック株式会社 カラーフィルタの欠陥検査装置
JPH11237344A (ja) * 1998-02-19 1999-08-31 Hitachi Ltd 欠陥検査方法およびその装置
DE19914994A1 (de) 1998-04-03 1999-10-14 Advantest Corp Verfahren und Vorrichtung zur Oberflächenprüfung
JP3610837B2 (ja) * 1998-09-18 2005-01-19 株式会社日立製作所 試料表面の観察方法及びその装置並びに欠陥検査方法及びその装置
US6690469B1 (en) * 1998-09-18 2004-02-10 Hitachi, Ltd. Method and apparatus for observing and inspecting defects
JP4403215B2 (ja) * 1999-10-07 2010-01-27 レーザーテック株式会社 欠陥検査装置
JP2001281165A (ja) * 2000-03-31 2001-10-10 Kokusai Gijutsu Kaihatsu Co Ltd 基板検査方法および装置
JP2001343336A (ja) * 2000-05-31 2001-12-14 Nidek Co Ltd 欠陥検査方法及び欠陥検査装置
JP3920218B2 (ja) * 2000-11-20 2007-05-30 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 表面検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513384B (zh) * 2012-06-26 2015-12-11 Seiko Precision Kk The hole position determining means, the opening position determining method and the program

Also Published As

Publication number Publication date
CA2504335A1 (en) 2004-05-13
JP4466560B2 (ja) 2010-05-26
US7440103B2 (en) 2008-10-21
US20050190259A1 (en) 2005-09-01
EP1557661A1 (en) 2005-07-27
TW200415962A (en) 2004-08-16
WO2004040281A1 (ja) 2004-05-13
AU2003280602A1 (en) 2004-05-25
JPWO2004040281A1 (ja) 2006-03-02
KR20050071640A (ko) 2005-07-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees