1314434 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種改善電子設備之電磁干擾的屏蔽 結構與其運用方法，且特別是有關於—種改善電子設備㈣ 模組之電磁干擾的屏蔽結構與其運用方法。 【先前技術】 隨著電子科技的曰益進步以及電子產業的應用曰漸普 及’電子產品的設計通常要求㈣短小，且硬體設計與軟硬 體更新週期日益縮短’為了讓電子產品，例如筆記型電腦、 可攜式電視、行動電話、攝錄放影機、個人數位式助理 (P咖nalDigitalAssistant，PDA)、以及數位相機，組立方便 以降低生產成本，同時兼顧後續的軟硬體更新與升級，常採 用各種可抽換的介面，例如Mini_pci介面或dimm介面， 將内建模組’例如繪圖晶卡、調譜卡（TunerCard)、無線網 卡’内建在主機板上。 π參照第1圖，第1圖係根據習知技術所繪製的一種内 建於筆記型電腦1G之中的内建模組1G2的組裝示意圖。其 中内建模組102係藉由介面插槽1〇〇固定且電性連結於筆記 型電腦ίο的主機板u之上。内建模組1〇2，例如緣圖晶卡， 係藉由金屬閂扣構件1〇3a和1〇3b，將内建模組1〇2夾制並 固^介面插槽1GG之中。内建模組1G2裝設有金手指1〇4 的一端則插入介面插槽1〇〇的匯流排1〇〇a中。 然而，内建模組在運作時，常會對外發散電磁波，當一 1314434 個以上的元件或裝置同時散發電磁波時，電磁干擾 (Electromagnetic Interference，EMI)常會使得電子設備在運 作過程中產生雜訊（N〇ise)而影響其運作功能。 爲了解決此問題，習知技術通常在主機板u與内建模組 102之間採用一接地的金屬板材1〇5來提供屏蔽效果，再藉 由尾縴（Pigtail) 101或以直接接觸的方式，讓金屬板材1〇5與 電子攻備的接地迴路電性連結，藉以有效地消除内建模組幅 射的電磁輻射雜訊，達成抑制電磁輻射干擾的效果。 然而，在主機板與内建模組之間額外裝設金屬板材，不 僅增加產品重量，佔據佈線空間，而且提高製造成本，加上 使用尾縴或讓金屬板材與接地迴路直接接觸的電性連結方 式，電性接觸的效果不易掌握，容易在搬運或攜帶時因衝撞 而失效。因此，有需要提供一種不需要額外增加其他屏蔽板 材，且能提供接觸效果良好的接地迴路電，藉以改善電子設 備之内建模組電磁干擾的結構與其運用的方法。 【發明内容】 有鑑於大部分電子設備之内建模組的一側，通常都安裝 有可用以覆蓋内建模組之電子元件的金屬散熱片或殼體。因 此若將金屬散熱片與電子設備的接地電路電性連結，金屬散 熱片正可應絲屏蔽内建模級電子元件所產生的電磁干擾。 本發明的目的就是在提供一種用來屏蔽電子設備之内 建模組之電磁干擾的結構，包括：介面插槽、散熱裝置以及 金屬連接件。介面_安裝於電子設備之上，具有用來輕合 1314434 2設傷與該内建模組的匯流排，以及用來將㈣模組固定 迴i =槽上的卡合元件，其中卡合元件與電子設備的接地 、路電性連結1歸置安裝於内建模組之上。金屬連 的-端固定於内建模组上，用來卡設 端則與散«置接觸。 4之巾另- ^本發明的另一目的就是在提供一種屏蔽電子設備内建 ^之電磁干擾的方法，此—方法包括下述步驟：首先安裝 :介面插槽於電子設備之上，此介面插槽具有用來耦合電子 設備與内建模組的匯流排，以及用來將内建模組固定於介面 插槽上的卡合元件’並且使卡合元件與電子設備的接地迴路 電性連結。接著安裝散熱裝置於内建模組之上，並將一金屬 連接件固定於㈣餘之上，使金屬連接件固定於内建模組 上的-端卡設於卡合元件之巾，另__端則與散熱裝置接觸。 根據以上所述之較佳實施例，本發明之技術特徵係在於 採用一種固定於内建模組上，並且與内建模組上的散熱金屬 板材耦合的金屬連接件，藉由金屬連接件與電子元件的卡合 元件緊密卡合，來促使内建模組的散熱金屬板材與電子設備 的接地迴路電性連結，使原本僅具有散熱功能的散熱板材， 也同時具有抑制路内建模組所產生之電磁輻射干擾的功 能。由於接地金屬連接件的尺寸小，不會佔據電子設備内部 的佈線空間，不僅組立方便，而且具有製造成本便宜，不使 產品重量陡增的優勢。再加上將金屬連接件的與卡合元件的 緊迫卡合，可增加卡合元件與金屬連接件的接觸面積與密合 程度，確保散熱板材與接地迴路之間具有良好的接觸，達成 7 1314434 上述發明之目的。 【實施方式】1314434 IX. Description of the Invention: [Technical Field] The present invention relates to a shielding structure for improving electromagnetic interference of an electronic device and a method for using the same, and in particular to improving electromagnetic interference of an electronic device (4) module Shielding structure and its application method. [Prior Art] With the advancement of electronic technology and the increasing popularity of the electronics industry, 'electronic product design usually requires (four) short, and hardware design and software and hardware update cycle is shortened' in order to make electronic products, such as notes Computers, portable TVs, mobile phones, camcorders, personal digital assistants (PDAs), and digital cameras, easy to set up to reduce production costs, while taking into account subsequent software and hardware updates and upgrades The various modeling interfaces, such as the Mini_pci interface or the dimm interface, are often used, and the internal modeling group such as a drawing card, a TunerCard, and a wireless network card are built in the motherboard. Reference is made to Fig. 1, which is a schematic view showing the assembly of the inner modeling group 1G2 built in the notebook computer 1G according to the conventional technique. The internal modeling group 102 is fixed by the interface slot 1 and electrically connected to the motherboard u of the notebook ίο. The inner modeling group 1〇2, for example, the edge pattern crystal card, is formed by sandwiching the inner modeling group 1〇2 and fixing the interface slot 1GG by the metal latch members 1〇3a and 1〇3b. One end of the inner modeling group 1G2 with the gold finger 1〇4 is inserted into the bus bar 1〇〇a of the interface slot 1〇〇. However, when the internal modeling group is operating, it often emits electromagnetic waves. When more than 1,314,434 components or devices emit electromagnetic waves at the same time, Electromagnetic Interference (EMI) often causes electronic devices to generate noise during operation (N 〇ise) affects its operational function. In order to solve this problem, the conventional technique generally uses a grounded metal plate 1〇5 between the motherboard u and the inner modeling group 102 to provide a shielding effect, and then by a pigtail (101) or in direct contact. The metal plate 1〇5 is electrically connected with the ground loop of the electronic attack, thereby effectively eliminating the electromagnetic radiation noise radiated by the internal modeling group, and achieving the effect of suppressing electromagnetic radiation interference. However, the additional metal plate between the motherboard and the internal modeling group not only increases the weight of the product, occupies the wiring space, but also increases the manufacturing cost, plus the electrical connection using the pigtail or the metal plate directly in contact with the ground loop. In this way, the effect of electrical contact is not easy to grasp, and it is easy to fail due to collision when carrying or carrying. Therefore, there is a need to provide a ground loop circuit that does not require additional shielding materials and provides good contact effects, thereby improving the structure of the electromagnetic interference of the modeling group within the electronic device and the method of its application. SUMMARY OF THE INVENTION In view of the fact that one side of a modeling set within most electronic devices, a metal heat sink or housing that can be used to cover the electronic components of the inner modeling set is typically installed. Therefore, if the metal heat sink is electrically connected to the grounding circuit of the electronic device, the metal heat sink can shield the electromagnetic interference generated by the modeling level electronic components. SUMMARY OF THE INVENTION It is an object of the present invention to provide a structure for shielding electromagnetic interference within a modeling group within an electronic device, including: an interface slot, a heat sink, and a metal connector. The interface _ is mounted on the electronic device, has a bus bar for lightly engaging the 1314434 2 and the inner modeling group, and a snap element for fixing the (4) module back to the i=slot, wherein the engaging component The grounding and electrical connection 1 of the electronic device is placed on the inner modeling group. The end of the metal joint is fixed to the inner modeling group, and the end of the metal is used to contact the strip. 4 - Another object of the present invention is to provide a method for shielding electromagnetic interference built into an electronic device, the method comprising the steps of: first installing: the interface slot is on the electronic device, the interface The slot has a bus bar for coupling the electronic device with the inner modeling group, and a snap element for fixing the inner modeling group to the interface slot and electrically connecting the snap element to the ground loop of the electronic device . Then, the heat dissipating device is installed on the inner modeling group, and a metal connecting member is fixed on the (four) balance, so that the metal connecting member is fixed on the inner modeling group and the end end is stuck on the engaging component, and the other The _ terminal is in contact with the heat sink. According to the preferred embodiment described above, the technical feature of the present invention is to use a metal connector fixed to the inner modeling group and coupled to the heat dissipation metal plate on the inner modeling group, by means of a metal connector The engaging components of the electronic components are tightly engaged to electrically connect the heat-dissipating metal plate of the inner modeling group and the grounding circuit of the electronic device, so that the heat-dissipating plate which originally only has the heat-dissipating function also has the suppression road modeling group. The function of electromagnetic interference generated. Since the size of the grounded metal connector is small, it does not occupy the wiring space inside the electronic device, and is not only convenient to assemble, but also has an advantage of being inexpensive to manufacture and not increasing the weight of the product. In addition, the tight contact of the metal connecting member with the engaging component can increase the contact area and the tightness of the engaging component and the metal connecting component, and ensure good contact between the heat radiating plate and the grounding circuit, reaching 7 1314434 The purpose of the above invention. [Embodiment]
本發明提供一種製造成本便宜，不會使產品重量陡增， 且能夠與接地迴路產生良好的接觸效果的電磁干擾屏蔽結 構’用以屏蔽電子設備，例如筆記型電腦、可攜式電視、行 動電話、攝錄放影機、個人數位式助理（personal Digital Assistant，PD A)、以及數位相機，之内建模組所產生的電磁 干擾。 有鑑於大部分電子設備的内建模組，例如Mini_pci介面 或DIMM介面、繪圖晶卡、調諧卡（Tuner Card)、無線網卡， 的一側都安直裝有一金屬散熱片或殼體，用以覆蓋内建模組 的電子元件。一般而言，散熱片係由金屬材質所組成，因此 若將金屬散熱片與電子設備的接地迴路耦合形成一種射頻 雜訊接地接觸介面（RF Noise Gr〇unding c〇ntaet t嫩㈣， ::消除或降低内建模组所產生的電磁干擾，具有屏蔽電磁 發射源所發射的電磁干擾的功能。 以下讓本㈣的目的、特徵、優點與能更明顯易懂， 槿έ之雷種女裝於筆記型電觸中，用來屏蔽Mini_pci 模、及之電磁干擾的電磁屏 明。 ㈣屏蔽、‘構作為較佳實施例來進行說 Μ參照第2A圖和第窈圖，第2A圖係 佳實施例所縿示的—_ 、、發月一較 .. $ 丁们種内建於筆記型電腦2〇The invention provides an electromagnetic interference shielding structure which is cheap to manufacture, does not increase the weight of the product, and can have a good contact effect with the ground loop, and is used for shielding electronic devices, such as a notebook computer, a portable television, and a mobile phone. Electromagnetic interference generated by the modeling team within the video recorder, personal digital assistant (PD A), and digital camera. In view of the internal modeling group of most electronic devices, such as Mini_pci interface or DIMM interface, graphics card, Tuner Card, wireless network card, one side is equipped with a metal heat sink or housing to cover The electronic components of the internal modeling group. Generally speaking, the heat sink is made of metal material, so if the metal heat sink is coupled with the ground loop of the electronic device to form a radio frequency noise ground contact interface (RF Noise Gr〇unding c〇ntaet t tender (4), :: eliminate Or reduce the electromagnetic interference generated by the internal modeling group, and have the function of shielding the electromagnetic interference emitted by the electromagnetic emission source. The purpose, characteristics, advantages and the advantages of the (4) are more obvious and easy to understand. In the notebook type electric touch, the electromagnetic screen for shielding the Mini_pci mode and the electromagnetic interference is explained. (4) Shielding, 'construction as a preferred embodiment. Referring to FIG. 2A and FIG. 2A, FIG. 2A is a good implementation. The example shows the -_,, and the moon is one.. $ Dings are built into the notebook 2〇
Mini-PCI模組201之雷磁用來屏蔽 之電磁干擾之屏蔽結構22的組裝示意 8 1314434 圖。第2B圖係繪示2A圖之Mini-PCI模組201的結構放大 圖。屏蔽結構22包括：介面插槽200、散熱裝置202以及金 屬連接件204。介面插槽200安裝於電子設備（筆記型電腦20) 之上，其中Mini-PCI模組201係藉由Mini-PCI介面插槽200 固定且電性連結於筆記型電腦20的主機板21之上》Mini-PCI 介面插槽200所提供的匯流排207 —端與筆記型電腦20的 主機板21耦合，另一端則與安裝在Mini-PCI模組201基板 205上的複數個金手指203相匹配。金手指203的一端與匯 流排207電性連結，另外一端則耦合於Mini-PCI模組201 上的至少一個電子元件215，例如晶片、晶片組、電晶體、 主動元件、被動元件或上述組合所組成之電子元件上。在本 發明的實施例之中，匯流排207可以包含包含，例如IDE、 ATAPI、SCSI、PCI、PCMCIA、ISA 或 USB 等介面。The assembly of the shielding structure 22 of the electromagnetic interference of the Mini-PCI module 201 for shielding electromagnetic interference is shown in Fig. 13 13434. Fig. 2B is an enlarged view showing the structure of the Mini-PCI module 201 of Fig. 2A. The shield structure 22 includes an interface slot 200, a heat sink 202, and a metal connector 204. The interface slot 200 is mounted on the electronic device (notebook 20). The Mini-PCI module 201 is fixed and electrically connected to the motherboard 21 of the notebook computer 20 via the Mini-PCI interface slot 200. The bus bar 207 provided by the Mini-PCI interface slot 200 is coupled to the motherboard 21 of the notebook computer 20, and the other end is matched with a plurality of gold fingers 203 mounted on the substrate 205 of the Mini-PCI module 201. . One end of the gold finger 203 is electrically connected to the bus bar 207, and the other end is coupled to at least one electronic component 215 on the Mini-PCI module 201, such as a chip, a chipset, a transistor, an active component, a passive component, or a combination thereof. On the electronic components that make up. In an embodiment of the invention, bus 207 may include interfaces including, for example, IDE, ATAPI, SCSI, PCI, PCMCIA, ISA, or USB.
Mini-PCI介面插槽200還包括卡合元件209，用來將 Mini-PCI模組201固定於Mini-PCI介面插槽200上。在本發 明的較佳實施例之中，卡合元件209係一組金屬閂扣構件 209a和209b，用來卡掣Mini-PCI模組201基板205的卡合 部205a和205b。在本實施例中，卡合部205a和205b係相 互對稱地位於基板205邊緣，各具有一個卡合開口 211a和 211b，與金屬閂扣構件209a和209b相匹配。另外卡合元件 209a和209b與筆記形電腦20本身的内構件（main frame)金 屬外框217電性連結，並透過内構件金屬外框217使卡合元 件209a和209b與筆記型電腦20的接地迴路耦合。 安裝於Mini-PCI模組201之上的散熱裝置202，係一金 1314434 屬殼體或-金屬板材，藉由至少—支撐件213與基板2 接，使散熱裝置2〇2的金屬殼體或金屬板材與基板之門 相距有-段距離。其中散熱裝置搬的金屬殼體或金屬姉 覆蓋於電子元件215之上，並且與這些震設於基板2〇5上的 電子元件215相距有一段距離。 、 坌屬運接件204係 W 兴一個密The Mini-PCI interface slot 200 also includes a snap element 209 for securing the Mini-PCI module 201 to the Mini-PCI interface slot 200. In the preferred embodiment of the invention, the snap element 209 is a set of metal latch members 209a and 209b for latching the snap portions 205a and 205b of the Mini-PCI module 201 substrate 205. In the present embodiment, the engaging portions 205a and 205b are symmetrically located on the edge of the substrate 205, each having a snap opening 211a and 211b for mating with the metal latch members 209a and 209b. The engaging members 209a and 209b are electrically connected to the main frame metal frame 217 of the notebook computer 20 itself, and the grounding members 209a and 209b are grounded to the notebook computer 20 through the inner member metal frame 217. Loop coupling. The heat sink 202 mounted on the Mini-PCI module 201 is a metal or a metal plate of a metal 1314434, and is connected to the substrate 2 by at least the support member 213 to make the metal case of the heat sink 2〇2 or The metal sheet is separated from the door of the substrate by a distance of -. The metal casing or metal crucible carried by the heat dissipating device covers the electronic component 215 and is spaced apart from the electronic component 215 disposed on the substrate 2〇5.坌 运 运 204 204 204
合^^(^的尺形彈片懷參照帛^圖广㈣彈片的密合端 204a套接於基板2〇5的卡合部⑽上，利用其具有彈性張 力的特性夾附並固定於基板2〇5邊緣的卡合開口 2ua與金^ 指203插入端之間。開口端2轉的—側則跨接於散熱裝置 2〇2的金屬板材上，與金屬板材形成電性接觸。 其中R形彈片套接於基板2〇5的部份係實值與基板2〇5 邊緣共形。由於共形於卡合開σ心與金手指加插入端之 間的R形彈片係具有_㈣厚度，因此當金屬閃扣構件職 與卡口開口 211a相互卡合時，金屬連接件2G4能夠以緊迫的 方式卡設於卡合元# 209之中，藉以增加卡合元件勘與金 屬連接件204的接觸面積與密合程度，以確保由散埶裝置 2〇2、金屬連接件綱、卡合元件挪内構件金屬外框217以 及接地迴路之間㈣成的射頻雜訊接地接觸介面具有良好 的電性接觸。 第3圖係依照本發明另一較佳實施例所繪示的一種内建 於筆記型電腦30中的内建模組3⑼結構示意圖。第3圖所 ㈣的内建模組_結構大致與第2B圖輯示的内建模組 200相似最大的差別在於金屬連接件的結構有所不同。 1314434 在本發明的其他實施例之中，金屬連接件3〇4可以是一 塊金屬片304a，一端附著並共形於基材3〇5的卡合部 另一端則藉由一金屬線材304b與散熱裝置3〇2電性接觸。 其中金屬片304a係黏附並固定於基板3〇5it緣的卡合開口 311a與金手指303插入端之間。與卡合部3〇5&共形的金屬 片304a同樣具有一定的厚度，因此也能夠以緊迫的方式卡設 於卡合元件309之中，具有增加卡合元件_與金屬連射 3〇4的接觸面積與密合程度的功效。 另外上藉由述實施例的精神，可提供一種屏蔽電子設備 内建模組電針擾的方法。請參照第4圖，第4圖係根據本 發明的較佳實施例所繪示的一種屏蔽電子設備内建模組電 磁干擾之方法的流程圖。此一方法包括係數步驟： 首先晴參照步驟S1 :安裝一介面插槽於電子設備之上， 其中此介面插槽具有用來耦合電子設備與内建模組的匯流 排’以及用來將内建模組固定於介面插槽上的卡合元件，並 且使卡合元件與電子設備的接地迴路電性連結。接著請參照 步驟S2:安裝散熱裝置於内建模組之上，並將一金屬連接件 的一端固定於内建模組之上，使其卡設於卡合元件之中，使 金屬連接件的另一端與散熱裝置接觸。 由上述本發明較佳實施例可知，本發明之技術優勢係在 於利用多數内建模組内建有散熱金屬板材或金屬殼體的特 性，使用一種簡單輕巧的金屬連接件，將内建模組的散熱金 屬殼體或板材與電子設備本身的接地迴路電性連結，形成具 有良好電性接觸的射頻雜訊接地介面，讓原本僅具有散熱功 11 1314434 能的散熱板材，也同時具抑制路内建模組所產生之電磁輻射 干擾的功能。由於金屬連接件尺寸輕巧，不僅組立方便，不 佔佈線空間’且具有製造成本便宜，不使產品重量陡增的優 勢，再加上將金屬連接件係藉由緊迫的方式卡設於卡合元件 之中，可增加卡合元件與金屬連接件的接觸面積與密合程 度，確保散熱板材與接地迴路之間具有良好的接觸，可防止 接地迴路在搬運或受外力撞擊時，不致因為接觸不良而失 效。 雖然本發明已以較佳實施例揭露如上，然其並非用以限 定本發明，任何相關技術領域具有通常知識者，在不脫離本 發明之精神和範圍内，當可作各種之更動與潤飾，因此本發 明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例能 更明顯易懂，所附圖式之詳細說明如下： 第1圖係根據習知技術所繪製的一種内建於筆記型電腦 之中的Mini-PCI模組的組裝示意圖。 第2A圖係依照本發明一較佳實施例所繪示的一種内建 於筆記型電腦中用來屏蔽Mini_PCI模組之電磁屏蔽結構的 矣且裝示意圖。 第2B圖係繪示2A圖之Mini_pci模組2〇1的結構放大 圖。 第2C圖係2A圖之所繪示之金屬連接件所繪示的結構放 12 1314434 大圖。 第3圖係依照本發明另一較佳實施例所繪示的一種内建 於筆記型電腦30中的内建模組3〇〇結構示意圖。 第4圖係根據本發明的較佳實施例所繪示的一種屏蔽電 子設備内建模組電磁干擾之方法的流程圖。 為了清楚繪示起見，圖示中的元件並未按照比例尺加以 繪示。在不同圖示之中，元件參照號碼可能會有重複，用以 標示相對應或相似的元件。 【主要元件符號說明】 10 :筆記型電腦 11 .主機板 100 :介面插槽 100a :匯流排 101 :尾縴 102 :内建模組 103a :閂扣構件 103b :閂扣構件 104 :金手指 105 :金屬板材 20 :筆記型電腦 21 :主機板 22 :電磁屏蔽結構 201 : Mini-Ρςΐ 模組 200 :介面插槽 202 :散熱裝置 203 :金手指 204 :金屬連接件 204a :密合端 204b :開口端 205 :基板 205a :卡合部 13 1314434 205b :卡合部 209 :卡合元件 209b :閂扣構件 211b :卡合開口 207 :匯流排 209a :閂扣構件 211 a :卡合開口 213 :支撐件 215 :電子元件 300 :内建模組 217 :内構件金屬外框 3〇2 :散熱裝置 303 :金手指 3〇4a :金屬片 3 0 5 ·基板 3 11 a :卡合開口The close-fitting end 204a of the shrapnel of the ^^(^) is attached to the engaging portion (10) of the substrate 2〇5, and is attached and fixed to the substrate 2 by the characteristic of elastic tension. Between the engaging opening 2ua of the edge of the 〇5 and the insertion end of the gold finger 203. The side of the opening end 2 is connected to the metal plate of the heat sink 2〇2, and is in electrical contact with the metal plate. The portion of the shrapnel sleeved on the substrate 2〇5 is conformal to the edge of the substrate 2〇5. Since the R-shaped shrapnel conformal between the snap-open σ core and the gold finger plus the insertion end has a thickness of _(four), Therefore, when the metal flash button member and the bayonet opening 211a are engaged with each other, the metal connector 2G4 can be snapped into the snap element # 209 in an urgent manner, thereby increasing the contact of the engaging component with the metal connector 204. The area and the degree of adhesion to ensure good electrical conductivity of the RF noise ground contact interface formed by the dilation device 2〇2, the metal connector, the metal component 217 of the engaging component, and the grounding circuit (4) Contact FIG. 3 is a diagram of another preferred embodiment of the present invention. A schematic diagram of the internal modeling group 3 (9) built into the notebook computer 30. The internal modeling group _ structure of the fourth figure (4) is substantially similar to the inner modeling group 200 of the 2B drawing. The biggest difference is the metal connector. 1314434 In another embodiment of the present invention, the metal connecting member 3〇4 may be a metal piece 304a, one end of which is attached and conformed to the engaging portion of the substrate 3〇5, and the other end is provided by a The metal wire 304b is in electrical contact with the heat sink 3〇2, wherein the metal piece 304a is adhered and fixed between the engaging opening 311a of the substrate 3〇5it edge and the insertion end of the gold finger 303. Together with the engaging part 3〇5& The shape of the metal piece 304a also has a certain thickness, so that it can be snapped into the engaging element 309 in an urgent manner, and has the effect of increasing the contact area and the degree of adhesion of the engaging element_to the metal connection 3〇4. In addition, by means of the spirit of the embodiments, a method for shielding a modeled group of electrical interference in an electronic device can be provided. Referring to FIG. 4, FIG. 4 is a shielding diagram according to a preferred embodiment of the present invention. Modeling group electromagnetic dry in electronic equipment Flowchart of the method. The method includes a coefficient step: first, referring to step S1: installing an interface slot on the electronic device, wherein the interface slot has a bus bar for coupling the electronic device with the inner modeling group. And the engaging component for fixing the inner modeling group to the interface slot, and electrically connecting the engaging component to the grounding circuit of the electronic device. Then refer to step S2: installing the heat sink on the inner modeling group And fixing one end of a metal connector to the inner modeling group so as to be engaged in the engaging component, so that the other end of the metal connector is in contact with the heat sink. The preferred embodiment of the present invention is known. The technical advantage of the present invention lies in utilizing the characteristics of a heat-dissipating metal plate or a metal casing built in a majority of the inner modeling group, and using a simple and lightweight metal connecting member to heat the metal casing or plate of the inner modeling group with the electronic component. The grounding circuit of the device itself is electrically connected to form a radio frequency noise grounding interface with good electrical contact, so that the heat dissipating plate which originally only has the heat dissipating function 11 1314434 can also Suppression of electromagnetic interference radiation generated by the built-in module of the road. Due to the compact size of the metal connector, it is not only convenient to assemble, does not occupy the wiring space, and has the advantage of being inexpensive to manufacture, does not increase the weight of the product, and the metal connector is clamped to the engaging component by pressing means. Among them, the contact area and the adhesion degree of the engaging component and the metal connecting component can be increased, and the good contact between the heat radiating plate and the grounding circuit can be ensured, and the grounding circuit can be prevented from being damaged due to contact when being handled or impacted by an external force. Invalid. While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and it is to be understood by those of ordinary skill in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A schematic diagram of the assembly of a Mini-PCI module built into a notebook computer. FIG. 2A is a schematic diagram of an electromagnetic shielding structure built in a notebook computer for shielding a Mini_PCI module according to a preferred embodiment of the present invention. Fig. 2B is an enlarged view showing the structure of the Mini_pci module 2〇1 of Fig. 2A. Figure 2C is a diagram showing the structure of the metal connector shown in Figure 2A. FIG. 3 is a schematic diagram showing the structure of an internal modeling group built into the notebook computer 30 according to another preferred embodiment of the present invention. Figure 4 is a flow chart showing a method of modeling electromagnetic interference in a shielded electronic device in accordance with a preferred embodiment of the present invention. For the sake of clarity, the elements in the figures are not shown in scale. In the different illustrations, the component reference numbers may be repeated to indicate corresponding or similar components. [Main component symbol description] 10: Notebook computer 11. Motherboard 100: Interface slot 100a: Bus bar 101: Pigtail 102: Inner modeling group 103a: Latch member 103b: Latch member 104: Gold finger 105: Sheet metal 20: notebook computer 21: motherboard 22: electromagnetic shielding structure 201: Mini-Ρςΐ module 200: interface slot 202: heat sink 203: gold finger 204: metal connector 204a: close end 204b: open end 205: substrate 205a: engaging portion 13 1314434 205b: engaging portion 209: engaging member 209b: latching member 211b: engaging opening 207: bus bar 209a: latching member 211a: engaging opening 213: supporting member 215 : electronic component 300 : inner modeling group 217 : inner member metal outer frame 3 〇 2 : heat sink 303 : gold finger 3 〇 4a : metal piece 3 0 5 · substrate 3 11 a : snap opening
3〇4 :金屬連接件 3〇4b ··金屬線材 305a :卡合部 313 :支撐件 S1 :安裝一介面插槽於電子設備之上，其中此介面插槽具有 用來耦合電子設備與内建模組的匯流排，以及用來將内建模 組固定於介面插槽上的卡合元件，並且使卡合元件與電子設 備的接地迴路電性連結。 I安裝散熱裝置於㈣模組之上，並將—金屬連接件的一 端固定於内建模組之上，使其卡設計合元件之中，使金屬 連接件的另—端與散熱裝置接觸。 143〇4: metal connector 3〇4b··metal wire 305a: engaging portion 313: support member S1: an interface slot is mounted on the electronic device, wherein the interface slot has a function for coupling electronic devices and built-in A bus bar of the module, and a snap component for fixing the inner modeling group to the interface slot, and electrically connecting the snap component to the ground loop of the electronic device. I Install the heat sink on the (4) module and fix one end of the metal connector on the inner modeling group so that the card is designed to be in the component, so that the other end of the metal connector is in contact with the heat sink. 14