1309998 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種晶片封裝方法及其結構，特別是一種喷 墨頭晶片封裝方法及其結構。 【先前技術】 喷墨頭為喷墨印表機之關鍵零組件。由於列印品質與解析 度的要求不斷提高，對於喷墨頭晶片封裝元件的可靠度、喷孔 密度與小尺寸的需求日益增加。因此，對於喷墨頭晶片封裝及 • 接合技術的要求越來越嚴苛。 第1圖所示為根據美國專利公告號第5420627號喷墨頭之 結構剖面示意圖，其揭示HP公司邊緣進料（edge feed )設計 之噴墨卡匣，係泛用於寬尺寸印表機（wide format printer )、 商用與桌上型印表機。此噴墨頭100之優點在於墨流對於加熱 晶片128的冷卻效果良好，墨流沿著兩長邊緣供應數列墨滴產 生腔。加熱晶片128黏固於一軟板構件118上對準拱形雷射割 除之喷孔。此具彈性之軟板構件118亦載有捲帶自動接合用之 金手指與加熱晶片128短邊緣上焊墊電性連接。然而，軟板構 ^ 件118上之喷孔需使用準分子雷射掘孔，準分子雷射設備昂貴 且須精確控制雷射光束對準晶片。 【發明内容】 鑑於上述問題，本發明目的之一係提供一種喷墨頭晶片封 裝方法及其結構，可有效降低封裝所需之精準度與減少墨流孔 之製作。 5 1309998 、 本發明目的之一係提供一種喷墨頭晶片封裝方法及其結 構，可增加墨水儲存空間且降低製作成本。 本發明目的之一係提供一種喷墨頭晶片封裝方法及其結 構，無須使用昂貴準分子雷射設備，有效降低成本。 為了達到上述目的，本發明一實施例之一種喷墨頭晶片封 裝方法，包括下列步驟：利用一微加工製程形成一列印元件之 噴嘴結構，係包括提供一墨腔層；以及形成一墨孔層於墨腔層 上，其中複數個喷墨通孔係貫穿墨孔層，且喷墨通孔係與墨腔 層之一墨腔相互貫通；以及利用一捲帶自動接合製程，係包括 | 將一軟板設置於墨孔層上，其中軟板具有至少一開口用以暴露 出喷墨通孔；以及設置一晶片於墨腔層下。 本發明又一實施例之一種喷墨頭晶片封裝結構，包括：一 列印元件之喷嘴結構，係包括一墨腔層以及一墨孔層設置於墨 腔層上，其中複數個噴墨通孔係貫穿墨孔層，且噴墨通孔係與 墨腔層之一墨腔相互貫通；一軟板設置於墨孔層上，其中軟板 具有至少一開口用以暴露出喷墨通孔；以及一晶片，係設置於 墨腔層下。 • 【實施方式】 第2A圖、第2B圖、第2C圖、第2D圖與第2E圖所示 為根據本發明喷墨頭晶片封裝方法一實施例之流程剖面示意 圖，首先，請先參閱第2D圖，為本發明喷墨頭晶片封裝結構， 如圖所示，噴墨頭晶片之封裝結構係包括一列印元件之喷嘴結 構。此喷嘴結構包括一墨腔層1 〇 (ink chamber layer )、一墨孔 基層 20 ( nozzle base layer )與一墨孔層 30 ( nozzle layer )。其 中，墨孔基層20可視需要與否設置。複數個噴墨通孔（nozzle through hole) 32貫穿墨孔基層20與墨孔層30並與墨腔層10 1309998 ' 之一墨腔12相互貫通。一軟板40設置於墨孔層30上，軟板 40上具有至少一開口 42，此開口 42對準喷墨通孔32並暴露 出所有喷墨通孔32。一晶片50設置於墨腔層10下。 接續上述說明，詳細說明本發明利用微加工製程與捲帶自 動結合製程完成喷墨頭晶片封裝方法，請參閱第2A圖至第2E 圖。首先，如第2A圖所示，以化學沉積或物理沉積形成一墨 腔層10，經由微影製程於墨腔層10形成一墨腔12。接著，如 第2B圖所示，利用沉積方式形成一墨孔基層20於墨腔層10 上與形成一墨孔層30於墨孔基層20上。之後，參照第2C圖， | 使用乾式蝕刻法對墨孔層30與墨孔基層20進行蝕刻，以形成 複數喷墨通孔32貫通墨腔層10之墨腔12後完成列印元件之 喷嘴結構。 繼續參照第2D圖，利用一捲帶自動接合（tape automatic bonding，TAB )製程將一軟板40設置於墨孔層30上，軟板 40之開口 42對準喷墨通孔32並暴露出所有噴墨通孔32。接 著，將一晶片50設置於墨腔層10下方。其中，晶片50與軟 板40間係電性連接。另，一黏著層（圖上未示）設置於墨孔 層30上用以黏著軟板40，此黏著層係以點膠方式形成於墨孔 φ 層40上。最後，經過一加熱程序固化黏著層以完成接合。 請參照第2E圖之本發明喷墨頭晶片封裝結構，於形成墨 腔層10之墨腔12時，更同時形成一墨水通道14。此墨水通 道14係用以貫通墨腔12與列印元件之墨水供給區16，係為 一邊緣進料之喷墨頭結構。另，於喷墨通孔32下方靠近墨腔 12處，可利用濕蝕刻方式將其喷墨通孔32邊緣圓角化（圖上 未標）使墨水進料更為順暢。 第3A圖與第3B圖所示為根據本發明喷墨頭晶片封裝結 構一實施例之正視圖與剖面示意圖如第3A圖所示，首先，軟 1309998 ·、 板40上的開口 42並不限定數量與形狀，僅需配合軟板40對 : 位接合暴露出喷墨通孔32即可。另，噴墨通孔32之形狀、數 量與排列並無限制，取決於不同印表機之不同列印效果設計。 接續上述說明，如第3B圖所示，於本發明噴墨晶片封裝 結構中，喷墨通孔32係利用微加工製程，如半導體製程，所 形成，喷墨通孔32上層軟板40之封裝對準精密度可降至30 至100微米，無須如習知使用準分子雷射時孔與軟板之精密度 需小於0.5微米。與習知技術比較，軟板40與晶片50間增加 使用墨孔基層20與墨孔層30，因此於軟板40、墨水儲槽60 _ 以及墨孔基層20與墨孔層30間會增加一墨水容置空間約50 微米，此增加之空間可有效緩衝邊緣進料墨水之壓力，使喷墨 頭墨水出料更均勻。 本發明之特徵係利用微加工方式來製作列印元件之喷嘴 結構，不僅可降低材料成本且同時具有容易製作之優點者，進 而達到價格便宜之功效。另外，藉由捲帶自動接合製程使用軟 板進行封裝有效克服習知需高精密度封裝且昂貴之缺失。綜合 上述，本發明可有效降低封裝所需之精準度與減少墨流孔之製 作，其結構可增加墨水儲存空間且無須使用昂貴準分子雷射設 φ 備有效降低製作成本。 以上所述之實施例僅係為說明本發明之技術思想及特 點，其目的在使熟習此項技藝之人士能夠瞭解本發明之内容並 據以實施，當不能以之限定本發明之專利範圍，即大凡依本發 明所揭示之精神所作之均等變化或修飾，仍應涵蓋在本發明之 專利範圍内。 8 1309998 【圖式簡單說明】 第1圖所示為美國專利公告號第5420627號喷墨頭之結構剖面 示意圖。 第2A圖、第2B圖 '第2C圖、第2D圖與第2E圖所示為根 據本發明喷墨頭晶片封裝方法一實施例之流程剖面示意圖。 第3A圖與第3B圖所示為根據本發明噴墨頭晶片封裝結構一 實施例之正視圖與剖面示意圖。 【主要元件符號說明】 100 喷墨頭 118 軟板構件 128 加熱晶片 10 墨腔層 12 墨腔 14 墨水通道 16 墨水供給區 20 墨孔基層 30 墨孔層 32 喷墨通孔 40 軟板 42 開口 50 晶片 60 墨水儲槽1309998 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer packaging method and structure thereof, and more particularly to an inkjet chip package method and structure thereof. [Prior Art] The ink jet head is a key component of the ink jet printer. As the requirements for print quality and resolution continue to increase, there is an increasing demand for reliability, orifice density, and small size of ink-jet chip package components. Therefore, the requirements for inkjet chip package and bonding technology are becoming more and more demanding. Figure 1 is a cross-sectional view showing the structure of an ink jet head according to U.S. Patent Publication No. 5,420,627, which discloses an ink jet cassette designed by HP's edge feed, which is widely used for wide-format printers ( Wide format printer ), commercial and desktop printers. An advantage of this ink jet head 100 is that the ink flow has a good cooling effect on the heated wafer 128, and the ink flow supplies a plurality of ink droplet generating chambers along the two long edges. The heated wafer 128 is adhered to a soft plate member 118 aligned with the arcuate laser cut nozzle. The resilient flexible panel member 118 also carries a gold finger for automatic tape joining and is electrically connected to the pad on the short edge of the heater wafer 128. However, the orifices on the flexible plate member 118 require the use of excimer laser boring holes, which are expensive and require precise control of the laser beam alignment. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an ink jet head wafer packaging method and structure thereof, which can effectively reduce the precision required for packaging and reduce the fabrication of ink flow holes. 5 1309998, an object of the present invention is to provide an ink jet head chip packaging method and structure thereof, which can increase ink storage space and reduce manufacturing cost. SUMMARY OF THE INVENTION One object of the present invention is to provide an ink jet head wafer packaging method and structure thereof, which eliminates the need for expensive excimer laser equipment and is effective in reducing costs. In order to achieve the above object, an ink jet head wafer packaging method according to an embodiment of the present invention includes the following steps: forming a nozzle structure of a printing element by a micromachining process, comprising providing an ink cavity layer; and forming an ink hole layer On the ink chamber layer, wherein a plurality of inkjet through holes are penetrated through the ink hole layer, and the ink jet through holes are interpenetrated with one of the ink chamber layers; and an automatic bonding process using a tape is included; The flexible board is disposed on the ink hole layer, wherein the soft board has at least one opening for exposing the ink jet through hole; and a wafer is disposed under the ink cavity layer. According to still another embodiment of the present invention, a nozzle chip package structure includes: a nozzle structure of a printing element, comprising an ink chamber layer and an ink hole layer disposed on the ink cavity layer, wherein the plurality of inkjet through holes are Through the ink hole layer, and the ink jet through hole and the ink chamber of the ink chamber layer penetrate each other; a soft plate is disposed on the ink hole layer, wherein the soft plate has at least one opening for exposing the ink jet through hole; The wafer is disposed under the ink cavity layer. [Embodiment] Figs. 2A, 2B, 2C, 2D, and 2E are schematic cross-sectional views showing an embodiment of an ink jet head chip packaging method according to the present invention. First, please refer to the first 2D is the ink-jet head wafer package structure of the present invention. As shown in the figure, the package structure of the ink-jet head wafer includes a nozzle structure of a printing element. The nozzle structure includes an ink chamber layer, a nozzle base layer 20 and a nozzle layer 30 (nozzle layer). Among them, the ink base layer 20 can be set as needed. A plurality of nozzle through holes 32 extend through the ink base layer 20 and the ink hole layer 30 and penetrate the ink chamber 12 of one of the ink chamber layers 10 1309998'. A flexible board 40 is disposed on the ink aperture layer 30. The flexible board 40 has at least one opening 42 which is aligned with the ink ejection aperture 32 and exposes all of the ink ejection apertures 32. A wafer 50 is disposed under the ink chamber layer 10. Following the above description, the present invention will be described in detail with respect to the method of encapsulating the ink-jet head wafer by the micro-machining process and the tape-and-tape automatic bonding process. Please refer to Figs. 2A to 2E. First, as shown in Fig. 2A, an ink layer 10 is formed by chemical deposition or physical deposition, and an ink chamber 12 is formed in the ink chamber layer 10 via a lithography process. Next, as shown in Fig. 2B, an ink base layer 20 is formed on the ink chamber layer 10 by deposition and an ink hole layer 30 is formed on the ink hole base layer 20. Thereafter, referring to FIG. 2C, the ink hole layer 30 and the ink hole base layer 20 are etched by a dry etching method to form a nozzle structure of the printing element after the plurality of ink ejection through holes 32 pass through the ink chamber 12 of the ink chamber layer 10. . Continuing to refer to FIG. 2D, a soft board 40 is disposed on the ink hole layer 30 by a tape automatic bonding (TAB) process, and the opening 42 of the soft board 40 is aligned with the ink ejection via 32 and exposes all Inkjet through hole 32. Next, a wafer 50 is placed under the ink chamber layer 10. The wafer 50 and the flexible board 40 are electrically connected. Further, an adhesive layer (not shown) is disposed on the ink hole layer 30 for adhering the soft board 40, and the adhesive layer is formed on the ink hole φ layer 40 by dispensing. Finally, the adhesive layer is cured by a heating process to complete the bonding. Referring to the ink-jet head wafer package structure of the present invention in Fig. 2E, an ink channel 14 is formed at the same time when the ink chamber 12 of the ink chamber layer 10 is formed. The ink channel 14 is used to pass through the ink chamber 12 and the ink supply region 16 of the printing element, and is an edge-feeding ink jet head structure. In addition, near the ink ejection opening 32, near the ink chamber 12, the edge of the ink ejection through hole 32 can be rounded (not marked) by wet etching to make the ink feeding smoother. 3A and 3B are a front view and a cross-sectional view showing an embodiment of an ink jet head chip package structure according to the present invention. As shown in FIG. 3A, first, the soft 1309998, the opening 42 on the board 40 is not limited. The number and shape need only match the pair of soft plates 40: The positional engagement exposes the ink ejection through holes 32. In addition, the shape, number and arrangement of the ink jet through holes 32 are not limited, depending on the different printing effects of different printers. Following the above description, as shown in FIG. 3B, in the ink-jet chip package structure of the present invention, the ink-jet via 32 is formed by a micro-machining process, such as a semiconductor process, and the package of the upper-layer soft board 40 of the ink-jet via 32 is formed. The precision of the alignment can be reduced to 30 to 100 microns, and the precision of the holes and the soft plates need not be less than 0.5 micrometers as is conventional. Compared with the prior art, the use of the ink hole base layer 20 and the ink hole layer 30 between the soft board 40 and the wafer 50 is increased, so that a gap is added between the soft board 40, the ink reservoir 60_, and the ink base layer 20 and the ink hole layer 30. The ink accommodation space is about 50 microns, which increases the pressure of the edge feed ink and makes the ink discharge of the ink jet head more uniform. The feature of the present invention is that the nozzle structure of the printing element is produced by the micromachining method, which not only reduces the material cost but also has the advantages of being easy to manufacture, thereby achieving the effect of being inexpensive. In addition, the use of a flexible tape for encapsulation by the tape automated bonding process effectively overcomes the need for high precision packaging and is expensive. In summary, the present invention can effectively reduce the precision required for packaging and reduce the fabrication of ink flow holes, and the structure can increase the ink storage space without using expensive excimer laser devices to effectively reduce the manufacturing cost. The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention. 8 1309998 [Simple description of the drawings] Fig. 1 is a schematic cross-sectional view showing the structure of an ink jet head of U.S. Patent Publication No. 5,420,627. 2A and 2B. Fig. 2C, 2D and 2E are schematic cross-sectional views showing the flow of an embodiment of the ink jet head wafer packaging method according to the present invention. 3A and 3B are front and cross-sectional views showing an embodiment of an ink jet head chip package structure according to the present invention. [Main component symbol description] 100 inkjet head 118 flexible plate member 128 heating wafer 10 ink chamber layer 12 ink chamber 14 ink channel 16 ink supply region 20 ink hole base layer 30 ink hole layer 32 ink jet through hole 40 soft plate 42 opening 50 Wafer 60 ink reservoir