1308879 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種用於成型散熱構件之壓鑄模具，還 涉及一種用該壓鑄模具製造散熱構件之方法。 【先前技術】 隨者電子技術之不斷發展’筆記型電腦、液晶電視、 投影機等電子裝置中之電子元件之功率越來越高，隨之所 產生之熱量亦越來越多。為將該等電子裝置中之電子元件 所產生之熱量及時有效地散發，通常會採用一含有散熱片 之散熱模組來對電子元件散熱。 目前，筆記型電腦、液晶電視機、投影機等電子裝置 中所使用之散熱模組中之散熱片通常會與一基板（Base) 結合’其中較常用之結合方式為將散熱片與一壓鑄件（Die Casting)如風扇之殼體、導熱板、機殼等一體壓鑄成型而 形成一個整體之散熱構件。然而’習知用於成型該散熱構 件之壓鑄模具之結構設計中，成型散熱片之部分設計為採 用一整體之模仁或整塊鑲件嵌入方式成型。 採用上述結構之壓鑄模具成型散熱片時，由於成型散 熱片之型腔為由整體模仁或整塊鑲件所構成之型腔，模具 之排氣狀癌不好，產品難以充填成形，故散熱片之厚度要 求做得較厚方可成形。另外，如果模具中用於成型其中一 片散熱片之成型結構損壞，則模具之整塊模仁或整塊鑲件 報廢，模具之維修、使用成本高。 6 1308879 【發明内容】 有鐾於此，有必要提供-_於成錄細件之 模具及使用該壓鑄·製造散熱構件之方法，職壓 具所成型之散熱構件之散熱片之厚度較薄，同時該輯模1308879 IX. Description of the Invention: The present invention relates to a die-casting mold for molding a heat dissipating member, and to a method for manufacturing a heat dissipating member using the die-casting mold. [Prior Art] With the continuous development of electronic technology, the electronic components in electronic devices such as notebook computers, LCD TVs, and projectors are getting higher and higher, and the amount of heat generated is also increasing. In order to dissipate the heat generated by the electronic components in the electronic devices in a timely and effective manner, a heat dissipation module containing a heat sink is usually used to dissipate heat from the electronic components. At present, heat sinks in heat sinks used in electronic devices such as notebook computers, LCD TVs, and projectors are usually combined with a substrate. The most common combination is to use heat sinks and a die casting. (Die Casting) such as the fan casing, the heat conducting plate, the casing and the like are integrally die-casted to form an integral heat dissipating member. However, in the structural design of the die-casting mold which is conventionally used for molding the heat-dissipating member, the portion of the molded heat-dissipating fin is designed to be formed by inserting a whole mold or a single insert. When the heat sink is formed by the die casting mold of the above structure, since the cavity of the molded heat sink is a cavity formed by the integral mold core or the integral insert, the venting of the mold is not good, and the product is difficult to be filled and formed, so the heat dissipation is performed. The thickness of the sheet is required to be thicker to form. In addition, if the molding structure for molding one of the fins in the mold is damaged, the entire mold or the entire insert of the mold is scrapped, and the maintenance and use cost of the mold is high. 6 1308879 [Summary of the Invention] In view of this, it is necessary to provide a mold for forming a fine part and a method of manufacturing the heat-dissipating member using the die-casting method, and the heat sink of the heat-dissipating member formed by the pressure tool has a thin thickness. At the same time
-種成型散減件之壓鑄模具，該散熱構件包括複數 散熱片’其中該壓鑄模具内鑲嵌有驗成型所述複數散熱 片之一鑲塊組，該鑲塊組包括複數堆疊在一起之片狀之^ 塊’每相鄰兩鑲塊之間形成有用於成型散熱片之一腔體。 -種用壓鑄模具製造散觸件之方法，藉由向上述壓 鑄模具内壓入熔融之金屬液而製得散熱構件。a die-casting mold for molding a diffusing member, the heat-dissipating member comprising a plurality of fins, wherein the die-casting mold is inlaid with a set of the plurality of fins, the set of inserts comprising a plurality of sheets stacked together A block is formed between each adjacent two inserts for forming a cavity of the heat sink. A method of manufacturing a dissimilar member by a die-casting mold, wherein a heat dissipating member is produced by pressing a molten metal liquid into the above-mentioned die-casting mold.
具之維修、使用成本低。 與習知技術相比，該成型散熱構件之壓鑄模具中，壓 鑄模具内鑲嵌有用於成型散熱片之鑲塊組，該鑲塊組包括 複數堆疊在一起之片狀之鑲塊，相鄰兩鑲塊之間形成有用 於成型散熱片之一腔體。在壓鑄成型時，壓鑄模具之型腔 内之空氣可以從鑲塊與鑲塊間之微小縫隙中逃出，模具之 排氣狀況得到較好改善，金屬液在型腔内能夠得到充分填 充’故較薄之散熱片亦能順利成型。同時，由於鑲塊組係 由複數片狀之鑲塊堆疊在一起所形成，當其中有一塊鑲塊 才貝壞時’只須更換相應之鑲塊即可，而無須更換整個鑲塊 組’從而大大降低壓鑄模具之維修、使用成本。 【實施方式】 圖1所示為一散熱構件1〇，該散熱構件1〇由具高導 熱係數之金屬或合金製成。該散熱構件1〇包括一主體部 7 1308879 η及複數散熱片π，該主體部η包括一離心風扇之殼體 ill及與殼體in相連之_板體112。該殼體nl包括一底 板113及由底板113延伸形成之一大致呈u形之側壁114, 該底板113之中央形成一開孔113a，該侧壁114上設有-出風口 13，該板體112設於殼體ιη遠離出風口 13之一 側，該等散熱片12設於該出風口 13處，並與殼體ηι之 底板113 -體壓鑄成型。該散熱構件1〇通常用於筆記型電 φ 腦内以對其内部之中央處理器、顯卡晶片等電子元件進行 散熱。該散麟件1G射以祕液晶魏、投影機等其他 之電子裝置中以對其内部之電子元件散熱。 圖2所示為本發明壓铸模具2〇〇之其中一較佳實施 例’祕鑄模具2GG用來成賴！巾所示之雜構件1〇， 由圖2巾可以看㈣壓鑄模具獅_無腔之設計方 案，在壓鑄成型時一次可同時成型兩個散熱構件10。該壓 禱模具200包括-動模2〇、一靜模3〇、兩個結構相同之模 • 仁40及兩組結構相同之鑲塊組50。 該壓鱗模具200之動模2〇及靜模3〇均大致為方形， 且均採用兩塊模板結構。該動模2〇上設有呈對稱分佈之兩 個模穴21，每一模穴21用來收容與之相對應之模仁40及 鎮塊叙50。每-模仁40上設有向外突出之一圓盤形凸台 41以用於成型離心風扇之絲113上之穿孔取，所述才二 仁40上還設有用於收容鑲塊組5〇之通孔42。 、 請同時參關3及圖4，每—鑲塊組5G包括複數堆叠 在一起之片狀之親51，該鑲塊組50用來成型散熱構ς 8 1308879 10之散熱片12。每一鑲塊51包括一頂部511及與該頂部 511相對之一根部512 ’各镶塊51之頂部5ιι之左右兩侧 分別向内凹陷’從而在相鄰之兩鑲塊51之頂部5ιι之間形 ，用於成型散熱片12之腔體513 (圖4)。各鑲塊51之根 部512向下延伸設有一卡塊514，模仁4〇上對應镶塊& 之卡塊設有-台階43，在將模仁4〇與鑲塊組5〇安裝 到動模20内時，鑲塊51之卡塊514可卡設在模仁4〇之台 • 階43處，以將鑲塊51緊固在動模20内。該鑲塊51之二 部512還設有供定位銷6〇穿設之兩個穿孔515，藉由將定 位銷60穿設於鑲塊51之穿孔515内並在定位銷6〇之兩端 : #以螺釘固定可將各鑲塊51固定為-個整體，即鎮塊組 50、為使麗鑄成型後之散熱# 能夠較順利地從^^模2〇 上脫落，鑲塊組50之部分鑲塊51之侧面上設有供扁平狀 之頂針（圖未示）穿設之方形槽516，該等方形槽516採 用成對設置，即相鄰之兩鑲塊51在相對之侧面上同時設有 _ 供同一頂針穿設之方形槽516，各方形槽516之深度大致 與鑲塊51之頂部511向内凹陷之深度相同。 圖5所示為模仁40與鑲塊組50安裝到動模20内之立 體圖，圖6所示為靜模3〇之立體圖。該動模2〇與靜模3〇 分別具有一相對之成型面22、32。該動模20之成型面22 上設有兩個呈對稱分佈之第-模腔23 (圖5)，該第-模 腔23包括模仁4〇之外表面與模穴21之内表面間形成之用 於成型離心風扇之側壁114之一腔體231以及鑲塊組5〇内 所形成之用於成型散熱片12之多個腔體513。對應動模2〇 9 1308879 之成型面22上之第一模腔23，靜模30之成型面32向下 凹陷形成有兩個呈對稱分佈之第二模腔33(圖6)，該第 二模腔33形成在動模20與靜模30之間，用於共同成型板 體112以及離心風扇之底板113。每一第一模腔23與相對 應之第二模腔33共同形成壓鑄模具2〇〇用於成型散熱構件 10之型腔。該動模20與靜模30之成型面22、32之中間 位置分別設有一澆道25、35，動模20與靜模30上之第一、 第二模腔23、33分別位於各自對應之澆道25、35之兩侧， 且澆道25、35分別與對應之第一、第二模腔23、33連通， 從而在壓鑄成型時，經澆道25、35於壓鑄模具之一側形成 之洗口 29將熔融之金屬液經該澆道25、35壓入到壓鑄模 具200之型腔内。為使該動模20與靜模30在合模時能夠 準確地合模，該動模20之成型面22之左下方及右上方分 別設有一定位槽27 ’與之相應地，在靜模30之成型面32 之相應位置設有與定位槽27配合之定位凸塊37。該動模 20上在第一模腔23及澆道25之位置處設有複數供頂針(圖 未示)穿設之頂針孔28，在分模時，穿設於該等頂針孔28 内之頂針向外將散熱構件1〇之毛坯頂出，以使散熱構件 的之毛坯能夠較順利地脫模。 請一併參照圖7及圖8，使用本實施例中之壓鑄模具 200壓鑄散熱構件10時，藉由如下步驟實現： 提供上述之壓鑄模具200 ; 將壓鑄模具200之動模20及靜模30安裝在壓鑄機 上’並使動模2〇與靜模30處於分開之狀態； 1308879 在動模20與靜模30之成型面上喷離型劑，然後合模； 由澆道25、35之澆口 29向壓鑄模具2〇〇之型腔内壓 入熔融之金屬液（鋁、鋁合金、鎂合金等）； 冷卻後’動模2〇背向靜模30運動，實施開模，同時 配合頂針之頂出動作，使散熱構件1〇之毛坯脫模； 取出散熱構件10之毛坯70，由於該壓鑄模具2〇〇採 用-模兩腔之設計，故可-次在—個毛链7G上同時成型兩 籲個散熱構件10 ’除去洗頭，將該兩個散熱構件1〇分離， 整形，即得到產品。 該用於成型散熱構件10之壓鑄模具2〇〇中，動模2〇 内鑲嵌有用於成型散熱片12之鑲塊組50，該鑲塊組5〇包 括複數堆疊在一起之片狀之鑲塊51，相鄰之兩鑲塊51之 間形成有用於成型散熱片12之腔體513。與習知採用一整 體之模仁或鑲件嵌入之方式成型之壓鑄模具相比，在壓鑄 成型時，本實施例中之壓鑄模具2〇〇之型腔内之空氣可以 • 從鑲塊51與鑲塊51間之微小縫隙中逃出，使模具之排氣 狀況得到較好改善，從而使金屬液能夠充分填充於型腔 内，有助於成型較薄之散熱片12。使用本實施例中之壓鑄 模具200成型圖1所示之散熱構件1〇之散熱片12時，散 熱片12之厚度可做到〇.6mm，兩相鄰之散熱片u間之間 距可做到1mm，而使用習知壓鑄模具加工時，散熱片之厚 度通常在1mm以上，兩相鄰之散熱片間之間距通常在 1.5mm以上。相比之下，在佔有相同體積之情況下，使用 本實施例中之壓鑄模具200加工出來之散熱片12較習知壓 11 1308879 鑄模具加工出之散熱片具有更大之散熱面積。該鑲塊組5〇 中部分鑲塊51之侧面上設有供扁平狀之頂針穿設之方形 槽516，在脫模時，穿設於方形槽516中之扁平狀之頂針 抵靠在散熱片12之頂部以辅助脫模，故散熱片12之脫模 角設計之較小時亦能順利脫模。同時，由於鑲塊組5〇係由 複數片狀之雜51堆疊在-麵形成，#其巾之單個镶塊 51損壞時，只須更換相應之鑲塊51即可，而無須更換整 個鑲塊組50，從而大大降低壓鑄模具2〇〇之維修、使用成 本。 該壓鑄模具200所能成型之散熱構件1〇之主體部u 及散熱片12並不限局於本實施例之圖示中所揭示之形 狀。散熱構件10中之主體部n還可以為導熱基板、電子 裝置之機殼等。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申明。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在紐本㈣精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1所示為一用於筆記型電腦中對電子元件散熱之散 熱構件。 圖2為加工圖1所示之散熱構件之壓鑄模具其中一較 佳實施例之立體分解圖。 圖3為圖2所示壓鑄模具其中一模仁與相對應之鑲塊 組之分解圖。 12 1308879 圖4為圖2所示壓鑄模具其中一鑲塊組之放大圖。 圖5為圖2所示壓鑄模具之動模與鑲塊組及模仁組合 後之立體圖。 圖6為圖2所示壓鑄模具之靜模之立體圖。 圖7為圖2所示壓鑄模具合模後之立體圖。 圖8為圖2所示壓鑄模具經壓鑄、開模後製得散熱構It has low maintenance and use costs. Compared with the prior art, in the die-casting mold for forming the heat dissipating member, the die-casting mold is embedded with a set of inserts for forming the heat sink, and the set of inserts includes a plurality of inlaid blocks, and two adjacent inlays. A cavity for forming a heat sink is formed between the blocks. During die-casting, the air in the cavity of the die-casting mold can escape from the tiny gap between the insert and the insert, the exhaust condition of the mold is better improved, and the molten metal can be fully filled in the cavity. The thinner heat sink can also be formed smoothly. At the same time, since the set of inserts is formed by stacking a plurality of inlaid inserts, when one of the inserts is broken, it is only necessary to replace the corresponding inserts without replacing the entire set of inserts. Greatly reduce the maintenance and use cost of die-casting molds. [Embodiment] Fig. 1 shows a heat dissipating member 1A made of a metal or alloy having a high thermal conductivity. The heat dissipating member 1 includes a main body portion 7 1308879 η and a plurality of fins π. The main body portion η includes a casing ill of a centrifugal fan and a plate body 112 connected to the casing in. The housing n1 includes a bottom plate 113 and a side wall 114 extending from the bottom plate 113. The bottom plate 113 defines an opening 113a. The side wall 114 is provided with an air outlet 13 and the plate body. 112 is disposed on a side of the housing ιη away from the air outlet 13. The heat sink 12 is disposed at the air outlet 13 and is die-cast molded from the bottom plate 113 of the housing η. The heat dissipating member 1 is usually used in a notebook type φ brain to dissipate heat from electronic components such as a central processing unit and a graphics card chip. The loose element 1G is shot in other electronic devices such as the secret liquid crystal projector and the projector to dissipate heat from the internal electronic components. Fig. 2 shows a preferred embodiment of the die casting mold 2 of the present invention. The secret casting mold 2GG is used for it! The miscellaneous components shown in the towel can be seen from the towel of Fig. 2 (4) The design of the die-casting lion _ no cavity, in which two heat dissipating members 10 can be simultaneously formed at the time of die casting. The pliers mold 200 includes a movable mold 2, a static mold 3, two identical molds, a core 40, and two sets of insert blocks 50 having the same structure. The movable mold 2 and the static mold 3 of the scale die 200 are both substantially square, and both have a template structure. The movable mold 2 is provided with two cavities 21 which are symmetrically distributed, and each of the cavities 21 is for receiving the corresponding mold core 40 and the town block 50. Each of the mold cores 40 is provided with a disc-shaped boss 41 projecting outwardly for forming a perforation on the wire 113 of the centrifugal fan, and the talented member 40 is further provided with a set of inserts for receiving the inserts. Through hole 42. Please refer to FIG. 3 and FIG. 4 at the same time. Each of the inlay groups 5G includes a plurality of sheet-like pros 51 stacked together, and the inlay group 50 is used to form the heat sink 12 of the heat dissipating structure 8 1308879 10 . Each insert 51 includes a top portion 511 and a base portion 512 opposite the top portion 511 'the left and right sides of the top portion 5 of each of the insert blocks 51 are recessed inwardly respectively to be between the top 5 of the adjacent two insert blocks 51 Shape, cavity 513 for forming heat sink 12 (Fig. 4). A root block 512 of each insert 51 extends downwardly with a block 514, and the block of the corresponding insert & is provided with a step 43 for mounting the mold core 4〇 and the insert group 5〇 to the movable portion In the mold 20, the block 514 of the insert 51 can be snapped onto the stage 43 of the mold core to secure the insert 51 in the movable mold 20. The two portions 512 of the insert 51 are further provided with two through holes 515 for the positioning pins 6 to pass through, by locating the positioning pins 60 in the through holes 515 of the insert 51 and at the two ends of the positioning pin 6〇: # fixing by screws can fix each insert 51 as a whole, that is, the town block group 50, in order to make the heat dissipation # after the casting can be smoothly detached from the die 2, the part of the set 50 is set. A square groove 516 is provided on the side of the block 51 for the flat thimble (not shown). The square grooves 516 are arranged in pairs, that is, the adjacent two inserts 51 are simultaneously provided on the opposite sides. The square groove 516 is provided for the same thimble, and the depth of each square groove 516 is substantially the same as the depth of the inward depression of the top 511 of the insert 51. Fig. 5 is a perspective view showing the mounting of the mold core 40 and the insert group 50 into the movable mold 20, and Fig. 6 is a perspective view showing the static mold 3. The movable mold 2 and the static mold 3 have an opposite molding surface 22, 32, respectively. The molding surface 22 of the movable mold 20 is provided with two symmetrically distributed first cavity 23 (Fig. 5), and the first cavity 23 includes a surface between the outer surface of the die 4 and the inner surface of the cavity 21. The cavity 231 for forming the side wall 114 of the centrifugal fan and the plurality of cavities 513 formed in the insert group 5 for forming the fins 12 are formed. Corresponding to the first cavity 23 on the molding surface 22 of the movable mold 2〇9 1308879, the molding surface 32 of the static mold 30 is recessed downward to form two symmetrically distributed second cavity 33 (Fig. 6), the second A cavity 33 is formed between the movable mold 20 and the static mold 30 for co-molding the plate body 112 and the bottom plate 113 of the centrifugal fan. Each of the first cavities 23 and the corresponding second cavities 33 together form a die-casting mold 2 for molding the cavity of the heat dissipating member 10. A runner 25, 35 is respectively disposed between the movable mold 20 and the molding surfaces 22, 32 of the static mold 30, and the first and second mold chambers 23, 33 on the movable mold 20 and the static mold 30 are respectively located respectively. The two sides of the runners 25, 35, and the runners 25, 35 are respectively connected with the corresponding first and second cavities 23, 33, so that during the die casting, the runners 25, 35 are formed on one side of the die casting mold. The washing nozzle 29 presses the molten metal liquid into the cavity of the die-casting mold 200 through the runners 25, 35. In order to enable the movable mold 20 and the static mold 30 to be accurately clamped when the mold is closed, a positioning groove 27' is respectively disposed on the lower left and the upper right of the molding surface 22 of the movable mold 20, corresponding to the static mold 30. A corresponding position of the molding surface 32 is provided with a positioning projection 37 that cooperates with the positioning groove 27. The movable mold 20 is provided with a plurality of ejector holes 28 through which the thimbles (not shown) are disposed at the positions of the first cavity 23 and the runners 25, and are inserted through the ejector holes 28 during the splitting. The inner ejector pin pushes out the blank of the heat dissipating member 1 to enable the blank of the heat dissipating member to be demolded smoothly. Referring to FIG. 7 and FIG. 8 together, when the heat-dissipating member 10 is die-cast using the die-casting mold 200 of the present embodiment, the following steps are realized: providing the above-mentioned die-casting mold 200; and moving the movable mold 20 and the static mold 30 of the die-casting mold 200 Installed on the die casting machine' and separate the movable mold 2〇 from the static mold 30; 1308879 sprays off the molding agent on the molding surface of the movable mold 20 and the static mold 30, and then molds; the runners 25, 35 The gate 29 presses the molten metal liquid (aluminum, aluminum alloy, magnesium alloy, etc.) into the cavity of the die-casting mold 2; after cooling, the movable mold 2 moves back to the static mold 30, and the mold is opened, and the mold is matched. The ejection action of the ejector pin releases the blank of the heat dissipating member 1; the blank 70 of the heat dissipating member 10 is taken out, and since the die-casting mold 2 is designed by using the two-cavity, it can be used on the 7G At the same time, the two heat dissipating members 10' are formed to remove the shampoo, and the two heat dissipating members 1 are separated and shaped to obtain a product. In the die-casting mold 2 for molding the heat-dissipating member 10, the insert block 50 for molding the heat sink 12 is embedded in the movable mold 2, and the insert group 5 includes a plurality of plate-like inserts stacked together 51. A cavity 513 for molding the heat sink 12 is formed between the adjacent two inserts 51. The air in the cavity of the die-casting mold 2 in this embodiment can be used from the insert 51 and the die-casting mold which is formed by inserting a mold or insert in a manner similar to that of the die-casting mold. The small gap between the inserts 51 escapes, so that the exhaust condition of the mold is better improved, so that the molten metal can be sufficiently filled in the cavity, which helps to form the thin heat sink 12. When the heat sink 12 of the heat dissipating member 1 shown in FIG. 1 is formed by using the die casting mold 200 in the embodiment, the thickness of the heat sink 12 can be 〇6 mm, and the distance between the two adjacent heat sinks u can be achieved. 1mm, when using conventional die-casting molds, the thickness of the heat sink is usually more than 1mm, and the distance between two adjacent fins is usually 1.5mm or more. In contrast, in the case of occupying the same volume, the heat sink 12 processed by the die-casting mold 200 of the present embodiment has a larger heat-dissipating area than the heat-dissipating fin processed by the conventional mold 11 1308879. The side of the insert block 51 of the insert block 5 is provided with a square groove 516 for the flat thimble to pass through. When the mold is released, the flat thimble penetrating in the square groove 516 abuts against the heat sink. The top of the 12 is used to assist in demolding, so that the draft angle of the fin 12 can be demoulded smoothly even when the draft angle is small. At the same time, since the insert group 5 is formed by stacking a plurality of sheets 51 on the surface, when the single insert 51 of the napkin is damaged, it is only necessary to replace the corresponding insert 51 without replacing the entire insert. Group 50, thereby greatly reducing the maintenance and use cost of the die-casting mold. The main body portion u and the heat sink 12 of the heat dissipating member 1 which can be formed by the die-casting mold 200 are not limited to the shape disclosed in the drawings of the embodiment. The main body portion n in the heat radiating member 10 may also be a heat conductive substrate, a casing of an electronic device, or the like. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent declaration according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by the person skilled in the art of the present invention should be included in the following claims. [Simple Description of the Drawings] Figure 1 shows a heat dissipating member for dissipating heat from electronic components in a notebook computer. Fig. 2 is an exploded perspective view showing a preferred embodiment of a die casting mold for processing the heat dissipating member shown in Fig. 1. Figure 3 is an exploded view of one of the mold cores and the corresponding insert block of the die-casting mold shown in Figure 2. 12 1308879 Figure 4 is an enlarged view of one of the insert sets of the die-casting mold shown in Figure 2. Fig. 5 is a perspective view showing the combination of the movable mold of the die-casting mold shown in Fig. 2 and the insert block and the mold core. Figure 6 is a perspective view of the static mold of the die-casting mold shown in Figure 2. Figure 7 is a perspective view of the die-casting mold shown in Figure 2 after being clamped. Figure 8 is a heat-dissipating structure of the die-casting mold shown in Figure 2 after die-casting and mold opening
件之立體圖。 【主要元件符號說明】A perspective view of the piece. [Main component symbol description]
散熱構件 10 主體部 11 殼體 111 板體 112 底板 113 開孔 113a 側壁 114 散熱片 12 出風口 13 壓鑄模具 200 動模 20 模穴 21 成型面 22、32 第一模腔 23 腔體 231、 513 洗道 25、35 定位槽 27 頂針孔 28 澆口 29 靜模 30 第二模腔 33 定位凸塊 37 模仁 40 凸台 41 通孔 42 台階 43 鑲塊組 50 鑲塊 51 頂部 511 根部 512 卡塊 514 穿孔 515 方形槽 516 定位銷 60 毛述 70 13Heat sink member 10 body portion 11 housing 111 plate body 112 bottom plate 113 opening 113a side wall 114 heat sink 12 air outlet 13 die casting mold 200 movable mold 20 cavity 21 molding surface 22, 32 first cavity 23 cavity 231, 513 wash Road 25, 35 Positioning groove 27 Pin hole 28 Gate 29 Static mold 30 Second cavity 33 Positioning cam 37 Mold 40 Boss 41 Through hole 42 Step 43 Insert group 50 Insert 51 Top 511 Root 512 Block 514 perforation 515 square groove 516 positioning pin 60 description 70 13