TWI306730B - - Google Patents

Description

1306730 IX. Description of the Invention: [Technical Field] The present invention relates to a heat pipe holder, and more particularly to a heat pipe holder having a high rate and a method of manufacturing the same. [Prior Art] The heat pipe is currently used in a large number of heat transfer components for the use of electronic tools, and the heat pipe is filled with high fluidity, high heat of vaporization, and low Buddha's point. And a chemically stable heat transfer medium, such as water, ethanol, and propylene, and the inner wall surface of the heat pipe is usually formed with a capillary structure having a plurality of burr-like protrusions. In actual use, one end of the heat pipe is connected to a heat pipe seat mounted on an electronic component as an evaporation section, and the other end of the heat pipe is used as a condensation section for a plurality of heat sink fins. Thus, when the evaporation section of the heat pipe is heated, the heat transfer medium in the evaporation section of the heat pipe vaporizes and absorbs a large amount of heat of vaporization, and the temperature of the heat pipe seat is lowered, and then the heat transfer medium diffuses in a vapor state to the condensation section of the heat pipe. The heat transfer medium can be attached to the capillary structures and condensed into a liquid state to be recirculated toward the evaporation section of the heat pipe, and a large amount of heat of liquefaction is dissipated by the heat dissipation fins. As shown in FIG. 1 , there is a heat pipe heat dissipating device, which comprises a heat pipe seat i which can be mounted on an electronic component (not shown), a heat pipe 2 in the shape of a shape, and a plurality of heat sink fins ^ The returning section 2 has an evaporation section 2 (1) which is flatly fixed on the heat pipe base i, two condensation sections 202 which are provided for the heat dissipation fins 3, and two connected to the evaporation section 2〇1 a bending section 203 between the condensing section 202. Although the heat-dissipating heat-dissipating device can be used for the electronic component by being loaded in the evaporation section 2〇1, the internal heat-dissipating device The heat transfer medium has a heat-dissipating effect of vapor and liquid two-state transition, but in actual production, it has the following defects: seat!: touch = segment can only rely on a small part (four) area to contact the heat pipe, therefore, The heat conduction performance is not good. w2. Due to the limitation of the internal space of the computer, the heat pipe 2 usually has a size limit of L. In addition, since the f-fold segments are added, there is also a minimum

, bowing + diameter R limit (through f minimum f-fold radius in the heat pipe diameter = 2 to 3 times), so 'actually the evaporation section training and the heat pipe seat 1 linear contact range о only size limit L subtracts twice the minimum bending radius r (ie, W = L - 2R), so that not only the area added by the base is limited by the minimum f-deflection radius R, but also the loading section. The area of the state is much smaller than the area of 2 〇 2 of the condensation section, which is not conducive to the circulation mechanism of heat conduction. ... 2, the evaporation section 2G1 is extruded into a flat shape, thus destroying the capillary structure of the '', s 2, and then affecting the back of the heat transfer medium after liquefaction &quot; The heat transfer performance of the heat pipe 2 is not good. ^ 4. The heat transfer medium must pass through the bow segments 203 having a bending angle of approximately ninety degrees to diffuse to the condensation section 2〇2 or back to the evaporation #201, so that the heat transfer medium passes through the bends. When the folding section is 2〇3, it will encounter the ΛΚ_ resistance of Tianda, and the smaller the bending radius R, the larger the flow resistance, which is not conducive to heat conduction. 5. In addition to the flattening of the evaporation section 2〇1, the heat pipe 2 needs to be subjected to two passes. The bending section 203 can be formed. 6 1306730 As shown in FIG. 2, there is another heat pipe heat dissipating device, which comprises a heat pipe seat 4, _ 3 ττ 1 , a main U-shaped heat pipe which can be mounted on an electronic component (not shown). 5' and eve of the loose money piece 6. The heat pipe base 4 has two linear grooves 401 for the heat pipes 5, and the heat pipes 5 respectively have an evaporation section 5 (1) and two in the linear grooves 401. 6 installed condensation section 5G2, and two connected to the evaporation section 5 () 1 and the ridge section 5 〇 3 between the condensation section 502. The heat pipe heat dissipating device can slightly increase the contact area between the evaporation &amp; 5〇1 and the heat pipe base 4 by the arrangement of the straight groove 401, and prevent the evaporation section 5〇1 from being crushed and destroyed= Structure, however, in addition to this, the heat pipe heat dissipation cracking also produces the same defect as the heat pipe heat dissipating device described above, which is disadvantageous for heat conduction, such as the linear contact range of the evaporation section 5 (H and the heat pipe holder 4). It is also limited by the minimum bending radius of the f-folding segments 503. The heat transfer medium also encounters a considerable flow resistance when passing through the bending segments 5〇3, and the heat pipes 5 also need to pass through two turns. 'The folding process can form the bending section 503 and so on. The figure 3 is not a conventional heat pipe cooling device, including one can be installed in an electronic forest "the same soil -, pieces (Figure not The upper heat pipe seat 7, the second heat pipe 8, and the plurality of heat radiating fins 1 „ ^ 亥 heat pipe socket 7 have two grooves 7 which are horizontally arranged for the heat pipes 8 to be installed (H, the heat pipes 8 respectively - horizontal setting = evaporation section that can be fixed in the linear grooves 7Gi, Xie, two relative to 5 The hair segment 8 01 is in the form of a gold l 吉 but _ 恶, ° straight 5 and can be used for the cooling fins 9 installed in the condensation section 802 'and two far-tech recognition # + - external hard operation in this treatment section 801 An angled section 803 between the condensing sections 802 and the heat releasing means can increase the contact area of the evaporation section 801 with the heat pipe base 7 by the arrangement of the grooves 701, and avoid The evaporation section 801 is crushed to destroy the capillary structure. However, in addition to this, the heat pipe heat dissipation device has the following disadvantages: 1. The condensation section 802 is clamped to the 90 degree with respect to the evaporation section 8〇1. The corner angles are formed to form the curved corner segments 803. Therefore, the capillary structures in the curved corner segments 8〇3 are often destroyed by severe bending deformation, thereby affecting the reflow effect of the heat transfer medium liquefaction. The heat conduction performance of the heat f 8 is not good. 2. The heat transfer medium must pass through the bend angles of the condensing section 8 〇 2 through the bending angle of 90 degrees or return to the evaporation section. Therefore, the heat transfer medium encounters a larger flow resistance when passing through the corner segments 8〇3. It is not conducive to heat conduction. Third, in addition to the paste forming of the evaporation section 8〇1, the heat pipe 8 needs to pass the two condensation materials to make the #condensing section 8G2^ straight to the evaporation section 801. The seats 4 must be symmetrically open to the horizontally disposed grooves 701 ′ for the horizontally disposed evaporation sections 8 ( ) 1 to be fixed, so that the heat pipe base 7 will occupy a large area and space. Therefore, the object of the present invention is to provide a heat pipe holder having high heat conduction efficiency. Another object of the present invention is to provide a method for manufacturing a heat pipe holder having high heat conduction efficiency. The heat pipe has a heat pipe having at least 1306730 嵩, and at least one condensing section connected to the evaporation section, the evaporation section has at least one curved portion, and a diameter, the curved portion has a radius of curvature and heat The socket includes at least a covering body having a cladding groove substantially parallel to a vertical reference surface and accommodating the evaporation section, the cladding groove having at least - corresponding to the curvature Radius and substantially flat Straight reference surface coated with a radius of curvature in the vessel, and a diameter corresponding to the width of the trench. The method for manufacturing the heat pipe holder of the present invention comprises: 1. preparing a workpiece. 2. Cutting the workpiece such that the workpiece forms a cladding groove having at least one radius of curvature and substantially parallel to the vertical reference plane. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will become apparent from the Detailed Description of the <RTIgt; Before the detailed description is made, it is noted that in the following description, similar elements are denoted by the same reference numerals. 4, 5, and 6 are a first preferred embodiment of the heat pipe base of the present invention, wherein the heat pipe 200 is provided for heat pipe 2, and the heat pipe 200 has an evaporation filled with heat conductive material. Sections 21〇' and 2 are connected to the evaporation section 21A to provide a condensation section 22G for a plurality of sheets 23G. The evaporation section 210 is formed by a curved portion and has a diameter D and a radius of curvature. r丨, the hot f seat includes a cover body 10 and a base body 2〇. The cladding body 10 has a cladding trench 丨 substantially parallel to a vertical reference plane XI, and the cladding trench has a 9 〇 〇 于 于The radius of curvature R1 is substantially parallel to the cladding curvature radius R2 of the vertical reference plane 一, a groove width w corresponding to the diameter D, and a groove not less than one-half of the diameter D of the tube D The depth z ^ is in this embodiment. The trench depth Z is greater than or equal to the tube diameter d.

The base body 20 has a top surface 21 and a contact bottom surface 22 which is mounted on an electronic component (not shown) opposite the top surface 21. In this embodiment, the cover body 10 is integrally formed on the top surface 21 of the base body 2, of course, the cover body 1 can also be separated from the base body to make 'and then solid Connected to the top surface 21 of the base body 2 。. Referring to Figure 7, a preferred embodiment of the method of manufacturing a heat pipe holder of the present invention comprises the steps of: - preparing a workpiece 300, in the embodiment, the workpiece 3 is extruded in a copper form And the workpiece 3 has the base body 2〇 and a covering body 1〇 formed on the top surface 21 of the base body 20. 2. Cut the workpiece 3 into a predetermined length. 2. Cutting the processing #300, the workpiece 3〇〇 is formed into the cladding trench π having the cladding radius of curvature R2. In the embodiment, the cladding is cut by a circular ore 400. The body 1〇#_top φ 12, and the covering body 1 〇 is formed into the cladding groove 1 . 4. The arc corresponding to the covering groove U is cut to remove the covering body ι in the cladding groove. The flesh on both sides of the trough is thick. Further, as shown in Fig. 8, the heat pipe holder of the present invention can also be produced by the following manufacturing method: k. Preparing a workpiece 300 having a rectangular cross section. 10 Ι 30673 Ό 2. The workpiece 300 is cut into a predetermined length. 2. Cutting the workpiece 3〇〇 so that the workpiece 300 forms the cladding groove 11. 4. The portion 31Q' of the workpiece 300 on both sides of the cladding groove 11 is cut to form the workpiece 300 to form the base body 20 and the cover body 1''. 5. The curvature of the covering groove 11 is cut off to the thickness of the covering body 1 on both sides of the covering groove 11.

Therefore, as shown in FIGS. 4, 5, and 6, the heat pipe 200 only needs to form a continuous curved arc of the evaporation section 21 by a bending process, and can be used together with the heat pipe seat of the present invention. The evaporation section 210 is installed in the cladding trench n, since the cladding curvature radius R2 and the trench width W of the cladding trench n correspond to the radius of curvature R1 of the evaporation section 210 and the diameter D, respectively. The groove depth Z of the cladding groove U is greater than or equal to the pipe diameter d. Therefore, the contact area of the evaporation section 210 with the cladding groove u can be maximized, and the heat conduction performance can be effectively improved.

Through the above description, the advantages of the present invention can be further summarized as follows: ―, since the cladding curvature of the package (four) groove U is half the groove width W is respectively corresponding to the radius of curvature R1 of the evaporation section 21G and the m 'and The groove depth z of the cladding groove 11 is greater than or equal to the tube and:, therefore, when the evaporation section 21 is mounted in the cladding groove u, (4) the emitting section 2U) and the covering groove u The contact _ can achieve maximum amplitude to improve heat transfer performance. The large method is in contact with the bent sockets 1, 4 of the thermal installations, and the cooling fins 1306730 are not provided for the sections 203, 503. The cladding groove u of the heat pipe holder of the present invention can cover the evaporation section 21 The entire bending of the crucible is solitary, so that the entire length of the heat pipe 2 均可 can function, and there is no ineffective bending section which cannot be contacted with the heat pipe seat and cannot be provided for the heat dissipation fins. Since the evaporation section covers all the bent portions of the heat pipe 200, the length and area of the evaporation section are not limited by the minimum bending radius of the f-folding section as in the prior art, so The evaporation section 21〇 and the condensation section 22〇 do not cause an excessively large area difference, and facilitate the circulation mechanism of heat conduction. The evaporation section 21 of the heat pipe 200 used in conjunction with the heat pipe holder of the present invention does not need to be repeated, and under the same heat dissipation size limit, the curvature of the evaporation section 21〇 can reach a maximum of 'R1' without generating If the radius of curvature of the prior art is too small - the folds 203, 503, or the continuous curved section 803 on two mutually perpendicular planes as in the prior art, the capillary structure inside the heat pipe 2 (9) is damaged by the bending process. The smallest, and the radius of curvature of the evaporation section 21〇 is significantly greater than the curvature of the conventional bending section 203, 5〇3 or the curved section 8〇3, so that the heat transfer medium can be directly evaporated from the evaporation. The turbulent flow of the section 21 to the condensing section 22 〇 ' while the heat conduction f liquefaction can also directly flow from the condensing section 220 to the evaporation section 21 〇, therefore, the heat transfer medium does not encounter excessive flow when flowing. Resistance, but is conducive to heat conduction. 4. The evaporation section 210 of the heat pipe 200 used in conjunction with the heat pipe holder of the present invention is to be flattened, and the evaporation section 210 and the condensation section 22 are not bent to form a conventional bending section 203 ' 503 or The curved section 8 〇 3, therefore, the phase car X is in the heat pipes 2, 5, 8 of the prior art, and the heat pipe 200 only needs to form the evaporation section 210 through a bending process to complete the production. 12 1306730 5. The covering groove π of the heat pipe seat of the present invention is formed on the covering body parallel to the straight reference plane X of the ship, and is not horizontally disposed. Therefore, the heat pipe seat of the present invention does not occupy space. It is conducive to the arrangement of the internal space of the computer. In addition, it is worth mentioning that when the heat pipe holder of the present invention is used in combination with the conventional heat officer 5, of course, the covering groove 丨丨 can also be shaped to correspond to the bending of the far bending section 503. a segment, and a straight segment corresponding to the evaporation section 501. However, compared to the prior art, the cladding groove can further cover the bends in addition to the Taifa section 501. The segment 5〇3 produces a better heat transfer effect. As shown in FIG. 9 , which is a second preferred embodiment of the present invention, the second preferred embodiment is similar to the first preferred embodiment, and the difference lies in the first preferred embodiment of the method. The cover body 10 is only included, and the cover body has a contact bottom plane 13 which is mounted on the electronic component (not shown) opposite to the cladding trench η. Thus, the second preferred embodiment can further reduce the occupied space in addition to the same purpose and effect as the above-described first preferred embodiment. As shown in FIG. 1G, which is a third preferred embodiment of the present invention, the third preferred embodiment is similar to the first preferred embodiment, and the difference is that the third preferred embodiment includes the number. The cover body 1〇 and a base body 3〇. The base body 30 has a base page 31' and a contact bottom plane 32 which is opposite to the top surface 31 and which can be mounted on an electronic component f-, 3, and 3, 13 13 〇 673 The crucible covering body 10 is spaced apart from the base and the third preferred embodiment can achieve the purpose and effect. The fourth filial piety embodiment is similar to the first 祛 # 加 加 加 , , , , , , % % % % % % % % % % % % % % % % % % % %

The 四 四 四 住 住 住 疋 疋 疋 疋 疋 四 四 四 四 四 四 四 四 四 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且The bottom plane 13 on the contact (not shown). Thus, the fourth preferred embodiment can achieve the same purpose and effect as the above-mentioned first preferred embodiment. In a preferred embodiment, the fifth preferred embodiment is similar to (four) - the preferred embodiment, and the difference is:

The top surface 31 of the body 3 is the same as the preferred embodiment of the above-mentioned preferred embodiment. The fifth preferred embodiment comprises a covering armature 4〇. The covering unit has two covering seats. The evaporation section 21 is disposed to cover the groove 42. The cladding bodies 41 have a pair of opposing faces 41 and a cover opposite to the cladding groove 42 respectively. a contact bottom plane 412 on the electronic component (not shown). The cladding trench 42 is formed between the opposing faces 411 and also has a cladding radius of curvature R2 corresponding to the radius of curvature ri, And a groove width w corresponding to the pipe diameter D. Thus, since the cladding groove 42 can completely cover the evaporation section 21〇, the fifth preferred embodiment can achieve the above comparison with the first In addition to the same purpose and effect, the preferred embodiment can produce better thermal conductivity. 14 1306730 In addition, the fifth preferred embodiment can also perform related configuration changes as in the first, third and fourth preferred embodiments described above. For example, the cladding unit 4 is disposed on the base (four) or the plurality of cladding sheets are spaced apart from each other to the base body. 'Or a plurality of cladding units 40 and #. In summary, the heat pipe holder and the manufacturing method thereof of the present invention not only have good If conductivity performance, but also effectively improve many defects of the conventional heat pipe; This is the ultimate goal of the invention. It is only the preferred embodiment of the present invention, which can limit the scope of the implementation of the present invention, that is, the simplicity of the scope of the present invention and the description of the invention. The equivalent change 1 is within the scope of the patent of the present invention.

15 1306730 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic side view of a conventional heat pipe heat sink; FIG. 2 is a perspective view of another heat pipe heat sink; FIG. 3 is a perspective exploded view of another heat pipe heat sink. 4 is a perspective exploded view of a first preferred embodiment of the heat pipe holder of the present invention and a heat pipe; FIG. 5 is a perspective view of the first preferred embodiment and the heat pipe; FIG. FIG. 7 is a schematic view showing a manufacturing process of the first preferred embodiment; FIG. 8 is a schematic view showing another manufacturing process of the first preferred embodiment; FIG. 10 is a perspective view of a third preferred embodiment of the heat pipe holder of the present invention and a plurality of heat pipes; FIG. 11 is a fourth comparison of the heat pipe seat of the present invention; FIG. 12 is a perspective view of a fifth preferred embodiment of a heat pipe holder of the present invention and a heat pipe; and FIG. 13 shows the fifth preferred embodiment and the same The combination of the tube cross-sectional view. 16 1306730

[Main component symbol description] 1 * · · Heat pipe holder 200 2 · Tube 210 201 · Evaporation section 220 202 Condensation section 230 203 · Bending section D· 3 ·... Heat sink fin R1 L · · Size limit 300 R.. Bending radius 310 w · · Contact range 400 4 · · · Heat pipe holder 10 - 401 Linear groove 11 · 5 * · Heat pipe 12 · 501 · Evaporation section 13 · 502 · Condensation section 20 · 503 · Bending section 21 6 Heat sink fins 22 · 7 · · · Heat pipe holder 30 · 701 · Groove 31 · 8 · - · Heat pipe 32 · 801 · Evaporation section 40 - 802 · Condensation section 41 · 803 · Angled section 411 Heat sink fin 412 Rail pipe *,,, &amp; Evaporation section Condensation section Heat sink fins Tube radius of curvature Machining part Partial circular saw blade Covering seat Covering groove Top surface Contact bottom plane Base body Top surface Contact bottom plane Base body top Surface contact bottom plane cladding unit cladding body facing surface contact bottom plane 17 1306730 42 · 'Groove X i • Vertical reference plane R2 Covering radius of curvature W ·. Groove width z * • Groove depth

18

Claims (1)

1306730 X. Patent application scope: 1. A thermal seat is available for installation, the heat has a continuation section, and at least one condensing section connected to the evaporation section, the evaporation section having a ‘, ♦ 曲.卩, and a pipe diameter, the curved portion has a radius of curvature, and the heat pipe seat comprises: ^The cladding body' has a cladding groove substantially parallel to a wrong reference plane and each of which can be disposed, the cladding groove having a radius corresponding to at least the radius of the curve The cladding surface of the 35-reference plane has a radius of curvature and a width corresponding to the diameter of the tube. The heat pipe holder according to the first aspect of the invention, wherein the cladding groove further has a groove depth not less than one-half of the pipe diameter. • The heat pipe seat according to the scope of the patent application, further comprising a base body, wherein the base body has a top surface, and - a contact bottom plane covering the top surface is provided on the top surface . 4. The heat pipe base according to item 3 of the patent application, wherein the body of the cover body is formed on a top surface of the base body. 5. The heat pipe holder according to item i of the patent application, wherein the crucible covering body has a contact bottom plane opposite to the cladding groove. 6. The heat pipe base according to item i of the patent application scope includes a plurality of cover bodies. 7. The heat pipe base according to claim 6 of the patent application, further comprising a base body, the base body having a top surface, and - opposite the contact bottom plane of the top surface, the covering body is disposed on the base On the top surface of the seat. 8. According to the heat pipe seat of the seventh paragraph of the patent application, 1 a H τ is specially covered, and the rough spacing is set on the top surface of the base body. 19 〇 〇 〇 〇 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热The groove contacts the bottom plane. 1〇, a method of manufacturing a heat pipe holder, comprising: (A) preparing a workpiece, and (B) cutting the workpiece to form the workpiece to have at least one radius of curvature and substantially parallel to a vertical reference Covering the groove. The manufacturing method of the heat pipe seat according to the first aspect of the invention, wherein in the step (A), the workpiece is extruded in a copper material, the workpiece has a base body, and one is formed in a cover body on a top surface of the base body. The method of manufacturing a heat pipe holder according to claim 11, wherein in the step (β), a top surface of the cladding body is cut to form the cladding groove. The method for manufacturing a heat pipe holder according to claim 12, wherein in the step (Β), the top surface of the covering body is cut by a circular saw blade to form the covering body to form the package Cover the groove. 14_ The method for manufacturing a heat pipe seat according to the first aspect of the patent application, further comprising a step (Α1) between the steps (A) and ((), in which the workpiece is cut in the step (A1) Into a predetermined length. According to the manufacturing method of the heat pipe base according to claim 10, further comprising a step (C) after the step CB), in the step (c), cutting the workpiece on both sides of the cladding groove Part of it. 16. A thermal seat for a heat pipe having at least one steaming 20,130,673, and at least a condensation section coupled to the evaporation section, the evaporation section having at least one bend, and a tube diameter having a radius of curvature 'the heat tube holder comprises: at least one cladding unit' having two cladding bodies, and a cladding groove accommodating the steaming section, the cladding blocks Each of the bodies has a matching face that is formed by: the cladding groove is formed between the opposing faces, the sub-having at least one radius of curvature corresponding to the radius of curvature, and one corresponding to The groove width of the pipe diameter. The heat pipe base according to item 16 of the patent application of the fifth aspect, wherein the cover bodies further have a contact bottom plane opposite to the cladding groove. The heat pipe seat according to Item 16 of the claim 53 further includes a base body, the 5Hai base body has a top surface, and a contact bottom plane opposite to the top surface, the covering unit is disposed on the top On the surface. The heat pipe seat according to item 16 of the claimed patent scope comprises a plurality of cladding units. The heat pipe seat of claim 19, further comprising a base body, the base body having a top surface and a contact bottom plane opposite to the top surface, wherein the covering unit is disposed at the base The top surface of the base body. According to the heat pipe base of claim 20, wherein the cover sheets are spaced apart from the top surface of the base body. The heat pipe base according to claim 19, wherein the covering sheets are close together, and the covering bodies of the covering units each have a opposite to the covering groove Contact the bottom plane. twenty one