TWI306619B - Semiconductor workpiece processing apparatus - Google Patents

Description

1306619 IX. Description of the Invention: [Technical Field] The present invention relates to the field of semiconductor manufacturing equipment, and more particularly to a processing chamber having a plurality of semiconductor processing articles and having a plurality of processing chambers in each semiconductor processing article Semiconductor process object processing platform:: Guide system object processing device. [Prior Art] There are currently two commonly used semiconductor process object processing systems, one is a system for batch processing semiconductor process articles, and the other is for single-chip processing of semi-conductive process articles. In a batch processing system, multiple semiconductor programs are placed and processed horizontally or vertically simultaneously. Although early film processing systems have advantages in terms of product handling, thermal effects, and military batch processing speed, their low production capacity and high production costs are clearly fatal defects that are difficult to overcome. In order to solve the above problems, the background portion of U.S. Patent No. 5,851,161 provides several batch processing systems. These batch processing systems have a plurality of processing chambers, each having a plurality of processing platforms, such that the processing chamber can simultaneously process a plurality of semiconductor process articles. However, the biggest problem with systems that process batches of semiconductor process articles is that the uniformity of processing of individual semiconductor process articles is difficult to guarantee. When batch processing semiconductor process articles, multiple semiconductor process objects are placed in the same chamber. The unevenness of semiconductor process object processing due to the difference in heat and airflow in the system. To overcome this deficiency, various solutions have been proposed in the industry. 108183.doc 1306619 ... see U.S. Patent No. 175, U.S. Patent No. 175, the entire disclosure of which is incorporated herein by reference in its entire entire entire entire entire entire entire entire entire disclosure The base 9 is provided with a heating base 35 below, and the heating base 35 is internally provided with a high-frequency heating coil to heat the Shi Xiji W. During the process, the carbon base 9 can be used with the carbon base. The support unit 旋转 rotates around the axis to ensure uniform temperature distribution. In addition, FIG. 2, U.S. Patent Application Serial No. 2,145,459, discloses another semiconductor process article processing scheme in which a rotatable +conductor process article carrier 116 is disposed in a reaction chamber, and a semiconductor process article (10) is disposed. Placed in the = conductor process article carrier 116, the semiconductor process article carrier Μ, the shaft 121' rotates, and the heating base m, stationary, its semiconductor reputation

The object carrier m, which has a sufficiently small distance from the reaction chamber, is rotated by the semiconductor process article carrier 116 to force the gas to flow horizontally outward along the channel (10) to achieve uniform film growth during processing of the semiconductor process article. Although the above two schemes can partially solve the heterogeneity problem of the semiconductor system, the semiconductor processing object of the 1st Guzhang β $ 卞 理 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体The processing of the semiconductor device and the semiconductor semiconductor heating semiconductor process object carrying device rotation to reach half of the material = semiconductor process object carrying a thousand conductors of the private object processing uniformity of the purpose of the hill = system: heating device and semiconductor process object bearing Two-position:: Adding the complexity of the system, and the semiconductor process object is carried, and the setting is such that the semiconductor process object is separated from the heating device. I08I83.doc 1306619 The processing temperature of the semiconductor process object is more difficult to control. Furthermore, in the process of semiconductor process object processing, the above two methods, the rotation of all the semiconductor process objects - rotates, the "mode is applied to the - semiconductor process object processing chamber Room (4) The semiconductor process object with a multi-conductor process object processing platform is not ideal for the uniformity of the processing of the conductor process article, >

And a semiconductor process object processing device, which can have an isolated semiconductor process environment when processing a plurality of process items, to ensure the uniformity of processing of each semiconductor process object, and to flexibly process the semiconductor process object. In particular, the adjustment = ', >, H + conductor process article batch processing system. The uniformity of the processing process object processing. [Summary of the Invention] The purpose of the invention is to provide, ycan, take care of you, and to solve the problem that the current semiconductor device mass production device is not uniform, and the semiconductor process object is not processed at the same time. Another object of the present invention is to provide a semiconductor process object processing which can simultaneously process a plurality of semiconductor process articles, and each semiconductor: the workpiece has a relatively isolated semiconductor π material # per semiconductor process object processing Γ Γ object Environment, heart

This book: the purpose of the re--the purpose is to provide a kind of semiconductor process object processing J - can simultaneously process multiple pieces of semiconductor process object object I < 士 ~ and thousand conductor stimulator device also seals the component to process in the semiconductor process object Bucket to the day · Keep the inside of the semiconductor process object processing chamber sealed, and has 108183.doc 1306619, the device to ensure the normal operation of the sealing element. The present invention is implemented by the following technical method: a semiconductor process article, at least, a semiconductor process object processing chamber, an object processing chamber, a 夕w ancient 襄 conductor, a semi-conductor, and an institutional process object processing. Platform, Feng conductor 1 process object processing platform and wins material + from. On the film conductor process items, ... semiconductor process object processing, the semiconductor lens processing platform can be rotated. The τ + conductor process semiconductor process object processing device is also provided with a plurality of platform rotating members corresponding to the number of semiconductor process articles, and each device processing platform has a flat conductor length. The rotating members are connected. At least two Pingxing wire rotating members are driven by the same motor _ 疋 违 驱动 违 违 = = = = = = = = = = = = = = = = = = = = 藉 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; The roller shaft is rotated by the belt. Leather = Shaft: There is a bayonet that matches the stripe on the belt to facilitate the tight coupling of the belt and the belt roller. There are four Shuhan semiconductor process object processing platforms, in which two adjacent hills are assembled with the same motor drive unit with animal processing platform by the first semiconductor process support board, and are driven by a first drive to move up and down. . A first positioning sensor is disposed on the first support plate to position the lifting and lowering position of the first support plate.笫—民牙 ^ The first motor is driven by a worm gear mast device to move the slab. Each of the semiconductor process object processing platforms is provided with a plurality of thimble guiding grooves, and each _ thimble guiding groove is provided with a thimble on the plurality of semiconductor process object processing platforms that can be lifted and lowered by the second branch 108183.doc 1306619 floor assembly Together 'and subject to the second motor drive to move up and down together. The second support plate is provided with a second positioning sensor for lifting and lowering the thimble within a certain range. The semiconductor process object processing device is also provided with a slider having a straightening and sliding slot for sliding up and down, and the two sliders/the first support plate and the second support plate are fixedly connected to guide the first support. The plate and the second support plate move up and down. Each semiconductor processing object processing platform is internally provided with a heating of the Μ distribution: a piece. The platform rotating member includes a rotating shaft and a belt roller shaft which are sequentially connected. The present invention also provides another technical solution for solving the current uniformity of the mass production device of the semiconductor process article. A semiconductor process object processing device includes at least one semiconductor process object processing chamber, and a semiconductor process physical chamber is provided with a plurality of semiconductor process object processing platforms, each half: a process object processing platform processing - a semiconductor process article, 1 : Each semiconductor processing object processing platform is provided with a corresponding platform f rotating member to drive the semiconductor process object processing platform to rotate and twist 2

The rotating member is provided with a channel power supply signal, and the sealing member is also provided on the semiconductor device to form a sealed environment in the semiconductor process. The cavity-to-platform rotating member includes a rotating shaft that rotates according to the rotation of the shaft and the belt. The belt roller shaft is connected to the signal amplifier by a wire connector. Below the semi-object handling platform, there is a support bar connected to the processing platform, and the king bar is connected to the rotating shaft. A power cord is provided inside the support bar to connect the semiconductor 2 108183.doc ^06619 The workpiece processing platform is heated. In the case of the semiconductor process object processing platform, the object processing platform 2::: The measuring device is used to measure the semiconductor process ring and the bellows seal. The seal 2 consists of an elastic seal and a semiconductor process object. Where. Xiao Yu (four) bellows seal wave (four) ~ contact cavity to the bottom contact gap. The bellows seal is connected with a rotating shaft and a cover disposed outside the rotating shaft. The first outer cover is provided with a bearing between the first outer cover and the rotating shaft, so that the outer cover of the rotating shaft does not rotate. Between the first cover and the bellows seal, the sealing member is also connected between the sealing member and the bellows rear seal. The magnetic sealing member is disposed between the screw and the rotating shaft, and the first outer cover is ensured when the rotary is rotated. The contact gap with the rotating shaft is connected by the dense support rod and (4) directly by the pin or the screw screw (4), and the sealing rod is provided at the place where the support rod and the rotating shaft are connected. Alternatively, the connecting rod and the rotating shaft are connected by the connecting block, and the sealing member is respectively disposed at a position where the supporting rod and the connecting block are in contact with each other and where the rotating shaft is connected to the connecting block. The first circulation passage is disposed on the rotating shaft for cooling the sealing member disposed near the rotating shaft. A second circulation passage is provided on the first outer casing for the sealing member disposed in the vicinity of the first outer casing. The first circulation channel and the first circulation channel are connected by an external pipe. The first circulation passage is provided with a coolant inlet' through which the coolant enters the first circulation passage. The first circulation passage includes a first cooling groove, a first passage and a second passage which are disposed on the rotating shaft and communicate with each other, wherein the first cooling groove is disposed around the sealing member near the rotating shaft of 108183.doc -11 - 1306619, The first channel and the second channel are disposed on the inner wall of the rotating shaft, and the shaft is also connected to the first passage and the second shaft is connected to the second passage. A second outer lining is further disposed around the rotating shaft, and a plurality of mutually spaced sealing members are disposed between the first outer cover and the rotating shaft, and a first ring is formed between the sealing members adjacent to the squatting τ The gap and a second loop drop. The first shaft hole is located in the first ring gap, and the inlet of the coolant inlet pipe is also located in the first ring gap, and the human%, six> soap coolant inlet pipe provides the coolant Enter the first ring gap and enter the shaft from the first-private shaft hole. The second shaft hole is located in the second ring gap, and the first pipe of the external pipe is also located in the second ring gap, and the coolant in the first circulation channel is pulled, and the second shaft hole is It flows out into the gap of the second ring and passes through the external battalion. The first end of the cutting path enters the external pipe and flows into the second circulation channel. The second circulation passage includes a second cooling groove disposed on the first outer cover. The second cooling groove is disposed around the sealing member near the first outer cover. The: cooling groove is disposed at different positions. The hole and a second cooling trough water outlet hole, wherein, the first fire, the 1 7 gutter inlet hole and the second end of the external pipe are connected to the second cooling trough water outlet and the coolant.彳Connecting W connection, another technical solution for arranging the invention is: the device, including at least half of the (four) material conductor process object at the end of the #古古# conductor I process object processing chamber, the processing of the internal authority is more A semiconductor process object processing platform, each object processing platform processes a system, a body, a body, a body, and an object, which is characterized in that each semiconductor process object is processed, and the tool is lifted and rotated, and the semiconductor system is 108183.doc J2- 1306619 =: τ is provided with a sealing member to keep the inside of the semi-conducting process object processing chamber in the semi-conducting object processing, and has a cold portion device to ensure the normal operation of the sealing member. Among them, the «« processing platform 7 material has a sealing device composed of a sealing ring and a bellows sealing member for sealing the contact between the wave yak and the bottom of the semiconductor processing object processing chamber (4). Wave =: The lower part of the part is provided with a first outer cover and a rotating shaft. In the first outer cover and the rotating shaft: ^-magnetic sealing element 'When the rotating shaft rotates, the contact gap between the first cover and the rotating cover is sealed. The first outer cover and the wave are provided with sealing elements to seal the gap between the first outer cover and the bellows seal; s contact between the law and the chiller is a water-cooled pipeline. The cooling is set to the channel including the first-semi-ring channel and the second circulation channel,";: the two-way channel is disposed in the rotating shaft and the sealing structure. The first-pass circulation channel is disposed on the first outer cover: (4) on the side wall of the rotating shaft The second circulation passage and the second circulation passage and the sealing member # are in close proximity, and the first periphery is also provided with a second C external pipe connected to each other. The mutually spaced sealing elements of the rotating shaft are provided between the rotating shafts. A plurality of phase first-ring gaps and -th-= sealing elements are respectively formed between the - channel and an external cooling source, and the first and second gaps and the first-cycle through-loop gap enter the first-cycle, The cooling source t coolant is connected by the first gap, and the external pipe=the second ring gap between the first-heart channel and the second ring can be in the first ring: also in the second ring gap, by the channel, and then into the first The coolant in the second circulation channel is transferred to the external pipe 108183.doc -13 - 1306619 The present invention also provides a semiconductor process article processing square conductor process object placed in a plurality of pieces + 仃 process 'in the process, the Semi-conducting rotation and heating to contact the semiconductor The process object is uniformly processed, wherein the plurality of semiconductor process object processing platforms are synchronously rotated, and the semi-conductor of the invention (4) is used for the fourth semiconductor process object. Heating. It is more flexible to carry out complex semiconductors. It is also a high-volume processing of semiconductor process objects. The present invention also designs a set of ffi氐, go to ^ 牛 borrow a w-set eight-purpose motor system' to ensure system synchronization The simplification of the mechanical structure simplifies the manufacturing structure and reduces the manufacturing cost. [Embodiment] The semiconductor process article of the present invention is disposed at (four), including at least - a process object processing chamber, processing " Multiple semiconductor process parts, each processing thousands of units on the processing - the semiconductor processing process of the mother-in-a-processing platform in the semiconductor process object processing Μ # . y clothing mad priming process can be rotated and heated separately to ensure semiconductor process objects Uniformity of processing. 立 = semiconductor process article processing apparatus of the present invention - embodiment * (5) semiconductor process article processing equipment in FIG. Including four processes, but for the sake of brevity, only two processing platforms in the processing chamber are displayed. It should be noted that the semiconductor process object processing device of the present invention is not limited to only four processing platforms, and may also include other quantities. Processing platform.... Please also refer to item 3, Fig. 4 and Fig. 5. Fig. 4 and Fig. 5 are schematic diagrams of the semiconductor process object processing device of the present invention shown in Fig. 3, which are viewed from the perspective of the clothes. 1306619 Multiple processing platforms 〖μ port is placed in a processing chamber (not shown), = - 捍 捍 4 connected to it, and each - at the table = = =: = rotating member (ie, the shaft 26 and the belt roller (4), the capacity: the platform is connected by the m-turn, the platform rotating member drives the support rod 4 and the branch support 4 to extend from the processing chamber and the corrugated sealing member disposed under the processing platform 1 . The table 1± also picks up the thimble period 4) of the semiconductor process article, and each thimble 2 is used for the corresponding ejector 3' to control the ejector pin & The ejector pin 3 is 戽 sealed # ', and the cavity is connected to the bottom. The corrugated seal member 52 is also coupled to the bottom of the chamber, and the seal member 52 can (4) ground (4) its contact surface with the bottom of the processing chamber, gas and heat. The bellows seals 52 are respectively disposed under the lower portion of the bellows seal member 52. The second outer cover is disposed under the second outer cover 28. The fourth outer cover 28 is disposed under the second outer cover 28 to rotate the rotating shaft 26 disposed inside the first outer cover 16 and the second outer cover 28 (see FIG. 7). . The belt-reporting shaft 17 is below the line-collecting line (4). When the processing platform i rotates, it is disposed on the support rod 4 and the shaft inside the shaft, and is not wound. Below the hub 19 is a signal amplifier Μ large input voltage. In the process of being placed, the thimble 2 of each of the processing platforms of the present invention can be lifted and lowered individually, and [the plurality of thimbles 2 can also be raised and lowered together by a combination of devices. In the embodiment of FIG. 4, the 'per-semiconductor process article processing platform 1 has three thimbles 2, and then two thimbles 2 and their corresponding ejector pins 3 and sealing devices are illustrated in the two processing platforms shown in the figure. 5. These thimbles 108183.doc 】5· 1306619 ejector 3 and sealed one by one ^ ^ ^, & 女 哀 上 上 上 upper support plate 6. The upper support. "The motor 8 control can move up and down along the slide rail 7, and drive all the thimbles 2, up and down. To ensure that the position of the ejector pin 2 moves up and down, the corresponding range is set at the corresponding position of the π rail 7 The position sensor 9 stops the movement of the motor 8 when the upper slab 6 passes the position of the sensor 9, thereby ensuring that the thimble 2 and its attachments can only move up and down within a predetermined range. Similarly, During the processing, each processing platform 1 in the present invention can be rotated or raised independently. Of course, a plurality of processing platforms can be rotated or raised by a combination of devices. Each of the __ processing platforms 1 is provided with a belt roller shaft 17 and a shaft 26 connected thereto. The belt roller shaft is driven by a belt (not shown) to rotate, and the rotating shaft 26 is rotated to drive the processing platform 1 to rotate. The belt roller shaft 17 is provided with a bayonet U which coincides with the stripe on the belt to facilitate the tight coupling of the belt and the belt roller shaft 17. The belt roller shafts 17 corresponding to each processing platform 1 can be rotated by a respective belt, or the belt rollers 17 corresponding to the plurality of processing platforms 1 can be rotated by the same belt, so that the plurality of processing platforms are synchronously rotated. Maintain uniformity of processing. For example, consistently, there are four semiconductor process object processing platforms 1, two of which are adjacent to each other! Sharing the same motor drive drives the same belt to rotate synchronously. The lower support plate 10 assembles the first outer cover 16 of the two semiconductor process article processing platforms. The first outer cover 16 can be caught by the lower support plate 1 and then moved up and down. The downward movement of the lower support plate 10 can drive the two semiconductor process object processing platforms 1 to move up and down together. The lower support plate 1 is driven up and down along the slide rail 7 by a motor 11 driven by the worm gear unit 12. Similarly, 108183.doc -16 - 1306619, in the phase of the slide rails ..... % "The board 10 is placed in the position of the sensor 13 to stop the motor , to ensure the semiconductor process object processing platform丄 can only move up and down within a certain range. In the embodiment of Fig. 3, the lower support plate 1G assembles two semiconductor process object processing platforms i to share a set of motor drive devices. In this embodiment 'The semiconductor process object processing chamber can have two sets of such combinations, that is, four semiconductor process object processing platforms. Each of the two processing platforms 1 shares a set of motor drive devices. These two combinations of symmetric settings ensure the semiconductor The stability of the process object processing chamber. By the arrangement of the upper support plate 6 and the lower support floor plate, the invention can realize the simultaneous lifting movement of the ejector pins of the plurality of +conductor process object processing platforms, and can realize more The semiconductor process object handles the flat leopard synchronous up and down movement. This arrangement, on the one hand, multiple sets of semiconductor process object processing platform 1 share a motor drive device' simplifies the device and reduces The cost, another: a plurality of sets of semiconductor process object processing platform ι share a motor drive device can also ensure that each processing platform 1 thus also ensures the uniformity of processing of each semiconductor process object processing platform 1. See Figure 5' It is seen that there are many vertically arranged holes 14 on the slide rail 7, and the lower support plate 10 can be moved up and down by the holes 14, and the slide rails 7' smash the pressure of the entire combination system against the worm gears 12, reducing the worm gears. The structure of the worm 12 is reduced. s & (4) degree H surface of the stable struts of the combined system, since the lower support plate 10 drives the entire system, the worm gear that drives the lower motor 11 is subjected to a larger one. Pressure, so 108183.doc 1306619 The lower support plate 10 and the worm gear 12 struts 10 are evenly stressed. A cavity 22 is placed so that the lower support can be seen in Figures 6, 7 and 8, and Figure 7 is processed. The platform and the flat surface of the present invention are the cross-sectional circles of the present invention, and FIG. 8 is a partial enlarged view of the surface of the apparatus of the present invention shown in FIG. 7. Each of the flat rotating members of the platform Section m, 7 sets of grain transfer members One end including a shaft 26 and a skin = 'shaft % is connected to the support rod 4, the shaft

7 is connected to the belt light shaft 17, and the belt view (4) has a 4 Γ 7 1 C hair six ′ which coincides with the stripe on the belt to facilitate the large force of the belt and the belt roller shaft. A motor driving device (not shown) is connected to a skin- (not shown). The belt roller shaft 17 is rotated by the belt and drives the motor 26 to rotate. (4) The semiconductor process object processing platform 1 connected to the support rod 4 is driven. Rotate. The number of the ball bearings 163 connected between the rotating shaft 26 and the first outer casing 16 by the ball bearings (6) may be one or more. In the actual example shown in the figure, the number of the ball bearings 163 is two, and the ball bearings 163 which are arranged one above the other are only schematic and do not show their true structure. Any kind of ball bearing. The hoisting ball bearing includes an outer connecting member, an inner connecting member and a bearing disposed therebetween. The inner connecting member is coupled to the rotating shaft 26, and the outer connecting member is coupled to the first outer cover 16. When the rotating shaft 26 rotates, the inner connecting member is rotated by the rotating shaft %$ and the bearings are also rotated together, so that the first outer cover 16 can be kept stationary. The first outer casing 16 is also provided with a coolant pipe (described later in detail) and a coolant outlet 15b. Below the first outer cover 16, there is a coolant input device for cooling (the details are described later) for cooling 108183.doc • 18· Ϊ 306619 liquid. the way. The rotary drive mode of the rotary switch can be implemented by a plurality of belt roller shafts 17 that are configured to be driven by respective motors, and each of them is driven by a motor drive device. : The belt roller shaft of the platform rotating member 17-rotates, and the belt roller shaft 17 of some platform rotating members is also combined, and the belt roller shaft of the remaining platform rotating member is rotated by one or two. The rotation or partial combination is driven by the respective motor driving device to be rotated by a motor driving device. A preferred embodiment of the invention is a 'semiconductor process object processing chamber. There is a four-conductor process object processing platform! Each semiconductor process article processing platform 1 corresponds to a set-platform rotating member. |Medium, adjacent: the belt roller shafts 17 of the two platform rotating members are combined in two, each combination is driven by a belt driven by a motor drive device. Thus, the four processing platforms in the entire semiconductor two-pass object processing chamber require two The motor drive unit can be rotated. For the purpose of processing semiconductor process articles, the semiconductor process article processing apparatus of the present invention should be capable of heating processed semiconductor process articles placed on its processing platform, and the semiconductor process object processing chamber should be a relatively vacuum processing environment. . Some of the sealing means should be provided in the portion of the SUb's connected to the processing chamber to isolate the processing chamber from the atmosphere to create a vacuum environment. It will be detailed below. Referring to Figure 7, the support rod 4 of the treatment platform 1 is internally hollow, and the inside of the shaft 26 is also hollow. The hollow support rod 4 and the shaft % 108183.doc • 19·1306619 are equipped with two cable tubes 23 And 24,1 medium-valued circuit, connected to the semiconductor process: piece:::= power input indication) on the semiconductor processing object processing platform: I! Power: with temperature detection device 23, connection, In the process of processing the semiconductor process object, the surface of the process is processed by the semiconductor process object: the semiconductor process object on the semi-heated surface, and = can be set = thus Suspected to ensure the uniformity of semiconductor process object processing. Referring to FIG. 7 and FIG. 8 together, since the semiconductor process article is disposed: the support rod 4 is extended from the underside of the semiconductor process object processing chamber, the support rod 4 and the semiconductor process object processing chamber must be ensured =::Γ Connected to seal. In accordance with this requirement, the present invention provides a bellows seal 52 under the semiconductor article processing chamber for sealing. Referring to Figure 13, there is shown a cross-sectional view of a bellows seal for use in the present invention. The bellows seal 52 is an axially symmetrical thin-walled round tube assembly. The round tube has a dense annular waveform protruding. Since each annular waveform protrudes, it can be deformed by external force application, and elastically recovers after the external force is removed, so that the wave The seal 52 has elastic recovery and is axially expandable and contractible. The corrugated mantle seal 52 of the present invention is a metal material, such as stainless steel, and has an upper flange ... and a lower flange 51b, wherein the upper flange 51a and the semiconductor process article processing chamber (not shown) are welded together. An elastic sealing ring 5〇 is disposed at the contact surface of the upper flange 5U and the semiconductor process object processing chamber for sealing the contact gap between the bellows seal and the bottom of the semiconductor process object processing chamber. The lower flange 5 1 b is welded to the first outer cover 16 . The bellows seal after welding 308l83.doc -20- 1306619 5 2 forms a sealed environment inside. Since the bellows seal 52 internally houses the support rod 4 and provides electrical signals to the conductor-conducting workpiece processing platform i, the support rod* of the present invention is hollow with wires and semiconductor process object processing platform i Electrical resistance wires (not shown) are connected to provide electrical energy. Therefore, the hollow portion of the support rod 4 has an atmospheric environment, and only the space formed inside the bellows seal 52 and the side of the support rod (10) is a vacuum environment 'hereinafter referred to as a bellows seal space.

The support rod 4 below the treatment platform 1 extends from the center of the bellows seal 52 and is connected to the turn (4). In order to connect the support rod 4 and the shaft %, a connecting block 41 is provided between the support rod 4 and the rotating shaft 26, and the support rod 4 is fixedly coupled to the rotating shaft 26 by means of a pin connection or a bolt-and-nut connection. It should be noted that in the embodiment shown in FIG. 8 , the shaft 26 and the support rod 4 may have other connection manners, for example, the shaft 26 and the support rod 4 are directly connected by a pin connection or a screw nut. Set the connection block 4 i. Referring to Fig. 8', in order to make the bellows sealing space formed inside the bellows seal 52 and the periphery of the support rod 4 a vacuum environment, any gap leading to this space must be blocked to make the space a closed space. First, the bellows seal 52 is connected to the first outer cover 16 by its lower flange 51b, and the contact surface between the two is sealed by a sealing member 16乜, which can be disposed on the rotating shaft 26. Open the n-way, the sealing element can be. The ring ' can of course be other forms of sealing material; then, a magnetic sealing element 16 设置 is disposed between the first outer cover 16 and the rotating shaft 26 to block between the first outer cover 16 and the rotating shaft 26 to the bellows. The gap of the sealed space 'usually' the magnetic sealing element 160 is a magnetic fluid seal element ^ 108I83.doc • 21 - 1306619

It has a relatively high sealing performance, and also ensures that the contact gap between the first cover 6 and the rotating shaft 26 is effectively sealed when the rotating shaft 26 rotates; in addition, the connecting block 41 is in contact with the support rod 4 and the rotating shaft 26. The sealing elements 41a, 41b are respectively provided for sealing, and the two sealing elements 41a, 41b ensure that the atmosphere flowing in the rotating shaft 26 and the supporting rod 4 does not pass through the connecting block "contact with the support rod 4 and the rotating shaft 26". The slit enters the bellows sealing space, and the sealing member 41a, 41b can adopt a ring-shaped ring or other sealing material. The sealing structure can completely seal the bellows sealing space, thereby ensuring the communication with the sealing device. There is a sealed vacuum environment inside the chamber. During the processing of semiconductor process articles, the temperature of the four platforms is usually very high, about 600 to 900 degrees Celsius. Therefore, during the process, the high temperature heat will follow the ceramics. The support rod 4 of the material is conducted to the shaft % and the first outer cover 16, and the heat is also applied to the various sealing elements described above (sealing element = 164a, magnetic sealing element 16). The sealing element 4U, called conduction, because the material of the sealing element and the magnetic sealing element cannot withstand high temperature, the aging failure will occur gradually at high temperature. After the failure, the effective sealing effect is no longer effective. Therefore, it is necessary to set around the sealing element. Specific Cooling (4) Specialized to 'reduce the temperature around the sealing element. Therefore, the present invention: provides a unique cooling system to ensure that the sealing element will be detailed below. 以. See Figure 12, first, for cooling The connecting block "two sealing elements disposed at the place where the branch 26 is in contact, the shaft -^., ., ^ 4 1 b '. The present invention opens a first cooling groove 162 at the upper end of the 盥 connecting block. 108183.doc -22- 1306619 The first cooling slot 162 is disposed around the periphery of the connecting block 41 and is not circumferentially connected. Referring again to Figures 10 and 9, the first cooling slot 162 is provided continuously. Cooling liquid 'The present invention is provided with a passage (first passage 61 and second 'second passage 62) along the longitudinal axis of the inner wall of the rotor 2, respectively, and the first passage 61 and the second passage 62 are respectively the first of the rotary shaft 26 Cooling tank 162 is connected And a first shaft hole 71 and a second shaft hole 72 are respectively disposed on the two passages 61 and 62 at the lower end of the rotating shaft 26. Referring to the broken line portion of Fig. 11, the setting of the rotating shaft 26 can be clearly seen. The first shaft hole 71, the second shaft hole 72, the first passage 61, the second passage 62 and the first cooling groove 162 are in communication with each other. Referring to FIG. 11 and FIG. 12, at the lower end of the rotating shaft 26 There is also a second outer cover 28 on the outside, and the second outer cover 28 is connected to the first outer cover 16. The first outer cover 28 and the rotating shaft 26 have a certain space, and several spaces are arranged in the space. The sealing element 166 has a first ring gap 81 and a second ring gap 82 formed between each of the two sealing elements 166. The male, sealing element 166 can be a braided ring or other form of sealing material. As shown in the figure, a coolant inlet pipe 15a is inserted into a hole (not shown) formed in the second casing 28, and the first shaft hole 71 of the shaft 26 is located first. In the ring gap 81, the coolant flows into the first ring gap 81 from the coolant inlet pipe i5a, and then flows into the first shaft hole 71 on the rotating shaft 26, and the coolant is injected into the rotating shaft through the first shaft hole 71. 26, and along the first passage 61 on the rotating shaft 26, flowing into the first cooling groove 162, and then flowing down into the second passage 62' and finally flowing out of the rotating shaft 26 through the second shaft hole 72 on the rotating shaft 26, entering the second The ring gap 82 flows within the second ring gap 82. The above constitutes a first circulation passage for cooling the sealing member 41 a, 108183.doc • 23-1306619 41b ° Next, for cooling the bellows a sealing member 1643 between the flange 51b of the sealing member 52 and the first housing 16 and a cooling magnetic sealing member 16A. The present invention opens a second cooling slot on the first housing 16 adjacent to the sealing member 164a. 167, the second cooling channel 167 constitutes a second circulation channel, the second cooling 1 67 may be disposed on the inner side or the outer side of the sealing member 164a. As shown in the drawings, a preferred embodiment of the present invention, the second cooling groove 167 is disposed outside the sealing member 164a and distributed along the outer side of the sealing member 164 & The second cooling groove 167 is not connected on the circumference, and a hole is respectively disposed at two positions of the second cooling groove a?, one hole is the second cooling groove water inlet hole 167&; one is the second The cooling tank outlet hole 167b, wherein the second cooling tank inlet X hole 167a is connected to the external pipe 84, and the second cooling tank water outlet hole "π is connected to a coolant discharge pipe 15b for discharging the coolant. To provide a continuous flow of coolant to the second cooling tank 167, the present invention utilizes an external f-channel 84 to interconnect the third circulating passage with the first _ circulating passage. In this way, the coolant input can be provided only by the water inlet of the first circulation passage and the coolant of the first circulation passage can be fully utilized to further cool the sealing member 164a and the cooling magnetic sealing element by the second circulation passage. 160' Finally, the coolant is discharged by the coolant outlet pipe 15b. Below. The sheep said that the cold liquid is in the second circulation channel and the external pipe. Referring to FIG. 11 again, the lower end of the external pipe 84 passes through a hole (not shown) provided in the second outer cover 28 and a second shaft hole 72 on the rotating shaft 26 together with a gap (4) 'the upper end of the external pipe 84 and the first portion- The second cold on the outer cover 16 = 108183.doc -24 - 1306619 The water inlet holes 167a (Fig. 12) of the slots 167 are connected. Thus, when the coolant flows out of the rotating shaft 26 from the second shaft hole 72 of the first circulation passage, the coolant enters the second ring gap 82 and flows therein. The water flowing in the second ring gap will flow in again. The second ring gap 82 is connected to the external pipe to flow upward along the external pipe 84, and then enters the second circulation channel through the water inlet hole 167a of the second cooling groove 167 on the first outer cover 16 (ie, the second In the cooling tank ^7), after circulating in the second cooling tank 167, the heat in the vicinity of the second cooling tank 167 is taken away. Finally, the water outlet hole of the second cooling tank flows out from the cooling liquid output pipe 15b. The water drains the entire platform rotation assembly. The second circulation passage carries the heat in the vicinity of the sealing member 164a and the cooling magnetic sealing member 16A by the coolant flowing in the second cooling groove 167. Referring to FIG. 8 again, the first cooling channel 162 is just above the bellows sealing space 'and the first cooling channel 162 is connected to the cooling liquid phase of the external atmosphere. The first cooling channel 162 is an atmospheric environment, and therefore The first cooling slot 162 must be isolated from the bellows seal space. To this end, in the (6) above the fixed connection - the first seal member, the first seal (four) two not only can play a sealing role, the aforementioned bellows seal space and the _A portion of the groove 162 is isolated, so that the first cooling The atmosphere of the groove 162 does not enter the corrugation: 2 space 'and can block the vapor of the coolant from overflowing due to high temperature: the first sealing member can be a variety of sealing materials, and the preferred embodiment is a steel material. And, the stainless steel material can be tightly welded to the Korean shaft 26. Similarly, the second cooling channel 167 is also fixedly connected to the second sealing member for blocking the coolant to overflow or the two sealing members can be various sealing materials. The preferred embodiment is: 108183. Doc -25- 1306619 material, and the stainless steel material is tightly welded to the first outer cover 16. It should be noted that the 冰-ice cover 16 and the second cover 28 of the present invention may be divided into two outer covers as described above, or a cover may be combined. The invention is ingeniously by externally connecting this to *. Λ 接 接 g channel 84 connects the first circulation channel and the second circulation channel together, so that the path of the circulation of the liquid P in the entire cooling system is lengthened and the time of staying is increased to fully utilize the cooling function of the coolant' The entire cooling system only needs to provide a coolant inlet and discharge, and the first ring gap 81 and the second ring gap 82 between the first cover 28 and the shaft % are used to achieve the coolant in the first cycle. The exchange between the channel and the second circulation channel. Not only is the cooling effect good, but the cost is low. The above description is only based on the present invention to limit the scope of the present invention. The replacement of components well known in the art, the steps of the invention are well known in the art and the scope of protection. The preferred embodiments of the present invention are not intended to be a combination, a separate embodiment of the present invention, and equivalent changes or substitutions to the present invention are not beyond the scope of the drawings. It is a structural diagram of an existing semiconductor processing object processing device. 2 is a structural view of another conventional semiconductor process article processing apparatus. 3 is a perspective view of a semiconductor process article processing apparatus of the present invention. Figure 4 is a schematic view of the semiconductor process article processing apparatus of the present invention as viewed from a viewing angle. Figure 5 is a schematic view of the semiconductor process article of the present invention being processed from another perspective. 108183.doc • 26-1306619 FIG. 6 is a schematic view of a semiconductor process transfer member of the present invention. Fig. 7 is a cross-sectional view of a semiconductor process rotating member of the present invention. + chamber and its platform rotation Fig. 8 is a partially enlarged view showing a cross-sectional view of the semiconductor flat-panel β^Cash processing platform of the present invention shown in Fig. 7 and its turn-to-turn member. Figure 9 is a cross-sectional view showing the cooling passage of the inner wall of the rotating shaft of the present invention.

Figure 1 is another cross-sectional view of the cooling passage of the inner wall of the rotating shaft of the present invention. Figure 11 is a schematic overall view of a cooling passage of the present invention. Figure 12 is a cross-sectional view showing the assembly of the rotating shaft, the first outer cover and the second outer cover of the present invention. Figure 13 is a schematic cross-sectional view of a bellows seal used in the present invention. [Main component symbol description] 1 Processing platform 1' High frequency heating coil 2 Thimble 3 Plunger 4 Support rod 5 Sealing device 6 Upper support plate 7 Slipper 8 Motor 8' 矽 Substrate 9 Sensor 108183.doc 1306619 9' Carbon base - 10 Lower support plate * 11 Motor «» 1Γ Carbon base support • 12 Worm gear 13 Sensor 14 • 15a Coolant connection Inlet pipe 15b Coolant outlet pipe 16 First casing 17 Belt 1 Kunming shaft 18 Bayonet 19 Hub 20 Signal amplifier 22 Cavity • 23 Cable pipe / temperature detecting device 24 Cable pipe 26 Rotary shaft 28 Second casing / processing chamber Chamber - 35' Heating base 41 Connection block 41a Sealing element 41b Sealing element 50 Sealing ring 108183.doc -28- 1306619 51a Upper flange 51b Lower flange 52 Bellows seal 61 First passage 62 Second passage 71 First Shaft hole 72 second shaft hole 81 first ring gap 82 second ring gap 84 external pipe 110' semiconductor process article 116' carrier 117' heating base 121' shaft 130' channel 160 Magnetic sealing element 162 First cooling groove 162a First seal 163 Ball bearing 164 Slot 164a Sealing element 166 Sealing element 167 Second cooling tank 167a Second cooling tank water 167b Second cooling tank water 108183.doc -29-

Claims (1)

/〇) eye Ι3Ό6δ f 9103572 Patent application,, the application for the patent scope replacement (97 years 1 month) X. Patent application scope: 1. A semiconductor process object processing device, including at least one semiconductor process object Processing chamber 'Semiconductor process article processing chamber is provided with a plurality of semiconductor process object processing platforms' Each semiconductor process object processing platform processes a semiconductor process article, characterized in that: semiconductor process object processing platform during semiconductor process object processing Rotatable, wherein the semiconductor processing article processing device is also provided with a plurality of platform rotating members corresponding to the semiconductor process object & number, and each process object processing platform is connected to a platform rotating member. A semiconductor process article processing apparatus according to claim 1, wherein the two platform rotating members are synchronously rotated by the same motor driving means. % \ The semiconductor process article processing apparatus of claim 2, characterized in that: = the motor drive device drives the plurality of semiconductor process object processing platforms to rotate by the sheath. The semiconductor process object processing apparatus of item 1 is characterized in that: X flat s: The % rotating member is provided with a belt roller shaft to be rotated by the belt. The semiconductor process object processing apparatus of claim 4, wherein the belt is provided with a bayonet that matches the stripe on the belt to facilitate the tight coupling of the belt and the belt roller. 6. The semiconductor process object processing device of the requester, the semiconductor process object processing flat has a total of four thousand, and the two adjacent ones are driven synchronously by the same motor drive device. 108183-9710H.doc Ι3Ό6619 7. The semiconductor processing article processing apparatus as claimed, wherein: at least two semiconductor process object processing platforms are assembled by the first support plate and are moved up and down by a first motor drive. The semiconductor process object processing apparatus of claim 7, wherein: the first positioning sensor is disposed on the first branching floor to position the lifting and lowering position of the first supporting plate. 9. The semiconductor process object processing according to claim 7 The device is characterized in that: the first motor drives the first support plate to move up and down by the - worm gear device. 10. The semiconductor process object processing device of the request is characterized in that: each semiconductor process object processing platform A plurality of ejector pins that can be lifted and lowered. η. The semiconductor process object processing device of claim 10, characterized in that: The thimbles on the semiconductor process object processing platform are assembled by the struts and are moved together by a flute - such as the semiconductor process of the request item. The Μ Μ processing device is characterized by: - a range The internal-lifting--clamping sensor' to ensure the thimble is in the semiconductor processing article processing device according to claim 7 or 11, characterized in that the semiconductor #Ρ+丹符征 is also provided in the cattle conductor process object processing device There is a slide rail, and the slide rail is provided with two straight-moving slot sliders which can slide up and down respectively, and are respectively fixedly connected with the first support plate and the two first-supporting extension plates of the Μ±π ghost '4 to guide the first branch. Swinging board and the second branch of the swinging board move up and down. "·If you request the semiconductor process object processing device, each semiconductor process object is located at the place of the semiconductor processing object, and the levy lies in the object processing. The internal setting has a uniform distribution of 108183-97W14. Doc Ι3Ό6619 Thermal components. 15' The semiconductor process article processing apparatus according to claim 1, characterized in that: The gantry platform rotating member includes a rotating shaft and a belt roller shaft which are sequentially connected. 16. A semiconductor process article processing apparatus, comprising at least one semiconductor process object processing chamber, a semiconductor process object processing chamber is provided with a plurality of semiconductor process object processing platforms, and each of the semiconductor process object processing platform processes the semiconductor process article The utility model is characterized in that: under each semiconductor processing object processing platform, a corresponding platform rotating member is arranged to drive the semiconductor processing object processing platform to rotate and heat, the platform rotating member is provided with a channel power supply signal input, and the semiconductor processing object processing device also has a sealing member. To form a sealed environment within the processing chamber of the semiconductor process article. 17. The semiconductor process article processing apparatus of claim 16, wherein: the off-platform rotating member comprises a rotating shaft and a belt (four) which are sequentially connected, and the rotating shaft is rotated by the rotation of the leather f-roll shaft. 18. The semiconductor process article processing apparatus of claim 17, wherein: the belt roller shaft is connected to the hub by a connection portion, and one end of the hub is connected to a signal amplifier. 19. As requested! The semiconductor process object processing device of the seventh embodiment is characterized in that: the semiconductor process object processing platform is provided with a support rod connected to the processing platform, the support rod is connected with the rotating (four) mesh, and the support rod (4) is provided with a power line for connecting the semiconductor process object. The resistance wire in the processing platform heats the semiconductor process object processing platform. 20. The semiconductor process article processing apparatus of claim 19, wherein: 108183-971014.doc Ι3Ό6619 process object The support bar is internally provided with a temperature detecting device for measuring the temperature of the surface of the semiconductor processing platform. 21. The semiconductor process article processing apparatus of claim 19, wherein: the support rod is provided with a sealing device consisting of an elastic sealing ring and a bellows seal, and a (four) wave (four) sealing member and a semiconductor process object processing chamber. Contact gap at the bottom. The semiconductor processing article processing apparatus of claim 21, wherein: the bellows seal is connected with a rotating shaft and a first outer cover, wherein the first outer cover is disposed outside the rotating shaft, and the first outer cover and the rotating shaft are disposed between The bearing allows the rotating shaft to rotate freely without the first outer cover rotating. 23. The semiconductor process article processing apparatus of claim 22, wherein: the first outer cover and the bellows seal are also provided with a sealing member for sealing a contact gap between the first outer cover and the bellows seal. 24. The semiconductor process object processing apparatus of claim 22, wherein: a magnetic sealing element is disposed between the first outer cover and the rotating shaft, and a contact gap between the first outer cover and the rotating shaft is ensured when the rotating shaft rotates. seal. 25. The semiconductor process object processing apparatus according to claim 19, wherein the support rod and the rotating shaft are directly fixedly connected by a pin or a screw bolt, and a sealing member is disposed at a place where the support rod and the rotating shaft are connected. 26. The semiconductor process object processing apparatus of claim 19, wherein: the support rod and the rotating shaft are connected together by a connecting block, where the support rod and the connecting block are in contact with each other, and at the rotating shaft The connecting blocks are respectively connected with sealing elements. The semiconductor process article processing apparatus of claim 22, wherein: 108183-971014.doc 1306619 a first circulation passage is provided on the rotating shaft for cooling the sealing member disposed near the rotating shaft. A semiconductor process article processing apparatus according to claim 27, wherein: a second circulation passage is provided on the first outer casing for cooling the sealing member disposed in the vicinity of the first outer casing. 29. The semiconductor process article processing apparatus of claim 28, wherein: the first circulation channel and the second circulation channel are in communication via an external conduit. 3. The semiconductor process object processing apparatus of claim 29, wherein: the coolant passage is provided with a coolant inlet, and the coolant inlet allows the coolant to enter the first circulation passage. 31. The semiconductor process object processing apparatus of claim 3, wherein: the first circulation channel comprises a first cooling channel first channel and a second channel disposed on the rotating shaft and communicating with each other, wherein the first cooling channel The first passage and the second passage are disposed on the inner wall of the rotating shaft, and the first shaft hole is connected to the first through hole and the first shaft hole. Connected to the second channel. For example, the semi-conductor of claim 31 (4) is characterized by: a second outer cover is also disposed around the rotating shaft, and a plurality of sealing elements spaced apart from each other are disposed between the second outer cover and the rotating shaft, wherein adjacent The first ring gap and the second ring gap are respectively formed between the sealing elements. The semiconductor process object processing device of claim 32, wherein: the brother-shaft hole is located in the first ring gap, and has a The coolant inlet pipe is located in the first-fourth gap, and the coolant connection pipe is provided to cool the first ring gap and enter the shaft from the first-axis hole. 108183-971014.d〇, 1306619 * * 34. The semiconductor process object processing device of item 33, wherein the second shaft hole is located in the second ring gap, and the coolant at the first end of the external pipe is also located in the first-cycle channel of the second ring f« The second shaft hole flows out into the second ring gap, and enters the external pipe through the first end of the external pipe, and then flows into the second circulation channel. A semiconductor process object processing device according to claim 34, characterized in that: the second cycle The channel includes a second cooling groove on the outer cover, the second cooling groove of the second sea is disposed around the sealing element near the first outer cover, and the second cooling groove is disposed at different positions—the second cooling groove inlet hole and the second cooling groove water outlet hole. Wherein, the water inlet of the second cooling tank is connected with the second end of the external pipeline, and the water outlet of the second cooling tank is connected with an external output tube for discharging the cooling liquid. 36.1 semiconductor processing object processing devices, including at least the semiconductor process : a processing chamber, a processing chamber is provided with a plurality of semiconductor process object processing platforms 'per-semiconductor process article at the institutional process object, characterized in that: the film guides you, the Niu Niu conductor process object processing device: set with The number of semiconductor processing object processing platforms corresponds to a plurality of flat reading members' and each of the semiconductor processing object processing platforms is connected to a platform rotating member, so that each semiconductor processing object processing platform can be divided into: up ^ rotation, semiconductor processing object processing Device is also = semiconductor process object processing platform to maintain semiconductor process when moving =: internal cavity And a cooling device for ensuring a sealing member A, such as the semiconductor process article processing device of claim 36, characterized in that: 108l83-971014.doc 1306619 The semiconductor processing article processing platform is provided with a lower portion _ consisting of an elastic sealing ring and a bellows seal The sealing device for sealing the contact gap between the bellows seal and the bottom of the processing chamber of the semiconductor process article. 38. The semiconductor process article processing device of claim 37, wherein the bellows seal has a first portion The cover and the rotating shaft are provided with a magnetic sealing element between the first outer cover and the rotating shaft. When the rotating shaft rotates, the contact gap between the first outer cover and the rotating shaft is sealed. 39. The semiconductor process article processing apparatus of claim 38, wherein: a seal member is disposed between the first outer cover and the bellows seal to seal a contact gap between the first outer cover and the bellows seal. 40. The semiconductor process article processing apparatus of claim 36, wherein: the cooling device is a water-cooled conduit. 41. The semiconductor process article processing apparatus of claim 40, wherein the cooling device is a cooling tunnel, the cooling passage package (four) - a circulation passage and a second circulation passage - wherein the first circulation passage is disposed on the rotation shaft The portion of the disk sealing member is adjacent to the side wall of the rotating shaft; the second circulating passage is disposed at a portion of the first outer cover and the sealing member, and the first passage and the second circulating passage are connected by an external pipe. 42. The semiconductor process article processing skirt of claim 41, wherein the periphery of the rotating shaft is further provided with a second outer cover, and a plurality of mutually sealing elements are disposed between the second outer cover and the rotating shaft, wherein adjacent A first ring gap and a second ring gap are respectively formed between the sealing elements. 43. The semiconductor process article processing apparatus of claim 42, wherein the first ring gap is connected to the first circulation channel and an external cooling source 108183-971014.doc 1306619, and the coolant of the external cooling source is borrowed Thereby the first ring gap enters the first circulation channel. 44. The semiconductor process object processing apparatus of claim 43, wherein: the first circulation channel is in communication with the second ring gap, and one end of the external pipe is also located in the second ring gap, by the second ring gap The coolant in the first circulation channel can be transferred to the outer channel, and then flow to the second circulation channel. R-type semiconductor process object processing method, including multiple semiconductor process objects respectively placed in a plurality of semiconductor plastics @ κ _ The processing device of the semiconductor material processing unit is processed, and during the processing, the plurality of semiconductor processing articles are processed and heated to uniformly process the semiconductor processing article, such as the semiconductor processing article processing method of claim 45, The plurality of semiconductor process object processing platforms are synchronously rotated 108183-971014.doc