1306389 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種軟板製造方法及其軟板結構，尤指防EMI的軟 板製造方法及其軟板結構。 【先前技術】 良好的接地對電磁場有很好的鮮作用，喊釋放設備機殼上累 積的大量電荷’從而避免産生靜電放電效應。換句話說，合理地 j用接地技術，就能大大提高系統的抗干擾能力，減少咖。一般 來說’在電子設備中地線結構大致有系統地、機殼地（遮罩地）、 數位地（邏輯地）和類比地等。 對於大1破使用在各類電子設備巾的雖電路板，线也必須考 慮到防EMI的設計。為了滿足軟板對防腿的需求，已有廠商提 =中華民國專利公告號第32_號「軟性電路板之聰防制方 ’其主要是在軟板中印刷導電膠(銀膠）而達到接地的目的。 =，讓軟板可以電性連接至其他電子元件(例如服封裝的晶 些接點均是設計在軟板的表面上，而非軟板的内部。然而， 又軟板防EMI設計只能賴軟板⑽的電路，而無法保護到曝 2防EMI的設計之外的接點，故不論是上述的_手段或其 有做去，均沒有將接'點的部分納入防EMI的設計之中，形成 .1306389 防Μ的死角。此外，為連接電子元件時在上述接點所填入的錫 =齡，也和接點同樣曝露在防ΕΜΙ的設計之外，使得 類軟板的電子裝置仍無法完全地防腿。 此外’-般軟板的箱銅層太厚而不容易製作出足夠細的線路 ㈣要使好層板來滿錢雜線路的絲，但卻因為每層軟 大置使用了枯合膠’使得軟板不再錄，反而變得有點硬，失去 了軟板應有.的錄概。本發明的特色為使恥膠薄銅，且線路 設計於第二層及第三層，仍猶_的細線路能力及不被導通孔 的鍵銅製程所影響而增厚’因此也可減少多層板的使用層數。 【發明内容】 ^發明之主要目的在提供—種本發明防咖的軟板製造方法及其 :板結構’其藉著賴無膠銅荡板的銅笛、基板而曝露出位在軟 板内部的線路，並絲這個線路為用來接受焊接的接點，使得接 7再曝露在軟板外部，⑽得是在軟油部，使得軟板本身防 EMI的设計更能涵蓋到此接點、錫球。 ^於上述目的，本發明防EMI的軟板製造方法及其軟板結構，四 曰的無膠銅箱賴合成的結構’線路集中在第二層及第三層，上 :兩面的第—層及第四層為接地層。使用鱗的鋪（具有兩種形 盆方式’其-為在聚亞酿胺的表面上顧_層薄金屬及鑛薄銅， 二為制_並於絲塗佈—層聚亞_)取代傳統的有膠銅 • 1306389 箔（將銅箔與聚亞醯胺以膠層粘合），線路集中在第二層及第三 - 層，第一層及第四層則設計為接地層並可分別與其它各層連接（以 . 雷射或沖孔或化學侧做出導通孔，可為盲孔或通孔），元件開口 •區域則以化學方式分別姓刻銅羯及聚亞酿胺而露出第二層及第三 •層的線路(屬於元件開口區域），且線路周圍仍穩固地被枯著物質 固定住。藉此，用來接受填入錫膏或錫球的線路，就能變成在軟 擊板内部’這使得軟腿的設計更能涵蓋到所有的元件接點。 關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得 到進一步的瞭解。 ’ 【實施方式】 多1第ΙΑ 1H圖，第ία〜1H圖為本發明防的軟板製造方法 之不忍圖。如第1A〜1E圖所示之製程大致上仍和習知軟板製造方 _ =相仿，但如第1IMH圖所示之製程則屬本發明防EMI的軟板製 ""方法的主要製程’因此底下先說明如第ΠΜΗ圖所示之製程， 再說明第1A〜1£：_示之製程。 '〜 本&明防腹I的軟板製造方法及其軟板結構，其主要 =者如第1F圖所示钱刻無膠銅紐Π)的銅箱1Gb、基板10a而曝 出位在軟板内部的線路16，並定義這個線路16為用來接受填入 而變^圖^斤不之锡球28的接點，使得此接點不再曝露在軟板外部， Λ ^ 軟板内部，使得軟板本身防ΕΜΙ的設計更能涵蓋到此 1306389 接點、錫球28。至於無膠崎板1G的形成方法，可大致分為兩種 形成方式，其-為在聚亞酸胺的基板1Ga的表面上錢鐘一層薄金 屬及鐘薄銅，其二為使用銅落10b、1〇c並於表面塗佈 胺的10a。 上 且 7 1F圖所示’本發明_的軟板製造方法及其軟板結構，在 一無膠域板收雜也可以是第二無膠嶋板12)的線路Μ 上，具有曝露出線路16(尤其是屬於接點者)的元件開口區域Μ， 線路16仍穩固地被枯著物質1〇固定住。 ^24_化學方式分職刻銅箱1%及聚亞酿胺的基 a而露出第二層及第三層的線路(屬於元件開^區域⑷，且 =6周__卿崎。具峨，元件開口區 Hi形成:則主要藉著侧第一無膠_板ifl(當然也可以是 —無膠銅4板12)中未被圖荦化 銅細彳μ 、以及侧第-無膠 …板10基板1Ga。在侧基㈣時 能力的_，而他仏士 _ 貝使用”有選擇性钱刻 的W❿再蝕刻時選擇地蝕刻基板伽 開口區域24底部的線路16、_ 不湖到凡件 飯刻藥液，含有已醇胺及題。 _可為熟知的Π 具體來說’在實際進行侧前 可《是第二無膠鋼箱板⑵的線tr’t; =Γ0(當然也 路16,然後細進行侧—鱗鋼;成接點的線 笛10b '以及餘刻第—無膠銅笛板1〇的 :皮圖案化的鋼 的基板10a ’直到曝露出屬 .1306389 於接點的線路16 ’而形成元件開α區域24。 ，成το件開σ區域24後，仍需要如第π圖所示在第—無 泊板10或/和第二無膠銅箔板12中未被，”、5 即 白㈣中未被圖案化的銅笛10b、l2b(亦 1如楚 進行圖案化出線路16)上形成絕緣層沈。铁 <，弟1好圖所示於元件開口區域財填入锡膏找至屬於接、 的線路16上，而可透過錫膏跗 ' ” 注意的是，.上述所形細緣層26仰、=73G。需特別 16 啄層仏卻刀遮敝住屬於接點的線路 件只能形成在第—無膠鋼箱板10的表面上。, 過來簡單^十t涵盖到此接點、錫球谭點28。底下，將回 如第1E圖所示之習知軟板結構。 如第1A圖所示，首先提供静 , 雙面上均具有域⑽、H)e、l2b、12c 的弟一無_驗1G、第二鱗輔板 著物質14b、⑷且含有基板丨㈣雙崎板t 無膠_板1Q、第二無膠_板i2並非湘勝質 =:，，，而是利用表面處理後電鍍形 成銅泊 10b、10c、12b、l?r>，4 @ /_ 第一…、膠鋼箔板10、第二無膠銅 箔板12上的銅箔i〇b、1〇e、i2b 基於厚度較薄的銅lQb、咖12<： ’可以輕易地控制成較薄。 很容易的，也比較不需製作多 ^ ’要製作出細線路會是 第二無膠銅謂板12本身 曰力—於第—無膠銅落板！〇、 此種軟板也不會有變硬的問題。易讓體變硬的齡膠’故 在提供了上述第-無膠鋼箱板1〇 板14之後，如第1B圖所干^_ / —^鋼治板12、雙面枯著 笛板12其中之-的_上^苐—無膠鱗板1G、第二無谬鋼 進行圖案化，㈣輕， 製作出線路16之後，則如第lc圖所 鋼箱板10、第二無膠銅箱板12分別面對雙面一無膠 第二•二=:使 传線路16的如細缝17中充滿枯著物質他。 起而使 ;=D圖所示貫通第一無膠鋼_、雙面_14、 m聽，然 =E圖所不在第一貫通孔咖、第二貫 成金屬22a、22b，以電性連接^ ㈣面上开ν ㈣中未被咖動、第二無膠銅 圖案化出線路16)。 0bl2b(亦即未如第π圖所示進行 具體實施例之詳述，係希望能更加清楚描述本發明 精神’而鮮赴騎縣触佳具財_來對本發 1306389 【囷式簡單說明】 第1A〜1H圖為本發明防EMI的軟板製造方法之示意圖。 I 【主要元件符號說明】 1〇第一無膠銅箔板 12第二無膠銅箔板 14雙面粘著板 l〇a、12a、I4a 基板 l〇b、l〇c、12b、12c 銅箔 14b ' 14c粘著物質 φ 16線路 17細縫 20a第一貫通孔 20b第二貫通孔 22a、22b 金屬 24元件開口區域 26絕緣層 28锡球 11 1306389 30電子元件1306389 IX. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a flexible board and a soft board structure thereof, and more particularly to a method for manufacturing a soft board for preventing EMI and a soft board structure thereof. [Prior Art] Good grounding has a very good effect on the electromagnetic field, and the large amount of charge accumulated on the casing of the device is released to avoid the electrostatic discharge effect. In other words, reasonable grounding technology can greatly improve the system's anti-interference ability and reduce coffee. In general, the ground structure in an electronic device is generally systematic, chassis (masked), digitally (logically), analogously, and the like. For large circuit boards that are used in various types of electronic equipment, the line must also consider the design of anti-EMI. In order to meet the demand for anti-legging of soft board, the manufacturer has mentioned that the Republic of China Patent Bulletin No. 32_ "Secret of the flexible circuit board" is mainly produced by printing conductive adhesive (silver glue) in the soft board. Grounding purpose =, allows the soft board to be electrically connected to other electronic components (for example, the crystal contacts of the service package are designed on the surface of the soft board, not the inside of the soft board. However, the soft board prevents EMI The design can only rely on the circuit of the soft board (10), and can not protect the contact outside the design of the exposure 2 EMI. Therefore, no matter the above-mentioned means or its work, the part that is connected to the point is not included in the EMI prevention. In the design, the corner of the .1306389 is formed. In addition, the tin filled in the above contact for connecting the electronic components is also exposed to the tamper-proof design as the contact, making the soft board The electronic device still can't completely prevent the leg. In addition, the copper layer of the soft board is too thick and it is not easy to make a thin enough line. (4) To make the layer of the board full of wires, but because of each layer Soft and large use of the dead glue 'so that the soft board is no longer recorded, but instead become Hard, lost the record of the soft board should be. The invention is characterized by the thin plastic copper, and the circuit is designed in the second layer and the third layer, still the fine line capacity and the key that is not the through hole The thickness of the multi-layer board is also reduced by the influence of the copper process. [The present invention] The main object of the invention is to provide a method for manufacturing a soft board for preventing coffee according to the present invention and a board structure Lay the copper flute and the substrate without glue copper plate to expose the line inside the soft board, and the wire is used to accept the joint of the welding, so that the connection 7 is exposed to the outside of the soft board, (10) is soft. The oil part makes the anti-EMI design of the soft board more cover the solder joint and the solder ball. ^ The above-mentioned purpose, the EMI-proof soft board manufacturing method and the soft board structure thereof, the four-layer glueless copper box Lai synthetic structure 'line is concentrated in the second and third layers, upper: the first layer and the fourth layer on both sides are grounding layers. The use of scales (with two basins) - it is in the poly On the surface of the amine, the thin metal and the thin copper are used, and the second is replaced by the silk coating layer. The traditional copper-clad 1306389 foil (bonding copper foil to polyamine) is layered on the second and third layers. The first and fourth layers are designed as ground planes. Connected to other layers separately (by laser or punch or chemical side to make vias, which can be blind holes or through holes), the element opening and area are chemically exposed by copper and polyamine The second and third layers of the line (belonging to the open area of the component), and the line is still firmly fixed by the dead material. Thus, the line for filling the solder paste or the solder ball can become The interior of the soft-saws' allows the design of the soft legs to cover all of the component contacts. The advantages and spirit of the present invention can be further understood by the following detailed description of the invention and the accompanying drawings. 】 1 1ΙΑ1H diagram, the ία~1H diagram is an unbearable picture of the method for manufacturing a soft board according to the invention. The process shown in Figures 1A to 1E is still substantially similar to the conventional soft board manufacturer _ =, but the process shown in the 1st IMH diagram is the main method of the EMI-resistant soft board system of the present invention. Process 'Therefore, the process shown in Figure 先 will be explained first, and then the process of 1A~1: _ shows. '~ This & Ming anti-abdominal I soft board manufacturing method and its soft board structure, the main = as shown in Figure 1F, the copper box 1Gb, the substrate 10a exposed The line 16 inside the flexible board, and defines this line 16 as the contact point for accepting the solder ball 28 which is filled and replaced, so that the contact is no longer exposed outside the soft board, Λ ^ inside the soft board The design of the soft board itself is more resistant to the 1306389 contact and solder ball 28. As for the formation method of the non-adhesive sheet 1G, it can be roughly divided into two formation modes, which are a thin metal and a thin copper on the surface of the substrate 1Ga of the polyimidate, and the second is the use of the copper drop 10b. , 1〇c and coated with 10a of amine on the surface. The soft board manufacturing method of the present invention and the soft board structure thereof shown in the figure 1F are arranged on the line Μ of the second glue-free board 12) in a glueless domain board, and have exposed lines. 16 (especially belonging to the contact) of the component opening area Μ, the line 16 is still firmly fixed by the dry matter 1〇. ^24_Chemical way to divide the copper box 1% and the base a of the poly-branched amine to expose the second layer and the third layer of the line (belonging to the component opening area (4), and = 6 weeks __ qingqi. The component opening area Hi is formed: mainly by the side first glue-free board ifl (of course, it can be - no glue copper 4 board 12), and the copper-free 彳μ, and the side-no glue... The board 10 substrate 1Ga. The ability of the side base (four) _, while his gentleman _ shell uses "selectively engraved W ❿ re-etching selectively etches the bottom line of the substrate gamma open area 24, _ no lake to A meal engraved liquid containing amino alcohol and the title. _ can be well-known Π Specifically, 'before the actual side can be "the second glue-free steel box board (2) line tr't; = Γ 0 (of course also Road 16, then finely carry out the side-scale steel; the wire flute 10b' of the joint and the remaining - the second copper-free flute plate: the leather patterned steel substrate 10a' until exposed to the genus .1306389 The line 16' of the point forms the element opening alpha region 24. After the σ region is opened, it is still required to be in the first non-parking plate 10 or/and the second glueless copper foil plate 12 as shown in Fig. π. No," 5, that is, white copper (4) unpatterned copper flutes 10b, l2b (also 1 such as Chu patterned circuit line 16) formed an insulating layer sink. Iron <, brother 1 good picture shown in the component opening area Into the solder paste to find the line 16 belonging to the connection, and through the solder paste 跗 ' ” Note that the above-mentioned shape of the thin layer 26 up, = 73G. Need a special 16 啄 layer but the knife concealed The line component of the joint can only be formed on the surface of the first rubber-free steel box plate 10. It is simple to cover the contact point and the solder ball tan point 28. Underneath, it will return as shown in Figure 1E. Conventional soft board structure. As shown in Figure 1A, the first is provided with static, both sides of the domain (10), H)e, l2b, 12c, the brothers have no _ test 1G, the second scale auxiliary board material 14b, (4) And containing the substrate 四 (4) Shuangqi board t no glue _ board 1Q, the second no glue _ board i2 is not Xiang Sheng quality =:,,, but by surface treatment after plating to form copper poise 10b, 10c, 12b, l?r> ;, 4 @ /_ first..., rubber steel foil board 10, copper foil i〇b, 1〇e, i2b on the second glueless copper foil board 12 based on thin copper lQb, coffee 12<: ' Can be easily controlled to be thinner. It's easy, and it doesn't need to make more than one. 'To make a fine line, it will be the second glueless copper. The board itself is the same. - The first - no glue copper drop board! 〇, this kind of soft board will not change. Hard problem. It is easy to let the body harden the ageing rubber. So after providing the above-mentioned first-non-adhesive steel box plate 1 〇 plate 14, as shown in Figure 1B, ^_ / ^^ steel plate 12, double-sided dry The flute 12 of which is - _ upper ^ 苐 - without the jellyboard 1G, the second flawless steel is patterned, (four) light, after the line 16 is produced, then the steel box 10 as in the lc figure, the second no The copper-clad box 12 faces the double-sided one without glue, and the second and second=: the gaps 17 of the transmission line 16 are filled with dry matter. As shown in the figure below, the first non-adhesive steel _, the double-sided _14, m is heard, but the E-picture is not in the first through hole, the second through metal 22a, 22b, and is electrically connected. ^ (4) On the surface of the opening ν (four) is not coffee, the second glueless copper pattern out the line 16). 0bl2b (that is, the detailed description of the specific embodiment is not as shown in the figure π, and it is hoped that the spirit of the present invention can be more clearly described] and the freshly-supplied to the county has a good fortune _ to the present 1306389 [simple description of the 】] 1A~1H is a schematic diagram of a method for manufacturing an anti-EMI soft board according to the present invention. I [Description of main component symbols] 1〇First glueless copper foil board 12 second glueless copper foil board 14 double-sided adhesive board l〇a 12a, I4a substrate l〇b, l〇c, 12b, 12c copper foil 14b' 14c adhesive substance φ 16 line 17 slit 20a first through hole 20b second through hole 22a, 22b metal 24 element open area 26 insulation Layer 28 solder ball 11 1306389 30 electronic components