B04996 五、發明說明（1) 發明領域 本發明係有關於一種半導體積體電路（integrated circuits，ICs)製程機台（process t〇〇is),特別是有關 於種半導體晶圓儲存之容器組件（p〇d assembly)，能夠 有效地避免半導體晶圓之表面氧化，進而提昇半導體裝置 的性能。 相關技術之描述 標準機械界面（standardized mechanical interface，SMIF)系統能夠減少在儲存與運送半導體晶圓 至半導體製程機台過程的顆粒流量，例如美國專利4, 532, 970以及4，534，389，所揭露者。 再者，通常為了運送半導體晶圓sSMIF箱具（p〇d)以 及製私機台之間，必名苜以人丁斗、& I A 上 π & # # ^ 乂肩以人工或自動的方式將箱具裝載於 =機台前方的裝載開口(1〇ad p〇r〇。而製程機台 疋二有—存取開口（access P〇rt)，當箱具卸下時，此 接'開了開口門(port d〇〇r)覆复著，上述開口門(p〇rt 暴露於半導體工廠環境的外部表面；以及部 甚+ p# 封境的内部表面。當smif箱具設 接著I 8# ^ 口時，箱具門（P〇d d00r)與開口門彼此鄰B04996 V. INSTRUCTION DESCRIPTION (1) FIELD OF THE INVENTION The present invention relates to a semiconductor integrated circuit (ICs) process, particularly to a container assembly for semiconductor wafer storage ( P〇d assembly) can effectively avoid surface oxidation of the semiconductor wafer, thereby improving the performance of the semiconductor device. Description of the Related Art Standardized mechanical interface (SMIF) systems are capable of reducing the flow of particles during the process of storing and transporting semiconductor wafers to semiconductor processing machines, such as U.S. Patents 4,532,970 and 4,534,389. Revealed. In addition, usually in order to transport the semiconductor wafer sSMIF box (p〇d) and between the private machine, it must be named 人 、, & IA π &## ^ 乂 shoulder manually or automatically The method is to load the box on the loading opening in front of the machine (1〇ad p〇r〇. The process machine has two access ports (access P〇rt), when the box is removed, this connection] Opened the opening door (port d〇〇r), the open door (p〇rt exposed to the outer surface of the semiconductor factory environment; and the inner surface of the +p# enclosure. When the smif box is set to follow I 8# ^ mouth, the box door (P〇d d00r) and the open door next to each other
Si姑^ 開口門上方的對準栓具㈤―t =被緊费地咬合於設置在箱具門㈤化⑻上方的孔 >I3J 。 又，近年來，低阻值與低電子遷移Si Gu ^ Alignment bolt above the opening door (5) - t = is tightly bitten into the hole > I3J placed above the box door (5) (8). Also, in recent years, low resistance and low electron mobility
1304996 五、發明說明（2) * (Electr〇-migrati〇n)之銅金屬導線（c〇pper Hne)已漸漸 地取代鋁銅金屬導線’以當作半導體元件之間的内連線， 然而已形成銅金屬導線的半導體晶圓在儲放於箱且（p〇d) 之中的等待時間，亦即業者常稱的"Q_time"，很容易在銅 金屬表面形成氧化銅（copper 〇xide)而使得阻值增加， 而影響半導體裝置的操作速度。 因此，有需要提供一種半導體晶圓儲存之容器組 ίΪίίυί導體晶圓之表面氧化的環境，進而提昇半 導體裝置的性能。 發明之概述及目的 根據上述目的，本發明提供一種半 a d〇〇D) ^ 放空氣的栓具，上述鈍氣容器組件包括二用來排 有至少一第一鈍氣孔與一第一空氣孔；一二，板，設 於上述第-絲’設有至少一第二鈍氣孔盥：；_反二：行 孔，分別對應於上述第一鈍氣孔與上述第二*，—工氣 罩，設置於上述第一底板上，且形成工氟孔；-外 半導體晶圓；當上述容器組件裝設且固儲存上述 的前板時，上述用來供應鈍氣的栓具穿裝載構件 與第二鈍氣孔，而上述用來排放空氣 ^第一鈍氣孔 孔。 具穿過第二空氣 再者，上述半導體晶圓儲存之容器 仵之中，鈍氣係 0725-7693TW(N) ; 1-02-003 ； Jessica.ptd 第5頁 _ 1304996 五、發明說明（3) 氮氣或是氬氣 由石Μ質；：半導體晶圓儲存之容器組件之中，外單係 應鈍=栓= = ;器組件之中，用來供 再者，上沭主：i 來排放空氣的拴具長。 隔板，β胃％ +導體晶圓儲存之容器組件，更~ #1304996 V. INSTRUCTIONS (2) * (Electr〇-migrati〇n) copper metal wire (c〇pper Hne) has gradually replaced aluminum-copper metal wire 'as an interconnect between semiconductor components, however The waiting time for the semiconductor wafer forming the copper metal wire to be stored in the box (p〇d), which is commonly referred to as "Q_time", easily forms copper oxide on the copper metal surface (copper 〇xide). This increases the resistance and affects the operating speed of the semiconductor device. Therefore, there is a need to provide a semiconductor wafer storage container group that oxidizes the surface of the conductor wafer, thereby improving the performance of the semiconductor device. SUMMARY OF THE INVENTION AND OBJECTS OF THE INVENTION In accordance with the above objects, the present invention provides a half-adhesive air-dissipating device, the air-blown container assembly comprising two for arranging at least one first obturator and a first air hole; One or two, the plate is disposed on the first wire-shaped portion provided with at least one second blunt hole 盥:; _ anti-two: row holes respectively corresponding to the first blunt hole and the second *, the hood, set On the first bottom plate, and forming a working fluorine hole; an outer semiconductor wafer; when the container assembly is installed and solidly storing the front plate, the above-mentioned plug for supplying the blunt gas is loaded with the loading member and the second blunt The vent is used to discharge the air first blunt hole. Passing through the second air, the semiconductor wafer is stored in the container ,, the blunt gas system is 0725-7693 TW (N); 1-02-003; Jessica.ptd page 5 _ 1304996 V. Invention description (3 Nitrogen or argon by stone enamel;: Among the container components of semiconductor wafer storage, the external single system should be blunt = plug = =; among the components of the device, for the other, the upper : main: i to discharge The cookware of the air is long. Separator, beta stomach% + conductor wafer storage container assembly, more ~ #
Pw极’设置於上诫笙 'Λ ΊΤ 旯包括—間 上述笛 货 第一底板與第二底板的兩側，用办~ 上述第一、第二底板。 J叩训，用來密封 第- Ϊ半導體晶圓儲存之容器組件之中，h 二鈍氣孔旁。 動擋板，分別設置於上述第-、第 再者’上述半導體晶圓儲存之容器 第三：動擋板，設置於上述空氣孔旁。、、巾，更包括 昍了讓本發明之上述和其他目的、特徵、和俱 月顯易懂，下文特舉一 #優點能更 詳細說明如下： Μ貫施例’並配合所附圖示，作 實施例 且组Ξ : ΐ :第'圖〜第4圖所示之之半導體晶圓儲存之r /、>上不思圖，以更詳細地說明本發明實施例。 目 請參照第1圖以及$3圖所示的半導體晶圓儲存抑 組件1〇〇，立主承白扭黎 谷益 八要匕括第一底板20、平行於第一底板2〇的 第一底板30、間隔板50，設置於上述第—底板2〇與第二 板30的兩側，用來密封上述第一、第二底板2〇、3〇，並且The Pw pole is disposed on the upper 诫笙 'Λ ΊΤ 旯 — Between the two sides of the first bottom plate and the second bottom plate, and the first and second bottom plates are used. J training, used to seal the container assembly of the first-thick semiconductor wafer, h next to the obtuse air hole. The movable shutters are respectively disposed on the first and second containers of the semiconductor wafer storage. The third movable shutter is disposed beside the air holes. The above and other objects, features, and advantages of the present invention are further described in the following description. The advantages of the present invention can be more fully described below as follows: The embodiment and the group Ξ: ΐ: The semiconductor wafer storage r /, > shown in Figs. 4 to 4 are not considered to explain the embodiment of the present invention in more detail. Please refer to the semiconductor wafer storage assembly 1 shown in FIG. 1 and FIG. 3, and the first substrate 20, the first bottom plate 30 parallel to the first bottom plate 2, a spacer 50 disposed on both sides of the first bottom plate 2 and the second plate 30 for sealing the first and second bottom plates 2, 3, and
0725-7693TWF(N) ; i_〇2-〇03 ; Jessica.ptd 第6頁 1304996 五、發明說明（4) 曰曰 形成一内部空間60。另外，半導體晶圓儲存之容器組件 100更包括一石英外罩110，設置於第一底板20以形成一 圓儲存空間120。 上述第一底板20設有一對第一鈍氣孔22與第一空氣孔 ’而第二底板30則是設有一對第二鈍氣孔32與一 ^二空 2氣孔34，分別對應於上述第一鈍氣孔22與上述第一空氣= 符號26、36表示鈍氣孔22、32用的活動檔板，分別設 置於鈍氣孔22、32的旁側，而符號28、38表示空氣孔24 °Γ 34用的活動擋板，分別設置於空氣孔24、34的旁侧。上述 活動擋板26、36、28、38根據鈍氣供應與否而決定開合二 第2圖顯示將半導體晶圓儲存之箱具組件1〇〇卡合;裝 載構件之前板40的卡合部位示意圖。上述前板4〇設有用來 供應氮氣、氦氣等鈍氣的栓具（1^11)42，與一用來排放空 氣的栓具44，其中用來供應鈍氣的栓具（pin)42的長度= 用來排放空氣的拴具44還長，以致於當上述容器組件ι〇〇 裝設且固定於上述裝載構件的前板料，上述用來供應純 乳的栓具42推動活動擋板26、36而穿過上述第一鈍氣孔。 與第二鈍氣孔32，最後停留在晶圓儲存空間12〇(如第】圖 所示）。而上述用來排放空氣的栓具44僅推開檔板38而穿 過第二空氣孔34，最後停留在内部空間6〇之中。 符號46表示供應鈍氣（氮氣）的管線，其連接於圖未 不的，氣供應系統，當鈍氣供應系統開啟供應開關，鈍 經由管線46以及栓具42供給於晶圓儲存空間12〇，形成—0725-7693TWF(N) ; i_〇2-〇03 ; Jessica.ptd Page 6 1304996 V. INSTRUCTIONS (4) 形成 An internal space 60 is formed. In addition, the semiconductor wafer storage container assembly 100 further includes a quartz outer cover 110 disposed on the first bottom plate 20 to form a circular storage space 120. The first bottom plate 20 is provided with a pair of first open air holes 22 and a first air hole ', and the second bottom plate 30 is provided with a pair of second open air holes 32 and a second air 2 air hole 34, respectively corresponding to the first blunt The air holes 22 and the first air = symbols 26, 36 indicate movable shutters for the blunt holes 22, 32, respectively disposed on the side of the blunt holes 22, 32, and the symbols 28, 38 indicate the air holes 24 ° Γ 34 The movable baffles are respectively disposed on the side of the air holes 24, 34. The movable baffles 26, 36, 28, 38 are determined according to the supply of the blunt gas or not. The second figure shows that the box assembly 1 for storing the semiconductor wafer is engaged; the engaging portion of the front plate 40 of the loading member schematic diagram. The front plate 4 is provided with a bolt (1^11) 42 for supplying an argon gas such as nitrogen gas or helium gas, and a bolt 44 for discharging air, wherein a pin 42 for supplying an blunt gas is provided. Length = the cooker 44 for discharging air is still long, so that when the above-described container assembly is mounted and fixed to the front sheet of the loading member, the above-mentioned bolt 42 for supplying pure milk pushes the movable shutter 26, 36 and pass through the first blunt hole. With the second blunt hole 32, it finally stays in the wafer storage space 12 (as shown in the figure). The above-mentioned plug 44 for discharging air only pushes the baffle 38 through the second air hole 34 and finally stays in the inner space 6〇. Reference numeral 46 denotes a line for supplying an off-gas (nitrogen) which is connected to the gas supply system. When the supply system of the air supply system is turned on, the blunt supply is supplied to the wafer storage space 12 via the line 46 and the bolt 42. form-
五、發明說明（5) 正壓，並且使得儲存於此的半導 符號48表示排放空氣的管線不易氧化。而 放系統，當鈍氣供應時，上述的正圖未顯示的空氣排 12〇内部的线等氣體推„板的壓/\以圓儲存空間 二底板30之間的内部*門Rfl 4第―底板20與第 放於空氣排=間6°’再經由栓具“以及管祕排 計ί Γ方面’第3圖係根據本發明實施例將半導體曰圓 第4圖顯示裝載構件的前板的 的栓具42、42與用來排放空氣 用來供應亂氣 構件的前板40之上方，％呈U:44千均地設置於裝載 叩至二角形地設置著。 發明特徵及功效 根據本發明實施例之半導體晶圓儲存之 ^ =避免半導體晶圓之表面：： 得在製程之間的等待時間Γ 了廿工間興％丨兄，使 金屬2不易氧化’心提昇半υ:,圓表面的銅 ::本發明已以較佳實施例揭露如上 限疋本發明，任何熟習 ：、：非用以 當可作更動與。因 虽視後附之中請專利範®所界定者為準。 遵|&圍 1304996V. INSTRUCTION DESCRIPTION (5) Positive pressure, and the semi-conductive symbol 48 stored therein indicates that the line for discharging air is not easily oxidized. And put the system, when the supply of the blunt gas, the above-mentioned positive map does not show the air line 12 〇 the internal line of the gas such as the pressure / \ to round the storage space between the two bottom plate 30 internal * door Rfl 4 - The bottom plate 20 is placed between the air trays and the air trays by 6°', and the second panel of the semiconductor device is shown in the fourth embodiment of the present invention. The plugs 42, 42 and the front plate 40 for discharging air for supplying the disorder member are provided with U: 44 thousand uniformly disposed on the loading jaw to the square shape. Inventive Features and Efficacy Semiconductor wafer storage according to an embodiment of the present invention avoids the surface of the semiconductor wafer:: Waiting time between processes Γ 廿 间 , , , , , , , , , , 金属 金属Lifting a half turn: copper on a round surface: The present invention has been disclosed in the preferred embodiment as the upper limit of the present invention, any familiarity:: not used as a change. This is subject to the definition of Patent Model®.遵|& Wai 1304996
第1圖係根據本發明實施例 、，且件不意圖。 卞守遛日日圓儲存之箱具 第2圖係根據本發明杏 組件卡合於^播,ΛΛ 1 +導體晶圓储存之箱且 3圖係根據本發明實施例將半導體曰圓 組件卸下於捉并碰L 干导體日日_储存之箱且 L固構件的第—底板與第二底板的示意圖 圖係裝载構件的前板的上視圖。 符號之說明 2〇〜第一底板； 22、32〜氮氣孔； 24、34〜空氣孔； 28、38〜空氣孔用檔板； 26、36〜氮氣孔用檔板；30〜第二底板； 5 〇〜間隔物； 4 0〜裝載構件的前板； 42〜用來供應氮氣的栓具（pin); 44〜用來排放空氣的栓具； 46〜供應氮氣的管線；48〜排放空氣的管線； 11 0〜石英外罩； 1 0 0〜半導體晶圓儲存之箱具組件； 6〇〜第一底板與第二底板之間的内部空間。Fig. 1 is an embodiment of the invention, and is not intended. Figure 2 is a box for storing Japanese yen storage according to the present invention. According to the present invention, the apricot component is engaged with the package, the ΛΛ 1 + conductor wafer storage box, and the figure 3 is for removing the semiconductor dome assembly according to the embodiment of the present invention. A top view of the front panel of the loading member of the L-conductor day-to-storage box and the first and bottom plates of the L-solid member. Description of the symbol 2〇~first bottom plate; 22, 32~nitrogen hole; 24, 34~ air hole; 28, 38~ air hole baffle; 26, 36~ nitrogen hole baffle; 30~ second bottom plate; 5 〇 ~ spacer; 4 0 ~ loading member front plate; 42 ~ used to supply nitrogen plugs; 44 ~ used to discharge air; 46 ~ nitrogen supply line; 48 ~ discharge air Pipeline; 11 0~ quartz cover; 1 0 0~ semiconductor wafer storage box assembly; 6〇~ internal space between the first bottom plate and the second bottom plate.