1304219 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種時脈控制裝置;且更特定言之,本發 明係關於一種能夠降低在導體記憶體之預充 用狀態中雙態觸發一内部時脈之電流消耗的技術。 【先前技術】 大體而言’同步於-時脈處理—半導體記憶體。已存在 對於高速運算記憶體之需要以便提高—記憶體系統之效 能。對於此高速運算而言,已試圖減少外部時脈震盈之數 目但同時增加了内部時脈轉變。然而,電流消耗歸因於半 導體記憶體内之時脈轉變而增加。因此,需要允許高速運 算但消耗低功率之記憶體特性。 圖1為一習知之普通時脈控制裝置組態的圖。 普通時脈控制裝置包括一設定電路10及一移位暫存器 20。設定電路10取決於一行位址選通(CAS)訊號CAsp而設 定一輸入位址Ai以提供一位址AYi。移位暫存器2〇具備串 聯連接之複數個D正反器DFF1至DFF4。D正反器DFF1至 DFF4同步於一内部時脈iCLK順序地執行位址AYi之一正反 運算以輸出一位址ΑΥΙ_χ。 如上組態之習知時脈控制裝置允許一與一外部時脈同步 輸入之訊號被識別為同步於一以低頻外部時脈操作之半導 體記憶體中的内部時脈iCLK。一同步於外部時脈之訊號的 輸入時序與一同步於内部時脈iCLK之訊號的識別時序之間 的時間間隔界定為一内部潛時。 112501.doc 1304219 特定言之,在諸如同步雙倍資料速率動態隨機存取記憶 體(DDR3 SDRAM)之記憶體中,使用者可適當地程式化且 利用取決於一時脈週期之内部潛時。 如圖2之一操作時序圖所示,在DDR3 SDRAM中,由一 啟用指令ACT之後的下一時脈CLK同步地輸入一寫入指令 WT且隨後在某一時間延遲後輸入資料。在輸入資料後, 在一實際DRAM之一核心區中進行一寫入操作。 在此情形中,一旦在實際DRAM之核心區中之寫入操作 之起始時刻輸入寫入指令WT,則必須饋入對應於内部潛 時之位址資料以便識別位址資料輸入。 為此目的,一旦輸入了寫入指令WT,則藉由回應於同 步於時脈CLK之CAS訊號CASP而觸發外部輸入位址Ai來輸 出位址AYi。接著,D正反器DFF1至DFF4順序地進行同步 於内部時脈iCLK觸發之位址AYi之正反運算,藉此輸出位 址AYI_x。意即,D正反器DFF1至DFF4根據同步於DRAM 之核心區中進行寫入操作時刻之時脈CLK啟用之CAS訊號 CASP—WT順序地進行位址AYi之正反運算。 然而,如上結構化之通用時脈控制裝置係藉由在並不顧 及晶片之當前狀態的情況下恆定地施加内部時脈iCLK至D 正反器DFF而操作。由於以上原因,電流消耗因為内部時 脈iCLK之週期性轉變而增加。 在如圖1所示僅操作一移位暫存器20的情況下,電流消 耗量為微小的。然而,由於實際DRAM應同時處理複數個 位址及指令訊號,故DRAM内存在大量如圖1所描繪之此 112501.doc 1304219 種組態的電路。因λ,習知裝置之—缺點在於電流消耗隨 記憶體之速度而增加。 & 【發明内容】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clock control device; and more particularly, to a method capable of reducing a two-state trigger in an internal state of a conductor memory. The technology of current consumption of the clock. [Prior Art] Generally speaking, 'synchronous-clock processing-semiconductor memory. There is a need for high speed computing memory to improve the performance of the memory system. For this high speed operation, an attempt has been made to reduce the number of external clock surges but at the same time increase the internal clock transition. However, the current consumption is increased due to the clock transition in the semiconductor memory. Therefore, there is a need for memory features that allow for high speed operation but consume low power. 1 is a diagram of a conventional clock control device configuration. The conventional clock control device includes a setting circuit 10 and a shift register 20. The setting circuit 10 sets an input address Ai to provide a bit address AYi depending on a row address strobe (CAS) signal CAsp. The shift register 2 has a plurality of D flip-flops DFF1 to DFF4 connected in series. The D flip-flops DFF1 to DFF4 sequentially perform one of the forward and reverse operations of the address AYi in synchronization with an internal clock iCLK to output the address ΑΥΙ_χ. The conventional clock control device configured as above allows one and an external clock to be synchronized to input a signal that is recognized as being synchronized to an internal clock iCLK in a semiconductor memory operating at a low frequency external clock. The time interval between the input timing of the signal synchronized to the external clock and the identification timing of the signal synchronized to the internal clock iCLK is defined as an internal latency. 112501.doc 1304219 In particular, in a memory such as a synchronous double data rate dynamic random access memory (DDR3 SDRAM), the user can properly program and utilize the internal latency that depends on a clock cycle. As shown in an operation timing chart of Fig. 2, in the DDR3 SDRAM, a write command WT is synchronously input by the next clock CLK after the enable command ACT and then data is input after a certain time delay. After inputting the data, a write operation is performed in one of the core areas of an actual DRAM. In this case, once the write command WT is input at the start of the write operation in the core area of the actual DRAM, the address data corresponding to the internal latency must be fed in order to identify the address data input. For this purpose, once the write command WT is input, the address AYi is output by triggering the external input address Ai in response to the CAS signal CASP synchronized to the clock CLK. Next, the D flip-flops DFF1 to DFF4 are sequentially synchronized with the forward and reverse operations of the address AYi triggered by the internal clock iCLK, thereby outputting the address AYI_x. That is, the D flip-flops DFF1 to DFF4 sequentially perform the forward and reverse operations of the address AYi in accordance with the CAS signal CASP_WT enabled in synchronization with the clock CLK at the time of the write operation in the core region of the DRAM. However, the above-described structured general-purpose clock control apparatus operates by constantly applying the internal clock iCLK to the D flip-flop DFF regardless of the current state of the wafer. For the above reasons, the current consumption increases due to the periodic transition of the internal clock iCLK. In the case where only one shift register 20 is operated as shown in Fig. 1, the current consumption amount is minute. However, since the actual DRAM should process multiple address and command signals simultaneously, there are a large number of circuits in the DRAM that are configured as shown in Figure 1. A disadvantage of conventional devices due to λ is that current consumption increases with the speed of the memory. & [Summary content]
因此,本發明之一主要目的為提供一種能夠藉由控制時 脈以僅在一半導體記憶體之一啟甩狀態中雙態觸發一内部 時脈來降低在一預充電/待用狀態中雙態觸發一内部時脈 之電流消耗的技術,該啟用狀態允許在一内部潛時之後施 加外部輸入之指令訊號及位址至一核心。 根據本發明之一態樣,提供一種時脈控制裝置,其包 括:-設定電路’其用於回應於—内部指令訊號而觸發一 輸入位址以輸出一第一位址;一移位暫存器,其包括串写 連接之複數個正反器,其中該等正反器中之一些同步於— 内部時脈執行該第一位址之一正反運算以提供一第二 址,且剩餘正反器同步於一同步時脈順序地進行該第二{ 址之一正反運算以產生一内部位址;一啟用訊號產生器, 其用於基於-指#每-組是否被啟動之啟用㈣訊號之狀 態及一預充電控制訊號而輸出一啟用訊號;及一時脈產生 器,其用於取決於該内部時脈及該啟用訊號而產生該同步 時脈。 根據本發明之另一態樣,提供一種時脈控制裝置,其包 括.°又疋電路,其用於回應於一内部指令訊號而觸發一 輸入位址以輸出—第—位址;_移位暫存器,#包括串聯 耦接之複數個正反器,其中該等正反器中之一些同步於一 内部時脈進行言亥第一位址之一正反運算以⑹共—第二位 iS·. 112501.doc 1304219 址,且剩餘正反器同步於一同步時脈順序地執行該第二位 址之一正反運算以產生一内部位址;一啟用訊號產生器, 其用於基於一指示每一組是否被啟動之啟用控制訊號之狀 態及一預充電控制訊號而輸出一啟用訊號;一正反器,其 用於同步於該内部時脈執行該啟用訊號之一正反運算以提 供一延遲啟用訊號;及一時脈產生器,其用於取決於該内 部時脈及該延遲啟用訊號而產生該同步時脈。SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a method for reducing a state in a precharge/standby state by controlling a clock to toggle an internal clock in only one of the semiconductor memory states. A technique that triggers current consumption of an internal clock that allows an externally input command signal and address to be applied to a core after an internal latent time. According to an aspect of the present invention, a clock control apparatus is provided, comprising: a setting circuit for triggering an input address in response to an internal command signal to output a first address; a shift temporary storage The device includes a plurality of flip-flops connected in series, wherein some of the flip-flops are synchronized with - the internal clock performs one of the first addresses to provide a second address, and the remaining The counter synchronizes with a synchronization clock to sequentially perform a forward and reverse operation of the second address to generate an internal address; an enable signal generator for enabling the activation based on the - finger # per group (4) And outputting an enable signal to the state of the signal and a precharge control signal; and a clock generator for generating the synchronization clock depending on the internal clock and the enable signal. According to another aspect of the present invention, a clock control apparatus is provided, comprising: a 疋 circuit for triggering an input address in response to an internal command signal to output - a first address; The register includes a plurality of flip-flops coupled in series, wherein some of the flip-flops are synchronized with an internal clock to perform one of the first addresses of the first address, and (6) a total of - the second bit iS.. 112501.doc 1304219 address, and the remaining flip-flops sequentially perform one of the second address forward and reverse operations in synchronization with a synchronization clock to generate an internal address; an enable signal generator for An enable signal is outputted as a status of the enable control signal indicating a start of each group and a precharge control signal; a flip flop for synchronizing the one of the enable signals with the internal clock to perform a forward and reverse operation Providing a delay enable signal; and a clock generator for generating the synchronization clock depending on the internal clock and the delay enable signal.
【實施方式】 下文將參看隨附圖式詳細陳述本發明之一較佳實施例。 圖3為說明根據本發明之一時脈控制裝置之一組態的方 塊圖。 本發明之時脈控制裝置包含一設定電路丨〇〇、一移位暫 存器200、一啟用訊號產生器300及一時脈產生器4〇〇。 具體而言’設定電路100回應於一 CAS訊號CASP而觸發 一輸入位址Ai以提供一位址AYi。移位暫存器200包括串聯 耦接之複數個D正反器DFF1至DFF4。 在複數個D正反器DFF1至DFF4之中,D正反器DFF1同步 於一内部時脈iCLK,進行位址AYi之正反運算以輸出一位 址Ayi一a。D正反器DFF2同步於内部時脈iCLK,執行位址 Ayi—a之正反運算以提供一位址Ayi_b。且D正反器DFF3及 DFF4同步於一同步時脈SCLK,執行内部位址Ayi_b之正反 運算以產生一内部位址AYI_x。 啟用訊號產生器300基於一啟用訊號ACTP<0:i>& —預充 電控制訊號?00卩<0:丨>產生一啟用訊號RATVD,其中該啟 112501.doc 1304219 用訊號指示記憶體處於一啟用狀態。時脈產生器400取決 於内部時脈iCLK及啟用訊號RATVD產生同步時脈SCLK。 圖4為圖3所示之設定電路1〇〇的詳細電路圖。 如圖4所提供’設定電路1 〇 〇具備一傳輸閘τ 1及多個反相 器IV1至IV5。具體言之,傳輸閘T1用以基於CAS訊號 CASP及藉由反相器IV1反相之一 CAS訊號CASP而選擇性地 輸出輸入位址Ai。反相器IV3及IV4鎖存傳輸閘T1之輸出訊 號長達一預設時間。反相器IV5反相包含反相器IV3及IV4 之鎖存器的輸出以產生一内部位址AYi。 圖5展現圖3所示之移位暫存器2〇〇的詳細電路圖。 每一 D正反器DFF包括傳輸閘T2及T3以及複數個反相器 IV6至IV10。傳輸閘T2回應於内部時脈iCLK及藉由反相器 IV6反相之一内部時脈iCLK而選擇性地輸出内部位址 AYi。反相器IV7及IV8鎖存傳輸閘T2之輸出訊號一預定時 間。 傳輸閘T3基於内部時脈iCLK及藉由反相器IV6反相之内 部時脈iCLK與傳輸閘T2同時運算以選擇性地控制包含反 相器IV7及IV8之鎖存器的輸出。一包含反相器IV9及IV10 之鎖存器鎖存傳輸閘T3之輸出以提供一輸出訊號OUT。 圖6提供圖3所描繪之啟用訊號產生器300的詳細電路 圖。 啟用訊號產生器300包括複數個啟用控制器310至330及 一邏輯運算器340。啟用控制器310至33〇中之每一者分別 邏輯地運算一啟用控制訊號ACTP<0:i>及一預充電控制訊 112501.doc 1304219 號PCGP<0:i>。複數個啟用控制器310至330具有相同組 態;且因此下文僅詳細描述一控制器3 10。 如圖6所示,啟用控制器310具有一反相器ivil及 NAND(「反及」)閘ND1及ND2。NAND閘ND1進行藉由反 相器IV11反相之一啟用控制訊號八(:丁?<0>與NAND閘ND2 之一輸出的一 NAND運算。NAND閘ND2執行預充電控制 訊號PCGP<0>與NAND閘ND1之輸出的一NAND運算。 邏輯運算器340包括一 NOR(「或非」)閘NOR1及一反相 器IV12。NOR閘NOR1對複數個啟用控制器310至330之輸 出執行NOR運算。反相器IV12反相NOR閘NOR1之輸出以 產生一啟用訊號RATVD。 圖7為圖3所示之時脈產生器400的詳細電路圖。 如圖7所示,時脈產生器400裝備有一NAND閘ND3及一 反相器IV13。NAND閘ND3對内部時脈iCLK及啟用訊號 RATVD作用一 NAND運算。反相器IV13反相NAND閘ND3 之輸出以提供同步時脈SCLK。 將參看圖3至圖7及圖8所示之操作時序圖來詳細描述如 上組態之本發明的操作。 首先,設定電路100在CAS訊號CASP啟動時同步鎖存一 時脈訊號CLK輸入的輸入位址Ai,以輸出位址AYi。藉由 一内部指令訊號、寫入或讀取指令所產生之CAS訊號CASP 來感測外部輸入位址Ai。 接著,移位暫存器200同步於内部時脈iCLK進行位址 AYi之一正反運算以輸出内部位址Ayi_b且同步於同步時脈 U250l.doc -10- 1304219 SCLK對位址Ayi—b順序地作用一正反運算以提供内部位址 AYI_x 〇 在一多組DRAM中,可對每一組進行一啟用操作。因 此,啟用訊號產生器300具備用於控制該等組中之每一者 之啟用狀態資料的複數個啟用控制器310至330。 此啟用訊號產生器300邏輯地運算啟用訊號人(:丁?<0」>與 預充電控制訊號PCGP<0:i>$之每一者以提供指示記憶體 處於一啟用狀態的啟用訊號RATVD。因此,若所有組均處 於預充電狀態,則啟用訊號RATVD為邏輯低,且若該等組 中之任一者處於啟用狀態,則啟用訊號RATVD被啟動為邏 輯高。 接著,時脈產生器400基於時脈訊號RATVD及内部時脈 iCLK產生同步時脈SCLK。換言之,若啟用訊號RATVD處 於啟動狀態,則同步於内部時脈iCLK輸出同步時脈 SCLK。 本發明取決於内部時脈iCLK與同步時脈SCLK兩者而控 制移位暫存器200之操作。意即,藉由表示外部啟用指令 之啟用控制訊號ACTP來啟動該啟用訊號RATVD。因此, 一旦高速運算,則與輸入啟用控制訊號ACTP之時脈CLK 相隔的内部延遲時間擴展至一延長時脈t A。 因此,為了降低電流消耗,僅在彼時刻之後產生僅在晶 片處於啟用狀態時運算的同步時脈SCLK。若藉由與同步 時脈SCLK同步來控制移位暫存器200之所有D正反器DFF1 至DFF4,貝第一 D正反器DFF1感測内部位址AYi,該内部 112501.doc -11 - 1304219 位址AYi為由在延遲時間tA之後所產生之同步時脈SCLK進 行的設定電路100的輸出。在此情形中,有效資訊之傳送 變得實質上慢於其將進行再同步化之一時間,藉此引起一 故障。 因此,本發明藉由分離内部時脈iCLK與同步時脈SCLK 而控制移位暫存器200之操作以便保證高速運算。此時, 延遲時間tA依賴於過程、電壓及溫度(PVT)而變化;且因 此藉由考慮在該延遲時間之後產生同步時脈SCLK時所處 的情況而分佈内部時脈iCLK與同步時脈SCLK。 因此,本發明可適當控制高速運算期間於預充電狀態下 過度運算之一時脈,藉此降低預充電狀態下之電流消耗 (在SDRAM中,平均電流消耗由IDD2N界定)。 圖9為根據本發明之另一實施例之一時脈控制裝置的方 塊圖。 圖9之實施例包含一設定電路100、一移位暫存器200、 一啟用訊號產生器300、一時脈產生器400及一 D正反器 500 〇 與圖3之結構相比較,如上結構化之圖9之實施例進一步 包含一D正反器500。D正反器500執行自啟用訊號產生器 300輸出之啟用訊號RATVD之一正反運算以提供一延遲啟 用訊號RATVD。藉由如此,可藉由允許施加至時脈產生器 400之啟用訊號RATVD與内部時脈iCLK之一下降邊緣同步 而更穩定地產生同步時脈SCLK。 換言之,在啟用訊號RATVD與内部時脈iCLK同步的情 ? 112501.doc •12- 1304219 況下,啟用訊號RATVD為經延遲該内部延遲之一訊號且内 部時脈iCLK為取決於一外部時脈而交互工作之一内部時脈 訊號。因此,可存在啟用訊號RATVD啟動為邏輯高時内部 時脈iCLK變為邏輯高的狀態。在此情形中,同步時脈 SCLK可產生為具有不完全脈寬之一短時脈衝波形干擾訊 號。[Embodiment] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Fig. 3 is a block diagram showing the configuration of one of the clock control devices according to the present invention. The clock control apparatus of the present invention comprises a setting circuit, a shift register 200, an enable signal generator 300 and a clock generator 4A. Specifically, the setting circuit 100 triggers an input address Ai in response to a CAS signal CASP to provide a bit address AYi. The shift register 200 includes a plurality of D flip-flops DFF1 to DFF4 coupled in series. Among the plurality of D flip-flops DFF1 to DFF4, the D flip-flop DFF1 is synchronized with an internal clock iCLK, and the forward and reverse operations of the address AYi are performed to output the address Ayi_a. The D flip-flop DFF2 is synchronized to the internal clock iCLK, and the forward and reverse operations of the address Ayi-a are performed to provide a bit address Ayi_b. And the D flip-flops DFF3 and DFF4 are synchronized to a synchronous clock SCLK, and the forward and reverse operations of the internal address Ayi_b are performed to generate an internal address AYI_x. The enable signal generator 300 is based on an enable signal ACTP<0:i>&-precharge control signal? 00卩<0:丨> generates an enable signal RATVD, wherein the start 112501.doc 1304219 signals the memory to be in an enabled state. The clock generator 400 generates a synchronous clock SCLK depending on the internal clock iCLK and the enable signal RATVD. 4 is a detailed circuit diagram of the setting circuit 1A shown in FIG. As shown in Fig. 4, the setting circuit 1 〇 〇 has a transmission gate τ 1 and a plurality of inverters IV1 to IV5. Specifically, the transmission gate T1 is used to selectively output the input address Ai based on the CAS signal CASP and one of the CAS signals CASP inverted by the inverter IV1. Inverters IV3 and IV4 latch the output of the transmission gate T1 for a predetermined period of time. Inverter IV5 inverts the output of the latch comprising inverters IV3 and IV4 to produce an internal address AYi. FIG. 5 shows a detailed circuit diagram of the shift register 2A shown in FIG. Each D flip-flop DFF includes transmission gates T2 and T3 and a plurality of inverters IV6 to IV10. The transfer gate T2 selectively outputs the internal address AYi in response to the internal clock iCLK and by inverting one of the internal clocks iCLK of the IV6. Inverters IV7 and IV8 latch the output signal of transmission gate T2 for a predetermined time. The transfer gate T3 operates concurrently with the transfer gate T2 based on the internal clock iCLK and the internal clock iCLK inverted by the inverter IV6 to selectively control the output of the latch including the inverters IV7 and IV8. A latch comprising inverters IV9 and IV10 latches the output of transmission gate T3 to provide an output signal OUT. Figure 6 provides a detailed circuit diagram of the enable signal generator 300 depicted in Figure 3. The enable signal generator 300 includes a plurality of enable controllers 310 to 330 and a logic operator 340. Each of the enable controllers 310 to 33A logically operates an enable control signal ACTP <0:i> and a precharge control message 112501.doc 1304219 PCGP<0:i>. The plurality of enable controllers 310 through 330 have the same configuration; and thus only one controller 3 10 will be described in detail below. As shown in FIG. 6, the enable controller 310 has an inverter ivil and NAND ("reverse") gates ND1 and ND2. The NAND gate ND1 performs a NAND operation of one of the control signals eight (??<0> and one of the NAND gates ND2 by the inversion of the inverter IV11. The NAND gate ND2 performs the precharge control signal PCGP<0> A NAND operation with the output of the NAND gate ND1. The logic operator 340 includes a NOR (NOR) gate NOR1 and an inverter IV12. The NOR gate NOR1 performs a NOR operation on the outputs of the plurality of enable controllers 310 to 330. The inverter IV12 inverts the output of the NOR gate NOR1 to generate an enable signal RATVD. Figure 7 is a detailed circuit diagram of the clock generator 400 shown in Figure 3. As shown in Figure 7, the clock generator 400 is equipped with a NAND. Gate ND3 and an inverter IV13. NAND gate ND3 operates a NAND operation on internal clock iCLK and enable signal RATVD. Inverter IV13 inverts the output of NAND gate ND3 to provide synchronous clock SCLK. 7 and the operation timing diagram shown in Fig. 8 to describe in detail the operation of the present invention configured as above. First, the setting circuit 100 synchronously latches the input address Ai of a clock signal CLK input when the CAS signal CASS is started to output bits. Address AYi. With an internal command signal, write The CAS signal CASP generated by the read command is used to sense the external input address Ai. Then, the shift register 200 synchronizes with the internal clock iCLK to perform a forward and reverse operation of the address AYi to output the internal address Ayi_b and is synchronized with Synchronous clock U250l.doc -10- 1304219 SCLK sequentially applies a positive and negative operation to the address Ayi-b to provide an internal address AYI_x 〇 in a plurality of sets of DRAM, and an enable operation can be performed for each group. The enable signal generator 300 is provided with a plurality of enable controllers 310 to 330 for controlling the enable status data of each of the groups. The enable signal generator 300 logically operates the enable signal person (: D? < 0 > and each of the precharge control signals PCGP<0:i>$ to provide an enable signal RATVD indicating that the memory is in an enabled state. Therefore, if all groups are in a precharge state, the enable signal RATVD is logic Low, and if any of the groups is enabled, the enable signal RATVD is enabled to logic high. Next, the clock generator 400 generates a synchronization clock SCLK based on the clock signal RATVD and the internal clock iCLK. If the enable signal RATVD is in the startup state, the synchronization clock SCLK is output synchronously with the internal clock iCLK. The present invention controls the operation of the shift register 200 depending on both the internal clock iCLK and the synchronization clock SCLK. The enable signal RATVD is activated by an enable control signal ACTP indicating an external enable command. Therefore, once the high speed operation is performed, the internal delay time separated from the clock CLK of the input enable control signal ACTP is extended to an extended clock t A . Therefore, in order to reduce the current consumption, the synchronous clock SCLK which is operated only when the wafer is in the enabled state is generated only after the time. If all of the D flip-flops DFF1 to DFF4 of the shift register 200 are controlled by synchronizing with the sync clock SCLK, the first D flip-flop DFF1 senses the internal address AYi, which is internally 112501.doc -11 - 1304219 The address AYi is the output of the setting circuit 100 by the synchronization clock SCLK generated after the delay time tA. In this case, the transmission of the effective information becomes substantially slower than the time at which it will be resynchronized, thereby causing a failure. Therefore, the present invention controls the operation of the shift register 200 by separating the internal clock iCLK from the synchronous clock SCLK to ensure high speed operation. At this time, the delay time tA varies depending on the process, voltage, and temperature (PVT); and therefore, the internal clock iCLK and the synchronous clock SCLK are distributed by considering the situation when the synchronous clock SCLK is generated after the delay time. . Therefore, the present invention can appropriately control one of the clocks in the precharge state during the high speed operation, thereby reducing the current consumption in the precharge state (in SDRAM, the average current consumption is defined by IDD2N). Figure 9 is a block diagram of a clock control apparatus in accordance with another embodiment of the present invention. The embodiment of FIG. 9 includes a setting circuit 100, a shift register 200, an enable signal generator 300, a clock generator 400, and a D flip-flop 500. Compared with the structure of FIG. 3, the above structure is as follows. The embodiment of FIG. 9 further includes a D flip-flop 500. The D flip-flop 500 performs one of the forward and reverse operations of the enable signal RATVD output from the enable signal generator 300 to provide a delayed enable signal RATVD. By doing so, the synchronization clock SCLK can be generated more stably by allowing the enable signal RATVD applied to the clock generator 400 to be synchronized with the falling edge of one of the internal clocks iCLK. In other words, when the enable signal RATVD is synchronized with the internal clock iCLK, 112501.doc • 12- 1304219, the enable signal RATVD is delayed by one of the internal delays and the internal clock iCLK is dependent on an external clock. Interworking one of the internal clock signals. Therefore, there may be a state in which the internal clock iCLK becomes logic high when the enable signal RATVD is enabled to be logic high. In this case, the sync clock SCLK can be generated as a short-time pulse waveform interference signal having an incomplete pulse width.
因此,圖9之實施例可藉由分離與内部時脈iCLK同步之 φ D正反器500及與同步時脈SCLK同步之移位暫存器2〇〇之D 正反器DFF來阻止具有短時脈衝波形干擾分量的同步時脈 所產生之故障。 • 雖然本發明之實施例中相對於作為輸入訊號之位址Ai加 • 以描述,但應注意,輸入訊號可為本發明之位址、控制訊 號或資料,且並不限於此。 如上所述,本發明可藉由僅在一半導體記憶體之一啟用 狀態中雙態觸發一内部時脈來降低在一預充電/待用狀態 • 中雙態觸發一内部時脈的電流消耗,該啟用狀態允許在一 内部潛時之後施加自外部輸入之指令訊號及位址至一核 〇 本申請案含有關於 Korean Intellectual Property Office於 、2005年9月29曰及2005年12月02曰所申請之韓國專利申請 案第2005-91673號及第2GG5_117137號之主旨,該等韓國專 利申請案之全部内容以引用方式併入本文中。 雖然本發明已相對於特定實施例加以描述,但熟習此項 技術者將顯而易見可在並不脫離如下列申請專利範圍中所 112501.doc -13 - 1304219 之精神>5 β 執命的情況下進行多種改變及修 【圖式簡單說明】 為一普通時脈控制裳置之—組態的方塊圖; 圖2為—普通時脈控制裝置的-操作時序圖; 圖3為說明根據本發明之—實施例之時脈控制裝 組態的方塊圖;Therefore, the embodiment of FIG. 9 can be prevented from being short by separating the φ D flip-flop 500 synchronized with the internal clock iCLK and the D flip-flop DFF of the shift register 2 同步 synchronized with the synchronous clock SCLK. A fault caused by the synchronous clock of the pulse waveform interference component. • Although the embodiment of the present invention is described with respect to the address Ai as the input signal, it should be noted that the input signal may be the address, control signal or data of the present invention, and is not limited thereto. As described above, the present invention can reduce the current consumption of an internal clock by a two-state trigger in a precharge/standby state by triggering an internal clock only in one of the enabled states of the semiconductor memory. This enabled state allows the application of an externally input command signal and address to a core after an internal dive. This application contains information about the Korean Intellectual Property Office, September 29, 2005 and December 02, 2005. The subject matter of the Korean Patent Application No. 2005-91673 and No. 2 GG5_117137, the entire contents of each of which are incorporated herein by reference. Although the present invention has been described with respect to the specific embodiments, it will be apparent to those skilled in the art that the present invention can be carried out without departing from the spirit of the above-mentioned patent application, 112501.doc -13 - 1304219 > A variety of changes and repairs [simplified description of the drawings] is a block diagram of the configuration of a normal clock control; FIG. 2 is a timing diagram of the operation of the ordinary clock control device; FIG. 3 is a diagram illustrating the operation according to the present invention. - a block diagram of the configuration of the clock control device of the embodiment;
圖4為圖3所示之設定電路的詳細電路圖; 圖5為圖3所示之移位暫存器的詳細電路圖; 圖6為圖3所描繪之啟用訊號產生器的詳細電路圖; 圖7為圖3所示之時脈產生器的詳細電路圖; 圖8為根據本發明之實施例之時脈產生器的操作時序 圖;及 圖9為根據本發明之另一實施例之一時脈控制裝置的方 塊圖。Figure 4 is a detailed circuit diagram of the setting circuit shown in Figure 3; Figure 5 is a detailed circuit diagram of the shift register shown in Figure 3; Figure 6 is a detailed circuit diagram of the enabled signal generator depicted in Figure 3; 3 is a detailed circuit diagram of a clock generator shown in FIG. 3; FIG. 8 is an operation timing diagram of a clock generator according to an embodiment of the present invention; and FIG. 9 is a timing control device according to another embodiment of the present invention. Block diagram.
界定之本發明 正〇 置之一 【主要元件符號說明】 10 設定電路 20 移位暫存器 100 設定電路 200 移位暫存器 300 啟用訊號產生器 310、320、330 啟用控制器 340 邏輯運算器 400 時脈產生器 112501.doc -14- 5001304219 DFF1、DFF2、DFF3、DFF4 IV1、IV3、IV4、IV5、IV6、 IV7、IV8、IV9、IV10、IV11、 IV12、IV13 ND1、ND2、ND3 N0R1 ΤΙ、T2、T3One of the defining devices of the present invention [Description of main component symbols] 10 setting circuit 20 shift register 100 setting circuit 200 shift register 300 enable signal generator 310, 320, 330 enable controller 340 logic operator 400 clock generator 112501.doc -14- 5001304219 DFF1, DFF2, DFF3, DFF4 IV1, IV3, IV4, IV5, IV6, IV7, IV8, IV9, IV10, IV11, IV12, IV13 ND1, ND2, ND3 N0R1 ΤΙ, T2, T3
D正反器 D正反器 反相器 NAND 閘 NOR閘 傳輸閘D flip-flop D flip-flop inverter NAND gate NOR gate transmission gate
112501.doc -15-112501.doc -15-