1304196 九、發明說明 【發明所屬之技術領域】 本發明是有關於一種可撓性電路板，且特別是有關於一 種具有至少二種間隔（Pitch)之導線（Channel)的可撓性電路 板，可應用在平面顯示裝置上。 【先前技術】 隨著平面顯示技術的蓬勃發展，再加上平面顯示器具有 φ 重量輕且體積薄小等優勢，平面顯示器已成為目前顯示設備 的市場主流。一般常見之平面顯示器包括液晶顯示器（L c D)以 及電漿顯示器。 目别’為因應平面顯不斋之兩解析度的需求以及各製造 廠所推行之降低成本（Cost Down)政策，捲帶自動接合（Tape1304196 IX. Description of the Invention The present invention relates to a flexible circuit board, and more particularly to a flexible circuit board having at least two types of pitch (Pitch) channels. Can be applied to flat display devices. [Prior Art] With the rapid development of flat panel display technology and the advantages of flat panel display with light weight and small size, flat panel display has become the mainstream of current display devices. Commonly used flat panel displays include liquid crystal displays (L c D) and plasma displays. The purpose of the two is to meet the needs of the two resolutions of the flat and the cost reduction (Cost Down) policy implemented by each manufacturer.
Automated Bonding ; TAB)/覆晶薄膜(Chip on Film ; COF)之多 重V線（Multi-channel)接合技術已成為趨勢。tab/COF多重導 線之概念為相同寬度之TAB/COF帶包含更多之導線，因此每 • 一導線相對應之間隔必須縮小。於是.，為增加可佈置之導線 數篁，一般係採用細間隔（Fine Pitch)方式（通常間隔〈5〇// m) 來設置導線。 請參照第1 ®，其係緣示傳、统覆晶薄膜/捲帶自動接合^ 上之導線的佈置示意、圖。覆晶薄膜/捲帶自動接合帶1〇〇主名 係由帶狀基板H)2、積體電路1G4、數條輸人導線ig6以及卖 條輸出導線10 8所構成。一私而> sk. ba ^ 丨僻取 叙而吕，積體電路104大都設4 基板102之中央區域卜，而^1 λ L Α上而輸入導線106與輸出導線i〇8貝 1304196 通常分別接合在積體電路104之相對二側的基板1〇2上，且 延伸至基板102之側邊邊緣。 目岫，輸入導線106與輸出導線丨〇8均係以固定間隔的 方式t列。請參照第2圖，其係繪示第1圖之輸出導線之放 大不思圖。在第2圖中，於基板1〇2上佈置輸出導線1〇8時， 係以相同間“方式進行排歹,J，因A每個輸出導線⑽具有之 間隔110均相同。 間隔縮小則相對應之製程精度的需求則更高，其中製程 精度包括TAB/C0F冑之製程精度與&晶模组（lcm)之對位壓 者精度。若採用一般細間隔方式來佈置導線，必須提高 TAB/COF本身之製作精度，如此將會造成帶製作以 及液晶模組製程精度的挑戰。 【發明内容】 因此’本發明之目的就是在提供一種可撓性電路板，直 在現行之導線製作精度下执 ’、 T F货度下，5又置至少二組具不同間隔的 線’而可在製程限制下，大幅增加可佈置之導線數量。 本發明之另一目的是在提供一種平面顯示面板，复可在 不增加：程成本負擔與預設精度下，於一定寬度之可撓性電Automated Bonding; TAB)/Chip on Film (COF) multi-channel bonding technology has become a trend. The concept of tab/COF multiple wires is that the TAB/COF strips of the same width contain more wires, so the spacing between each wire must be reduced. Therefore, in order to increase the number of wires that can be arranged, the wire is generally set by the Fine Pitch method (usually <5 〇//m). Please refer to the 1 ®, the schematic diagram and diagram of the arrangement of the wires on the edge-to-edge, film-on-film/reel automatic bonding. The flip chip/tape automatic bonding tape 1 〇〇 main name is composed of a strip substrate H) 2, an integrated circuit 1G4, a plurality of input wires ig6, and a sell output wire 108. A private and > sk. ba ^ 丨 取 取 而 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , They are respectively bonded to the substrate 1 2 on the opposite sides of the integrated circuit 104 and extend to the side edges of the substrate 102. It is seen that both the input wire 106 and the output wire 丨〇8 are arranged in a fixed interval t. Please refer to Fig. 2, which shows the enlargement of the output wire of Fig. 1. In Fig. 2, when the output wires 1〇8 are arranged on the substrate 1〇2, the same arrangement is performed in the same manner, J, since each of the output wires (10) has the same interval 110. The interval is reduced. The corresponding process accuracy requirements are higher, where the process accuracy includes the process accuracy of TAB/C0F胄 and the accuracy of the alignment die of the crystal module (lcm). If the wire is arranged in a generally fine interval, the TAB must be increased. The manufacturing precision of /COF itself will cause challenges in tape fabrication and process precision of the liquid crystal module. [Invention] Therefore, the object of the present invention is to provide a flexible circuit board directly under the current wire fabrication precision. Under the TF, the TF is set to at least two sets of wires with different intervals, and the number of wires that can be arranged can be greatly increased under the process limitation. Another object of the present invention is to provide a flat display panel, Flexible cable with a certain width without increasing the cost of the process and the preset accuracy
路板内设置更多之導線，古A σ.七 有助於可撓性電路板接合技術應用 在"際產°〇中，有效提升平面顯示面板之產品良率。 發明之又-目的是在提供一種平面顯示裝置，盆 固定寬度之可撓性電路板上訊 、 顯示裝置之解析度’而獲得較佳之顯示品質。面 6 1304196 、根據本發明之上述目的，提出一種可撓性電路板，適用 於一平面顯示裝置，其中此可撓性電路板至少包括：一可拎 性基板；一積體電路，設於可撓性基板上；一輸入導線組二 設於積體電路之一側的可撓性基板上，並與積體電路電=連 接，及至少二輸出導線組，相鄰而設於可撓性基板上並與積 體電路電性連接，其中這些輸出導線組係以不同之間進干 排列。 叮More wires are placed in the board, and the ancient A σ.7 helps the flexible circuit board bonding technology to effectively improve the product yield of the flat display panel. Still another object of the invention is to provide a flat display device having a resolution of a display device of a flexible circuit board having a fixed width of a basin to obtain a better display quality. Surface 6 1304196, according to the above object of the present invention, a flexible circuit board is provided, which is suitable for a flat display device, wherein the flexible circuit board comprises at least: an sturdy substrate; an integrated circuit disposed at On the flexible substrate; an input wire group 2 is disposed on the flexible substrate on one side of the integrated circuit, and is electrically connected to the integrated circuit, and at least two output wires are disposed adjacent to the flexible substrate. And electrically connected to the integrated circuit, wherein the output conductor sets are arranged in different directions. Ding
根據本發明之目的，另外提出一種平面顯示面板，至少 包括：—玻璃基板，其中玻璃基板之周邊上設有複數個接觸 端子；一平面顯示單元，設於玻璃基板上；以及複數個可撓 性電路板’接合在玻璃基板之周邊上。其中，每一可撓性； 路板至少包括：一可撓性基板；—積體電路，設於可挽性基 板上，輸入導線組，設於積體電路之一側的可撓性基板上， 並與積體電路電性連接；以及至少：輪出導線組，相鄰而設 於可撓性基板上並與積體電路電性連接，且每一輸出導線組 包括馒數個輸出導線分別對應電性連接前述接觸端子，其中 這些輸出導線組係以不同之間隔進行排列。 根據本發明之另一目的，更提出一種平面顯示裝置，至 少包括-平面顯示面板、以及一背光模組，設於平面顯示面 板之背面。此平面顯示面板至少包括：一玻璃基板，其中玻 璃基板之周邊上設有複數個接觸料；一平面顯示單元，設 於玻璃基板上；以及複數個可撓性電路板，接合在玻璃基板 之周邊上。其中，每—可撓性電路板至少包括：—可挽性基 板；-積體電路’設於可撓性基板上；—輸人導線組，設於 1304196 積體電路之一側的可 以及至少二輸出導線：f板上’並與積體電路電性連接； 電路電性連接，且每相鄰而設於可撓性基板上並與積體 姆應電性連接上述：二出：線：包括複數個輸出導線分別 同之間隔進行排列。&子、、中这些輪出導線組係以不 依照本發明_較佳實施例，上述之輸 小間隔之一者設於可撓域、、、二： 線組中呈有i /1、„ r W ^央區域，而輸出導 小間隔者的二側。θ I者鄰設於這些輸㈣線組中具有最 【實施方式】 本發明揭露一種可撓性電路祐 應用，可在現行最佳製二：：=在平面顯示裝置上之 / ^衣作精度下，於固定寬度之基板上，設 夕¥線’因此可進一步提高平面顯示裝置之解析度， 並降低生產成本。為了使本發 敘述更加詳盡與完備，可 多π下列描述並配合第3圖至第5圖之圖示。 請參照第3圖’其繪示依照本發明一較佳實施例的一種 可撓性電路板之上視示意圖。本發明之可撓性電路♦反可 例如為覆晶薄膜帶(C0F tape)或捲帶自動接合帶(TAB邮)， 而可適用於一般平面顯示裝置，例如液晶顯示器或電漿顯示 ^之平面顯示模組與外部訊號之電性接合介面。可撓性電 路板200主要包括可撓性基板2()2、積體電路2⑽、輸入導線 2〇6以及輸出導線2〇8，其中積體電路_ —般可為驅動積體 電路’以驅動平面顯示模組等顯示單元。積體電路2〇4通常 1304196 設於可撓性基板202之中心區域，而輸入導線206與輸出導 β 線208則通常係分別設於積體電路2〇4之二側的可撓性基板 202上，其中，這些輸入導線2〇6與輸出導線2〇8之一端均與 積體電路204接合而形成電性連接，而另一端則分別朝可撓 性基板202的二側邊延伸。對於平面顯示裝置而言，其可撓 性電路板200所需之輸入導線2〇6之數量通常遠較輸出導線 208之數量少。因此，本發明提出一種新導線佈局方式，以在 現行導線佈置之最佳製作精度下，於固定寬度之可撓性基板 籲上設置更多之輸出導線。 對於可撓性電路板200，例如ΤΑΒ帶或⑶F帶等的製作 中’於固疋寬度之導線佈置區域下，配合現行平面顯示模植 製程的需求’佈置不同間隔之導線時，所對應之可撓性電路 板20J的導線製作精度不同，亦即可撓性電路板_的可容 許總誤差率（Total Pitch Tolerance)不同。.μ — —* )不同在此可容許總誤差率 疋義為可容許之總間隔誤差與 值。一般而言，假如可撓性電路寬度的比 ^丄 、， j視性電路板之導線佈置設計之總誤差 率，大於該導線間隔所對應之 " 後續製程良率降低。舉例而$ 差率，則可能造成 u ^ ° 在可撓性電路板200夕道的 的可佈置區域為28 mm下 败200之^-線 差率與所斜廡…一一撓性電路板200之可容許總誤 ---Μ Γ 可容許總誤差率 衣一所示。 ------— 4 5 u m 0.040% —0-035% 44 u m 0.030% —_ 42 n m 1304196According to another aspect of the present invention, a flat display panel includes: a glass substrate, wherein a plurality of contact terminals are disposed on a periphery of the glass substrate; a flat display unit is disposed on the glass substrate; and a plurality of flexible layers are provided The board 'joined on the periphery of the glass substrate. Wherein each flexible; the circuit board comprises at least: a flexible substrate; an integrated circuit disposed on the switchable substrate, the input wire set, disposed on the flexible substrate on one side of the integrated circuit And electrically connected to the integrated circuit; and at least: the turn-out wire set is adjacently disposed on the flexible substrate and electrically connected to the integrated circuit, and each output wire set includes a plurality of output wires respectively Correspondingly, the foregoing contact terminals are electrically connected, wherein the output wire groups are arranged at different intervals. According to another object of the present invention, a flat display device is provided, comprising at least a flat display panel and a backlight module disposed on a back surface of the flat display panel. The flat display panel comprises at least: a glass substrate, wherein a plurality of contact materials are arranged on the periphery of the glass substrate; a flat display unit is disposed on the glass substrate; and a plurality of flexible circuit boards are bonded around the glass substrate on. Wherein, each of the flexible circuit boards comprises at least: a - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The two output wires are: 'on the board' and electrically connected to the integrated circuit; the circuit is electrically connected, and each adjacently is disposed on the flexible substrate and electrically connected to the integrated body. The second: line: The plurality of output wires are arranged at intervals. And the above-mentioned round-trip wire sets are not in accordance with the present invention. In the preferred embodiment, one of the above-mentioned small intervals is set in the flexible domain, and the second: line group has i /1. „ r W ^ ^ zone, and the two sides of the output small spacer. θ I is adjacent to these transmission (four) line group has the most [embodiment] The present invention discloses a flexible circuit application, which can be used at present佳制二::= On the flat display device, under the precision of the clothing, on the fixed-width substrate, the 夕¥线' can further improve the resolution of the flat display device and reduce the production cost. The description is more detailed and complete, and can be described as follows π and the diagrams of Figures 3 to 5. Referring to Figure 3, a flexible circuit board according to a preferred embodiment of the present invention is illustrated. The top view of the flexible circuit of the present invention can be, for example, a CF tape or a tape automatic bonding tape (TAB), and can be applied to a general flat display device such as a liquid crystal display or a plasma. Displaying the electrical connection between the planar display module and the external signal The flexible circuit board 200 mainly comprises a flexible substrate 2 (2), an integrated circuit 2 (10), an input wire 2〇6, and an output wire 2〇8, wherein the integrated circuit _ can be a driving integrated circuit. A display unit such as a planar display module is driven. The integrated circuit 2〇4 is usually disposed in a central region of the flexible substrate 202, and the input lead 206 and the output conductive β line 208 are generally disposed in the integrated circuit 2〇. On the flexible substrate 202 on the side of the second side, wherein one of the input wires 2〇6 and the output wires 2〇8 are joined to the integrated circuit 204 to form an electrical connection, and the other end is respectively flexible. The two sides of the substrate 202 extend. For a flat display device, the number of input wires 2〇6 required for the flexible circuit board 200 is generally much smaller than the number of output wires 208. Therefore, the present invention proposes a new wire. The layout method is such that more output wires are placed on the flexible substrate with a fixed width under the optimum manufacturing precision of the current wire arrangement. For the flexible circuit board 200, such as an ankle tape or a (3) F tape, etc. '于固疋Width Under the wire arrangement area, when the wires of different spacings are arranged in accordance with the requirements of the current flat display molding process, the corresponding precision of the wires of the flexible circuit board 20J is different, that is, the total allowable error of the flexible circuit board _ The total (Total Pitch Tolerance) is different. .μ — —* ) The total allowable error rate is allowed to be the allowable total interval error and value. In general, if the ratio of the width of the flexible circuit is 丄, The total error rate of the wire layout design of the visual circuit board is greater than the corresponding interval of the wire spacing. The yield of the subsequent process is reduced. For example, the difference rate may cause u ^ ° on the flexible circuit board 200. The arrangable area is 28 mm and the line-to-line rate and the slanting 庑 一 一 一 一 一 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性 挠性------— 4 5 u m 0.040% —0-035% 44 u m 0.030% —_ 42 n m 1304196
成後所：’隨著導線間隔的縮小，為了避免例如造 只衣u位#差使得相鄰導線短路的情況 =::板的總誤差率就愈小。因此，本發明根據= 田二σ疋陡電路板之製作精度的對應關係，將導線以非單 ，隔的方式進订排列’以於現行之可撓性電路板的製作精 度與平面顯示模組的對位壓著精度下，對應增加可撓性電路 板之多重導線的數量的需求。 請參照第4圖，在本較佳實施例中，這些輸出導線2〇8 至少分成二導線組21〇與212，其中導線組21〇包括數個導線 208a，導線組212包括數個導線208b。這些導線2〇8&與2〇朴 之一端均與積體電路2〇4電性連接，而另一端則延伸至可撓 性基板202之一側邊上。導線組21〇設於可撓性基板2〇2之 一側的中央區域，而導線組212則平均鄰設於導線組21〇之 二側，如第4圖所示。導線組210之導線208a以使每一導線 208a具有間隔214a的方式來進行排列，而導線組212之導線 208b則以使每一導線208b具有間隔214b的方式來進行排 列。其中，導線組210之間隔214a不同於導線組212之間隔 214b，且間隔214a對應於一製作精度，間隔214b則對應於 另一製作精度。此外，位於可撓性基板202之一側邊中央區 的導線組210的間隔214a小於位於兩旁之導線組212的間隔 2 14b 〇 在本實施例中，於可撓性基板202上佈置導線組2 1 〇與 1304196 212時，導線208&與2〇8b均係在一預設精度下進行設置，其 中導線208a之間隔214a所對應之製作精度較此預設精度高， 而導線208b之間隔214b所對應之製作精度即為此預設精 度。在一較佳實施例中，上述之預設精度為製作可撓性電路 板的現行最佳製作精度，即現行可量產而符合平面顯示模組 製程需求之最佳製作精度。也就是說，雖然目前之技術只能 確貫製作出對應於現行最佳製作精度之間隔的導線，即導線 2〇8b，而無法在高於現行最佳製作精度之製作精度下確實製 作出具有對應間隔之導線，即在導線2〇8a之間隔214a所對應 之$作精度下確實製作出導線2〇8a，亦即製作導線2〇。時， 八貝際製作精度可能低於其間隔2丨4a所對應之最佳製作精 度。 舉例而言，根據前述之表一，若以現行TAB/c〇F帶之最 佳製作精度為下，於可佈置導線之區域寬度為28 _ 的TAB/COF帶上設置導線。首先，依照傳統固定間隔的方式 進行導線佈置時’由表一可知對應於製作精度〇〇4〇%之間隔 • 為45 # m，因此 月匕佈置之導線數量為：28 mm+45 // m与620， 總間隔誤差為：620x45 M㈣。 另-方面，依照本發明之方法，同樣在現行tab/c〇F帶 之最佳製作精度為下，於可佈置導線之區域寬度為Μ mm的TAB/COF帶上設置導線。若者虐 ^ ^右亏慮佈置導線具有的間隔 所對應之製作精度較高於現行最 兄仃取佳I作精度時，例如間隔為 40 // m時，28 mm寬的可佑署F a a _ J怖置£域所旎容許之總誤差為28 π 1304196 mmx0.025%= 7 // m。既然於整個28 mm寬的可佈置區域内， 所能容許之總誤差為7 // m内，才能符合平面顯示模組之對 位製程需求。因此，本發明在低於間隔為4〇 # m所對應之製 作精度的現行最佳製作精度下，佈置間隔為4〇 # m之導線， 其中在總誤差需在7 // m以内下，可容納之導線數量為 7 // m+(40 // mx〇.〇4〇%)与 440 〇 再將整個可佈置區域的寬度減去佈置間隔為4〇 之導 線的區域寬度後’剩下寬度之區域可再佈置對應於現行最佳 製作精度之導線，亦即間隔為45 # m之導線。此時，剩下寬 度之區域可容納導線數量為 [28 mm-(40 # mx44〇)] + 45 # m= 230。 如此一來，在此實施例中，總共可佈置440+ 230 = 67() 條導線，而由於所有導線之佈置均係在預設製作精度下，亦 即現行最佳製作精度0 040%下，因此總間隔誤差為 (440x40 230x45 #m)x0.040% 与 11.18 //m。 與傳統方式相較之下，運用本發明實施例之方法可在幾 乎相同之總間隔誤差下，於具相同寬度之可佈置區域的可撓 性基板上佈置更多之導線。 凡 在本發明中，可撓性電路板2〇〇在後續之熱接合製程中， 其材料可能會有熱膨脹現象產±，而材料結構之膨㈣度係 由中央朝外圍遞增，亦即在材料結構之中央部分的偏移量較 低’而在材料結構之外圍部分的偏移量較大。有#於材料結 構之熱膨脹現象，因此在本發明中，間隔較小且對應之製^ 精度較高的導線組210係設置在可撓性基板202之一側的中 12 1304196 央區域，而間隔較大且對應之製作精度較低的導I组212則 鄰設於導線組210兩旁的可撓性基板2〇2上。 因此，本發明之-特徵就是在可挽性基板之一側上設置 至少二組間隔不同之輪出導線組，且較佳為這些輸出導線組 所對應之間隔從可撓性基板之—側的中央朝外側漸次遞增。 如此-來，可在現行之可撓性電路板之製作精度與平面顯示 模組之對位壓著精度下，於固定寬之可撓性電路板内，大幅 增加輸出導線之佈置數量。此外，可在平面顯示模組製程鱼 可撓性電路板封裝廠不需更高的精度要求下，有效提升製程 良率’更可輕易導入產品並量產。 " 本發明之可撓性電路板可適用於―般平面顯示裝置，例 如液晶顯示器或電漿顯示器。平面顯示裝置主要係由平面顯 不面板以及背光模組所組成，其中背光模組設在平面顯示面 板之背面’以提供平面顯示面板光源。而可撓性電路板則係 設置在平面顯示面板中。 、 明參妝第5圖，其係繪示依照本發明一較佳實施例的— 種平面顯示面板之裝置示意圖。平面顯示面板300主要包括 玻璃基板302、平面顯示單元斯以及數個如同前述之可挽性 ，路板200。玻璃基板之周邊上設有數個接觸端子， 这些接觸端子3G6分別對應於可撓性電路板扇 導 子 則設於玻璃基板302之上，而接觸端 06之-端與平面顯示單元接合，另—端則向外側延 玻璃純302之—側邊處。這些可撓性電路板_則利 列如熱壓著方式對位接合在玻璃基板302之周邊上，其中 13 1304196 可凡性電路板200之輸出導線2〇8分別對準玻璃基板3〇2上 之接觸端子306,並透過㈣而接合在—起以形成電性連接。 由於相同寬度之可撓性電路板2〇〇可佈置更多之輸出導 線3〇8 ’因此可進—步提高平面顯示t置之解析度。 由上述本發明較佳實施例可知，本發明之一優點就是因 為本發明之可撓性電路板可在現行之導線製作精度與平面顯 示模組製程精度下，今罟5 ,丨、_ 4 θ «置至V 一、、且具不同間隔的導線，因此 可在不增加製程負擔下，有效增加可佈置之導線數量。 ，由上述本發明較佳實施例可知，本發明之另-優點就是 因為本發明之平面顯示面板可在不增加製程成本負擔與預設 精度下’於一定寬度之可撓性電路板内設置更多之導線，因 此不僅可有助於可撓性電路板接合技術應用在實際產品及量 產’更可提升平面顯示面板之產品良率。 由上述本發明較佳實施例可知，本發明之又一優點就是 因為本發明之平面顯示裝置可在固定寬度之可撓性電路板上 設置更多導線，因此可提高平面顯示裝置之解析度，進而達 到提升顯示裝置之顯示品質的目的。 雖然本發明已以一較佳實施例揭露如上，然其並非用以 限定本發明’任何熟習此技藝I’在不脫離本發明之精神和 範圍内，當可作各種之更動與潤飾，因此本發明之保護範圍 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係繪示傳統覆晶薄膜/捲帶自動接合帶上之導線的 14 13 〇4196 佈置示意圖。 第2圖係繪示第1圖之輸出導線之放大示意圖。 第3圖係繪示依照本發明一較佳實施例的一種可撓性電 路板之上視示意圖。 第4圖係繪示第3圖之輸出導線的佈置放大示意圖。 第5圖係繪示依照本發明一較佳實施例的一種平面顯示 面板之裝置示意圖。 # 【主要元件符號說明】 100 ： 覆晶薄膜/捲帶自動接合帶 102 ： 基板 104 ： 積體電路 106 ： 輸入導線 108 ： 輸出導線 110 : 間隔 200 ： 可撓性電路板 202 ： 可撓性基板 204 ： 積體電路 206 ： 輸入導線 208 ： 輸出導線 208a :導線 218b :導線 210 ： 導線組 212： 導線組 214a :間隔 214b :間隔 300 ： 平面顯示面板 302 ： 玻璃基板 304 ： 平面顯示單元 15After the completion of the following: 'With the reduction of the wire spacing, in order to avoid, for example, the short-circuit of adjacent wires caused by the difference of the clothing u-number =:: the total error rate of the board is smaller. Therefore, according to the corresponding relationship of the fabrication precision of the =2 σ 疋 steep circuit board, the present invention arranges the wires in a non-single and spaced manner to make the current precision of the flexible circuit board and the flat display module. The alignment accuracy of the alignment corresponds to the need to increase the number of multiple wires of the flexible circuit board. Referring to Figure 4, in the preferred embodiment, the output conductors 2〇8 are divided into at least two conductor sets 21A and 212, wherein the conductor set 21A includes a plurality of conductors 208a, and the conductor set 212 includes a plurality of conductors 208b. These wires 2〇8& and one of the two ends are electrically connected to the integrated circuit 2〇4, and the other end extends to one side of the flexible substrate 202. The wire group 21 is disposed at a central portion of one side of the flexible substrate 2〇2, and the wire group 212 is disposed adjacent to the two sides of the wire group 21, as shown in Fig. 4. The wires 208a of the wire set 210 are arranged such that each wire 208a has a spacing 214a, and the wires 208b of the wire set 212 are arranged such that each wire 208b has a spacing 214b. The interval 214a of the wire group 210 is different from the interval 214b of the wire group 212, and the interval 214a corresponds to a manufacturing precision, and the interval 214b corresponds to another manufacturing precision. In addition, the interval 214a of the wire group 210 located at the central portion of one side of the flexible substrate 202 is smaller than the interval 2 14b of the wire group 212 located at both sides. In the present embodiment, the wire group 2 is disposed on the flexible substrate 202. 1 196 and 1304196 212, the wires 208 & and 2 〇 8b are set at a preset precision, wherein the interval 214a of the wires 208a corresponds to a higher precision than the preset precision, and the interval 214b of the wires 208b is The corresponding production accuracy is the preset accuracy for this purpose. In a preferred embodiment, the preset accuracy is the current best manufacturing accuracy for fabricating a flexible circuit board, i.e., the current production quality that meets the requirements of the flat display module process. That is to say, although the current technology can only produce the wires corresponding to the interval of the current best manufacturing precision, that is, the wires 2〇8b, it cannot be produced with a precision higher than the current optimum manufacturing precision. The wire 2 〇 8a is produced by the wire corresponding to the interval, that is, the wire corresponding to the interval 214a of the wire 2 〇 8a, that is, the wire 2 制作 is produced. At the same time, the accuracy of the eight-bay production may be lower than the optimum production accuracy corresponding to the interval of 2丨4a. For example, according to Table 1 above, if the optimum manufacturing accuracy of the current TAB/c〇F band is lower, a wire is placed on the TAB/COF tape having a width of 28 _ in the area where the wire can be arranged. First of all, when the wire arrangement is carried out in accordance with the conventional fixed interval method, 'the interval corresponding to the manufacturing precision 〇〇4〇% is 45 # m, so the number of wires arranged in the moon is 28 mm+45 // m. With 620, the total spacing error is: 620x45 M (four). On the other hand, in accordance with the method of the present invention, the wire is placed on the TAB/COF tape having a width of Μ mm in the area where the wire can be arranged, also under the optimum manufacturing precision of the current tab/c〇F tape. If the spacing of the right-handed wires is higher than that of the current best brother, for example, when the interval is 40 // m, the 28 mm wide can be used. The total error allowed for the J domain is 28 π 1304196 mm x 0.025% = 7 // m. Since the total error allowed in the entire 28 mm wide arrangable area is 7 // m, it can meet the alignment process requirements of the flat display module. Therefore, the present invention arranges the wires with an interval of 4 〇# m under the current optimum fabrication precision lower than the fabrication precision corresponding to the interval of 4 〇 # m, wherein the total error needs to be within 7 // m, The number of wires accommodated is 7 // m+ (40 // mx〇.〇4〇%) and 440 〇 and the width of the entire arrangable area is subtracted from the width of the area of the wire arranged at intervals of 4〇. The area can be re-arranged to correspond to the current best-precision wire, that is, a wire with a spacing of 45 # m. At this time, the remaining width area can accommodate the number of wires [28 mm - (40 # mx44〇)] + 45 # m = 230. In this way, in this embodiment, a total of 440+ 230 = 67 () wires can be arranged, and since all the wires are arranged under the preset manufacturing precision, that is, the current optimum manufacturing precision is 0 040%, Therefore the total spacing error is (440x40 230x45 #m) x 0.040% and 11.18 //m. In contrast to conventional approaches, the use of embodiments of the present invention allows for the placement of more conductors on a flexible substrate having the same width of the arrangable region under substantially the same total spacing error. In the present invention, in the subsequent thermal bonding process, the material of the flexible circuit board 2 may have a thermal expansion phenomenon, and the expansion of the material structure is increased from the center toward the periphery, that is, in the material. The central portion of the structure has a lower offset and has a larger offset at the peripheral portion of the material structure. There is a thermal expansion phenomenon of the material structure. Therefore, in the present invention, the wire group 210 having a small interval and corresponding high precision is disposed in the central region of the side of the flexible substrate 202, and the interval is 12,304,196. The larger and correspondingly less conductive group I 212 is disposed adjacent to the flexible substrate 2〇2 on both sides of the wire group 210. Therefore, the present invention is characterized in that at least two sets of wheeled wire sets having different intervals are disposed on one side of the slidable substrate, and it is preferable that the interval corresponding to the output wire groups is from the side of the flexible substrate. The center gradually increases toward the outside. In this way, the number of output wires can be greatly increased in a fixed-width flexible circuit board under the current manufacturing precision of the flexible circuit board and the alignment accuracy of the flat display module. In addition, the flat display module process fish flexible circuit board packaging factory can increase the process yield without requiring higher precision requirements, and can be easily imported into the product and mass-produced. " The flexible circuit board of the present invention can be applied to a general flat display device such as a liquid crystal display or a plasma display. The flat display device is mainly composed of a flat display panel and a backlight module, wherein the backlight module is disposed on the back surface of the flat display panel to provide a flat display panel light source. The flexible circuit board is placed in the flat display panel. 5 is a schematic view of a device for a flat display panel according to a preferred embodiment of the present invention. The flat display panel 300 mainly includes a glass substrate 302, a flat display unit, and a plurality of slabs 200 as described above. A plurality of contact terminals are disposed on the periphery of the glass substrate. The contact terminals 3G6 are respectively disposed on the glass substrate 302 corresponding to the flexible circuit board, and the end of the contact end 06 is coupled to the flat display unit. The end is extended to the outside of the glass pure 302 - side. The flexible circuit boards are aligned and bonded to the periphery of the glass substrate 302 by a hot pressing method, wherein the output wires 2 〇 8 of the 13 1304196 versatile circuit board 200 are respectively aligned on the glass substrate 3 〇 2 The contact terminals 306 are joined to each other through (4) to form an electrical connection. Since the flexible circuit board 2 of the same width can be arranged with more output wires 3〇8', the resolution of the plane display t can be further improved. It is obvious from the above preferred embodiments of the present invention that one of the advantages of the present invention is that the flexible circuit board of the present invention can be used in the current wire fabrication precision and the precision of the flat display module process, and today, 5, 丨, _ 4 θ «The wires are placed at V, and have different spacings, so the number of wires that can be arranged can be effectively increased without increasing the process burden. According to the preferred embodiment of the present invention described above, another advantage of the present invention is that the flat display panel of the present invention can be disposed in a flexible circuit board of a certain width without increasing the process cost burden and preset accuracy. A large number of wires can not only help the flexible circuit board bonding technology to be applied in actual products and mass production, but also improve the product yield of flat display panels. According to the preferred embodiment of the present invention, another advantage of the present invention is that the flat display device of the present invention can provide more wires on a flexible circuit board having a fixed width, thereby improving the resolution of the flat display device. Further, the purpose of improving the display quality of the display device is achieved. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. [Simple description of the drawing] Fig. 1 is a schematic view showing the arrangement of 14 13 〇 4196 of the wires on the conventional flip chip/tape automatic bonding tape. Fig. 2 is an enlarged schematic view showing the output lead of Fig. 1. Figure 3 is a top plan view of a flexible circuit board in accordance with a preferred embodiment of the present invention. Fig. 4 is an enlarged schematic view showing the arrangement of the output wires of Fig. 3. Figure 5 is a schematic view of a device for a flat display panel in accordance with a preferred embodiment of the present invention. # [Main component symbol description] 100 : Flip film / tape automatic bonding tape 102 : Substrate 104 : Integrated circuit 106 : Input wire 108 : Output wire 110 : Space 200 : Flexible circuit board 202 : Flexible substrate 204: Integrated circuit 206: Input wire 208: Output wire 208a: Wire 218b: Wire 210: Wire group 212: Wire group 214a: Space 214b: Space 300: Flat display panel 302: Glass substrate 304: Flat display unit 15