1303591 九、發明說明： 【發明所屬之技術領域】 本發明係關於蚀除的方法與設備，其藉由一種脈衝式 雷射束以提供-材料自—工件之移除，且提供用於控制形 式為微粒與由該處理所產生的蝕除產物之碎屑。尤其是， 本發明係關於-種雷射之運用於自所運用的大基板之薄膜 ’肖除、刻劃或移除有機、無機或金屬材料，舉例而言：針 對於-平板顯示器（FPD，flat panel display)或太陽能（⑽㈣ 面板之製造，且本發明係關於一大面積薄片（sheet)的聚合 物表面上複雜、密集的三維(3_D)結構之雷射蝕除，以建： 針對於透鏡陣列、擴散器與用於顯示單元的其他元件之製 造的母版。 【先前技術】 藉由脈衝雷射束之-種直接的姓除方法以構成材料結 構係一種相當成熟的技術，其為廣泛運用於（而不限於）醫 療”飞車、太陽能、顯示器、及半導體產業的精密1303591 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to an etching method and apparatus for providing a -material-to-workpiece removal by a pulsed laser beam and providing a control form It is the debris of the particles and the erosion products produced by the treatment. In particular, the present invention relates to the use of a laser for the removal, scoring or removal of organic, inorganic or metallic materials from a large substrate used, for example: for a flat panel display (FPD, Flat panel display) or solar ((10) (four) panel manufacturing, and the present invention relates to a complex, dense three-dimensional (3D) structure of laser etching on a large area of the sheet polymer, to: for the lens Array, diffuser and master for the manufacture of other components of the display unit. [Prior Art] A well-established technique for constructing a material structure by means of a pulsed laser beam-like direct surname separation method, which is extensive Used in (not limited to) medical precision, precision in the solar, display, and semiconductor industries
生產。 I 蝕除方法係涉及：一材料表面暴露至由一脈衝雷射源 所產生的㈣射之-或多個脈衝。若雷射波長係俾使輕射 為強烈吸收於材料之頂層’ 1能量密度為足夠高以使得吸 收的能量係升高該頂層的溫度為高於材料 / 蜱f 蝽點，則於此 月y 材料之此頂層係分解且改變成為展開自表面之5 體、液體或固體微粒的副產物。針對於進行蝕除 乳 之根 1303591 本必要條件係在於：足夠的能量 收於材料，以使得…、孔… 充刀紐的時間而吸 一溫度。“度係迅速升尚至俾使該材料為分解之 針對於敍除厚的材料，各個雷射脈衝係移除於π太 只(nm)與數個微米(micr〇n)之間的材料，&取決於二 度、雷射波長、與材料吸收係數。各個脈衝係運作produce. The I erosion method involves exposure of a material surface to (four) shots or pulses generated by a pulsed laser source. If the laser wavelength is such that the light shot is strongly absorbed on the top layer of the material '1 energy density is high enough so that the absorbed energy increases the temperature of the top layer above the material / 蜱f , point, then this month y This top layer of material decomposes and changes to a by-product of the 5 body, liquid or solid particles that are unwound from the surface. For the root of the etched milk 1303591, the necessary condition is: enough energy to be collected in the material, so that ..., the hole ... the time to fill the knife and absorb a temperature. "The degree is rapidly increased so that the material is decomposed to the thickness of the material, and each laser pulse is removed from the material between π too (nm) and several micrometers (micr〇n). & depends on second degree, laser wavelength, and material absorption coefficient.
::二Γ寻在一連續的脈衝之後，1毫米(_)之材料部 :了移除。蝕除的材料係經常轉換至一氣體材料，但曰 於諸多情形而可包括液體與固體的成分。 疋 針對於薄膜之材肖，敍除方法係可稍微不同。當 膜係沉積於由一不同材料所作成的一基板之頂部，：二 膜之厚度係低（例如m微米），敍除係可能由二種方 法之-者所進行。若薄膜係強烈吸收雷射輻射 6丄 />v> 土 ，飞 ' <、、、干田 、牙透至下層的基板而為吸收於薄膜之内。該種強烈吸收 ;薄層係致使5亥薄膜之溫度為迅速上升且熱量係傳導至 下側，在此係致使薄膜與下層基板之間的鍵結瓦解。該種 處：：發生於薄的金屬貞。於此例’金屬係以微粒與液體 之合物的形式而移除於一個雷射脈衝。 假使該薄膜對於雷射輻射為完全或部分透通，且下層 的基板係相較於薄膜而更為強烈吸收輻射，能量係吸收於 该二層之間的一介面而於下層的基板之頂部，致使溫度迅 速上升與頂層之蝕除。於此例，移除的頂層係通常分解為 尺寸fe圍自次微米（sub micr〇n)至數十個微米之微粒。 若疋下層的基板材料係對於雷射輻射為透通且薄膜係 1303591 將其吸收，則有時使得雷射束直接透過基板至該基板/薄膜 介面係有利的。於該等情形，薄膜係經常為於適度能量密 度之僅有一個雷射光點下就脫層自該基板。藉由雷射之所 有的材料蝕除處理係導致於產生一個範圍的蝕除產物成 分’其可為於氣體、液體或固體的形式。此等者係包括： 原子、分子、簇群（cluster)、微粒、聚合鏈、小與大的材 料碎片、液滴與喷射物（jet)與其他者。下文，此材料係稱 為蝕除碎屑。此蝕除碎屑之控制係一個重大的問題，且蝕 除碎屑之沉積於基板表面係必須為最小化以避免污染。尤 其是，假使於針對FPD製造之薄膜蝕除，其中，直接的雷 射:除處理係取代—種溼式化學或電㈣刻處理（其中微粒 5木係不谷易發生），則於一雷射蝕除FpD生產過程期間 Μ除碎屑的再次沉積於基板表面係無法容許。本發明^ =目的係控制自該基板表面之㈣碎屑的流動錢料 再次沉積於基板為最小化。 八 參所^經運用方法，企圖獲取及控制於雷射敍除處理期間 戶:”的钱除碎屬。大多數的方法係仰除’ Γ错由吹氣於該區域之-側及強力吸取自另一=建 。所運用的氣體經常為空氣於 諸如氦氣、氧氣、$ & ^ ^ 二&形，係運用 或虱氧之其他的氣體。於所有情來, 遠離重要區域，或較佳為將其整：= 眉二且指引其為 種處理係仰賴於氣體八 ^基板區域移除。該 札體刀子與姓除碎屬之間的動量交換，且 1303591 2此有效者係需要高壓力與高的氣體流動率。諸如氬氣之 了種重氣體的運用係可助於此處理。若氦氣係運用，嗖 :、不同，由於氦氣分子之質量係小於空氣分子甚多，：： 乳係相較於空氣而較不有效於與韻除碎屑的交互作用。於 ’移動的㈣碎屬係可接著在減速或沉積之前而行 :離該姓除位置。此具有的效應為移動所 :更运離原始位置，但並未顯著降低再次沉積的材料總 重0 “ 諸如氧氣之反應氣體的運用係可降低沉積的材料量， 於其中，敍除的碎屑係與該反應氣體反應，以將其轉變至 一種純的氣體。此一個實例係一些聚合物材料之姑除。在 此.，產，的有機微粒係與氧氣反應，以形成純的氣體，諸 如·二氧化碳或一氧化碳。 、跨於一表面之一液體流動係有時候運用為對於一氣體 流動以截留(_rap)祕碎叙_種#代者。於雷射韻除處 、J ] 薄層的水、或其他的液體係指引為跨於蝕除區 域之表面。該層係需要為薄以使得其不吸收或干擾進入的 :射束，且通常由定位於蝕除區域的一側之某型式的霧化 “(主* er)喷紫而建立。該種系統已經於近日描述於文獻 月d田射加工（C!ean Laser Machiwng)，，（西元2〇的年$ 月出版之轰業雷射解決方案（Industrial Laser 心/⑽謝））。已經通過跨於基板表面的流體係收集於環 、χ>持有4基板的-夾具（ehuek)之某個型式的通道。 夫係矛彳用#曰引跨過一表面之未受抑制的氣體 10 1303591 或液體流動。該種運用係具有受限的有效性於移除該蝕除 碎屑·，此乃由於碎屑之獲取係非完全有效，且於基板的其 他區域之再次沉積係經f發生。㈣的碎屑,係僅吹送或流 動至基板之另-個區域，在此碎屑係再次沉積。液體流動L =法之另-個嚴重的缺點係在於：不適於處理關聯於咖 製造之大的基板，由於此情形之用於基板的一安裝夾具係 將為極大，且任何的水獲取通道係距離錢除點很遠了結 果’自該流體流動的㈣碎屑之再次沉積於基板係可能發 寸 板 土明之-個目的係避免此等限制，且提供自任何尺 之基板表面的钱除碎屑之移除而未顯著重新沉積於基 根據本發明之一第一 ^, 弟層面係楗出一種蝕除處理方法， 其包括一步驟為藉由一雷 乃/2： 勹权P 射束以钱除一基板之一區域，且 匕括另-步驟為藉由一流 此等者之一組合）流動以巩體或蒸虱、一液體或 非為八 自该區域移除所蝕除之大部分（若 :、、、王口 P )的碎屑，其中，兮、、古、六/ 域，藉以#留乂、+、ΛΛ Μ，瓜體、，现動係指引以流動於該區 猎以截遠别述的碎屑 的碎屬，㈣藉由指5丨帶右： 亥區域而移除所截留 沿著一預定路和 壬可截留碎屑的該流體流動為 沉積於基板。 硃避免所截留的碎屑之後續 根據本發明之第_ 弟層面的-第一個較佳版本，指引的 1303591 &體流動係由一氣體所構成。 根據本發明之第一層面的一第二個較佳版本或其第— ^較佳版本，係致使指引的流體流動實質為垂直於 域。 ▲根據本發明之第一層面的第二個較佳版本或其第一個 較佳版本，係致使指引的流體流動橫向於該區域。 根據本發明之一第二層面係提出一種設備，其能使一 雷射韻除-基板之—區域，且包括_部分閉合的碎屬取出 果組（贿，debris extraction m。细e)，其為位於針對於一 雷射束的-聚焦或成像透鏡與一基板的一區域之間 ㈣具有輸入與輸出璋，藉此，—流體（即·一氣體或基氣、、 -：體或此等者之一組合)流動係致使以流動於該區域，辟 ^留自該區域所⑽的碎h其後為自該 ^ 1 留的碎肩，此乃藉由提供帶有截留碎相該流體流= 疋路控而遠離該區域之機構，以防止所 眉之後績沉積於基板。 外 根據本發明之第二層面的—第—個較佳版本，指 k體流動係由一液體所構成。 的 :據本發明之第二層面的—第二個較佳版本或其第— :土版本’提供該指引的流體流動之機構係致使實質為 垂直於該區域。 夏貝為 二根據本發明之第二層面的—第三個較佳版本或 前述的較佳版本，提供該指 /、何 向流動於該區域。 引的抓體机動之機構係致使橫 12 1303591 根據本發明之第二層面的一第四個較佳版 前述的較佳版本，刪係、由一窗部（wind〇w)而閉合^ ^ 該透鏡之-側，該窗部係對於雷射束為透通。較佳而:， 該窗部係具有-擦拭（wiper)機構，用於移除於窗部所二藉 的碎屬。典型而言，係設置一靜止擦拭器，窗部係可=動 跨過此者，以移除於窗部所沉積的碎屬。 動:: Two Γ after a continuous pulse, 1 mm (_) of the material: removed. Etched materials are often converted to a gaseous material, but may include liquid and solid components in many cases.疋 For the film material, the method of removal can be slightly different. When the film system is deposited on top of a substrate made of a different material: the thickness of the two films is low (e.g., m microns), and the removal system may be performed by two methods. If the film strongly absorbs the laser radiation 6丄 />v> soil, fly ' <,,, dry field, teeth penetrate to the lower substrate and absorb into the film. This kind of strong absorption; the thin layer causes the temperature of the 5 kel film to rise rapidly and the heat to be conducted to the lower side, which causes the bond between the film and the underlying substrate to collapse. This species: occurs in thin metal crucibles. In this case, the metal is removed from a laser pulse in the form of a mixture of particles and liquid. If the film is completely or partially transparent to the laser radiation, and the underlying substrate absorbs radiation more strongly than the film, the energy is absorbed by an interface between the two layers on top of the lower substrate. This causes the temperature to rise rapidly and the top layer to erode. In this case, the removed top layer is typically decomposed into particles ranging in size from submicron to tens of microns. If the substrate material of the underlying layer is transparent to the laser radiation and the film is absorbed by the film system 1303591, it is sometimes advantageous to have the laser beam directly transmitted through the substrate to the substrate/film interface. In such cases, the film system is often delaminated from the substrate at only one laser spot at a moderate energy density. Erosion of the treatment system by all of the materials of the laser results in the creation of a range of erosion product components which may be in the form of a gas, liquid or solid. These include: atoms, molecules, clusters, particles, polymeric chains, small and large material fragments, droplets and jets, and others. Hereinafter, this material is referred to as eroding debris. This control of debris removal is a significant problem and the deposition of debris on the substrate surface must be minimized to avoid contamination. In particular, if the film is manufactured for FPD, the direct laser: in addition to the treatment system instead of a wet chemical or electric (four) engraving treatment (in which the microparticle 5 wood is not easy to occur), then in a mine Erosion removal of the debris during the FpD production process is again unacceptable on the substrate surface. The present invention is intended to minimize the re-deposition of the flow material of the (iv) debris from the surface of the substrate to the substrate. Eight ginseng's method of use, in an attempt to obtain and control the household during the laser-discharging process: "The money is removed. Most of the methods are based on the erroneously blown in the area - the side and the strong draw Since the other = built. The gas used is often for air such as helium, oxygen, $ & ^ ^ two & type, other gases used or oxygenated. In all sentiments, away from important areas, or Preferably, the whole: = eyebrows and the guiding of the processing system depends on the removal of the gas substrate area. The momentum exchange between the zigzag knife and the surname is broken, and 1303591 2 is effective. High pressure and high gas flow rate. The application of heavy gas such as argon can help this treatment. If the helium system is used, 嗖:, different, because the mass of helium molecules is less than the air molecules, :: The milk system is less effective than the air in interacting with the debris removal. The 'moving (four) genus can then be followed by deceleration or deposition: the position is removed from the last name. This has the effect For the move: more away from the original location, but not significantly lower 0 total weight of the deposited material, "such as the use of an oxygen-based reactive gas may reduce the amount of deposited material, in which, in addition to the crumb-based classification is reacted with the reaction gas, to convert it to a pure gas. An example of this is the ablation of some polymeric materials. Here, the organic particles produced react with oxygen to form a pure gas such as carbon dioxide or carbon monoxide. One of the liquid flow systems across a surface is sometimes used to trap (_rap) the secrets of a gas flow. In the removal of the laser, J] thin water, or other liquid system is directed across the surface of the erosion area. The layer needs to be thin so that it does not absorb or interfere with the incoming: beam, and is typically established by a certain type of atomized "(primary * er) spray purple positioned on one side of the erosion region. It has been described in the literature recently (C!ean Laser Machiwng), (Infrared Laser Solution (Industrial Laser Heart / (10) Xie) published in the 2nd year of the 2nd year.) The flow system on the surface of the substrate is collected in a ring, χ> a type of channel that holds a 4-substrate-ehuek. The spears use #曰 to lead an uninhibited gas 10 1303591 or liquid across a surface. Flow. This type of application has limited effectiveness in removing the etched debris. This is because the acquisition of debris is not completely effective, and the re-deposition in other areas of the substrate occurs via f. (4) Debris, which is only blown or flows to another area of the substrate where the debris is deposited again. Another serious disadvantage of the liquid flow L = method is that it is not suitable for processing large substrates associated with coffee making. Because of this situation, a mounting fixture for the substrate will be Large, and any water acquisition channel is far away from the point of money. The result is that the (four) debris from the fluid flow is deposited again on the substrate system, which may be used to avoid such restrictions. The surface of the substrate of any ruler is removed from the debris without significant redeposition. According to one of the first aspects of the present invention, the method of etching is performed, which includes a step of /2: 勹 P 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射 射The area removes most of the debris (if:,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Guide the flow of the debris in the area to intercept the debris, and (4) remove the fluid intercepted along a predetermined path and from the debris by means of the right side: The flow is deposited on the substrate. The subsequent avoidance of the trapped debris is based on the first aspect of the present invention. A preferred version, the directed 1303591 & body flow system is comprised of a gas. A second preferred version of the first level of the invention, or a preferred version thereof, results in a fluid flow of the guidance Is perpendicular to the domain. ▲ According to a second preferred version of the first aspect of the invention or a first preferred version thereof, the directed fluid flow is caused to be transverse to the region. According to a second aspect of the present invention An apparatus that enables a laser to be removed from the -substrate-area and includes a partially closed fragmented debris extraction (debris extraction m. fine e) that is located for a laser beam - Between the focusing or imaging lens and a region of a substrate (4) having input and output ports, whereby a fluid (ie, a gas or a base gas, a body, or a combination thereof) is caused to flow In this area, the shredded h from the area (10) is followed by the broken shoulder left from the ^1, which is provided by the mechanism that provides the fluid flow with the intercepting phase and the distance from the area. In order to prevent the appearance of the eyebrows after deposition on the substrate. Further, according to a second preferred embodiment of the present invention, the k-body flow system is composed of a liquid. The mechanism according to the second aspect of the present invention - the second preferred version or its - soil version - provides the fluid flow of the guide so as to be substantially perpendicular to the area. Xiabei provides a reference to the region in accordance with a second preferred version of the second aspect of the invention, or a preferred version of the foregoing. The mechanism of the grasping body maneuvering causes the horizontal 12 1303591 to be closed according to a fourth preferred version of the second aspect of the present invention, which is closed by a window (wind〇w) ^ ^ On the side of the lens, the window is transparent to the laser beam. Preferably, the window portion has a wiper mechanism for removing the shredded parts from the window portion. Typically, a static wiper is provided which can be moved across the window to remove debris deposited by the window. move
=康：發：之第二層面的一第五個較佳版本或其任何 則迷的較仏版本’刪係由一板而閉合於最靠近該 側，該板係位在於該透鏡之光闌㈨叩），其具有—孔或二 歹J之孔，以允a午该束為通過DEM至該區域。 S 一根據本發明之第二層面的一第六個較佳版本或其任何 則述的較佳版本，-間隙係設置☆ DEM與—基板 :允許該流體流動進人刪而流動於該區域之至少❹ 一根據本發明之第二層面的—第七個較佳版本或其任何 刚述的較佳版本，贿係安裝於_可動的滑動件⑽岭 且設置於DEM的下緣之間隙係維持固定於基板移動期間， 此乃藉由連結輯動件之-適合的基板表面位置感測器。 一根據本發明之第二層面的一第八個較佳版本或其任何 別述的較佳版本，職係附接至浮動於基板之上的一 壓盤（puck)。 二乳 —根據本發明之第二層面的—第九個較佳版本或其任何 則逑的較佳版本，通過麵之_流體流動係藉由KP 以致使流體進入DEM而產生或維持。 13 1303591 較佳版本或其任何 第十個 根據本發 m + 不T TO平乂 1玄欣桊或其任何 圭版本，通…之-流體流動係藉由-栗以 自忒DEM取出流體而產生或維持。 明之第二層㈣1十—個較佳版本或其任 域之de=佳=本’ 1體輪入璋（P〇rt)係位於偏離自該區 窗部的碎屬的一區域以提供—氣體流動，用於移除沉積於 «本發明之第二層面的—第十二個較佳版本或其任 y的&佳版本，該或各個輪人料提供__進 、-動，以能夠流動於朝向該區域之一朝内的徑向方向。 何前=::::第=面的—第十三個較佳版本或其任 體流動的不m 之内部係平滑，且沒有影響該流 何乂 ΓΐΓ發明之第二層面的"'第十四個較佳版本或其任 二 較佳版本，機構係提供以致使該流體流動為沒動 於一閉迴路，直中，ώ # η 籾局机動 返回至軸。自该DEM取出之流體係重新循環且 氣體係提供實質的摔益於韻除領域之多個層面。於 1^ ’ #信的是：於㈣碎屑移除的效率之顯著 改良係可達成，芒名触、夫4 卞心”、、貝者 遠離該基板表面而m 配置使得其指引為實質垂直 下達成:指引-氣體trr的話。此舉係可藉著以 除位置之所有表面朝内的方向而為跨過環繞餘 為藉由-種適-的林ί用力吸取於該位置之上方。此係可 、口的格室之結構而實現，該格室係定位以填 14 1303591 1於基板與運用以曝光該基板的雷射束聚焦或成像透鏡之 ’曰的某個部分空間。此格室係由一窗部而密封於頂側，該 窗部係對於雷射束為透通且其下緣為接近於基板之表面: =格室係附接至持有該透鏡之裝置4因此基板係 由移動於該格室之下方。哕执玄在#丄 °亥格至係精由-吸取泵而部分為 # — ’使得氣體係透過接近於基板之間隙而吸入。以此 方式’-強烈朝内指向表面流動係轉換至一朝上的流動， 而自該表面移除敍除碎屬。若流動係充分強烈，大多數的 姓除碎屬係可自該表面移除，而不具有任何的再次沉積。 fDFM A種概括型式之一格室係稱為一種碎屑取出模組 (DEM，Debris Extract Module)。 如同強力吸取連接’DEM係、可具有另外的氣體入口 i，以助於自It基板之碎屑移除且實行其他作用，諸如： 防止碎屑沉積於位在DEM頂部之窗部。 顯然’諸多的氣體或蒸氣係可運用於一 dem，以用於 接近於基板之朝内流動與接近於窗部之流動，但於諸多情 形，針對於便利與成本理由而運用之一種適當的氣體係空 氣0 DEM設計之一個重要的層面係在於：介於其下緣與基 :之間的距離係必須一直保持固定’即使是當該基板係側 :移動且基板係可能為不平，藉以維持固定氣體流動條 ★由於聚焦或成像透鏡亦需要保持與該基板有一固定距 離’通常附接DEM至與該透鏡相同的安裝機構，使得於 料㈣㈣可追㈣不平的基板之表面。用於保持★亥透 15 1303591 .DEM於基板頂部的—固定距離之數個機構係存在， /、包括：機械式、光學式、氣動式、超音波式1 其他的感測器系統。若該等裝置係附接至麵之下表面了 •且3 DEM與透鏡附接至_伺服馬達驅動式的滑動件，則 該感測器訊號之回授至馬達係可運用，以一直維持該美柄 與DEM下緣和透鏡的距離為固定。 、μ 土 另:種用於保持DEM (與透鏡）和該基板的一固定距離 之方法係存在。此係仰賴於一種空氣壓盤之運用，如同於 本案申請人之專利申請案PCT/GB2〇〇4/〇〇1432所述的彼等 者。於本例，DEM與透鏡係附接至“浮動（fl〇at)”於基板 表面之一空氣壓盤的頂部，故一直維持彼等與該表面2 的一固定距離。 此方法係具有關鍵的優點在於：並不需要單獨的高度 感測裳置以及祠服控制式的DEM與透鏡移動系統，因^ 該壓盤、DEM與透鏡組件係一直跟隨該基板表面輪廓， _隨著於壓盤下表面與基板之間的空氣層係以一高準確度而 自動維持其本身於相同的厚度。誠然，該系統係理想於用 於FPD裝置製造的大面積基板之處理，於其中，破璃基板 之厚度變化係可改變高達1毫米之部分者。 於一 DEM為附接至一空氣壓盤之最簡單的情形，進 入該格室下側而致使朝上的流動為通過蝕除區域且截留該 钱除碎屑之氣體’係衍生自指引至該壓盤之通道以建立空 氣懸浮層的空氣流動。於此情形，以一朝内方向而自該中 空壓盤下側漏出之空氣部分者，係藉著附接為靠近dem 16 1303591 的 是 氣 限 頂部之一強力抽取泵而吸取向上。該種方法係簡單 可移動至壓盤的内側之空氣體積可能有限。此可道 一 凡』導致空 之較不有效的朝上流動，使得蝕除碎屑取出 >= Kang: Hair: A fifth preferred version of the second level or any of its more succinct versions 'deleted by a board that is closed to the nearest side, the board is located in the light of the lens (9) 叩), which has a hole of a hole or a hole J to allow the beam to pass through the DEM to the area. S A sixth preferred version of the second aspect of the invention, or any preferred version thereof, - gap system setting ☆ DEM and - substrate: allowing the fluid to flow into and out of the area At least one of the seventh preferred version of the second aspect of the invention, or any preferred version thereof, is attached to the _ movable slider (10) and the gap disposed at the lower edge of the DEM is maintained. Fixed during substrate movement by a suitable substrate surface position sensor that couples the actuator. According to an eighth preferred version of the second aspect of the invention, or any other preferred version thereof, the grade is attached to a puck that floats above the substrate. The second emulsion - according to the second aspect of the invention - the ninth preferred version or any preferred version of the crucible, is produced or maintained by the surface fluid flow through the KP to cause fluid to enter the DEM. 13 1303591 The preferred version or any of its tenth according to the present invention m + not T TO 乂 1 Xuan Xinyi or any of its genius versions, through - the fluid flow is generated by taking the fluid from the 忒DEM Or maintain. The second layer (4) of the Ming dynasty, or the preferred version of the domain, or the domain of the 1 = = 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体Flow for removing the twelfth preferred version deposited on the second level of the present invention or the & good version of the y, the or each of which provides __in, and Flows in a radial direction towards one of the areas inward. Where before =:::: the = face - the thirteenth preferred version or its internal flow is not smooth, and there is no influence on the flow of the second level of the invention In the fourteen preferred versions, or any two preferred versions thereof, the mechanism is provided such that the fluid flows to remain in a closed loop, and the ώ# η 机动 is maneuvered back to the shaft. The flow system taken out of the DEM is recirculated and the gas system provides substantial benefits in many aspects of the field. In 1^' #信是是: (4) significant improvement in the efficiency of debris removal can be achieved, the name of the name is touched, the husband is 4", and the shell is away from the surface of the substrate and the m is configured such that it is directed to be substantially vertical. The following is achieved: the guide - the gas trr. This can be achieved by absorbing the surrounding area in the direction of the inward direction of all the positions of the position. The structure of the chamber of the mouth and the mouth is realized, and the cell is positioned to fill a portion of the space of the substrate and the laser beam used to expose the substrate to focus or image the lens. Sealed by a window portion on the top side, the window portion is transparent to the laser beam and the lower edge is close to the surface of the substrate: the cell system is attached to the device 4 holding the lens, and thus the substrate system Moved to the bottom of the cell. 哕 玄 在 in #丄 ° Haige to the essence of the - suction pump and part of the # - 'make the gas system through the gap close to the substrate to inhale. In this way' - strong The inner pointing surface flow system is switched to an upward flow, and the removal is removed from the surface If the flow system is sufficiently strong, most of the surnames can be removed from the surface without any re-deposition. fDFM A generalized version of the compartment is called a debris removal module ( DEM, Debris Extract Module). Like the strong suction connection 'DEM system, there may be additional gas inlet i to help remove debris from the It substrate and perform other functions such as: Prevent debris from depositing on top of the DEM Window. Obviously 'many gases or vapors can be applied to a dem for inward and near-surface flow of the substrate, but in many cases, for convenience and cost reasons An appropriate gas system air 0 DEM design is an important layer: the distance between the lower edge and the base: must remain fixed at all times - even when the substrate side: moving and the substrate system may be uneven In order to maintain a fixed gas flow strip ★ because the focusing or imaging lens also needs to maintain a fixed distance from the substrate 'usually attach DEM to the same mounting mechanism as the lens, so that the material (4) The surface of the substrate can be chased (four). The number of mechanisms used to maintain the fixed distance of the top surface of the substrate is: /, including: mechanical, optical, pneumatic, ultrasonic 1 Other sensor systems. If the devices are attached to the underside of the surface and the 3 DEM and the lens are attached to the _servo motor-driven slider, the sensor signal is fed back to the motor system. It can be used to maintain the distance between the handle and the lower edge of the DEM and the lens. The method of maintaining a fixed distance between the DEM (and the lens) and the substrate exists. An air pressure plate is used as described in the applicant's patent application PCT/GB2〇〇4/〇〇1432. In this example, the DEM and the lens system are attached to the "float" on top of one of the air platens on the surface of the substrate, so that they are maintained at a fixed distance from the surface 2. This method has the key advantage that it does not require a separate height sensing skirt and a control-controlled DEM and lens moving system, since the platen, DEM and lens components follow the surface contour of the substrate, _ The air layer between the lower surface of the platen and the substrate automatically maintains itself at the same thickness with a high degree of accuracy. It is true that the system is ideal for the processing of large area substrates for the fabrication of FPD devices in which the thickness variation of the glass substrate can vary by as much as 1 mm. In the simplest case where a DEM is attached to an air platen, entering the lower side of the cell causes the upward flow to pass through the erosion zone and trap the money to remove debris. The process is derived from the guidance to the pressure The passage of the disk to establish the air flow of the air suspension layer. In this case, the portion of the air that leaks from the lower side of the hollow platen in an inward direction is suctioned by a strong extraction pump attached to the top of the gas limit near the dem 16 1303591. This method is simple and the volume of air that can be moved to the inside of the platen may be limited. This can be used to cause the empty, less effective upward flow, so that the debris is removed >
欲克服此限制而提出的是：埠係建立於空氣壓盤，含 埠係可運用以指引附加的空氣（或其他的氣體）至中空壓2 之中央。諸埠係配置以指引該流動為徑向朝内，自該壓盤 之外側至内側，且成形以使得發射至壓盤内部的氣：係釋 放為極接近於基板表面’且為指引於一小角度至該表面。 藉由此種方法，氣體係致使為以高速而流動於沿著該表面 而朝向姓除區之一朝内方向。隨著氣體係移動至該壓盤之 已經發現的是：由飯险步田 甘旦， 田蝕除處理所產生的碎肩係可變化於 其里與尺寸，且一 4b型式夕较^ γ 拉W 式之移除係可作成更為有效，此乃 错由“氣體流動以增強對於碎 遷盤之DEM係可具有另外 女衣於工乳 外的虱體入口與出口埠，以改善 自该基板之碎屑移除，且降 ^ 亨低碎屑之再次沉積於DEM窗 口P。埠係可藉由連接至一谪人 ® ^ ^ 5 A ^ 口的泵或壓縮器而遞送空氣或 乱體至基板，或者是，氣體 埠而移除。 Τ猎由連接至一吸取泵之一 2核心，施加至職之吸力係致使該流動自徑向朝内 r交至朝上’故更為有效截留朝上移動的蝕除碎屑。To overcome this limitation, it is proposed that the tether is built on an air platen that can be used to direct additional air (or other gas) to the center of the hollow pressure 2. The rafts are configured to direct the flow radially inward, from the outer side to the inner side of the platen, and shaped such that the gas emitted to the interior of the platen is released to be in close proximity to the surface of the substrate and is directed to a small Angle to the surface. By this method, the gas system is caused to flow at a high speed along the surface toward the inward direction of one of the surnames. As the gas system has moved to the platen, it has been found that the broken shoulder system produced by the rice stalks, Gantian, and the etched strips can be changed in size and size, and a 4b type eve is better than γ pull W type. The removal system can be made more effective, which is caused by "gas flow to enhance the DEM system for the broken disk, which can have another female garment outside the working milk inlet and outlet ports to improve the crushing from the substrate. The chips are removed, and the lower debris is deposited again in the DEM window P. The tether can deliver air or chaos to the substrate by a pump or compressor connected to a ®人® ^ ^ 5 A ^ port. Or, the gas is removed and removed. The shovel is connected to one of the cores of a suction pump, and the applied suction system causes the flow to move from the radially inward r to the upward direction. Corrosion of debris.
π 一禋婦描處 以選擇性指引氣體或空氣法 板運動之一方向而沿著基柄 ，>1盤之諸埠係可做配置， 平行、傾斜、或垂直於基 。於蝕除碎屑移除效率為 17 1303591 :相對於移動基板的氣體流動方向之情況，則此方向係 二错由打開或閉合適合的閥❿改變，以交替式連接諸埠至 輸入或取出流動。或者是，整個㈣組件係可作 正確對準諸埠於基板運動。π 禋 描 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以The efflux removal efficiency is 17 1303591: relative to the direction of gas flow in the moving substrate, this direction is changed by opening or closing the appropriate valve , to alternately connect the rafts to the input or take out the flow. . Alternatively, the entire (four) component can be properly aligned to the substrate motion.
dEM之種種其他提出的特徵係論述於後。雷射窗部位 f係可於種種不同的位置。於一些情形，可為有利的是使 固部於接近該透鏡的底狀DEM的_，使得職係幾 乎完全佔據透鏡與基板之間的空間。於其他的情形，可為 有利的是定位該窗部於透鏡與基板之間的—中間位置。位 選取係經常取決於透鏡與基板之間的雷射束之形狀。 田j透鏡係聚焦③束，束尺寸接近於基板時係成為極小， 使固。卩適當定位遠離基板係重要，以避免由於高雷射功率 所引起的損壞。另一方面，當該透鏡係投射一大影像且尤 其是當該透鏡係遠心（telecentric)型式，窗部之位置係可接 近於基板表面而不具有由於雷射束之損壞的風險。Other proposed features of dEM are discussed below. The laser window part f can be in various positions. In some cases, it may be advantageous to have the solid portion in close proximity to the bottom DEM of the lens such that the grade almost completely occupies the space between the lens and the substrate. In other cases, it may be advantageous to position the window at an intermediate position between the lens and the substrate. The bit selection system often depends on the shape of the laser beam between the lens and the substrate. The field lens is focused on 3 beams, and the beam size is close to the substrate to make it extremely small.卩 Proper positioning away from the substrate is important to avoid damage due to high laser power. On the other hand, when the lens project a large image and especially when the lens is in a telecentric version, the position of the window can be close to the surface of the substrate without the risk of damage due to the laser beam.
奴允才DEM操作於長期間而無需維護，重要為防止 蝕除碎屑沉積於DEM之内。若該種效應係發生，沉積的 碎屬係可能落回於基板。較佳而言，一 DEM因此應設計 以具有平滑的内表面而無梯級、不連續性、或突然的尺寸 變化。一 DEM之該種設計係將允許氣體之一未阻礙的流 動，且使得碎屑沉積於此單元内的風險為最小化。 儘管此等預防措施，由於氣體接近DEM壁部的流動 速率係低，一些碎屑可能自氣體流動沉積至DEM壁部之 可犯性仍然存在。欲防止此材料落回至基板，dem係構成 18 1303591 使得=屑並不具有沿著自DEM壁部至基板之直接路徑。 此係藉由適合設計的逆向傾斜表面或階級（step)之運用而 - 成。 w 由於雷射束係必須通過DEM之窗部，重要的是：於 固邛的碎屑沉積係最小化。此係通常藉著修正接近於窗部 的輸入氣體流動而達成，然而一些沉積係仍可能發生。於 I*月形延長一 DEM之操作的壽命係重要，此乃藉由配 _置該窗部為可移動式，使得窗部之污染部分係可自該束移 除，且更換為清潔的區域。該種移動係可為手動或自動作 成。 鸟係可設置一種内建窗部的清潔系統，藉以延長DEM 之可。卩。忒種系統係可為基於一種移動式刮板bide) •或是由一靜止刮板所組成，跨於此，窗部之污染側係可為 ，$期式移動。於又—個版本，-種動力或手動驅動序列之 窗部係可設置，-者定位以作用為一運作的窗部，而該序 _ 列之其餘的部件係作清潔。 於一些情形，其中，雷射束之直徑係小且DEM係填 充透鏡與基板之間的空間之實質部分，則為可能以具有」 縫隙或孔之一不透通的板而更換該透通的窗部。若縫隙係 適度的尺寸（正好大於在該板之束尺寸）且施加至D讀之吸 ^力係充分，則靠近基板之一朝上的氣體流動及同時透過縫 '隙之一朝下的氣體流動係建立，以確保微粒碎屑係自該基 板移除而且並未到達該透鏡。 於此情形’其中’該透鏡係—投射透鏡且為非遠心 19 1303591 〃n-Wecentric)，則雷射束係形成一焦點於透鏡與基板之 間的一位置。此位置係稱為光闌（St0p)。於大多數情形，於 此光闌點之束尺寸係小，且因此置放於此點以密封Dem 頂部之一板係僅需要一小的縫隙。於此情形，此孔對於Dem 之氣體流動的效應係小。 若係運用一種多元件的透鏡系統，以在該透鏡所投射 的遮罩（或縫隙）之前而均化該束，則於光闌位置之束係不 再為單一個聚焦光點而是一陣列的聚焦光點所組成。光點 之數目係等於藉由多元件均化光學元件所產生之習稱作 “小束（beamlet)，，的數目。概括而言，此數目係於幾個至 100或更大者之一範目，但是任何可實行的數目之光點係 可運用於此情形，密封該DEM頂部之板係具有適當尺 、/、1距之陣列的孔，以允許所有的小束通過。所需的 各個孔之尺寸係取決於雷射束之發散與透鏡之焦距，但是 針對於大多數的雷射而言係實質為小於i毫米。 ，於DEM的頂部為由具有位在光闌位置之一陣列的孔 斤*封的h形，係最為經常發生在當雷射為多模式型 2者’諸如·· -紫外線的準分子雷射或一近紅外線的固態 田射0針對於此等雷射束，涉及該束分割至多個小束之均 化糸統係最為普遍運用，以產生用於投射的一均勻圖案。 处，一個情形，容許至一 DEM且隨後為引取自該dem =乳或其他氣體係可容納於一閉合循環流動迴路系統。 乂 一泵與過濾單元於流動迴路係將方便取 蝕除的微粒。於其他情形，可能更為適當者係自由釋 20 1303591 自DEM所吸取的空氣或其他氣體而非為將其返回至 贿:於此情形，新鮮的氣體或空氣係供應至DEM。 夕女衣於工氣壓盤或藉由其他方法以維持位置之DEM *係可運作於幾乎任何方位。麵係可能藉著基板為垂直且 該束為水平而操作。其他的方位係可能，包括：令該基板 為於垂直與水平之間的任何中間角度。 藉著該基板為水平且該束為指引自下方而垂直朝上以 操作-麵， 亦為可能。當欲姓除的材料係沉積於對於雷 射輕射為透通之-基板時，若為適當，雷射束係可透過該 基板而照射該薄膜。於此情形，DEM係可位在於基板之一 側而雷射束係位於另一側。於水平的情形，該束係可來自 頂部且朝下通過該基板。DEM接著為於基板之下方且捕 捉自下表面所姓除的碎屑。或者是，該束係可自基板的下 方而朝上，且致使自上側蝕除而造成碎屑。於此後者的情 形，DEM係於頂部。於此二個情形，雷射束係未通過βΕΜ， _ 故並不需要窗部或是穿孔的束進入板。 液體流動之利用 在此，係提出運用位於基板之一薄層的液體所產生之 一種改良。於此情形，此液體係一直截留於一窗部與基板 之間。該液體層之厚度係無須為薄，且可能填充於基板與 透鏡之間的整個空間，但預期的是··若該層係相當薄於^ 毫米的部分者至高達1或2毫米之範圍，蝕除碎屑之更為 有效的截留及移除係將發生。 該窗部係如同透鏡而附接至相同的安裝配置，且二者 21 1303591 係均為保持與基板有一固定距離，此乃藉由一伺服馬達驅 動式滑動件’其為由一適合的感測器元件所致動，感測器 元件係偵測該基板頂部之位置。於基板與窗部之間的間隙 係因此一直維持為固定。該間隙係形成一格室或DEM，液 體係通過此以移除於蝕除處理期間所產生的微粒。DEM於 側向之尺寸係概括為稍微大於雷射束所佔有之面積。針對 於一成像束之情形，該尺寸係可能高達20毫米。針對於 _ 知描光學系統之情形，該尺寸係可能稍微較大。DEM形 ^係可為圓形、方形、矩形、或任何其他的形狀，其為適 當且最配合該束於基板的形狀。液體係於一側而注入至 DEM且於相對側而取出，使得存在一液體流動為跨過dem 而於窗部與基板之間。該液體係截留蝕除碎屑且將其自蝕 除區域移除。 该種系統係類似於針對於光學浸入式蝕印法（〇pticai _ersi〇n lith〇graphy)所提出之方法，其中，於一晶圓步 進益或掃描工具的成像透鏡之間的間隙係填充以液體，以 改善光學解析度與聚焦深度。於此情形，該基板係概括為 -覆有光阻之晶圓，且由該透鏡所建立於其上的輻射圖案 係曝光該光阻，其隨後為顯影以形成—結構。於此情形， 光線強度係極低，故並未發生光阻之直接㈣，且因此並 無顧除碎4產生。於最差的情形，—些氣體係釋放於曝光 處理期間。此係截留於該液體且移除。 提出於此之本發明係牲& i ^ / 货将疋針對雷射束強度為充分高以 直接钮除材料且形成敍除碎屬之情形。因為由於D腿窗 22 1303591 部造成之液體污染，可 σ 力荖在於黏^由 的疋··本發明係將不適於大的壓 產生於蝕除處理期間 合物之$食匕旦旧, 脣形。该種情形係將為針對於聚 口物之间犯里最差密度 ^, 射的情形。若一高壓力係由於形 成的軋體建立於餘除處理 流動且可能損壞DEM窗:1㈣或許會瓦解該㈣ 的情形··使薄層之有機或：::月係特別為重要於以τ /“、、機材料於一適度或低能量密度 下而自一下層的基板公 。於此情形，少量或無氣體產生， 無壓力產生，且液體流動 至係未受到干擾。該種情況 係舍生於诸如於FPD所男釗去*咕成 見到者之薄層的材料由雷射所圖案 4t ° "" 由；職窗部係接近於基板，明顯的是，此 室發明係不適於該束為聚焦且其於窗部處為小尺寸之情 形。本發明係適於當影像尺寸為比較大且欲敍除薄層的材 料所需的能量密度為低之情形。 思及上述型式的一種液體DEM係可能，其中，窗部 係直接附接至透鏡’且窗部（與透鏡）係浮動於窗部與基板 之間的液體薄層上。此係類似於上述的空氣壓盤與麵， 但是於此情形，液體格室係實行浮動且dem係同時為運 作0 上述的DEM發明之氣體與液體版本係可運用於任何 塑式之雷射系統，其具有波長範圍自遠紅外線（例如：I% 微米）而朝下至深紫外線（例如：157奈米）。主要的條件係 必須在於：光學輻射係須能夠通過窗部材料而無重大的損 失，且在於：針對於液體情形，液體係必須對於雷射輻^ 23 1303591 為透通。概括預期的是··此 r η 6 1Q^ ^ ^月係將主要運用於使用波 長乾圍自193奈米至I·% 的石々+ , .r U未之雷射。於此範圍，熔凝 的石夕土 (fused silica)孫一搞Tm上 ’、 里省的窗部材料，且水係一種 理想的液體。尤其是，、、存鍊 ^ . /體DEM裝置之諸多的應用係預 ^ 刼作於248奈米或308奈米之一 糸外線準分子雷射係運用。 DEM之氣體與液駚形4 β 1 〆式係均可操作於藉著DEM為相 關於基板為靜止或是針對於 丁％具有相對運動之情形。該靜止 十月形係將發生於雷射處理兔鲁 里為實施於一步進及重複模式。該 移動情形係將發生於雷射處理為—掃描模式。 【實施方式】 本發明之範例實施例將參照包含第i至1〇圖之伴隨的 圖式而將次明於後，第！至j 〇圖係dem之概略的視圖。 第1圖係顯示碎屑取出模組（DEM)概念之一種氣體版 春本（version)，於其中，運用的流體流動係空氣。一平坦的 基板1係由透鏡2所聚焦或成像之-雷射束3而照射。雷 射束3係通過藉由一透通的窗部5而閉合於上端之一 dem 4，且蝕除於區域R之中的基板丨。空氣、與由蝕除處理所 產生的任何夾帶碎屑係自DEM 4的向上一段距離之一埠6 取出’且由進入之空氣7所替換，進入之空氣7係透過於 DEM 4的下緣4A與基板i之間的間隙g而吸入。DEM 4 與透鏡2係維持與相對於基板1之固定位置，此乃藉由耦 接至一饲服馬達驅動式的滑動機構之一高度感測器（未顯 24 1303591 示）。 第2圖係顯示一種設有一附加埠8之運用氣體式的 MM 4 ’附加淳8係裝配至DEM 4之一上端區域，以提供 氣體進入内部。此附加_ 8係提供—清潔流動之空氣8A 為維持於窗部5之底側。 第3圖係顯示一種運用氣體式的DEM 4之一個更為複 雜的形式，DEM 4係附接至一空氣壓盤9,其透過埠1〇饋 入空氣流動10A，以使壓盤9空中飄浮（levitati〇n)於基板 1之上方，藉以維持間隙G於一預定的高度。 第4圖係顯示一種設有特定氣體進入埠u之空氣流動 式的DEM 4 ’進入埠丨丨係指引一附加空氣流動丨丨a至壓 =9之内部，接近於㈣位置R。埠^係仙以指引空氣 l動11A於朝向蝕除位置R之一朝内的方向，且指引其於 某们適田的小角度或儘可能為平行於基板表面。埠11係 可配置於壓盤9之二或多個側邊，或是可整個環繞於壓盤 9 〇 第5圖係顯示—種DEM4’，運用於其中的為透通的基 板1田射束3係通過基板1以自基板1的側邊1A之區域 R，餘除材料，側邊1A係相對於透鏡2位在上方之側邊⑶。 於此例，DEM 4,係不需要一雷射窗部。 第6圖係顯示一種DEM 4，，，其中，於第i至4圖所 描述為-窗部者係替換為一 12，其具有一陣列之孔（範 為孔HI H2) ’各個孔係允許一小束Βι、以進入 4之内部。板12係位在於一透鏡光闌(st〇p)，於此處，由 25The slave is only allowed to operate for a long period of time without maintenance, and it is important to prevent the removal of debris from depositing in the DEM. If this effect occurs, the deposited genus may fall back to the substrate. Preferably, a DEM should therefore be designed to have a smooth inner surface without steps, discontinuities, or sudden dimensional changes. This design of a DEM will allow for unimpeded flow of one of the gases and minimize the risk of debris being deposited within the unit. Despite these precautions, the susceptibility of some debris to the wall of the DEM may still exist due to the low flow rate of the gas near the wall of the DEM. To prevent this material from falling back onto the substrate, the dem system constitutes 18 1303591 so that the swarf does not have a direct path along the wall from the DEM to the substrate. This is achieved by the application of a reversed inclined surface or step suitable for the design. w Since the laser beam system must pass through the window of the DEM, it is important that the solid debris deposition system is minimized. This is usually achieved by correcting the flow of input gas close to the window, although some deposition systems may still occur. It is important to extend the life of a DEM operation in the I* moon shape. This is because the window portion is movable so that the contaminated portion of the window can be removed from the beam and replaced with a clean area. . This type of mobile system can be made manually or automatically. The bird system can be equipped with a built-in window cleaning system to extend the DEM. Hey. The system can be based on a mobile scraper or • consisting of a stationary scraper, across which the contaminated side of the window can be moved in a $ period. In yet another version, the window portion of the power or manual drive sequence can be set to position as a functioning window while the remaining components of the sequence are cleaned. In some cases, where the diameter of the laser beam is small and the DEM fills a substantial portion of the space between the lens and the substrate, it is possible to replace the through-hole with a plate having a gap or a hole that is impermeable. Window. If the gap is of a moderate size (just larger than the beam size of the plate) and the suction force applied to the D reading is sufficient, the gas flowing toward one of the substrates is upward and the gas flowing downward through the slit is simultaneously The flow system is established to ensure that particulate debris is removed from the substrate and does not reach the lens. In this case, where the lens system is a projection lens and is non-telecentric 19 1303591 〃n-Wecentric, the laser beam system forms a focus at a position between the lens and the substrate. This position is called the pupil (St0p). In most cases, the beam size at this stop is small and therefore only a small gap is required to place the plate at the top of the Dem. In this case, the effect of this hole on the gas flow of the Dem is small. If a multi-element lens system is used to homogenize the beam before the mask (or slit) projected by the lens, then the beam at the pupil position is no longer a single focused spot but an array The focus of the light consists of. The number of spots is equal to the number of known "beamlets" produced by multi-element homogenizing optics. In general, this number is in the range of a few to 100 or greater. However, any number of light points that can be applied can be used in this case. The plate that seals the top of the DEM has holes of an array of suitable scales, /, 1 distance, to allow all small beams to pass. The size of the hole depends on the divergence of the laser beam and the focal length of the lens, but is substantially less than i mm for most lasers. At the top of the DEM is an array with one of the positions at the pupil position. The h-shaped shape of the hole is the most frequently occurring when the laser is a multi-mode type 2 'such as - ultraviolet light excimer laser or a near infrared infrared solid field field 0 for these laser beams, Homogenization systems involving the splitting of the beam into a plurality of small beams are most commonly used to produce a uniform pattern for projection. At one point, one is allowed to a DEM and then taken from the dem = milk or other gas It can be housed in a closed loop flow loop system. The pump and filter unit will facilitate the removal of particulates in the flow circuit. In other cases, it may be more appropriate to freely release 20 1303591 air or other gases drawn from the DEM instead of returning it to bribes: In this case, fresh gas or air is supplied to the DEM. The DEM* system on the working pressure plate or by other means to maintain the position can operate in almost any orientation. The face may be vertical by the substrate and the The beam is operated horizontally. Other orientations are possible, including: making the substrate at any intermediate angle between vertical and horizontal. By the substrate being horizontal and the beam being directed from below and vertically upwards to operate-surface It is also possible that when the material to be surnamed is deposited on a substrate that is transparent to the laser, if appropriate, the laser beam can illuminate the film through the substrate. In this case, the DEM system It can be located on one side of the substrate and the laser beam is on the other side. In the horizontal case, the beam can pass from the top and downward through the substrate. The DEM is then below the substrate and captures the name from the lower surface. Broken Alternatively, the beam system may face upward from the bottom of the substrate and cause debris to be removed from the upper side. In the latter case, the DEM is attached to the top. In both cases, the laser beam system fails. βΕΜ, _ does not require a window or a perforated bundle to enter the plate. The use of liquid flow here proposes an improvement resulting from the use of a liquid located in a thin layer of the substrate. In this case, the liquid system is always retained. Between a window portion and a substrate, the thickness of the liquid layer need not be thin, and may be filled in the entire space between the substrate and the lens, but it is expected that if the layer is relatively thinner than the portion of the ^mm Up to 1 or 2 mm, a more efficient removal and removal of debris will occur. The window is attached to the same mounting configuration as a lens, and both 21 1303591 are maintained There is a fixed distance from the substrate by a servo motor driven slider that is actuated by a suitable sensor element that senses the position of the top of the substrate. The gap between the substrate and the window portion is thus maintained constant. The gap forms a cell or DEM through which the liquid system is removed to remove particles generated during the etching process. The lateral dimension of the DEM is summarized to be slightly larger than the area occupied by the laser beam. This size may be as high as 20 mm for the case of an imaging beam. This size may be slightly larger for the case of the optical system. The DEM shape can be circular, square, rectangular, or any other shape that is suitable and most suitable for the shape of the bundle on the substrate. The liquid system is injected into the DEM on one side and removed on the opposite side such that there is a liquid flow across the dem between the window and the substrate. The liquid system intercepts the debris and removes it from the etched area. This system is similar to the method proposed for optical immersion etching (〇pticai _ersi〇n lith〇graphy) in which the gap between the imaging lenses of a wafer stepper or scanning tool is filled. Use liquid to improve optical resolution and depth of focus. In this case, the substrate is summarized as - a wafer coated with a photoresist, and the radiation pattern established by the lens exposes the photoresist, which is subsequently developed to form a structure. In this case, the light intensity is extremely low, so that no direct photo-resistance occurs (4), and therefore no break-up 4 is produced. In the worst case, some gas systems are released during the exposure process. This system is trapped in the liquid and removed. The invention of the present invention is directed to the case where the intensity of the laser beam is sufficiently high to directly remove the material and form a genus. Because of the liquid contamination caused by the D leg window 22 1303591, the σ 荖 荖 荖 黏 黏 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本shape. This situation will be the case for the worst density of shots between the agglomerates. If a high pressure is due to the formation of the rolling body established in the residual treatment flow and may damage the DEM window: 1 (d) may disintegrate the situation (4) · make the thin layer organic or ::: month is particularly important to τ / ", the machine material is at a moderate or low energy density from the substrate of the lower layer. In this case, little or no gas is generated, no pressure is generated, and the liquid flows to the system without being disturbed. The material such as the thin layer of the FPD's male 钊 咕 咕 由 由 由 由 由 由 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 FP FP FP FP FP FP FP FP FP FP FP FP FP FP FP FP FP FP FP The beam is in focus and is small in size at the window. The present invention is suitable for situations where the image density is relatively large and the energy density required to remove the thin layer is low. A liquid DEM system is possible in which the window portion is directly attached to the lens 'and the window portion (and the lens) floats on the liquid thin layer between the window portion and the substrate. This is similar to the air pressure plate and surface described above. However, in this case, the liquid compartment system is floated. Both the dem system and the dem system are operating at the same time. The gas and liquid versions of the DEM invention described above can be applied to any plastic laser system having a wavelength range from far infrared (for example: 1% micron) to downward to deep ultraviolet ( For example: 157 nm. The main condition must be that the optical radiation system must be able to pass through the window material without significant loss, and that the liquid system must be transparent to the laser radiation 23 13359591 for liquid conditions. The general expectation is that this r η 6 1Q^ ^ ^ month system will be mainly used for the use of wavelengths from 193 nm to I·% of Dendrobium +, .r U laser. In this range, Fused fused silica Sun Yi engages in the window material of Tm, and the water system is an ideal liquid. In particular, the storage chain ^ / / the application system of the body DEM device It is used in the excimer laser system of 248 nm or 308 nm. The gas and liquid helium 4 β 1 〆 system of DEM can be operated by DEM for the substrate to be stationary or For the case where Ding% has relative motion, the static October shape will be issued. The laser processing rabbit Rauri is implemented in a stepping and repeating mode. The mobile situation will occur in the laser processing-scan mode. [Embodiment] Exemplary embodiments of the present invention will refer to the inclusion of the i-th to the first The accompanying drawings will be sub-expressed, and the summary view from the ! to j 〇 diagram dem. The first figure shows a version of the gas version of the Debris Removal Module (DEM) concept. In this case, the applied fluid flow is air. A flat substrate 1 is illuminated by a laser beam 3 that is focused or imaged by the lens 2. The laser beam 3 is closed by a transparent window 5 One of the upper ends is dem 4 and is etched away from the substrate 之中 in the region R. The air, any entrained debris generated by the erosion treatment, is taken one of the upward distances from the DEM 4 埠6 and is replaced by the incoming air 7, which enters the lower edge 4A of the DEM 4 Inhaled with the gap g between the substrate i. The DEM 4 and lens 2 are maintained in a fixed position relative to the substrate 1 by means of a height sensor coupled to a feed motor-driven sliding mechanism (not shown in Figure 23 1303591). Fig. 2 shows an MM 4 'additional 淳 8 system with an additional 埠 8 applied to the upper end region of the DEM 4 to provide gas into the interior. This additional _ 8 series provides that the clean flowing air 8A is maintained on the bottom side of the window portion 5. Figure 3 shows a more complex form of a DEM 4 using a gas type, the DEM 4 is attached to an air platen 9 which feeds the air flow 10A through the 埠1〇 to float the platen 9 ( Levitati〇n) is above the substrate 1 to maintain the gap G at a predetermined height. Figure 4 shows an air flow type DEM 4 ' entering the tether with a specific gas entering the 埠u to direct an additional air flow 丨丨a to pressure = 9 inside, close to the (iv) position R.埠^系仙 to guide the air l move 11A in the direction toward the inner side of the erosion position R, and direct it to a small angle of the field or as parallel as possible to the surface of the substrate. The 埠11 system can be disposed on two or more sides of the platen 9, or can be entirely surrounded by the platen 9 〇 Figure 5 shows the type of DEM4', which is used for the transparent substrate 1 field beam 3 passes through the substrate 1 from the region R of the side 1A of the substrate 1, and the material is left, and the side 1A is on the upper side (3) with respect to the lens 2 position. In this case, DEM 4 does not require a laser window. Figure 6 shows a DEM 4, wherein, as depicted in Figures ith to 4, the window portion is replaced by a 12 having an array of holes (fan is a hole HI H2) 'each hole system allows A small bundle of Βι to enter the interior of 4. The board 12 is located in a lens stop (st〇p), here, by 25