TWI303441B - Output controller with test unit - Google Patents
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- TWI303441B TWI303441B TW095123954A TW95123954A TWI303441B TW I303441 B TWI303441 B TW I303441B TW 095123954 A TW095123954 A TW 095123954A TW 95123954 A TW95123954 A TW 95123954A TW I303441 B TWI303441 B TW I303441B
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- 238000012360 testing method Methods 0.000 title claims description 77
- 238000012546 transfer Methods 0.000 claims description 55
- 230000000630 rising effect Effects 0.000 claims description 28
- 230000001360 synchronised effect Effects 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 21
- 230000004044 response Effects 0.000 claims description 17
- 230000009467 reduction Effects 0.000 claims description 11
- 230000003111 delayed effect Effects 0.000 claims description 10
- 230000009849 deactivation Effects 0.000 claims description 6
- 230000001934 delay Effects 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims 2
- 230000003247 decreasing effect Effects 0.000 claims 1
- 230000002441 reversible effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 5
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C29/50012—Marginal testing, e.g. race, voltage or current testing of timing
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/022—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in I/O circuitry
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/023—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in clock generator or timing circuitry
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
- G11C7/1066—Output synchronization
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/22—Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management
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Description
1303441 九、發明說明: 【發明所屬之技術領域】 本發明係關於一半導體記憶體裝置;且更特定言之,本 發明係關於一具有一測試單元之輸出控制器以控制一半導 體記憶體裝置之資料輸出時序。 【先前技術】 由於半導體記憶體裝置被高度整合,所以已進行了許多 - 嘗5式來增加其操作速度。為達成此目的,已引入了與一外 • 部 時脈同步操作之同步記憶體裝置。 在一個時脈週期期間,一單資料速率(SDR)同步記憶體 裝置經由一資料插頭與外部時脈之一上升邊緣同步來輸入 及輸出一個資料。 、 然而,該SDR同步記憶體裝置不足以滿足一高速系統之 速度需要。因此,已提議在一個時脈週期期間處理兩個資 料之雙資料速率(DDR)同步記憶體裝置。 在該DDR同步記憶體裝置中,經由資料輸入/輸出插頭 與=邛呤脈之上升及下降邊緣同步連續地輸入及輸出兩個 貝料。該DDR同步記憶體裝置可在不增加時脈之頻率的情 况下建構至少兩倍於SDR同步記憶體裝置之頻寬,因此獲 得高速操作。 由於該DDR記憶體裝置須在一個時脈週期期間接收或輸 出兩個貝料,故可不再使用習知同步記憶體裝置中使用之 資料存取方法。 * /夺脈週期為大約10 ns,則須在ό nsec或更少時間内 112655.doc 1303441 大體上處理兩個連續資料,除了上升時間及下降時間(大 約0·5χ4=2 ns)及滿足其他規格所需之時間外。然而,在, 記憶體裝置内執行該過程係困難的。因此,僅冬 I王田㈢一外部 電路輸入資料或向其輸出資料時,該記憶體裝置才與談時 脈之上升及下降邊緣同步操作。大體上,該等兩個資料在 該記憶體裝置内與該時脈之一個邊緣同步處理。 為了將 > 料自一記憶體裝置轉移至一内部核心區域或將BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a semiconductor memory device; and more particularly, to an output controller having a test unit for controlling a semiconductor memory device. Data output timing. [Prior Art] Since the semiconductor memory device is highly integrated, many have been carried out - the type 5 is used to increase the operation speed. To achieve this, a synchronous memory device that operates synchronously with an external clock has been introduced. During a clock cycle, a single data rate (SDR) sync memory device inputs and outputs a data via a data plug synchronized with one of the rising edges of the external clock. However, the SDR sync memory device is insufficient to meet the speed requirements of a high speed system. Therefore, it has been proposed to process two data double data rate (DDR) sync memory devices during one clock cycle. In the DDR synchronous memory device, two feed materials are continuously input and output in synchronization with the rising and falling edges of the 邛呤 pulse via the data input/output plug. The DDR sync memory device can construct at least twice the bandwidth of the SDR sync memory device without increasing the frequency of the clock, thereby achieving high speed operation. Since the DDR memory device is required to receive or output two bedding during one clock cycle, the data access method used in conventional synchronous memory devices can no longer be used. * / The cycle of the pulse is about 10 ns, and the two consecutive data must be processed substantially in ό nsec or less 112655.doc 1303441, except for the rise time and fall time (about 0·5χ4=2 ns) and other The time required for the specification is outside. However, it is difficult to perform this process within the memory device. Therefore, only when the winter circuit (W) and the external circuit input data or output data to it, the memory device operates in synchronization with the rising and falling edges of the talk clock. In general, the two data are processed in synchronization with one edge of the clock within the memory device. In order to transfer > from a memory device to an internal core region or
該轉移之資料輸出至一外部電路,需要一新的資料存取方 法。 該同步記憶體裝置使用若干不同於彼等非同步記憶體穿 置之概念。其中一者為CAS潛時(CL)。CAS潛時為自一讀 取指令至資料輸出之一輸入計數的時脈之數目。若 CL=3,則其意謂在自讀取指令之一輸入的三個時脈週期 之後資料被輸出至一外部電路。CAS潛時判定資料輸出時 序。在該半導體記憶體裝置之一初始操作中,使用一組經 偵測之CL值來存取且輸出資料。 因此’在一操作時脈週期被延遲了與該組CAS潛時一樣 長之後,產生一資料輸出致能訊號。當將該資料輸出致能 訊號啟用時,輸出經存取之資料以回應讀取指令。 所使用之操作時脈為一延遲鎖定迴路(DLL)時脈,其藉 由將一外部時脈延遲鎖定一預定時間而獲得。此DLL時脈 產生自一延遲鎖定迴路(DLL)電路。在同步半導體記憶體 裝置中’資料輪出必須與外部時脈之上升及下降邊緣精確 地同步。然而,歸因於時脈訊號之延遲時間(其在内部處 112655.doc C·.. 1303441 理期間不可避免地發生),使得資料輸出不能與外部時脈 之上升及下降邊緣精確地同步。 圖1為一習知輸出控制器之方塊圖。The transfer of the transferred data to an external circuit requires a new method of data access. The synchronous memory device uses a number of different concepts than their non-synchronous memory placement. One of them is CAS Latent Time (CL). The CAS latency is the number of clocks from the first read fetch to the data output. If CL = 3, it means that the data is output to an external circuit after three clock cycles input from one of the read commands. The CAS latency determines the data output timing. In one of the initial operations of the semiconductor memory device, a set of detected CL values are used to access and output the data. Thus, a data output enable signal is generated after an operational clock cycle is delayed as long as the set of CAS latency. When the data output enable signal is enabled, the accessed data is output in response to the read command. The operational clock used is a delay locked loop (DLL) clock that is obtained by locking an external clock delay for a predetermined time. This DLL clock is generated from a delay locked loop (DLL) circuit. In synchronous semiconductor memory devices, the data wheel must be accurately synchronized with the rising and falling edges of the external clock. However, due to the delay time of the clock signal (which inevitably occurs during the internal period), the data output cannot be accurately synchronized with the rising and falling edges of the external clock. Figure 1 is a block diagram of a conventional output controller.
參看圖1,輸出控制器包括一時脈延遲單元10、一選擇 單元20、一初始同步單元30及一同步單元40。該時脈延遲 單元10將一上升DLL時脈RCLK_DLL及一下降DLL時脈 FCLK一DLL·延遲一預定時間以回應CAS潛時資訊訊號CL3 至CL5。該選擇單元20在該時脈延遲單元10之輸出訊號當 中選擇對應於CAS潛時資訊訊號CL3至CL5之訊號且將該 等經選擇之訊號輸出作為複數個驅動時脈RCLK_OE10至 RCLK—OE35。當啟用一讀取CAS訊號CASP6—RD時,該初 始同步單元30輸出一輸出致能訊號OEOO。該同步單元40 將該選擇單元20之輸出訊號與相應驅動時脈及DLL時脈同 步,且產生輸出致能訊號OE10至OE45。 為供參考,讀取CAS訊號CASP6_RD由一半導體記憶體 裝置内之一讀取操作所導致,且僅對應於該組CL之C AS潛 時資訊訊號CL3至CL5被啟用。 雖然未在圖1中展示,但輸出致能訊號OEOO至OE45含有 與自讀取CAS訊號CASP6_RD之啟用流逝之延遲時間有關 的資訊,且提供CL資訊。換言之,當產生用於控制資料輸 出之輪出驅動訊號ROUTEN及FOUTEN時,在經由一資料 墊輸出回應於讀取指令而自一記憶體核心區塊輸出之資料 時使用該等輸出致能訊號OEOO至OE45以滿足該組CAS潛 時。 / if*": V ' 112655.doc 1303441 下文將描述不具有時脈延遲單元10及選擇單元20之輸出 控制器的操作。 圖2 A為一習知輸出控制器在以一低頻率操作時的波形 圖。 參看圖2 A,當與外部時脈CLK同步應用一讀取指令RD 時,一相應讀取CAS訊號CASP6_RD被啟用。Referring to Fig. 1, the output controller includes a clock delay unit 10, a selection unit 20, an initial synchronization unit 30, and a synchronization unit 40. The clock delay unit 10 delays a rising DLL clock RCLK_DLL and a falling DLL clock FCLK_DLL by a predetermined time in response to the CAS latent information signals CL3 to CL5. The selecting unit 20 selects signals corresponding to the CAS latent information signals CL3 to CL5 in the output signals of the clock delay unit 10 and outputs the selected signals as a plurality of driving clocks RCLK_OE10 to RCLK_OE35. When a read CAS signal CASP6-RD is enabled, the initial synchronization unit 30 outputs an output enable signal OEOO. The synchronizing unit 40 synchronizes the output signal of the selecting unit 20 with the corresponding driving clock and the DLL clock, and generates output enable signals OE10 to OE45. For reference, the read CAS signal CASP6_RD is caused by a read operation in a semiconductor memory device, and only the C AS latency information signals CL3 to CL5 corresponding to the set of CLs are enabled. Although not shown in Fig. 1, the output enable signals OEOO to OE45 contain information on the delay time of the elapse of the self-reading CAS signal CASP6_RD, and provide CL information. In other words, when the wheel-out drive signals ROUTEN and FOUTEN for controlling the data output are generated, the output enable signals OEOO are used when outputting data from a memory core block in response to the read command via a data pad output. To OE45 to meet the group's CAS latency. / if*": V ' 112655.doc 1303441 The operation of the output controller without the clock delay unit 10 and the selection unit 20 will be described below. Figure 2A is a waveform diagram of a conventional output controller operating at a low frequency. Referring to FIG. 2A, when a read command RD is applied in synchronization with the external clock CLK, a corresponding read CAS signal CASP6_RD is enabled.
隨後,初始同步單元30啟用輸出致能訊號OEOO以回應 該讀取CAS訊號CASP6_RD。該第一同步單元自該輸出致 能訊號OEOO之啟用輸出與第一上升DLL時脈RCLK_DLL之 上升邊緣同步的輸出致能訊號OE10。 雖然未圖示,但藉由將第一同步單元之輸出致能訊號 OE10與下降DLL時脈FCLK—DLL同步,第二同步單元啟用 輸出致能訊號OE15,且藉由將第二同步單元之輸出訊號 OE15與上升DLL時脈RCLK—DLL同步,第三同步單元啟用 輸出致能訊號OE20。 經由此等程序,複數個輸出致能訊號OEOO至OE45自讀 取CAS訊號CASP6_RD之啟用而與上升DLL時脈 RCLK—DLL及下降DLL時脈FCLK—DLL同步啟用。 然而,如圖2B所說明,若以一高頻率操作該輸出控制 器,貝1丨自該讀取CAS訊號CASP6_RD之啟用不能啟用與第 一上升DLL時脈RCLK_DLL同步之輸出致能訊號OE10。 由於以一高頻率操作該輸出控制器,故該第一上升DLL 時脈RCLK_DLL之邊緣導致輸出致能訊號OEOO之啟用時間 由初始同步單元30啟用。因此,該第一同步單元輸出與第 112655.doc 1303441 二上升DLL時脈同步之輸出致能訊號〇E1 〇。 意即’由於自該輸出控制器產生之輸出致能訊號的啟用 時間被延遲了一個時脈,故與經產生之輸出驅動訊號同步 輸出以回應該輸出致能訊號之資料不能滿足該組CAS潛 時,從而導致資料失效。 為解決此等問題,習知輸出控制器進一步包括時脈延遲 單疋以用於根據該CAS潛時來延遲上升DLL時脈及下降 dll時脈及選擇單元以用於根據該CAS潛時輸出相應時脈 作為驅動時脈。 為在該第一上升DLL時脈比讀取CAS訊號更早地啟用時 防止資料失效發生,習知輸出控制器根據頻率調節該DLL 時脈之上升時間點。然而,歸因於固定延遲量,根據ρντ 變化來控制實際晶片係困難的。 【發明内容】 因此,本發明之一目標為提供一具有一測試單元之輸出 控制器,該測試單元能夠根據一真實情況下之一操作頻率 測試一適當延遲量。 根據本發明之一態樣,提供了一輸出控制器,其包括: 一初始同步單元,其用於在一讀取CAS訊號被啟用時輸出 第輸出致能祝號,衩數個串聯連接之同步單元,其, 者用於輸出前一級之輸出tfL號作為一與相應驅動時^同 步之輸出致能訊號,該等同步單元之第一級接收第—輪。 ^能訊號·,及-測試單元,其用於根據複數個測試訊號^ 卽輪入時脈之延遲量且輸出該驅動時脈。 ° 112655.doc 1303441 根據本發明之另一態樣,提供了一用於控制資料輸出時 序之半導體裝置,其包括:一初始同步單元,其用於在一 讀取CAS訊號被啟用時輸出一第一輸出致能訊號;複數個 串聯連接之同步單元,其每一者用於輸出前一級之輸出訊 號作為一與相應驅動時脈同步之輸出致能訊號,該複數個 同步單元之第一同步單元接收第一輸出致能訊號;及一測 試單元,其用於基於複數個測試-延遲量調節訊號來調節 輸入時脈之延遲量且輸出複數個驅動時脈以回應複數個測 試完畢訊號。 【實施方式】 現將參看附圖詳細描述根據本發明之例示性實施例之輸 出控制器。 圖3為根據本發明一具有一測試單元之輸出控制器的方 塊圖。 參看圖3,根據本發明之一實施例之輸出控制器包括一 時脈延遲單元100、一選擇單元200、一初始同步單元 3 00、複數個串聯連接之同步單元400及一測試單元500。 該初始同步單元300在一讀取CAS訊號CASP6JRD被啟用時 輸出一輸出致能訊號OE00。藉由將個別前級之輸出訊號 與相應驅動時脈RCLK—OE10至FCLK—OE35及上升及下降 DLL時脈RCLK_DLL及FCLK_J)LL同步,同步單元400產生 輸出致能訊號OE10至OE45。該測試單元500控制根據一測 試訊號TM所應用之輸入時脈RDLL—OE10CL至 FDLL^_OE3 5CL的每一延遲量且輸出驅動時脈RCLK_OE10 112655.doc -10- 1303441 至FCLK—OE35。該時脈延遲單元100將上升及下降DLL時 脈RCLK^DLL及FCLK—DLL延遲一預定時間以回應CAS潛 時資訊訊號CL3至CL5。該選擇單元200在該時脈延遲單元 100之輸出訊號當中選擇對應於CAS潛時資訊訊號CL3至 CL5之訊號。 由於該輸出控制器進一步包括可為輸入至同步單元400 之驅動時脈RCLK—OE10至FCLK—OE35添加延遲以用於產 生輸出致能訊號OE00至OE45的測試單元500,故可在真實 晶片情況下測試根據頻率所需之延遲量。 下文將參看附圖詳細描述該輸出控制器之個別單元。 圖4為根據本發明之一第一實施例圖3之測試單元500的 電路圖。 參看圖4,該測試單元500包括第一至第六延遲調節單元 510、520、53 0、540、550及560以用於藉由根據一測試· 延遲增量訊號TM_INC、一測試-延遲減量訊號TM_DEC及 一測試-延遲正常訊號NO_TM調節輸入訊號之延遲量而輸 出驅動時脈RCLK_OE10至FCLK_OE3 5。 圖5為圖4之第一延遲調節單元510之電路圖。第二至第 六延遲調節單元520至560具有與第一延遲調節單元510之 電路組態相同的電路組態。將描述該第一延遲調節單元 5 10作為一例示性結構。 參看圖5,該第一延遲調節單元510包括一第一延遲單元 512、一第二延遲單元514、一第一轉移閘TG1、一第二轉 移閘TG2及一第三轉移閘TG3。第一及第二延遲單元512及 112655.doc -11- 1303441 5 14經串聯連接以用於延遲輸入訊號。該第一轉移閘TGI 轉移輸入時脈RDLL—OE10CL作為驅動時脈RCLK_OE10以 回應測試-延遲減量訊號TM__DEC。該第二轉移閘TG2轉移 該第一延遲單元512之一輸出訊號作為驅動時脈 RCLK一OE10以回應測試-延遲正常訊號NO—TM。該第三轉 移閘TG3轉移該第二延遲單元514之一輸出訊號作為驅動 時脈RCLK一OE10以回應測試-延遲增量訊號TM—INC。Subsequently, the initial synchronization unit 30 enables the output enable signal OEOO in response to the read CAS signal CASP6_RD. The first synchronization unit outputs an output enable signal OE10 synchronized with the rising edge of the first rising DLL clock RCLK_DLL from the enable output of the output enable signal OEOO. Although not shown, the second synchronization unit enables the output enable signal OE15 by synchronizing the output enable signal OE10 of the first synchronization unit with the falling DLL clock FCLK_DLL, and by outputting the second synchronization unit The signal OE15 is synchronized with the rising DLL clock RCLK_DLL, and the third synchronizing unit enables the output enable signal OE20. Through such a procedure, a plurality of output enable signals OEOO to OE45 are enabled by the self-reading CAS signal CASP6_RD and synchronized with the rising DLL clock RCLK_DLL and the falling DLL clock FCLK_DLL. However, as illustrated in Figure 2B, if the output controller is operated at a high frequency, the enable enable signal OE10 synchronized with the first rising DLL clock RCLK_DLL cannot be enabled from the enable of the read CAS signal CASP6_RD. Since the output controller is operated at a high frequency, the edge of the first rising DLL clock RCLK_DLL causes the enable time of the output enable signal OEOO to be enabled by the initial synchronization unit 30. Therefore, the first synchronization unit outputs an output enable signal 〇E1 同步 synchronized with the 112655.doc 1303441 second rising DLL clock. That is, since the activation time of the output enable signal generated from the output controller is delayed by one clock, the data outputted in synchronization with the generated output drive signal to output the enable signal cannot satisfy the group of CAS dive. At the time, the data is invalidated. To solve such problems, the conventional output controller further includes a clock delay unit for delaying the rising DLL clock and the falling dll clock according to the CAS latency and selecting a unit for outputting according to the CAS latency output. The clock acts as the driving clock. In order to prevent data failure from occurring when the first rising DLL clock is enabled earlier than reading the CAS signal, the conventional output controller adjusts the rising time point of the DLL clock according to the frequency. However, due to the fixed delay amount, it is difficult to control the actual wafer system according to the change in ρντ. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an output controller having a test unit that is capable of testing an appropriate amount of delay based on an operating frequency of a real situation. According to an aspect of the present invention, an output controller is provided, comprising: an initial synchronization unit for outputting an output enable command number when a read CAS signal is enabled, and synchronizing a plurality of serial connections The unit, for outputting the output tfL number of the previous stage as an output enable signal synchronized with the corresponding driving time, the first stage of the synchronous units receiving the first wheel. The enable signal ·, and - test unit is configured to clock the delay amount of the clock according to the plurality of test signals and output the drive clock. According to another aspect of the present invention, a semiconductor device for controlling data output timing is provided, comprising: an initial synchronization unit for outputting a first read CAS signal when enabled An output enable signal; a plurality of serially connected synchronization units, each of which is configured to output the output signal of the previous stage as an output enable signal synchronized with the corresponding drive clock, the first synchronization unit of the plurality of synchronization units Receiving a first output enable signal; and a test unit for adjusting a delay amount of the input clock based on the plurality of test-delay adjustment signals and outputting a plurality of drive clocks to respond to the plurality of test completion signals. [Embodiment] An output controller according to an exemplary embodiment of the present invention will now be described in detail with reference to the accompanying drawings. Figure 3 is a block diagram of an output controller having a test unit in accordance with the present invention. Referring to FIG. 3, an output controller according to an embodiment of the present invention includes a clock delay unit 100, a selection unit 200, an initial synchronization unit 00, a plurality of serially connected synchronization units 400, and a test unit 500. The initial synchronization unit 300 outputs an output enable signal OE00 when a read CAS signal CASP6JRD is enabled. The synchronizing unit 400 generates output enable signals OE10 to OE45 by synchronizing the output signals of the individual preceding stages with the corresponding driving clocks RCLK_OE10 to FCLK_OE35 and the rising and falling DLL clocks RCLK_DLL and FCLK_J)LL. The test unit 500 controls each delay amount of the input clock RDLL_OE10CL to FDLL^_OE3 5CL applied according to a test signal TM and outputs a drive clock RCLK_OE10 112655.doc -10- 1303441 to FCLK_OE35. The clock delay unit 100 delays the rising and falling DLL clocks RCLK^DLL and FCLK_DLL by a predetermined time in response to the CAS latent information signals CL3 to CL5. The selection unit 200 selects signals corresponding to the CAS latent information signals CL3 to CL5 among the output signals of the clock delay unit 100. Since the output controller further includes a test unit 500 that can add a delay to the driving clocks RCLK_OE10 to FCLK_OE35 input to the synchronization unit 400 for generating the output enable signals OE00 to OE45, in the case of a real wafer Test the amount of delay required based on frequency. The individual units of the output controller will be described in detail below with reference to the accompanying drawings. 4 is a circuit diagram of the test unit 500 of FIG. 3 in accordance with a first embodiment of the present invention. Referring to FIG. 4, the test unit 500 includes first to sixth delay adjustment units 510, 520, 53 0, 540, 550, and 560 for use by a test-delay increment signal TM_INC, a test-delay decrement signal. TM_DEC and a test-delay normal signal NO_TM adjust the delay amount of the input signal to output the driving clocks RCLK_OE10 to FCLK_OE3 5. FIG. 5 is a circuit diagram of the first delay adjustment unit 510 of FIG. 4. The second to sixth delay adjusting units 520 to 560 have the same circuit configuration as that of the first delay adjusting unit 510. The first delay adjustment unit 5 10 will be described as an exemplary structure. Referring to FIG. 5, the first delay adjustment unit 510 includes a first delay unit 512, a second delay unit 514, a first transfer gate TG1, a second transfer gate TG2, and a third transfer gate TG3. The first and second delay units 512 and 112655.doc -11- 1303441 5 14 are connected in series for delaying the input signal. The first transfer gate TGI transfers the input clock RDLL_OE10CL as the drive clock RCLK_OE10 in response to the test-delay down signal TM__DEC. The second transfer gate TG2 transfers the output signal of one of the first delay units 512 as the driving clock RCLK_OE10 in response to the test-delay normal signal NO_TM. The third transfer gate TG3 transfers the output signal of one of the second delay units 514 as the drive clock RCLK_OE10 in response to the test-delay increment signal TM_INC.
在延遲調節單元510中,當測試-延遲正常訊號NO_TM被 啟用時,輸出由第一延遲單元512延遲之訊號作為驅動時 脈RCLK一OE10,且當測試-延遲增量訊號TM一INC被啟用 時,輸出由第一及第二延遲單元5 12及5 14延遲之訊號作為 驅動時脈RCLK—OE10。當測試-延遲減量訊號TM—DEC被 啟用時,立刻輸出輸入時脈RDLL_OE10CL作為驅動時脈 RCLK_OE10。 圖6為圖3之選擇單元200之電路圖。 參看圖6,該選擇單元200包括第一至第六選擇器210、 220、23 0、240、250及260以用於選擇第一至第三時脈延 遲單元120、140及160之輸出時脈中之一者以回應CAS潛 時資訊訊號CL3至CL5。 第一至第六選擇器210至260具有相同電路組態。因此, 將選取第一選擇器210作為一實例。 該第一選擇器210包括一第一轉移閘TG4、一第二轉移 閘TG5、一第三轉移閘TG6及一反相器II。當CAS潛時資訊 訊號CL3被啟用時,該第一轉移閘TG4轉移第一時脈延遲 112655.doc -12- 1303441 單元120之輸出時脈當中之第一時脈RDLL—OE10DL3。當 CAS潛時資訊訊號CL4被啟用時,該第二轉移閘TG5轉移 第二時脈延遲單元140之輸出時脈當中之第一時脈 RDLL—OE10DL4。當CAS潛時資訊訊號CL5被啟用時,該 第三轉移閘TG6轉移第三時脈延遲單元160之輸出時脈當 中之第一時脈RDLL—OE10DL5。該反相器II將第一至第三 轉移閘TG4至TG6之共同輸出節點的電壓反相以輸出第一 CAS延遲時脈RDLL—OE10CL。In the delay adjustment unit 510, when the test-delay normal signal NO_TM is enabled, the signal delayed by the first delay unit 512 is output as the drive clock RCLK_OE10, and when the test-delay increment signal TM-INC is enabled. The signals delayed by the first and second delay units 5 12 and 514 are output as the driving clocks RCLK_OE10. When the test-delay down signal TM-DEC is enabled, the input clock RDLL_OE10CL is immediately output as the drive clock RCLK_OE10. FIG. 6 is a circuit diagram of the selection unit 200 of FIG. Referring to FIG. 6, the selection unit 200 includes first to sixth selectors 210, 220, 23 0, 240, 250, and 260 for selecting output clocks of the first to third clock delay units 120, 140, and 160. One of them responds to the CAS latent information signals CL3 to CL5. The first to sixth selectors 210 to 260 have the same circuit configuration. Therefore, the first selector 210 will be selected as an example. The first selector 210 includes a first transfer gate TG4, a second transfer gate TG5, a third transfer gate TG6, and an inverter II. When the CAS latency information signal CL3 is enabled, the first transfer gate TG4 shifts the first clock RDLL_OE10DL3 among the output clocks of the first clock delay 112655.doc -12- 1303441 unit 120. When the CAS latent information signal CL4 is enabled, the second transfer gate TG5 transfers the first clock RDLL_OE10DL4 among the output clocks of the second clock delay unit 140. When the CAS latency information signal CL5 is enabled, the third transfer gate TG6 transfers the first clock RDLL_OE10DL5 of the output clock of the third clock delay unit 160. The inverter II inverts the voltages of the common output nodes of the first to third transfer gates TG4 to TG6 to output the first CAS delay clock RDLL_OE10CL.
意即,當CAS潛時資訊訊號CL3被啟用時,選擇單元200 轉移第一時脈延遲單元120之複數個延遲時脈 RDLL_OE10DL3 及 FDLL_OE15DL3 作為 CAS 延遲時脈 RDLL_OE10CL至FDLL—OE35CL,或當CAS潛時資訊訊號 CL4被啟用時,選擇單元200轉移第二時脈延遲單元140之 複數個延遲時脈 RDLL_OE10DL4、FDLL_OE15DL4、 RDLL—OE20DL4、FDLL—OE25DL4 作為 CAS 延遲時脈 RDLL 一 OE10CL 至 FDLL—OE35CL。同樣,該選擇單元200 轉移第三時脈延遲單元160之複數個延遲時脈 RDLL一OE10DL5、FDLL OE15DL5,…,RDLL一OE30DL5、 FDLL一OE35DL5 作為 CAS 延遲時脈 RDLL_OE10CL 至 FDLL_OE35CL。 圖7為圖3之初始同步單元3〇〇之電路圖。 參看圖7,該初始同步單元3〇〇包括一停用控制單元 320、一驅動單元340、一鎖存器單元36〇及一初始化單元 380。該停用控制單元320接收一行叢發指令YBST及一内 •13- 112655.doc } ·· "Η. 1303441 部時脈CLKP4以產生一停用控制訊號。該驅動單元340驅 動一輸出節點N1以回應讀取CAS訊號CASP6JRJD及該停用 控制訊號。該鎖存器單元360鎖存該輸出節點之一反相電 壓且將輸出致能訊號OE00輸出。該初始化單元380初始化 該輸出節點N1以回應一加電訊號PWRUP及一寫入/讀取旗 標 WT_RDB。 該停用控制單元320包括:一反相器12,其用於將一叢 發長度訊號BL2反相;一第一NAND閘極ND1,其用於執 行該反相器12之一輸出訊號及行叢發指令YBST的一 NAND 操作;一反相器13,其用於將讀取CAS訊號CASP6_RD反 相;一第二NAND閘極ND2,其用於執行第一 NAND閘極 ND1之輸出訊號、内部時脈CLKP4及該反相器13之一輸出 的一 NAND操作;一反相器14,其用於將該第二NAND閘 極ND2之一輸出訊號反相;及一第三NAND閘極ND3,其 用於執行該等反相器13及14之輸出訊號之一 NAND操作以 輸出停用控制訊號。 初始化單元380包括:一初始化訊號產生單元382,其用 於接收寫入/讀取旗標WT_RDB及加電訊號PWRUP以產生 初始化訊號;及一具有一閘極之PMOS電晶體PM1,其用 於接收該初始化訊號及在一内部電壓(VDD)端子與輸出節 點N1之間的一源極-汲極路徑。 下文將簡要描述初始同步單元300之操作。首先,當讀 取CAS訊號CASP6_RD被啟用至一邏輯高位準時,驅動單 元340將輸出節點N1降低至一邏輯低位準以回應該讀取 112655.doc -14- 1303441 CAS訊號CASP6—RD。隨後,鎖存器單元360將施加於該輸 出節點N1上之電壓反相。輸出致能訊號OEOO被啟用至該 邏輯高位準。That is, when the CAS latency information signal CL3 is enabled, the selection unit 200 transfers the plurality of delay clocks RDLL_OE10DL3 and FDLL_OE15DL3 of the first clock delay unit 120 as the CAS delay clock RDLL_OE10CL to FDLL_OE35CL, or when the CAS is latent. When the information signal CL4 is enabled, the selection unit 200 transfers the plurality of delay clocks RDLL_OE10DL4, FDLL_OE15DL4, RDLL_OE20DL4, FDLL_OE25DL4 of the second clock delay unit 140 as CAS delay clocks RDLL_OE10CL to FDLL_OE35CL. Similarly, the selection unit 200 transfers the plurality of delay clocks RDLL_OE10DL5, FDLL OE15DL5, ..., RDLL_OE30DL5, FDLL_OE35DL5 of the third clock delay unit 160 as CAS delay clocks RDLL_OE10CL to FDLL_OE35CL. Figure 7 is a circuit diagram of the initial synchronization unit 3A of Figure 3. Referring to FIG. 7, the initial synchronization unit 3A includes a disable control unit 320, a drive unit 340, a latch unit 36A, and an initialization unit 380. The deactivation control unit 320 receives a line of bursting instructions YBST and an internal 13-13426.doc } ··· " 1303441 clock CLKP4 to generate a deactivation control signal. The driving unit 340 drives an output node N1 in response to reading the CAS signal CASP6JRJD and the deactivation control signal. The latch unit 360 latches one of the output node inversion voltages and outputs the output enable signal OE00. The initialization unit 380 initializes the output node N1 in response to a power up signal PWRUP and a write/read flag WT_RDB. The deactivation control unit 320 includes an inverter 12 for inverting a burst length signal BL2, and a first NAND gate ND1 for performing one of the inverters 12 to output signals and lines. A NAND operation of the burst instruction YBST; an inverter 13 for inverting the read CAS signal CASP6_RD; a second NAND gate ND2 for performing the output signal of the first NAND gate ND1, internal a NAND operation of the clock CLKP4 and one of the inverters 13; an inverter 14 for inverting an output signal of one of the second NAND gates ND2; and a third NAND gate ND3, It is used to perform one of the output signals of the inverters 13 and 14 to output a disable control signal. The initialization unit 380 includes: an initialization signal generating unit 382 for receiving the write/read flag WT_RDB and the power-on signal PWRUP to generate an initialization signal; and a PMOS transistor PM1 having a gate for receiving The initialization signal and a source-drain path between an internal voltage (VDD) terminal and the output node N1. The operation of the initial synchronization unit 300 will be briefly described below. First, when the read CAS signal CASP6_RD is enabled to a logic high level, the drive unit 340 lowers the output node N1 to a logic low level to read 112655.doc -14 - 1303441 CAS signal CASP6_RD. Subsequently, the latch unit 360 inverts the voltage applied to the output node N1. The output enable signal OEOO is enabled to the logic high level.
當沒有應用讀取CAS訊號CASP6_RD且行叢發指令YBST 為一邏輯低位準或叢發長度資訊訊號BL2為一邏輯高位準 時,初始同步單元300產生停用控制訊號以回應該邏輯高 位準之内部時脈CLKP4,從而允許驅動單元340升高輸出 節點N1。因此,該輸出節點N1被改變為邏輯高位準且鎖 存器單元360將該輸出節點之位準反相。因此,輸出致能 訊號OEOO被停用。 當加電訊號PWRUP由於内部電壓之位準在該裝置之初 始驅動期間不穩定而未被啟用時,或歸因於寫入指令WT 之應用而將寫入/讀取旗標WTJRJDB設定為一邏輯高位準 時,初始化單元3 8 0升高輸出節點N1。因此,輸出致能訊 號OEOO被停用而與輸入訊號無關。 圖8為圖3之第一同步單元410的電路圖。第二至第六同 步單元420至480具有與該第一同步單元410之電路組態相 同的電路組態。將描述該第一同步單元410作為一例示性 結構。 參看圖8,該第一同步單元410包括一輸入單元412、一 驅動單元414、一鎖存器單元416及一輸出控制單元418。 該輸入單元412接收與驅動時脈RCLK_OE10之上升邊緣同 步之輸出致能訊號OE00。該驅動單元414驅動一輸出節點 N2以回應該輸入單元412之第一及第二輸出訊號D2B及 112655.doc -15- 1303441 D2 °該鎖存器單元416鎖存應用於該驅動單元414之輸出節 點N2上之訊號。當一重置訊號〇E_RSTB被啟用時,該輸 出控制單元418將應用於該輸出節點N2上之訊號反相,且 將輸出致能訊號OE10輸出。When no application reads the CAS signal CASP6_RD and the burst command YBST is a logic low level or the burst length information signal BL2 is a logic high level, the initial synchronization unit 300 generates a disable control signal to return to the internal clock of the logic high level. CLKP4, thereby allowing drive unit 340 to raise output node N1. Therefore, the output node N1 is changed to a logic high level and the latch unit 360 inverts the level of the output node. Therefore, the output enable signal OEOO is deactivated. The write/read flag WTJRJDB is set to a logic when the power up signal PWRUP is not enabled because the level of the internal voltage is unstable during the initial driving of the device, or due to the application of the write command WT. At the high level on time, the initialization unit 380 raises the output node N1. Therefore, the output enable signal OEOO is disabled regardless of the input signal. FIG. 8 is a circuit diagram of the first synchronization unit 410 of FIG. The second to sixth synchronization units 420 to 480 have the same circuit configuration as the circuit configuration of the first synchronization unit 410. The first synchronization unit 410 will be described as an exemplary structure. Referring to FIG. 8, the first synchronization unit 410 includes an input unit 412, a driving unit 414, a latch unit 416, and an output control unit 418. The input unit 412 receives the output enable signal OE00 that is synchronized with the rising edge of the drive clock RCLK_OE10. The driving unit 414 drives an output node N2 to respond to the first and second output signals D2B and 112655.doc -15- 1303441 D2 of the input unit 412. The latch unit 416 latches the output applied to the driving unit 414. The signal on node N2. When a reset signal 〇E_RSTB is enabled, the output control unit 418 applies an inversion of the signal applied to the output node N2 and outputs the output enable signal OE10.
一旦操作該第一同步單元410,當該重置訊號〇E_RSTB 被啟用至一邏輯低位準時,輸出致能訊號OE10即被停用 至一邏輯低位準而與輸入訊號無關。當輸入訊號〇E00被 啟用同時該重置訊號〇E_RSTB被停用時,將該輸出致能訊 號OE10與驅動時脈RCLK_OE10之上升邊緣同步輸出。 下文將參看圖3至圖8描述根據本發明之第一實施例之具 有測試單元500的輸出控制器的操作。 首先,第一至第三時脈延遲單元120至160將輸入時脈延 遲其固定延遲量以輸出複數個延遲時脈。選擇單元200根 據CAS潛時資訊訊號CL3至CL5輸出作為CAS延遲時脈之自 第一至第三時脈延遲單元120、140及160中之一者輸出的 延遲時脈。 測試單元500根據測試-延遲正常訊號NO_TM、測試-延 遲增量訊號TM_INC及測試-延遲減量訊號TM_DEC將一額 外延遲添加至所應用之CAS延遲時脈RDLL_OE10CL、 FDLL_OE15CL,…,RDLL_OE30CL、FDLL_OE35CL 之延 遲,或輸出驅動時脈RCLK OE10、RCLK OE15,..., RCLK_OE30、FCLK_OE35 而無額外延遲。 同樣,當啟用讀取CAS訊號CASP6_RD以回應讀取指令 時,初始同步單元300啟用輸出致能訊號OEOO以回應該讀 112655.doc -16- 1303441 取 CAS 訊號 CASP6_RD。 隨後,第一同步單元410輸出初始同步單元300之輸出訊 號OEOO作為與第一驅動時脈RCLK_OE10同步之輸出致能 訊號OE10。第二同步單元420輸出該第一同步單元410之 輸出訊號OE10作為與第二驅動時脈FCLK_OE15同步之輸 出致能訊號OE15。第三同步單元430輸出該第二同步單元 420之輸出訊號OE15作為與第三驅動時脈RCLK_OE20同步 之輸出致能訊號OE20。Once the first synchronization unit 410 is operated, when the reset signal 〇E_RSTB is enabled to a logic low level, the output enable signal OE10 is disabled to a logic low level regardless of the input signal. When the input signal 〇E00 is enabled and the reset signal 〇E_RSTB is deactivated, the output enable signal OE10 is output in synchronization with the rising edge of the driving clock RCLK_OE10. The operation of the output controller having the test unit 500 according to the first embodiment of the present invention will be described below with reference to Figs. First, the first to third clock delay units 120 to 160 delay the input clock by a fixed delay amount to output a plurality of delay clocks. The selection unit 200 outputs a delayed clock output from one of the first to third clock delay units 120, 140, and 160 as a CAS delay clock based on the CAS latency information signals CL3 to CL5. The test unit 500 adds an additional delay to the delay of the applied CAS delay clocks RDLL_OE10CL, FDLL_OE15CL, ..., RDLL_OE30CL, FDLL_OE35CL according to the test-delay normal signal NO_TM, the test-delay increment signal TM_INC, and the test-delay down signal TM_DEC. Or the output drive clocks RCLK OE10, RCLK OE15, ..., RCLK_OE30, FCLK_OE35 without additional delay. Similarly, when the read CAS signal CASP6_RD is enabled in response to the read command, the initial synchronization unit 300 enables the output enable signal OEOO to read the 112655.doc -16- 1303441 CAS signal CASP6_RD. Subsequently, the first synchronizing unit 410 outputs the output signal OEOO of the initial synchronizing unit 300 as the output enable signal OE10 synchronized with the first driving clock RCLK_OE10. The second synchronizing unit 420 outputs the output signal OE10 of the first synchronizing unit 410 as the output enable signal OE15 synchronized with the second driving clock FCLK_OE15. The third synchronization unit 430 outputs the output signal OE15 of the second synchronization unit 420 as the output enable signal OE20 synchronized with the third driving clock RCLK_OE20.
因此,所申請之發明的輸出控制器產生該複數個輸出致 能訊號OEOO至OE45,該等訊號自讀取CAS訊號CASP6JRD 之啟用時間點開始以大約半個時脈間隔被啟用。 此時,藉由測試訊號NO—TM、TM_INC及TM—DEC來調 節該等輸出致能訊號OE00至OE45之啟用時間點。換言 之,藉由根據該等測試訊號NO—TM、TM_INC及TM—DEC 調節應用於同步單元400之驅動時脈的延遲量而控制該啟 用時間點。 該輸出控制器可經由對控制輸出致能訊號之啟用時間點 的驅動時脈之延遲量的調節根據頻率來調節防止資料失效 所需的延遲量。意即,本發明可解決先前技術不能反映實 際晶片之PVT變化的問題,雖然經由習知時脈延遲單元給 出該延遲量。 圖9為根據本發明之一第二實施例圖3之測試單元500的 電路圖。 參看圖9,該測試單元500包括複數個延遲調節單元 112655.doc -17- 1303441 570、5 80、590、592、594及596,其不僅可根據測試-延 遲増量訊號TM_INC、測試-延遲正常訊號NOJTM及測試-延遲減量訊號TM_DEC改變輸入時脈之延遲量,而且可藉 由使用測試完畢訊號TM—OE10、TM—OE20及TM一OE30根 據該輸入時脈判定測試之使用。 圖10為圖9之第一延遲調節單元570的電路圖。第二至第 延遲調節單元580至5 96具有與該第一延遲調節單元5 70 之電路組態相同的電路組態。描述該第一延遲調節單元 57〇作為例示性結構。 參看圖10,該第一延遲調節單元5 70包括第一及第二延 遲單元571及572、第一至第三轉移閘TG7、TG8及TG9、 一第一控制單元573、一第二控制單元574及一第三控制單 元575。第一及第二延遲單元571及572經串聯連接以延遲 輸入時脈RDLL_OE10CL。當啟用一相應控制訊號時,第 一至第三轉移閘TG7至TG9轉移第一及第二延遲單元571及 572之輸入及輸出訊號作為第一驅動時脈rcLK_OE10。該 第一控制單元573接收第一測試完畢訊號TM_OE 10及測試-延遲減量訊號TM—DEC以控制該第一轉移閘TG7之驅動。 該第二控制單元574接收該第一測試完畢訊號TM_OE 10及 測試-延遲正常訊號NO_TM以控制該第二轉移閘TG8之驅 動。該第三控制單元575接收該第一測試完畢訊號 ΤΜ_ΟΕ10及測試-延遲增量訊號TM_INC以控制該第三轉移 閘TG9之驅動。 除輸入訊號外,第一至第三控制單元573至575具有相同 112655.doc -18 - •1303441 之電路組態。 該第一控制單元573包括:一 NAND閘極ND5,其用於執 行第一測試完畢訊號TM—OE10及測試-延遲減量訊號 TM一DEC之一 NAND操作;及一反相器17,其用於將該 NAND閘極ND5之一輸出訊號反相以輸出第一控制訊號。 將詳細描述根據所申請之發明之第二實施例的測試單元 500的操作。在該測試單元5〇〇中,驅動時脈之延遲量並非 完全根據測試-延遲減量訊號TM—DEC、測試_延遲正常訊 號NO一TM及測試-延遲增量訊號tmjnc來控制,而是可藉 由使用測試完畢訊號TM一(:^10至TM一〇E3〇根據時脈來選 擇測試之使用。 意即,不同於第一實施例,可根據該等驅動時脈來執行 根據所申請之發明之第二實施例的測試單元。 由於輸出控制器藉由使用測試訊號來控制輸出致能訊號 之啟用時間點,故可根據驅動頻率及ρντ變化來調節防止 資料失效所需之延遲量。 雖然已對在輸出資料以回應讀取指令時控制時序之輸出 控制器作出了上述描述,但當應用諸如讀取CAS訊號之旗 標訊號時,所申請之發明亦可應用於其中以規則間隔啟用 複數個訊f虎之區塊。意即,t以規則間隔自該旗標訊號產 生複數個訊號時,可根據頻率來調節所需延遲量。 本申請案含有與2005年9月29日及2005年12月27日於韓 國智慧財產局申請之韓國專利申請案第2〇〇5_9〇888號及第 2005 13 0444號有關之標的物,其全部内容以引用之方式 112655.doc -19- 1303441 倂入本文中。 雖然已就特定較佳實施例而描述了本發明,但熟習此項 技術者將清楚’可在不脫離如在下述申請專利範圍中所界 定之本發明之範疇的情況下作出各種變化及修改。 【圖式簡單說明】 / 圖1為先前技術之一輸出控制器之方塊圖; 圖2A為-習知輸出控制器在以一低頻率操作時的波形 圖; 圖2B為-用於解釋-習知輸出控制器在以—高頻率操作 時之問題的波形圖; ” 圖3為根據本發明一具有一刺續置分 ^ ,别忒早兀之輸出控制器的方 塊圖, 圖4為根據本發明之一第一實施例圖3所示之測試單元的 電路圖; 圖5為圖4所示之一延遲調節單元的電路圖; 圖6為圖3所示之一選擇單元的電路圖; 圖7為圖3所示之一初始同步單元的電路圖; 圖8為圖3所示之一同步單元的電路圖; 圖9為根據本發明之一第二實施例圖3所示之测試單元的 電路圖;及 圖10為圖9所示之一延遲調節單元的電路圖。 【主要元件符號說明】 10 時脈延遲單元 20 選擇單元 112655.doc 1303441 30 初始同步單元 40 同步單元 100 時脈延遲單元 120 第一時脈延遲單元 140 第二時脈延遲單元 160 第三時脈延遲單元 200 選擇單元 210 第一選擇器 220 第二選擇器 230 第三選擇器 240 第四選擇器 250 第五選擇器 260 第六選擇器 300 初始同步單元 320 停用控制單元 340 驅動單元 360 鎖存器單元 380 初始化單元 400 同步單元 410 第一同步單元 412 輸入單元 414 驅動單元 416 鎖存器單元 418 輸出控制單元 -21 - ·, ϋ1»*- 5 . 112655.doc 1303441Accordingly, the output controller of the claimed invention generates the plurality of output enable signals OEOO through OE45, which are enabled at approximately half a clock interval from the enable time point of the read CAS signal CASP6JRD. At this time, the enable time points of the output enable signals OE00 to OE45 are adjusted by the test signals NO_TM, TM_INC and TM-DEC. In other words, the enable time point is controlled by adjusting the delay amount of the drive clock applied to the sync unit 400 based on the test signals NO_TM, TM_INC, and TM-DEC. The output controller adjusts the amount of delay required to prevent data failure based on the frequency by adjusting the amount of delay of the drive clock that controls the enable time of the output enable signal. That is, the present invention solves the problem that the prior art does not reflect the PVT variation of the actual wafer, although the delay amount is given via the conventional clock delay unit. Figure 9 is a circuit diagram of the test unit 500 of Figure 3 in accordance with a second embodiment of the present invention. Referring to FIG. 9, the test unit 500 includes a plurality of delay adjustment units 112655.doc -17- 1303441 570, 5 80, 590, 592, 594, and 596, which can be based not only on the test-delay measurement signal TM_INC, but also on the test-delay normal signal. The NOJTM and the test-delay down signal TM_DEC change the delay amount of the input clock, and can be used to determine the test based on the input clock by using the test completion signals TM-OE10, TM-OE20, and TM-OE30. FIG. 10 is a circuit diagram of the first delay adjustment unit 570 of FIG. The second to delay adjustment units 580 to 5 96 have the same circuit configuration as that of the first delay adjustment unit 570. The first delay adjustment unit 57 is described as an exemplary structure. Referring to FIG. 10, the first delay adjustment unit 570 includes first and second delay units 571 and 572, first to third transfer gates TG7, TG8, and TG9, a first control unit 573, and a second control unit 574. And a third control unit 575. The first and second delay units 571 and 572 are connected in series to delay the input clock RDLL_OE10CL. When a corresponding control signal is enabled, the first to third transfer gates TG7 to TG9 transfer the input and output signals of the first and second delay units 571 and 572 as the first drive clock rcLK_OE10. The first control unit 573 receives the first test completion signal TM_OE 10 and the test-delay reduction signal TM-DEC to control the driving of the first transfer gate TG7. The second control unit 574 receives the first test completion signal TM_OE 10 and the test-delay normal signal NO_TM to control the driving of the second transfer gate TG8. The third control unit 575 receives the first test completion signal ΤΜ_ΟΕ10 and the test-delay increment signal TM_INC to control the driving of the third transfer gate TG9. The first to third control units 573 to 575 have the same circuit configuration of 112655.doc -18 - • 1303441 except for the input signal. The first control unit 573 includes: a NAND gate ND5 for performing one NAND operation of the first test completion signal TM-OE10 and the test-delay reduction signal TM-DEC; and an inverter 17 for The output signal of one of the NAND gates ND5 is inverted to output a first control signal. The operation of the test unit 500 according to the second embodiment of the claimed invention will be described in detail. In the test unit 5, the delay amount of the driving clock is not completely controlled according to the test-delay reduction signal TM-DEC, the test_delay normal signal NO-TM, and the test-delay increment signal tmjnc, but can be borrowed The use of the test is selected according to the clock using the test completion signal TM(:^10 to TM_〇E3〇. That is, unlike the first embodiment, the invention according to the application can be executed according to the drive clocks. The test unit of the second embodiment. Since the output controller controls the enable time point of the output enable signal by using the test signal, the delay amount required to prevent data failure can be adjusted according to the drive frequency and the change of ρντ. The above description has been made for an output controller that controls timing when outputting data in response to a read command, but when applying a flag signal such as reading a CAS signal, the claimed invention can also be applied to a plurality of of which are enabled at regular intervals. The block of the tiger, that is, when t generates a plurality of signals from the flag signal at regular intervals, the required delay amount can be adjusted according to the frequency. The subject matter of the Korean Patent Application No. 2〇〇5_9〇888 and 2005 13 0444, which were filed on September 29, 2005 and December 27, 2005, by the Korea Intellectual Property Office, the entire contents of which are incorporated by reference. The present invention has been described in terms of a particular preferred embodiment, and it will be apparent to those skilled in the art that the invention may be devised without departing from the scope of the invention as defined in the following claims. Various changes and modifications are made in the context of the invention. [Simplified Schematic] FIG. 1 is a block diagram of an output controller of the prior art; FIG. 2A is a conventional output controller operating at a low frequency. FIG. 2B is a waveform diagram for explaining the problem of the conventional output controller operating at a high frequency; FIG. 3 is a schematic diagram of a spurt according to the present invention. FIG. 4 is a circuit diagram of the test unit shown in FIG. 3 according to a first embodiment of the present invention; FIG. 5 is a circuit diagram of a delay adjustment unit shown in FIG. 4; a circuit diagram showing one of the selection units; 7 is a circuit diagram of an initial synchronization unit shown in FIG. 3. FIG. 8 is a circuit diagram of one of the synchronization units shown in FIG. 3. FIG. 9 is a circuit diagram of the test unit shown in FIG. 3 according to a second embodiment of the present invention. And Fig. 10 is a circuit diagram of one delay adjustment unit shown in Fig. 9. [Description of main component symbols] 10 clock delay unit 20 selection unit 112655.doc 1303441 30 initial synchronization unit 40 synchronization unit 100 clock delay unit 120 first Clock delay unit 140 Second clock delay unit 160 Third clock delay unit 200 Selection unit 210 First selector 220 Second selector 230 Third selector 240 Fourth selector 250 Fifth selector 260 Sixth selection 300 initial synchronization unit 320 deactivation control unit 340 drive unit 360 latch unit 380 initialization unit 400 synchronization unit 410 first synchronization unit 412 input unit 414 drive unit 416 latch unit 418 output control unit-21 - ·, ϋ 1 »*- 5 . 112655.doc 1303441
420 第二同步單元 430 第三同步單元 440 第四同步單元 450 第五同步單元 460 第六同步單元 470 第七同步單元 480 第八同步單元 500 測試單元 510 第一延遲調節單元 512 第一延遲單元 514 第二延遲單元 520 第二延遲調節單元 530 第三延遲調節單元 540 第四延遲調節單元 550 第五延遲調節單元 560 第六延遲調節單元 570 第一延遲調節單元 571 第一延遲單元 572 第二延遲單元 573 第一控制單元 574 第二控制單元 575 第三控制單元 580 第二延遲調節單元 590 第三延遲調節單元 112655.doc -22- 1303441420 second synchronization unit 430 third synchronization unit 440 fourth synchronization unit 450 fifth synchronization unit 460 sixth synchronization unit 470 seventh synchronization unit 480 eighth synchronization unit 500 test unit 510 first delay adjustment unit 512 first delay unit 514 Second delay unit 520 second delay adjustment unit 530 third delay adjustment unit 540 fourth delay adjustment unit 550 fifth delay adjustment unit 560 sixth delay adjustment unit 570 first delay adjustment unit 571 first delay unit 572 second delay unit 573 first control unit 574 second control unit 575 third control unit 580 second delay adjustment unit 590 third delay adjustment unit 112655.doc -22- 1303441
592 第四延遲調節單元 594 第五延遲調節單元 596 第六延遲調節單元 112655.doc -23-592 Fourth delay adjustment unit 594 Fifth delay adjustment unit 596 Sixth delay adjustment unit 112655.doc -23-
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| KR20050090888 | 2005-09-29 | ||
| KR1020050130444A KR100668517B1 (en) | 2005-09-29 | 2005-12-27 | Output control unit with test device |
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| TWI303441B true TWI303441B (en) | 2008-11-21 |
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| TWI743221B (en) * | 2016-10-07 | 2021-10-21 | 南韓商三星電子股份有限公司 | Memory system, memory device and clock synchronizing method performed by the same |
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- 2005-12-27 KR KR1020050130444A patent/KR100668517B1/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI743221B (en) * | 2016-10-07 | 2021-10-21 | 南韓商三星電子股份有限公司 | Memory system, memory device and clock synchronizing method performed by the same |
| US11282555B2 (en) | 2016-10-07 | 2022-03-22 | Samsung Electronics Co., Ltd. | Clock synchronizing method of a multiple clock domain memory device |
| US11615825B2 (en) | 2016-10-07 | 2023-03-28 | Samsung Electronics Co., Ltd. | Clock synchronizing method of a multiple clock domain memory device |
| US12057193B2 (en) | 2016-10-07 | 2024-08-06 | Samsung Electronics Co., Ltd. | Clock synchronizing method of a multiple clock domain memory device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200713312A (en) | 2007-04-01 |
| KR100668517B1 (en) | 2007-01-12 |
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