1303356 五、、發明說明（1) 、【發明所屬之技術領域】 本發明係有關於一種曝光裝置， 晶面板製程中的曝光袭置，其中光線j 疋有關於一種液 照射。 可對於面板進行雙面 【先前技術】 如第1圖所示，在液晶面板之製作過程中 一 係放置於-習知承載機構2〇,上。w知’ 板 不透光的材質，例如:声’所製成。面板1〇 構20 2 11，、12’與框膠（seaiant)13,所組成，其中/基田板^基= I為彩色濾光片基板（Color Filter)，基板12’可為薄膜電 晶體基板（TF T)。面板的組裝方式有兩種，一是先將上下 基板11 、1 2以框H 3接合’框谬1 3 ’必須經過光:化學反 應才能硬化，一般係採用一光源1 5 ’產生特定波長之紫外 光（UV)進行照射，使得感光性的框膠硬化，或是利用加熱 方式使得熱固性框膠達到硬化。在此步驟中，以紫外光固 化框膠1 3 ’後，便組成一空的液晶盒，再注入液晶1 6，於其 中。另一方式是先在下基板12’周圍上一圈框膠13，，進行 液晶滴入製程（one drop fill，〇DF)滴入液晶16，，覆蓋 上基板11 ’，再以紫外光固化框膠1 3，，以形成一液晶面 板。 就生產設備流程與電腦整合製造系統（Computer integrated manufacturing，CIM)系統而言，在其相關配 置的限制下，無論是上述哪一種製程，單一生產線僅能將 紫外光固定照射CF面（或TFT面）。因此，為了使框膠完全1303356 V. SUMMARY OF THE INVENTION (1) Technical Field of the Invention The present invention relates to an exposure apparatus for exposure exposure in a crystal panel process in which light ray is irradiated with respect to a liquid. Double-sided panel can be used. [Prior Art] As shown in Fig. 1, the liquid crystal panel is placed on the conventional carrier mechanism 2 〇. w know' board is made of opaque material, such as: sound. The panel 1 is composed of 20 2 11, 12' and a sealant 13 , wherein / the base plate = I is a color filter substrate, and the substrate 12' can be a thin film transistor. Substrate (TF T). There are two ways to assemble the panel. First, the upper and lower substrates 11 and 12 are first joined to the frame H 3 'frame 谬 1 3 '. It must pass light: chemical reaction to harden. Generally, a light source 15 5 ' is used to generate a specific wavelength. Ultraviolet light (UV) is irradiated to harden the photosensitive sealant, or the thermosetting sealant is hardened by heating. In this step, after the sealant 13 3 ' is cured by ultraviolet light, an empty liquid crystal cell is formed, and the liquid crystal 16 is injected therein. Another way is to first apply a frame of glue 13 around the lower substrate 12', and perform a liquid drop infusion process (one drop fill, 〇DF) to drop into the liquid crystal 16, cover the upper substrate 11', and then cure the sealant with ultraviolet light. 1 3, to form a liquid crystal panel. Regarding the production equipment process and the computer integrated manufacturing (CIM) system, under the limitation of the relevant configuration, no matter which of the above processes, the single production line can only fix the UV light to the CF surface (or the TFT surface). ). Therefore, in order to make the sealant completely
0632-A50217TWf(5.0) ； AU0402017 ； Yuchia.ptd 第5頁 1303356 五、發明說明（2) 固化，紫外光係必須先照射基板1 1，而使框膠1 3，部分產生 硬化’隨後再將面板翻轉1 8 0度，進而再以紫外光照射另 一基板1 2 。如此一來，除了增加製程步驟及困難性、CIΜ 系統之負擔之外，生產設備支出成本、生產成本亦無法有 效降低，增加生產時間’造成於生產線上無法充分運用， 如此將造成產品設計上的限制。 因此，如何有效解決基板製程的問題，且有效提高基 板生產率’使得生產線之工作致率達到最佳化，是目前必 須積極解決之主要課題。 ‘【發明内容】 有鑑於此，本發明之目的在於提供一種曝光裝置，提 供雙面曝光設備，亦即，可對彩色濾光片（CF)面及薄膜電 晶體（TFT)面同時進行紫外線曝光，減少設備投資成本及 無塵室使用空間，達到簡化製程之目的。 由於本發明曝光裝置設計簡單化且完全不會遮蔽紫外 光’本發明之另一目的在於可加速讓框膠完全硬化，簡化 系統負擔，提高生產線之稼動率、產能利用率、可負載能 力（〇 p e r a t i ο n a v a i 1 a b i 1 i t y、u t i 1 i z a t i ο n r a t e、0632-A50217TWf(5.0) ; AU0402017 ; Yuchia.ptd Page 5 1303356 V. INSTRUCTIONS (2) Curing, the ultraviolet light must first illuminate the substrate 1 1 and the frame rubber 1 3, partially harden ' then the panel Flip 180 degrees, and then irradiate another substrate 1 2 with ultraviolet light. In this way, in addition to increasing the process steps and difficulties, and the burden of the CIΜ system, the production equipment expenditure cost and production cost cannot be effectively reduced, and the increase of production time is caused by the inability to fully utilize the production line, which will result in product design. limit. Therefore, how to effectively solve the problem of the substrate manufacturing process and effectively improve the productivity of the substrate has optimized the production rate of the production line, which is a major problem that must be actively solved at present. [Invention] In view of the above, an object of the present invention is to provide an exposure apparatus that provides a double-sided exposure apparatus, that is, a color filter (CF) surface and a thin film transistor (TFT) surface can be simultaneously exposed to ultraviolet light. Reduce equipment investment costs and clean room use space to simplify the process. Since the exposure apparatus of the present invention is simple in design and does not obstruct ultraviolet light at all, another object of the present invention is to accelerate the complete hardening of the sealant, simplify the system burden, and improve the productivity of the production line, the capacity utilization rate, and the loadability (〇 Perati ο navai 1 abi 1 ity, uti 1 izati ο nrate,
working ratio )，進而增加產出。 根據本發明，提供一種曝光裝置，其包括一承載機 構、一第一能量裝置及一第二能量裝置。承載機構包括複 數個承載元件，用以承载基板。第一能量裝置與第二能量 裝置分別設置於承載機構的上方及下方。 在一較佳實施例中，承載元件為可透光之桿狀材料所 1303356 五、發明說明(3) 製成。承載元件係選自於石 基材條棒或其相互组合件所槿^ 5成石英條棒、玻璃 在另-較佳·；：：所構成之族群中之任-者。 選自於繩索、纜二：並:豕：凡件為線狀。*載元件伟 者。 痛或其相互組合件所構成之族群中之2 本發明之曝光裝置更包括一 士加 裝置、、第二能量裝置與承載機構。木’用以設置第—能量 明顯：述他目的、特徵、和優點能更 詳細說明如；特舉一較佳貫施例，並配合所附圖示，作 【實施方式] 囬第2圖係顯示本發明之曝光裝置2〇〇之分解立體圖 3A圖係顯不本發明之曝光裝置2〇〇組合後之正視圖。第3 圖係顯示本發明之曝光裝置2〇〇組合後之側視圖。以 同時參考第2、3A及3B圖。 ^ 本發明之曝光裝置2 00包括一複數個承載元件22所組 成之承載機構、一第一能量裝置i 5a、一第二能量裝置丨'“ 及一框架20。第一能量裝置15a與第二能量裝置15b可為_ 產生紫外光之光源或熱能之裝置。框架2〇包括一上層 201、一中空中間層2〇2、一下層203以及複數支柱24，中 間層2 0 2係位於上層2 0 1與下層2 0 3之間。 應注意的是，為方便說明起見，於第2圖中將框架2 〇 分解成為上層201、中空中間層202及下層203，於實際上 應為一體成形之中空的框架2 0。在本實施例中，第一能量Working ratio ), which in turn increases output. According to the present invention, there is provided an exposure apparatus comprising a carrier mechanism, a first energy device and a second energy device. The carrier mechanism includes a plurality of carrier members for carrying the substrate. The first energy device and the second energy device are respectively disposed above and below the carrier mechanism. In a preferred embodiment, the carrier member is made of a light transmissive rod-like material 1303356 V. Description of the Invention (3). The load-bearing member is selected from the group consisting of a stone substrate bar or a combination thereof, a quartz bar, and a glass in another group. Selected from the rope, cable two: and: 豕: the pieces are linear. * The component is superb. 2 of the groups formed by the pain or the mutual assembly thereof The exposure apparatus of the present invention further comprises a singular device, a second energy device and a carrier mechanism. Wood 'is used to set the first - energy is obvious: the purpose, characteristics, and advantages of the description can be described in more detail, such as a preferred embodiment, and with the accompanying drawings, [Embodiment] Back to Figure 2 The exploded perspective view of the exposure apparatus 2 of the present invention is shown in a perspective view of the combination of the exposure apparatus 2 of the present invention. Fig. 3 is a side view showing the combination of the exposure apparatus 2 of the present invention. To refer to Figures 2, 3A and 3B at the same time. The exposure device 200 of the present invention comprises a carrier mechanism composed of a plurality of carrier elements 22, a first energy device i 5a, a second energy device 丨'" and a frame 20. The first energy device 15a and the second The energy device 15b can be a device for generating a light source or thermal energy of ultraviolet light. The frame 2 includes an upper layer 201, a hollow intermediate layer 2, a lower layer 203, and a plurality of pillars 24, and the intermediate layer 2 0 2 is located in the upper layer 20 1 and the lower layer 2 0 3. It should be noted that, for convenience of explanation, the frame 2 〇 is decomposed into the upper layer 201, the hollow intermediate layer 202 and the lower layer 203 in Fig. 2, which should actually be integrally formed. Hollow frame 20. In this embodiment, the first energy
0632-A502l7TWf(5.0) ; AU0402017 ; Yuchia.ptd 第7頁 1303356 五'、發明說明（4) 裝，15a二置於上層2〇1之上，第二能量裝置l5b係以相對 =第此里裝置1 5 a的方式而設置於框架2 〇的下層2 〇 3之 由第2圖可知，複數承載元件22係位於第一能量裝置 a與第一妬里裝置15b之間的方式而設置於框架之中空 中=層202，且承載元件22之間互相平行。藉由複數承載 兀件22以同時對於基板1〇進行支撐。應注意的是，本實施 =,基板1 0與習知基板構造相同，因此省略說明，惟在本 貝加例甲田基板1 0擺放在承載機構2 0上時，基板1 〇的 ^、下面並*限定為CF基板或TFT基板，亦即，藉由具有 =面照射功能的曝光裝置20 0，可不限定基板1〇的擺放方 向0 ❹^鄰t*載元件22之間具有一既定間隙h，此間隙h 係根據用於傳輸基板的機械手臂（未顯示）之尺寸而決定， :::隙h大约為2 00公釐’可使得機械手臂(R〇b〇t)於承 上順利取放液晶基板，不會被干擾到。第二能量 置15b所產生之能量L可經由間隙h從下方傳遞至基板，' =土第一能量裝置15a從上方照射，使得能量W同時照 射在基板10之雙面上。 、 成ΐί實中’承載元件22為可透光之桿狀材料所製 ，。因政匕，承载元件22不會影響能量L之傳遞。承載 可選石央棒材、*成石英條棒、玻璃基材條棒或其 相互組ά件所構成之族群中之任一者。 — 在另-實施例令’纟载元件22為線狀。亦即，承載元 第8頁 0632-A50217I¥f(5.0) ； AU0402017 ； Yuchia.ptd 1303356 五、發明說明（5) 件2 2可選自於繩索 之任一者。 綜上所述，藉 光面板之方法，包 將框膠附著於面板 即’利用上述曝光 曝光面板1 0，以硬 加快曝光製程的速 猎此本發明提 即’可由基板1 0的 面同時進行紫外光 化系統負擔及無塵 滴下的複雜性，達 構設計簡單化且完 可加速讓框膠完全 動率、產能利用率 availability 、ut 而增加產出。 雖然本發明已 限定本發明，任何 和範圍内，當可作 範圍當視後附之申 、纜繩或其相互組合件所構成之族群中 由本發明之雙面曝光設備而提供新的曝 括以下步驟··提供一面板或基板1 〇後， 部份或整個周圍。藉由一曝光製程，亦 裝置200同時從面板10之上下兩面同時 化框膠，此方法不僅可簡化製程，更可 度。 供雙面曝光設備及曝光面板之方法，亦 彩色濾光片（CF)面及薄膜電晶體（TFT) 之曝光，減少CIΜ系統的投資成本、簡 室使用空間，且可簡化ODF製程中液晶 到製程簡化之目的。由於本發明承載機 全不會遮蔽紫外光，本發明之優點在於 硬化，簡化系統負擔，提高生產線之稼 、可負載能力（operation ilization rate 、 working ratio)，進 以較佳貫施例揭露如上，然其並非用以 熟習此技蟄者，在不脫離本發明之精神 些許之更動與潤飾，因此本發明之保護 請專利範圍所界定者為準。 0632-A50217TWf(5.0) ； AU0402017 ； Yuchia.ptd 第9頁 1303356 圖式簡單說明 第1圖係為習知之承載機構與基板之側視示意圖； 第2圖係顯示本發明之曝光裝置之分解立體圖； 第3A圖係顯示本發明之曝光裝置組合後之正視圖；以 及 第3B圖係顯示本發明之曝光裝置組合後之侧視圖。 【主要元件符號說明】 1 0 ’、1 0〜基板； 11’〜CF基板（彩色濾光片基板）； 12’〜TFT基板（薄膜電晶體基板）； 1 3 ’〜框膠； 14’〜光罩； 1 5 ’〜光源； 15a〜第一能量裝置； 15b〜第二能量裝置； 1 6 ’〜液晶； 2 G ’〜承載機構； 20〜框架； 2 2〜承載元件； 24〜支柱； 2 0 0〜曝光裝置； 2 0 1〜上層； 2 〇 2〜中空中間層； 2 0 3〜下層；0632-A502l7TWf(5.0) ; AU0402017 ; Yuchia.ptd Page 7 1303356 V', invention description (4) loading, 15a two placed on the upper layer 2〇1, the second energy device l5b is relative = the first device The lower layer 2 〇3 of the frame 2 〇 is provided in the manner of 1 5 a. As can be seen from Fig. 2, the plurality of carrier elements 22 are disposed between the first energy device a and the first device 15b and are disposed in the frame. In the middle air = layer 202, and the carrier elements 22 are parallel to each other. The substrate 22 is supported by a plurality of carrier members 22 at the same time. It should be noted that, in the present embodiment, the substrate 10 has the same structure as the conventional substrate, and therefore the description is omitted. However, when the Benka sample substrate 10 is placed on the carrier mechanism 20, the substrate 1 is below and below. And * is limited to a CF substrate or a TFT substrate, that is, by an exposure device 20 having a surface illumination function, the placement direction of the substrate 1 不 is not limited to 0 ❹ ^ t* has a predetermined gap between the carrier elements 22 h, this gap h is determined according to the size of the robot arm (not shown) used to transport the substrate, :::gap h is about 200 mm, which makes the robot arm (R〇b〇t) smooth on the bearing. The liquid crystal substrate is taken up and removed without being disturbed. The energy L generated by the second energy level 15b can be transmitted from below to the substrate via the gap h, and the soil first energy device 15a is irradiated from above so that the energy W is simultaneously irradiated on both sides of the substrate 10. The carrier member 22 is made of a rod-like material that can transmit light. Due to the political situation, the load bearing element 22 does not affect the transfer of the energy L. Any of the ethnic groups consisting of an optional stone core bar, a quartz bar, a glass substrate bar, or a group of components. - In another embodiment, the load carrying member 22 is linear. That is, the carrier element page 8 0632-A50217I¥f(5.0); AU0402017; Yuchia.ptd 1303356 V. Description of the invention (5) Item 2 2 may be selected from any of the ropes. In summary, the method of attaching the frame glue to the panel by means of the light panel is to use the above exposure exposure panel 10 to harden the speed of the exposure process, and the present invention can be simultaneously performed by the surface of the substrate 10 The burden of the ultraviolet illuminating system and the complexity of the dust-free drip, the simplification of the design and the completion of the frame can accelerate the full dynamic rate of the sealant, the availability of the capacity utilization, and the increase in output. Although the present invention has been defined by the present invention, the following steps are provided by the double-sided exposure apparatus of the present invention in any and a range of applications that can be used as a scope, a cable, or a combination thereof. · Provide a panel or substrate 1 〇, part or the entire circumference. By means of an exposure process, the device 200 simultaneously simultaneously forms the frame glue from both the upper and lower sides of the panel 10. This method not only simplifies the process, but also the degree. The method for the double-sided exposure device and the exposure panel, and the exposure of the color filter (CF) surface and the thin film transistor (TFT), reduces the investment cost of the CIΜ system, the space for the simple room, and simplifies the liquid crystal in the ODF process. The purpose of process simplification. Since the carrier of the present invention does not shield ultraviolet light, the present invention has the advantages of hardening, simplifies the system burden, and improves the operation ilization rate and working ratio of the production line. However, it is not intended to be exhaustive to those skilled in the art, and the invention may be modified and modified without departing from the spirit and scope of the invention. 0632-A50217TWf(5.0) ; AU0402017 ; Yuchia.ptd Page 9 1303356 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic side view of a conventional carrier mechanism and a substrate; FIG. 2 is an exploded perspective view showing the exposure apparatus of the present invention; Fig. 3A is a front view showing the combination of the exposure apparatus of the present invention; and Fig. 3B is a side view showing the combination of the exposure apparatus of the present invention. [Main component symbol description] 1 0 ', 1 0 to substrate; 11' to CF substrate (color filter substrate); 12' to TFT substrate (thin film transistor substrate); 1 3 '~ frame glue; 14'~ Photomask; 1 5 '~ light source; 15a~ first energy device; 15b~ second energy device; 1 6 '~ liquid crystal; 2 G '~ bearing mechanism; 20~ frame; 2 2~ load bearing element; 2 0 0~exposure device; 2 0 1~upper layer; 2 〇2~ hollow intermediate layer; 2 0 3~lower layer;
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