TWI398670B - Method for making lens array - Google Patents
Method for making lens array Download PDFInfo
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- TWI398670B TWI398670B TW97129298A TW97129298A TWI398670B TW I398670 B TWI398670 B TW I398670B TW 97129298 A TW97129298 A TW 97129298A TW 97129298 A TW97129298 A TW 97129298A TW I398670 B TWI398670 B TW I398670B
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- transparent substrate
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- 238000000034 method Methods 0.000 title claims description 21
- 230000003287 optical effect Effects 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 41
- 229920002120 photoresistant polymer Polymers 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 239000012778 molding material Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004049 embossing Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 238000003491 array Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Description
本發明涉及一種鏡片、鏡片陣列及其製造方法,尤其涉及一種壓印成型之鏡片、鏡片陣列及其製造方法。 The invention relates to a lens, a lens array and a manufacturing method thereof, in particular to an embossed lens, a lens array and a manufacturing method thereof.
目前,鏡片通常係於透光基板兩側以壓印成型光學部(請參見The Novel Fabrication Method and Optimum Tooling Design Used for Microlens Arrays,Proceedings of the 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems;January 18-21,2006,Zhuhai,China)之方式生產。壓印成型係指先將液態或塑性變形材料塗敷於基板上,再以壓印模具壓印成型。請參閱圖13,當鏡片之兩個表面806與808均為光學表面時,一般採用於基板80之兩側802與804分別壓印成型。此時,基板80之厚度決定了鏡片之厚度。 Currently, lenses are typically embossed on both sides of a light transmissive substrate to form an optical portion (see The Novel Fabrication Method and Optimum Tooling Design Used for Microlens Arrays, Proceedings of the 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems; January) Produced in the manner of 18-21, 2006, Zhuhai, China). Embossing refers to the application of a liquid or plastically deformed material to a substrate and then imprinting with an imprinting mold. Referring to FIG. 13, when both surfaces 806 and 808 of the lens are optical surfaces, they are generally stamped on both sides 802 and 804 of the substrate 80. At this time, the thickness of the substrate 80 determines the thickness of the lens.
然,於手機鏡頭尺寸微小化之發展趨勢下,鏡片亦需要越來越薄。目前,可藉由透光基板之薄化技術來減小基板之厚度,從而減小鏡片之厚度。但薄化基板不但製程良率低,價格高且具有易彎曲、破裂等低機械強度特性,於壓印製程中亦不能承受其壓力。 However, under the trend of miniaturization of the size of the mobile phone lens, the lens needs to be thinner and thinner. At present, the thickness of the substrate can be reduced by the thinning technique of the transparent substrate, thereby reducing the thickness of the lens. However, the thinned substrate not only has low process yield, high price, but also has low mechanical strength characteristics such as being bendable and cracked, and cannot withstand the pressure in the imprint process.
有鑑於此,有必要提供一種輕薄型之鏡片、鏡片陣列及其製造方法。 In view of the above, it is necessary to provide a thin and light lens, an array of lenses, and a method of manufacturing the same.
一種鏡片陣列之製造方法,其包括以下步驟:提供一透光基板,其具有相對之第一表面與第二表面;蝕刻該透光基板之第一表面形成複數陣列排佈 之凹槽;形成一光阻層於每個凹槽之底面,利用曝光顯影之方法去除預定區域光阻,使該底面露出部分表面,成為非光學區,於該非光學區形成遮光膜;去除每個凹槽內殘留之光阻,形成光學區,於該光學區加一成型材料,壓印成型第一光學部,並固化第一光學部之成型材料;於透光基板之第一表面上於每個凹槽四周形成切割道。 A method for manufacturing a lens array, comprising the steps of: providing a transparent substrate having opposite first and second surfaces; etching the first surface of the transparent substrate to form a plurality of arrays a recess; forming a photoresist layer on the bottom surface of each of the recesses, removing the photoresist of the predetermined area by exposure and development, exposing the bottom surface to a portion of the surface, forming a non-optical region, forming a light-shielding film in the non-optical region; Residual photoresist in the groove forms an optical zone, a molding material is added to the optical zone, the first optical part is embossed, and the molding material of the first optical part is cured; on the first surface of the transparent substrate A scribe line is formed around each groove.
一種鏡片,其包括一透光基板,該透光基板具有相對之第一表面與第二表面,該透光基板之第一表面設有一凹槽,該凹槽之底面設有一第一光學部與一遮光膜,該遮光膜圍繞設置於該第一光學部週邊。 A lens comprising a transparent substrate having a first surface and a second surface opposite to each other, wherein the first surface of the transparent substrate is provided with a recess, and a bottom surface of the recess is provided with a first optical portion and A light shielding film is disposed around the periphery of the first optical portion.
一種鏡片陣列,包括一透光基板,該透光基板具有相對之第一表面與第二表面,該透光基板之第一表面設有複數陣列排佈之凹槽,每個凹槽之底面設有一第一光學部與一遮光膜,該遮光膜圍繞設置於該第一光學部週邊。 An array of lenses includes a transparent substrate having a first surface and a second surface opposite to each other, and the first surface of the transparent substrate is provided with a plurality of rows of grooves, and the bottom surface of each groove is provided There is a first optical portion and a light shielding film, and the light shielding film is disposed around the periphery of the first optical portion.
相較於先前技術,由於該鏡片陣列或鏡片之第一光學部係於凹槽之底面上形成之,所形成之鏡片陣列或鏡片較於透光基板之第一表面上形成第一光學部之鏡片更薄,且由於透光基板並不是整塊進行薄化,凹槽四周未薄化之區域可同時承受壓印過程中之壓力,避免了鏡片製程中透光基板之彎曲與破裂。 Compared with the prior art, since the first optical portion of the lens array or the lens is formed on the bottom surface of the groove, the formed lens array or lens forms a first optical portion on the first surface of the transparent substrate. The lens is thinner, and since the transparent substrate is not thinned, the un-thinned area around the groove can simultaneously withstand the pressure during the imprinting process, thereby avoiding the bending and cracking of the transparent substrate in the lens manufacturing process.
806、808‧‧‧表面 806, 808‧‧‧ surface
80、10‧‧‧基板 80, 10‧‧‧ substrate
802、804‧‧‧兩側 802, 804‧‧‧ both sides
11‧‧‧凹槽 11‧‧‧ Groove
13‧‧‧光阻層 13‧‧‧Photoresist layer
100‧‧‧鏡片陣列 100‧‧‧ lens array
200‧‧‧鏡片 200‧‧‧ lenses
102‧‧‧第一表面 102‧‧‧ first surface
104‧‧‧第二表面 104‧‧‧ second surface
112‧‧‧底面 112‧‧‧ bottom
132‧‧‧負光阻 132‧‧‧negative photoresist
14‧‧‧非光學區 14‧‧‧Non-optical zone
12‧‧‧切割道 12‧‧‧ cutting road
60‧‧‧遮光膜 60‧‧‧Shade film
16‧‧‧鏡片成型區 16‧‧‧ lens forming area
20‧‧‧模具 20‧‧‧Mold
202‧‧‧凸出部 202‧‧‧protrusion
2022‧‧‧成型腔 2022‧‧‧ molding cavity
30‧‧‧第一光學部 30‧‧‧First Optics
40‧‧‧第二光學部 40‧‧‧Second Optics
17‧‧‧黏著層 17‧‧‧Adhesive layer
18‧‧‧成型材料 18‧‧‧ molding materials
圖1係本發明實施例鏡片之製造方法流程圖。 1 is a flow chart of a method of manufacturing a lens according to an embodiment of the present invention.
圖2至圖12係本發明實施例鏡片製造方法之過程示意圖。 2 to 12 are schematic views showing the process of the lens manufacturing method of the embodiment of the present invention.
圖13係先前技術鏡片之結構示意圖。 Figure 13 is a schematic view showing the structure of a prior art lens.
下面將結合附圖與實施方式對本技術方案作進一步詳細說明。 The technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.
請參閱圖1、圖11、圖12,本發明鏡片陣列100或鏡片200之製造方法包括 以下步驟:提供一透光基板,其具有相對之第一表面與第二表面;蝕刻該透光基板之第一表面形成複數陣列排佈之凹槽;形成一光阻層於每個凹槽之底面,利用曝光顯影之方法去除預定區域光阻,使該底面露出部分表面,成為非光學區,於該非光學區形成遮光膜;去除每個凹槽內殘留之光阻,形成光學區,於該光學區加一成型材料,壓印成型第一光學部,並固化第一光學部之成型材料;壓印成型第二光學部於該透光基板之第二表面與該第一光學部同光軸之位置;於透光基板之第一表面上於每個凹槽四周形成切割道;形成一黏著層於透光基板之第一表面上每個切割道所圍成之區域;沿著該切割道切割該透光基板形成各個鏡片。 Referring to FIG. 1 , FIG. 11 and FIG. 12 , the manufacturing method of the lens array 100 or the lens 200 of the present invention includes The following steps: providing a transparent substrate having opposite first and second surfaces; etching the first surface of the transparent substrate to form a plurality of rows of grooves; forming a photoresist layer in each of the grooves The bottom surface is removed by exposure and development, and the bottom surface is exposed to a portion of the surface to form a non-optical region, and a light-shielding film is formed in the non-optical region; the photoresist remaining in each of the grooves is removed to form an optical region. Adding a molding material to the optical zone, embossing the first optical portion, and curing the molding material of the first optical portion; and embossing the second optical portion on the second surface of the transparent substrate and the optical axis of the first optical portion a cutting path formed on each of the grooves on the first surface of the transparent substrate; forming an adhesive layer on the first surface of the transparent substrate; the area enclosed by each of the cutting streets; along the cutting path The light transmissive substrate is cut to form individual lenses.
下面將結合圖2至圖12對鏡片陣列100或鏡片200之製造方法進行詳細描述。 The method of manufacturing the lens array 100 or the lens 200 will be described in detail below with reference to FIGS. 2 through 12.
如圖2所示,首先提供一透光基板10,該透光基板10之材料係一種透光材料,例如玻璃,優選地,可為穿透率大於95%之光學玻璃。該透光基板10具有兩個相對之表面,即第一表面102與第二表面104。 As shown in FIG. 2, a transparent substrate 10 is first provided. The material of the transparent substrate 10 is a light transmissive material, such as glass. Preferably, it can be an optical glass having a transmittance of more than 95%. The light transmissive substrate 10 has two opposing surfaces, a first surface 102 and a second surface 104.
於第一表面102藉由蝕刻方法形成複數陣列排佈之凹槽11,該蝕刻方法可為物理性蝕刻,如濺射蝕刻(Sputter Etching)、離子束蝕刻(Ion Beam Etching);化學性蝕刻,如電漿化學蝕刻(Plasma Chemical Etching);或物理、化學複合蝕刻,如反應性離子蝕刻(Reactive Ion Etching) 。 Forming a plurality of arrays of grooves 11 on the first surface 102 by etching, the etching method may be physical etching, such as sputter etching, ion beam etching (Ion Beam Etching), chemical etching, Such as plasma chemical etching (Plasma Chemical Etching); or physical, chemical compound etching, such as reactive ion etching (Reactive Ion Etching) .
利用裂縫塗佈(Slit Coating)或者自轉式塗佈法或其他塗佈法於每個凹槽11之底面112形成光阻層13,光阻層13可為負光阻,亦可為正光阻。 The photoresist layer 13 is formed on the bottom surface 112 of each of the grooves 11 by a slit coating or a spin coating method or other coating method. The photoresist layer 13 may be a negative photoresist or a positive photoresist.
藉由具有預定圖案之光罩(圖未示)對光阻層13進行紫外光照射曝光。如果使用負光阻,例如聚異戊二烯(polyisoprene),由於負光阻對紫外光敏感,曝光部分將不溶於顯影劑。 The photoresist layer 13 is exposed to ultraviolet light by a photomask (not shown) having a predetermined pattern. If a negative photoresist, such as polyisoprene, is used, the exposed portion will be insoluble in the developer due to the negative photoresist being sensitive to ultraviolet light.
請參閱圖3,使用顯影劑後,將未曝光之負光阻溶解,留下被曝光之負光阻132。凹槽11之底面112露出部分表面,形成非光學區14。 Referring to Figure 3, after the developer is used, the unexposed negative photoresist is dissolved leaving the exposed negative photoresist 132. The bottom surface 112 of the recess 11 exposes a portion of the surface to form a non-optical zone 14.
請參閱圖4,利用現有之鍍膜技術,例如濺鍍法,於非光學區14上鍍一層遮光材料,例如鉻,形成遮光膜60,遮光膜60用於減少雜散光。遮光膜60至少覆蓋如圖3所示之非光學區14。遮光膜60之厚度小於負光阻132之厚度。 Referring to FIG. 4, a light shielding material 60 is formed on the non-optical region 14 by using a conventional coating technique, such as sputtering, to form a light shielding film 60 for reducing stray light. The light shielding film 60 covers at least the non-optical zone 14 as shown in FIG. The thickness of the light shielding film 60 is smaller than the thickness of the negative photoresist 132.
請參閱圖5,利用一種可溶解負光阻但與遮光材料鉻無反應之溶劑,例如丙酮溶液,溶解如圖4所示之負光阻132,露出鏡片成型區16。 Referring to FIG. 5, the negative photoresist 124 as shown in FIG. 4 is dissolved by a solvent which dissolves the negative photoresist but does not react with the light-shielding material chromium, such as an acetone solution, to expose the lens forming region 16.
然後於鏡片成型區16利用壓印模具壓印成型第一光學部。 The first optical portion is then stamped into the lens forming zone 16 using an imprinting mold.
成型過程請參閱圖6至圖12。請參閱圖6,該壓印模具20由一種能透過紫外光之材料製成,其具有複數與凹槽11相對應之凸出部202,每個凸出部202具有一成型腔2022,用於成型鏡片之光學部形狀。本實施例中,該成型腔2022之形狀為內凹之球面。 See Figure 6 through Figure 12 for the molding process. Referring to FIG. 6, the imprinting mold 20 is made of a material that transmits ultraviolet light, and has a plurality of protrusions 202 corresponding to the grooves 11, each of the protrusions 202 having a molding cavity 2022 for The shape of the optical portion of the molded lens. In this embodiment, the shape of the molding cavity 2022 is a concave spherical surface.
首先於鏡片成型區16加一成型材料18,該光學成型材料18為熱塑性材料或熱固性材料,且此時呈液態或熔融態,光學成型材料18受熱或受紫外光照射後可固化。 First, a molding material 18 is added to the lens forming region 16, which is a thermoplastic material or a thermosetting material, and is in a liquid or molten state at this time, and the optical molding material 18 is cured by being heated or irradiated with ultraviolet light.
請參閱圖7,將壓印模具20對準成型材料18進行壓印。然後,紫外光自模具 20向成型材料18照射,使成型材料18固化。 Referring to Figure 7, the imprinting mold 20 is aligned with the molding material 18 for imprinting. Then, ultraviolet light from the mold 20 is irradiated to the molding material 18 to cure the molding material 18.
請參閱圖8,固化完成後,脫去壓印模具20,每個凹槽11之底面112上形成有第一光學部30。 Referring to FIG. 8, after the curing is completed, the imprinting mold 20 is removed, and the first optical portion 30 is formed on the bottom surface 112 of each of the grooves 11.
請參閱圖9,壓印成型第二光學部40於該透光基板10之第二表面104與該第一光學部30同光軸之位置。 Referring to FIG. 9 , the second optical portion 40 is imprinted on the second surface 104 of the transparent substrate 10 and the first optical portion 30 at the same optical axis.
請參閱圖10,於該第一表面102上於每個凹槽11四周形成切割道12,其可藉由鐳射切割裝置或刀具切割形成。 Referring to FIG. 10, a scribe line 12 is formed on the first surface 102 around each of the grooves 11, which can be formed by laser cutting or cutting.
請參閱圖11,於該透光基板10之第一表面102上每個切割道12所圍成之區域藉由塗佈方法形成一黏著層17,即形成鏡片陣列100。該黏著層17之作用在於使透光基板10可黏合多片具有光學元件之基板,形成多層光學元件結構後,再整體進行切割。該光學元件可為複數感光器(CMOS或者CCD)或者複數透鏡。 Referring to FIG. 11, an area of each of the dicing streets 12 on the first surface 102 of the transparent substrate 10 is formed into an adhesive layer 17 by a coating method, that is, the lens array 100 is formed. The adhesive layer 17 functions to allow the light-transmitting substrate 10 to bond a plurality of substrates having optical elements, and to form a multilayer optical element structure, and then cut the whole. The optical element can be a complex photoreceptor (CMOS or CCD) or a complex lens.
請參閱圖12,沿著該切割道12切割該透光基板10形成單個鏡片200。 Referring to FIG. 12, the transparent substrate 10 is cut along the scribe line 12 to form a single lens 200.
相較於先前技術,由於該鏡片陣列100或鏡片200之第一光學部30係於凹槽11之底面112上形成之,所形成之鏡片陣列100或鏡片200較於透光基板10之第一表面102上形成第一光學部之鏡片更薄,且由於透光基板10並不是整塊進行薄化,凹槽11四周未薄化之區域可同時承受壓印過程中之壓力,避免了鏡片陣列100或鏡片200之製程中透光基板10之彎曲與破裂。 Compared with the prior art, since the first optical portion 30 of the lens array 100 or the lens 200 is formed on the bottom surface 112 of the groove 11, the lens array 100 or the lens 200 formed is the first one compared to the transparent substrate 10. The lens forming the first optical portion on the surface 102 is thinner, and since the transparent substrate 10 is not thinned, the un-thinned region around the recess 11 can simultaneously withstand the pressure during the imprinting process, avoiding the lens array. The bending and cracking of the transparent substrate 10 in the process of 100 or the lens 200.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
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| TW97129298A TWI398670B (en) | 2008-08-01 | 2008-08-01 | Method for making lens array |
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| TWI398670B true TWI398670B (en) | 2013-06-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244033A (en) * | 1988-08-04 | 1990-02-14 | Matsushita Electric Ind Co Ltd | Lens processing apparatus and lens |
| US20020008916A1 (en) * | 1998-08-27 | 2002-01-24 | Takao Nishikawa | Micro lens array, method of fabricating the same, and display device |
| CN1345420A (en) * | 1999-03-31 | 2002-04-17 | 罗姆股份有限公司 | Lens array unit method of producing lens array unit and optical device using lens array unit |
| US20040196560A1 (en) * | 2001-06-13 | 2004-10-07 | Kuraray Co., Ltd. | Lens sheet and method for producing it |
| US20050068475A1 (en) * | 2003-09-26 | 2005-03-31 | Yasuhiro Kume | Dioptric element array substrate, image display device and image display apparatus |
-
2008
- 2008-08-01 TW TW97129298A patent/TWI398670B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244033A (en) * | 1988-08-04 | 1990-02-14 | Matsushita Electric Ind Co Ltd | Lens processing apparatus and lens |
| US20020008916A1 (en) * | 1998-08-27 | 2002-01-24 | Takao Nishikawa | Micro lens array, method of fabricating the same, and display device |
| CN1345420A (en) * | 1999-03-31 | 2002-04-17 | 罗姆股份有限公司 | Lens array unit method of producing lens array unit and optical device using lens array unit |
| US20040196560A1 (en) * | 2001-06-13 | 2004-10-07 | Kuraray Co., Ltd. | Lens sheet and method for producing it |
| US20050068475A1 (en) * | 2003-09-26 | 2005-03-31 | Yasuhiro Kume | Dioptric element array substrate, image display device and image display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201006647A (en) | 2010-02-16 |
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