TWI396810B - Led lamp - Google Patents

Description

Light-emitting diode lamp

The invention relates to a lighting device, in particular to a light-emitting diode lamp.

As a highly efficient light source, the light-emitting diode has been widely used in various fields due to its environmental protection, power saving and long life.

The conventional LED lamp includes a flat heat sink and a plurality of light emitting diode modules mounted on one side of the heat sink. When the light emitting diode is illuminated, the light emitting diode module mounted on the side of the heat sink functions as an illumination. Since the light-emitting diode is only mounted on the plane of the heat sink body, the light emitted by the light-emitting diode can only be radiated outward from the side plane of the heat sink at a small angle, and the illumination range is limited and the illumination effect is not good.

In view of this, it is necessary to provide a light-emitting diode lamp having a large irradiation range.

A light-emitting diode lamp includes a substrate and a plurality of heat-dissipating fins extending therefrom, and a plurality of heat-conducting chip sets having a top surface fixed on the substrate and a light-emitting diode module The inclined bottom surface is disposed, and each of the thermal conductive sheet groups includes a plurality of thermally conductive sheets that are mutually buckled.

Compared with the prior art, the light-emitting diode module of the light-emitting diode lamp of the present invention is attached on the inclined bottom surface of the heat-conducting chip group, so that the heat of the light-emitting diode module can be transmitted to the substrate while being The emitted light can radiate to the periphery of the heat sink to make the illumination range of the light-emitting diode lamp wider.

Referring to FIG. 1 and FIG. 2 , the LED device 100 of the present invention includes a heat sink 10 , a plurality of thermal conductive sheet assemblies 20 mounted on the bottom of the heat sink 10 , and a plurality of heat absorbing panels 30 fixed to the bottom surface of the thermal conductive sheet assembly 20 . The plurality of LED modules 40 are attached to the heat absorbing plate 30.

The heat sink 10 is made of a high thermal conductivity metal or alloy, such as copper, aluminum or copper aluminum alloy material, and includes a substantially rectangular flat plate substrate 12 and a plurality of heat dissipating fins extending perpendicularly from the surface of the substrate 12 . Sheet 14. The substrate 12 has a bottom surface 121 and a top surface 122 opposite the bottom surface 121. The heat dissipation fins 14 include second heat dissipation fins 141 and second heat dissipation fins 142 respectively formed on the first heat dissipation fins 141 and the top surface 122 of the bottom surface 121 of the substrate 12 .

The first heat dissipation fins 141 are spaced apart from each other and distributed on both sides of the bottom surface 121 of the substrate 12 such that a rectangular heat-free fin region is formed in the middle of the bottom surface 121 of the substrate 12 for arranging the heat conductive sheet group 20 . The two first heat dissipation fins 141 located at the outermost side of the substrate 12 have the same height and are lower than the other first heat dissipation fins 141, and the heights of the other first heat dissipation fins 141 gradually increase from the opposite sides of the substrate toward the middle portion. A plurality of air passages are formed between the first heat dissipation fins 141 to increase the heat dissipation effect. The second heat dissipation fins 142 extend vertically upward from the top surface 122 of the base 12 and are parallel to each other to form a ventilation passage. The second heat dissipation fins 142 located at the outermost side of the susceptor 12 have the same height and are lower than the other second heat dissipation fins 142, the second heat dissipation fins 142 of the middle portion are the highest, and the heights of the other second heat dissipation fins 142 are from the substrate. 12 The opposite sides gradually increase toward the middle. The entire heat sink 10 is vertically symmetrical along the opposite sides of the substrate 12.

Referring to FIG. 3 to FIG. 4 together, in the embodiment, the number of the thermal conductive sheet groups 20 is four. The heat conducting sheet groups 20 are elongated and parallel to each other, and are soldered and fixed to the heat-dissipating fin region of the bottom surface 121 of the susceptor 12. Each of the heat conductive sheet groups 20 is composed of a plurality of heat conductive sheets 23 which are mutually slid by each other. Each of the heat conducting sheets 23 is stamped from a single metal sheet, and includes a body 231, a flange 233 extending from the top edge of the body 231, a bottom edge extending in the same direction, and a fourth extending from the opposite sides of the body 231. The buckle portion 235. The body is disposed in a right-angled trapezoidal shape, wherein opposite side edges thereof are parallel to each other and perpendicular to the top edge, and the bottom edge is inclined at an angle to the top edge. The flange 233 and the latching portion 235 extend from the edge of the body 231 in the same side direction. The latching portions 235 are opposite to each other, and each of the latching portions 235 has a substantially convex shape, and a middle portion of the latching portion 237 is provided. A card 238 extends outwardly from the junction of the body 231 and the buckle portion 235. After assembly, the card 238 of each of the heat conducting sheets 23 is inserted into the insertion holes 237 of the adjacent front heat conducting sheets 23 to snap the adjacent heat conducting sheets 23 together. The flanges 233 of the heat conducting sheets 23 abut each other to form a flat top surface and a bottom surface. The top surface of the four heat conducting sheet groups 20 is soldered on the bottom surface 121 of the base 12, and the bottom surface thereof is obliquely symmetrically perpendicular to the heat sink 10 along the opposite sides of the substrate 12 to accommodate the heat absorbing plate 30 and the light emitting diode mold. Group 40.

Each of the heat absorbing plates 30 is made of a metal material having good thermal conductivity, and is disposed in a vertically long rectangular shape to cover the bottom surface of the heat conductive sheet group 20. Each of the LED modules 40 includes a vertically long circuit board 42 and a plurality of LEDs 44 uniformly fixed to one side of the circuit board 42. The other side of the circuit board 42 is attached to the bottom surface of the heat absorbing plate 30. The light-emitting diodes 44 are located on the same line extending along the length of the circuit board 42 to heat them. The amount is evenly conducted to the heat absorbing plate 30, the heat conductive sheet group 20, and finally to the heat sink 10, which is radiated in the air by the heat radiating fins 14.

Compared with the prior art, the top surface of the thermal conductive sheet group 20 for illuminating the LED module 40 in the present invention is inclined from the two sides of the substrate 12 toward the opposite center and extends inward, and thus is attached to the thermal conductive sheet group. The light-emitting diode module 40 of 20 satisfies the heat dissipation while the light emitted by the light-emitting diode module 40 can reach the illumination intensity and illumination range required by the lamp. Further, since the heat conductive sheet group 20 is formed by interlocking the metal sheets of the single piece, the angle between the bottom surface of the light emitting diode module 40 and the bottom surface of the base 12 can be adjusted according to actual needs, and has a very high Great flexibility.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

100‧‧‧Lighting diode lamps

10‧‧‧ radiator

12‧‧‧Substrate

121‧‧‧ bottom

122‧‧‧ top surface

14‧‧‧Heat fins

141‧‧‧First heat sink fin

142‧‧‧Second heat sink fins

20‧‧‧ Thermal film set

23‧‧‧ Thermal sheet

231‧‧‧ body

233‧‧ ‧Folding

235‧‧‧ buckle department

237‧‧‧ jack

238‧‧‧ cards

30‧‧‧heat absorbing plate

40‧‧‧Lighting diode module

42‧‧‧ boards

44‧‧‧Lighting diode

1 is an assembled view of a light-emitting diode lamp of the present invention.

2 is an inverted view of the light-emitting diode lamp of FIG. 1.

3 is an exploded perspective view of the light-emitting diode lamp of FIG. 2.

Figure 4 is an enlarged view of a thermally conductive sheet of Figure 3.

100‧‧‧Lighting diode lamps

10‧‧‧ radiator

12‧‧‧Substrate

122‧‧‧ top surface

121‧‧‧ bottom

14‧‧‧Heat fins

141‧‧‧First heat sink fin

142‧‧‧Second heat sink fins

20‧‧‧ Thermal film set

30‧‧‧heat absorbing plate

40‧‧‧Lighting diode module

Claims (9)

A light-emitting diode lamp comprising a substrate and a plurality of heat-dissipating fins extending thereon, the improvement comprising: further comprising a plurality of heat-conducting sheet groups having a top surface fixed on the substrate and for emitting light The slanted bottom surface of the pole body module is disposed, each of the heat conducting sheet groups includes a plurality of mutually conductive thermally conductive sheets, and the heat dissipating fins comprise a first heat dissipating fin extending from a bottom surface of the substrate provided with the heat conducting sheet group The first heat dissipation fins are distributed on both sides of the extending direction of the heat conduction sheet group, and the two first heat dissipation fins located at the outermost side of the substrate have the same height and are lower than the other first heat dissipation fins, and the other The height of a heat sink fin gradually increases from the opposite sides of the substrate toward the middle. The illuminating diode lamp of claim 1, wherein each of the heat conducting sheets is disposed in a right-angled trapezoid, wherein opposite side edges thereof are parallel to each other and perpendicular to the top edge, and the bottom edge is inclined at an angle to the top edge. . The light-emitting diode lamp of claim 2, wherein a top edge and a bottom edge of each of the heat-conducting sheets are vertically extending in a same direction, and the flanges of the heat-conducting sheets are mutually abutted to form a flat surface. The top surface and the bottom surface of the slope. The illuminating diode lamp of claim 2, wherein each of the heat conducting sheets has a buckle portion extending from opposite sides of the heat conducting sheet to buckle adjacent heat conducting sheets. The light-emitting diode lamp of claim 4, wherein each of the fastening portions is provided with a socket, and a card extends outwardly from the edge of the edge of the heat-conducting sheet, and the card is disposed adjacent to the card. The jack of the former thermal pad is used to snap the adjacent thermal sheets together. Such as the light-emitting diode lamp described in claim 2, which also includes The plurality of heat absorbing panels are disposed on the bottom surface of the corresponding heat conducting sheet group, and the light emitting diode module is attached to the bottom surface of the heat absorbing plate. The light-emitting diode lamp of claim 1, wherein the heat-dissipating fins further comprise second heat-dissipating fins extending perpendicularly from a top surface of the substrate, wherein the first heat-dissipating fins are distributed on two sides of the bottom surface of the substrate. A rectangular fin-free fin region is formed in the middle of the bottom surface of the substrate to place the heat conductive sheet group. The light-emitting diode lamp of claim 7, wherein the outermost second heat-dissipating fin of the base has the same height and is lower than the other second heat-dissipating fins, and the second heat-dissipating fin of the middle portion is the highest. The heights of the other second heat dissipation fins gradually increase from the opposite sides of the substrate toward the middle. The illuminating diode lamp of claim 1, wherein the illuminating diode lamp is symmetrical along a perpendicular line between two opposite sides of the substrate.