TWI395637B - Precision polishing device - Google Patents

Description

Precision polishing device

The present invention relates to a processing tool, and more particularly to a precision polishing apparatus.

Machining is the most common material removal procedure. Generally, the workpiece is often subjected to multiple initial, fine and fine cutting operations, but the workpiece after cutting often leaves many small defects on the surface of the workpiece. The cutting lines, therefore, for workpieces that require surface roughness or surface accuracy, the workpieces need to be machined, polished, etc. after cutting to eliminate the cutting lines to obtain a smoother workpiece surface.

A computer-controlled processing machine and a control method are disclosed in the British Patent Publication No. GB2452091. The processing spindle of the processing function can be moved along a two-dimensional intersecting arc-shaped predetermined path to grind the finished product after cutting, but the general grinding or The polishing process and the cutting process are separated from each other. Therefore, when the cutting process is completed, the workpiece needs to be removed, and then mounted on a processing machine such as grinding or polishing to perform grinding or polishing processing, and all processing machine operators It is known that the disassembly and assembly of the workpiece not only affects the processing efficiency, but also the disassembly and assembly process of the workpiece is often accompanied by the error in the clamping position, which in turn affects the dimensional accuracy of the workpiece.

In order to overcome the above shortcomings, the related art has developed a technology disclosed in the invention patent of the Republic of China No. I230107, which mainly improves the integration of the turning system, the chemical mechanical polishing system, and the electrolytic polishing system. It is a precision compound processing device, which reduces the trouble of disassembling the workpiece and the error that may occur when disassembling the workpiece.

However, the chemical mechanical polishing may affect the accuracy of the polishing process due to the abrasion caused by the polishing process or the machining error of the turning system.

Accordingly, it is an object of the present invention to provide a precision polishing apparatus that is convenient, fast, and highly precise in polishing.

Thus, the precision polishing apparatus of the present invention is suitable for use in a processing machine for polishing a workpiece to be polished, the precision polishing apparatus comprising a bracket spaced from the processing machine, a polishing unit disposed on the bracket, and a connecting bracket A connection unit with the polishing unit.

The polishing unit is movable relative to the object to be polished along a predetermined path of two circular arc-shaped intersections to polish the object to be polished; the connecting unit includes a base connected to the processing machine and defining an installation space, a buffer seat disposed in the installation space of the base, and at least one actuating member disposed on the base and capable of being controlled to abut against the buffer seat, wherein the buffer seat is partially protruded outside the installation space And being connected to the bracket, when the buffer seat is pressed by the actuating member, stress concentration occurs to interlock the bracket, and the polishing unit disposed on the bracket is changed between the object to be polished and the object to be polished. load.

The utility model has the advantages that the connecting unit is combined with the processing unit and the processing machine, and the actuating member can be controlled to be pressed against the buffer seat, so that the buffer seat is concentrated due to structural weakening, and the The buffer seat generates a slight deformation and displacement, and the throwing connection to the buffer seat The light unit generates a slight displacement change relative to the object to be polished, thereby adjusting the load and the polishing rate between the polishing unit and the object to be polished, so that the load between the polishing unit and the object to be polished can be kept fixed. Improve polishing precision of polishing the object to be polished.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to Figure 1, a first preferred embodiment of the precision polishing apparatus 1 of the present invention comprises a holder 2, a polishing unit 3 on which the holder 2 is disposed, and a connection unit 4 to which the holder 2 is attached.

The connecting unit 4 includes a base 41 defining a mounting space 410, a buffer base 42 disposed in the mounting space 410, and four disposed on the base 41 and controllably resisting the buffer base Actuator 44 on 42 (only three are shown in Figure 1 due to the viewing angle relationship). The buffer base 42 includes a main body 421 disposed in the base 41, a connecting member 43 connected to the main body 421 and protruding from the mounting space 410 and connected to the bracket 2, and most of the connecting members 43 are formed thereon. Each of the actuating members 44 is disposed on the base 41 and located between the base 41 and the body 421, and can be controlled to be forced along the reserved hole 422. The body 421 of the buffer base 42 is abutted. In the preferred embodiment, the actuator 44 is a piezoelectric actuator.

Referring to FIGS. 1 and 2, for convenience of description, a part of the member is omitted in FIG. 2, the polishing unit 3 includes a first guide rail 5 disposed on the bracket 2 and having an arc shape, and is spaced apart from the first rail 5 a first driving group 6 on the bracket 2, and a polishing group 7 connecting the first rail 5 and the first driving group 6, wherein the first driving group 6 has a first power disposed on the bracket 2 a source 61, and a coupling seat 62 that is driven by the first power source 61. The polishing group 7 has a sliding seat 71 on the first rail 5, and has an arc shape and two ends respectively. a second rail 72 connecting the sliding seat 71 and the coupling seat 62, a polishing seat 73 slidably disposed on the second rail 72, and a second driving unit 7 capable of driving the polishing seat 73 to move along the second rail 72 a driving group 74, a second power source 75 disposed on the polishing base 73, a polishing spindle 76 capable of being rotated by the second power source 75, and a polishing tool detachably disposed on the polishing spindle 76 77.

The sliding seat 71 has a body 711 and a plurality of first rollers 712 pivotally mounted on the base 711 and in sliding contact with the first rail 5.

Referring to FIGS. 2 and 3 and reviewing FIG. 1 , for convenience of explaining a part of the components in FIG. 3 , the second driving group 74 has a rack 741 formed on the second rail 72 , and a rack 741 . The meshing gear 742, a third power source 743 disposed on the polishing base 73 and capable of driving the gear 742 to rotate, and a second roller pivotally disposed on the polishing base 73 and in sliding contact with the second rail 72 744. In the preferred embodiment, the first and third power sources 61, 743 are stepping motors and the second power source 75 is a servo motor.

4, 5, and 6, in actual use, the precision polishing apparatus 1 is mounted on a processing machine 100 by using the base 41 to polish a workpiece 101 to be polished, and the first, second, and third power sources 61, The actuation modes of 75, 743 and the actuating member 44 are all controlled by a programmable computer (not shown). In the preferred embodiment, the object to be polished 101 is processed by the processing machine 100, and the processing machine 100 is a common computer numerical control machine (CNC), such as a common CNC. The precision polishing apparatus 1 of the present invention can be mounted on a milling machine or a CNC lathe, etc., and therefore should not be limited to the description of the embodiment.

In use, after the workpiece is first processed on the processing machine 100, the workpiece is smoothly moved to the position of the precision polishing apparatus 1 by manipulating the processing machine 100. At this time, the polishing tool is directly polished. 77 is in contact with the side surface of the object to be polished 101, and the second power source 75 can drive the polishing tool 77 to perform the polishing operation of the object to be polished 101 according to the direction indicated by the arrow 11 in FIG. The moving direction of the polishing tool 77 is moved in the radial direction of the object to be polished 101, thereby eliminating the effect of uneven distribution of the surface roughness of the polishing tool 77.

The third power source 743 drives a gear 742 (shown in FIG. 3) that meshes with the rack 741 (shown in FIG. 3), thereby driving the polishing seat 73 to be on the second rail 72 according to the arrow in FIG. The direction of movement 14 ensures that the axis of rotation of the polishing tool 77 can be rotated with the normal to the surface of the object to be polished 101 to maintain a constant angle.

The first power source 61 is capable of driving the binding base 62 to rotate in the direction indicated by the arrow 12 in FIG. 5, and the second rail 72 is driven to swing relative to the object to be polished 101 according to the direction of the arrow 13 in FIG. The sliding seat 71 moves on the first guide rail 5 in the direction indicated by the arrow 13 in FIG. 6, so that the polishing tool 77 generates a rocking motion along the radial direction of the object to be polished 101, thereby increasing the polishing tool 77 and the polishing tool to be polished. The wear range between the articles 101 (wideband wear) causes the polishing tool 77 to wear more uniformly, thereby suppressing the wear effect of the polishing tool 77 and increasing the service life of the polishing tool 77.

In addition, each actuating member 44 (shown in FIG. 5) is controlled to be forced against the body 421 of the buffer base 42 in the direction of the reserved hole 422 by the program control computer control, so that the body of the buffer base 42 The 421 generates a stress concentration phenomenon at the reserved hole 422 (ie, the structure is weakened), and causes a slight deformation and displacement of the body 421, which causes the polishing tool 77 to generate a slight displacement change with respect to the object to be polished 101, so that A stable load is maintained between the polishing tool 77 and the object to be polished 101, so that the polishing tool 77 can accurately remove the shape error of the object to be polished 101 and improve the processing accuracy.

It can be seen from the above that the precision polishing apparatus 1 of the present invention has the following effects in practical applications:

1. High polishing precision:

Since the object to be polished 101 is processed without any removal after the processing machine 100 completes the processing operation, the high precision movement of the processing machine 100 itself can be directly utilized, so that the object to be polished 101 can be smoothly moved to the precision polishing device. Polishing directly at the position of 1 not only facilitates the operation, but also does not cause the positional accuracy of the object to be polished 101 to be shifted due to the conversion tool; further, the first and second guide rails 5, 72 can be used to secure the same. The rotation axis of the polishing tool 77 can be rotated together with the normal line of the surface of the object to be polished 101 to maintain a constant angle, and the polishing tool 77 can be caused to swing along the radial direction of the object to be polished 101 to suppress the polishing. The wear effect of the cutter 77 finally matches the actuating member 44 on the buffer base 42 to cause a slight deformation and displacement of the body 421, and the polishing tool 77 is changed and adjusted between the polishing operation and the object to be polished 101. The load, while changing the residence time of the polishing tool 77 at different positions on the surface of the object to be polished 101, accurately removing the object to be polished 101 Shape error, effectively improve the precision of the polishing operation.

2. Convenient and low cost, easy to install and disassemble on all types of processing machines:

The processing unit 100 and the bracket 2 and the polishing unit 3 can be connected by the connecting unit 4, so that it can be directly attached to the processing machine 100, which not only facilitates but also reduces the cost of additional purchase of the machine.

Moreover, since the connecting unit 4 can be easily detachably and detachably attached to the processing machine 100, the polishing unit 3 can be flexibly applied to various types of processing machines, such as the aforementioned CNC milling machine and CNC lathe.. In other words, the processing machine and the precision polishing device 1 can be integrated as necessary, or the precision polishing device 1 can be detached and only the processing machine can be operated, and the overall operation is quite flexible.

3. Long service life:

Continuing the above, the polishing tool 77 can increase the wear band width with the object to be polished 101 by the above-mentioned rocking motion, so that the wear of the polishing tool 77 is more uniform; and the force of the actuating member 44 is forced to force The structure of the main body 421 of the buffer base 42 is weakened due to the reserved hole 422, and a slight deformation and displacement are generated, so that the polishing tool 77 is kept fixed during the polishing operation and the load between the object to be polished 101 is effectively suppressed. The wear effect of the polishing tool 77 increases the overall service life.

4. Special effects of circular arc stereo polishing design:

As described in the British Patent No. GB2452091, which is described in the prior art, although it also has a circular arc-shaped three-dimensional polishing design concept, this is only for the surface shape of the workpiece, and the first and second guide rails designed by the present invention. 5, 72, but can achieve the effect never mentioned in the British patent case - that is, to ensure that the polishing tool 77 can maintain a constant angle according to the free surface normal of different positions of the object 101 to be polished; and the polishing tool 77 can generate a rocking motion in the radial direction of the object to be polished 101, thereby increasing the wear width between the polishing tool 77 and the object to be polished 101 to suppress the wear effect of the polishing tool 77.

Referring to FIG. 6, a second preferred embodiment of the precision polishing apparatus 1 of the present invention is substantially the same as the first preferred embodiment, and includes a bracket 2, a polishing unit 3, and a connecting unit 4. The difference is that the polishing unit 3 includes a first transmission group 31 disposed on the bracket 2, a second transmission group 32 disposed on the first transmission group 31, and a second transmission unit disposed on the second transmission. a polishing mechanism 33 on the group 32, wherein the first transmission group 31 has a first pivoting seat 311 and a first transmission member 312 spaced apart from each other along the first axis L1, and a pivoting portion An outer frame 313 of the first pivoting member 311 and capable of being driven by the first transmission member 312 and pivoting about the first axis L1. The second transmission group 32 has a second axis L2. a second pivoting seat 321 and a second transmitting member 322 are disposed on the outer frame 313. The polishing mechanism 33 has a pivoting mechanism 321 and is coupled to the second pivoting member 321 and configured by the second transmitting member 322. a mounting base 331 that is pivoted about the second axis L2, a third transmission member 332 disposed on the mounting base 331, and an actuating shaft 333 that can be rotated by the third transmission member 332, and a polishing head 334 detachably disposed on the operating shaft 333, wherein the first axis L1 and the second axis L2 are mutually Vertically, the actuating shaft 333 can be moved relative to the object to be polished 101 (shown in FIG. 5) by a predetermined path 15, 16 intersecting in two arcs, wherein the direction of movement of the buff head 334 is along The radial direction of the object to be polished 101 generates a rocking motion, increasing the wear width between the polishing head 334 and the object to be polished 101 to suppress the wear effect of the polishing head 334, and the rotation axis of the polishing head 334 can be The normal to the surface of the object to be polished 101 is rotated together to maintain a constant angle. In the preferred embodiment, the first and second transmission members are 312, 322 which are stepping motors and the third transmission member 332 is a servo motor.

The overall structure of the present embodiment is substantially the same as that of the foregoing first preferred embodiment. Therefore, the various functions mentioned above can be achieved by the present embodiment, and will not be further described herein. A different from the first preferred embodiment.

In summary, the precision polishing apparatus 1 of the present invention combines the polishing unit 3 and the processing machine 100 by using the connecting unit 4, which is convenient in design and installation and can reduce the cost of additional purchase of the machine; Controlly pressing against the buffer base 42 causes the buffer base 42 to be concentrated due to structural weakening, causing a slight deformation and displacement of the buffer base 42 and, in conjunction with the polishing tool 77 connected to the buffer base 42, A slight displacement change is generated with respect to the object to be polished 101, so that the polishing tool 77 is kept fixed with the load between the object to be polished 101 during the polishing operation, and the rocking motion generated by the polishing tool 77 can be increased. The abrasion between the objects to be polished 101 is wide, and the abrasion effect of the polishing tool 77 and the polishing blade 334 can be suppressed, thereby improving the precision of the polishing, and increasing the overall service life, so that the present invention can be achieved. The purpose.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1‧‧‧Precision polishing device

2‧‧‧ bracket

3‧‧‧ Polishing unit

31‧‧‧First Transmission Group

311‧‧‧First pivoting seat

312‧‧‧First transmission

313‧‧‧External framework

32‧‧‧Second gear set

321‧‧‧Second pivoting seat

322‧‧‧second transmission parts

33‧‧‧ polishing mechanism

331‧‧‧ Mounting

332‧‧‧ Third transmission

333‧‧‧ actuation axis

334‧‧‧ polishing head

4‧‧‧ Connection unit

41‧‧‧Base

410‧‧‧ installation space

42‧‧‧ Buffer seat

421‧‧‧ Ontology

422‧‧‧Reserved holes

43‧‧‧Connecting parts

44‧‧‧Operator

5‧‧‧First rail

6‧‧‧First Drive Group

61‧‧‧First power source

62‧‧‧ joint

7‧‧‧ polishing group

71‧‧‧Sliding seat

711‧‧‧ body

712‧‧‧First wheel

72‧‧‧Second rail

73‧‧‧ polishing seat

74‧‧‧Second drive group

741‧‧‧Rack

742‧‧‧ Gears

743‧‧‧ Third power source

744‧‧‧Second wheel

75‧‧‧second power source

76‧‧‧ polishing spindle

77‧‧‧ polishing tools

100‧‧‧Processing machine

101‧‧‧Items to be polished

L1‧‧‧first axis

L2‧‧‧second axis

11~16‧‧‧ arrow

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a first preferred embodiment of the precision polishing apparatus of the present invention; Fig. 2 is a perspective view, which is an explanatory view of Fig. 1, in which a part of the member is omitted; and Fig. 3 is a partially enlarged view showing the first preferred embodiment. FIG. 4 is a perspective view showing the first preferred embodiment mounted on a processing machine; FIG. 5 is a side view showing the processing of the first preferred embodiment Figure 6 is another side view, with assistance in explaining Figure 5; Figure 7 is a perspective view showing a second preferred embodiment of the precision polishing apparatus of the present invention.

1‧‧‧Precision polishing device

2‧‧‧ bracket

3‧‧‧ Polishing unit

4‧‧‧ Connection unit

41‧‧‧Base

410‧‧‧ installation space

42‧‧‧ Buffer seat

421‧‧‧ Ontology

422‧‧‧Reserved holes

43‧‧‧Connecting parts

44‧‧‧Operator

5‧‧‧First rail

6‧‧‧First Drive Group

61‧‧‧First power source

62‧‧‧ joint

7‧‧‧ polishing group

72‧‧‧Second rail

73‧‧‧ polishing seat

744‧‧‧Second wheel

75‧‧‧second power source

76‧‧‧ polishing spindle

77‧‧‧ polishing tools

Claims (8)

A precision polishing device is mounted on a processing machine for polishing a workpiece to be polished, the precision polishing device comprising: a bracket spaced apart from the processing machine; a polishing unit disposed on the bracket and capable of being along two a predetermined path of the circular arc-shaped three-dimensional intersection is moved relative to the object to be polished to polish the object to be polished; and a connecting unit includes a base connected to the processing machine and defining an installation space, and a a buffer seat in the installation space of the base, and at least one actuating member disposed on the base and capable of being controlled to be pressed against the buffer seat, wherein the buffer base includes a mounting space disposed in the base a main body, a connecting member connected to the mounting body and protruding from the mounting space, and a plurality of connecting holes formed on the main body, wherein the actuating member is disposed on the base and located at the base Between the base and the body, the actuating member can urge the body and cause stress concentration of the body with the reserved hole; when the buffer seat is forced by the actuating member, stress concentration occurs. Moving the stent, the polishing units disposed on the bracket, to be changed with the load between the polishing article. The precision polishing apparatus according to claim 1, wherein the polishing unit comprises a first guide rail disposed on the bracket and having an arc shape, and a first portion spaced apart from the first guide rail on the bracket a driving group, and a polishing group connecting the first rail and the supporting base, wherein the first driving group has a first power source disposed on the bracket, and a a polishing base that is driven by the first power source, the polishing group has a sliding seat on the first rail, a circular arc shape, and two ends respectively connected to the sliding seat and the coupling seat a second guide rail, a polishing seat slidably disposed on the second rail, a second driving group capable of driving the polishing seat to move along the second rail, a second power source disposed on the polishing seat, and a a polishing spindle capable of driving rotation of the second power source, and a polishing tool detachably disposed on the polishing spindle, so that the moving direction of the polishing tool is a rocking motion along a radial direction of the object to be polished. The abrasion bandage between the polishing tool and the object to be polished is increased to suppress the wear effect of the polishing tool, and the rotation axis of the polishing tool can rotate together with the normal line of the surface of the object to be polished to maintain a constant angle. The precision polishing apparatus according to claim 2, wherein the sliding seat has a body and a plurality of first rollers pivotally mounted on the base and in sliding contact with the first rail. The precision polishing apparatus according to claim 3, wherein the second driving group has a rack formed on the second rail, a gear meshing with the rack, and a polishing seat disposed on the polishing seat a third power source capable of driving the gear to rotate, and a second roller pivotally disposed on the polishing seat and in sliding contact with the third rail. The precision polishing apparatus according to claim 4, wherein the first and third power sources are stepping motors, and the second power source is a servo motor. The precision polishing apparatus according to claim 1, wherein The polishing unit includes a first transmission group disposed on the bracket, a second transmission group disposed on the first transmission group, and a polishing mechanism disposed on the second transmission group, wherein the first The transmission group has a first pivoting seat and a first transmission member spaced apart from each other along a first axis, and a pivoting portion of the first pivoting seat and capable of being driven by the first transmission member The second transmission group has an outer frame that is pivoted about the first axis, and the second transmission group has a second pivoting seat and a second transmission member spaced apart from each other along a second axis. The polishing mechanism Having a mounting seat pivotally mounted on the second pivoting seat and driven by the second transmission member and pivoting about the second axis, a third transmission member disposed on the mounting seat, and a An actuating shaft for driving the third transmission member, and a polishing head detachably disposed on the actuating shaft, wherein the first axis and the second axis are perpendicular to each other, so that the actuating shaft can a predetermined path of two arc-shaped three-dimensional intersections moving relative to the object to be polished, and The moving direction of the polishing head is to generate a rocking motion along the radial direction of the object to be polished, increasing the abrasion band between the polishing head and the object to be polished to suppress the wear effect of the polishing head, and the polishing head is The axis of rotation can be rotated with the normal to the surface of the object to be polished to maintain a constant angle. The precision polishing apparatus according to claim 6, wherein the first and second transmission members are stepping motors, and the third transmission members are servo motors. The precision polishing apparatus according to claim 1, wherein the connecting unit comprises a plurality of actuating members, and each actuating member is controllable The ground is forced against the body of the buffer seat in the direction of the reserved hole.