TWI393243B - Light-changeable light-emitting device and method for manufacturing the same - Google Patents

Description

Light-changing light-emitting element and manufacturing method thereof

The present invention relates to a light-emitting element, and more particularly to a light-emitting light-emitting element.

When a conventional LED chip is applied to a light-emitting element module, a series-parallel structure circuit is used to connect the light-emitting diode chips.

However, such a circuit structure design, when a part of the light-emitting diode chip is burned, the entire light-emitting element module cannot operate normally, which seriously affects the applicability of the light-emitting element module. Moreover, in the case where a part of the light-emitting diode chip of the light-emitting element module is burned, the light-emitting element module can be reassembled and replaced, and the damaged light-emitting diode chip in the light-emitting element module can be replaced, so that the light can be emitted. The component module operates smoothly and smoothly, which is time consuming and costly. Therefore, the circuit structure design of the conventional light-emitting element module is not economical.

In addition, in the current phosphor coating technology, the phosphor powder can be simultaneously coated on a plurality of or all of the LED chips in the same light-emitting device package, and cannot be located in the same light-emitting device package. Each of the light-emitting diode chips is coated with a different phosphor powder.

Therefore, due to limitations of the phosphor powder coating technology, the application range of the light-emitting element module is limited. How to solve the problem that the series-parallel structure circuit is connected with the light-emitting diode chip and the fluorescent powder which is different in the same light-emitting diode package in the same light-emitting element package is a problem that needs to be solved in the industry of the light-emitting diode.

Accordingly, it is an object of the present invention to provide a dimming light-emitting element. Each of the light-emitting elements of the light-emitting device has an independent power source, so that the switch of each light-emitting chip can be independently controlled, and the light-emitting color of the light-emitting element can be switched at any time, thereby effectively expanding the application of the light-emitting element.

Another object of the present invention is to provide a dimming light-emitting element that does not use a series-parallel circuit to connect all of the light-emitting wafers, and that each of the light-emitting chips has an independent power source. Therefore, the probability that all of the illuminating wafers are inoperable can be greatly reduced, so that after the partial illuminating wafer is destroyed, another portion of the illuminating wafer can still operate efficiently, and the light source can continue to be provided.

It is still another object of the present invention to provide a dimming light-emitting element which can provide a plurality of color light sources in the same element, and which can increase the diversity of the light-emitting colors of the light-emitting elements.

In accordance with the above objects of the present invention, a dimming light-emitting element is provided that includes a holder, a first light-emitting wafer, a second light-emitting wafer, and a two-part power source. The holder includes a wafer carrier. The first luminescent wafer and the second luminescent wafer are disposed on a surface of the wafer carrier, wherein the first luminescent wafer and the second luminescent wafer have different luminescent colors. The independent power source is electrically connected to the first light emitting chip and the second light emitting chip, respectively, to respectively control the switches of the first light emitting chip and the second light emitting chip.

According to an embodiment of the invention, the dimming light-emitting element further includes a switch for separately controlling the switches of the independent power sources.

In accordance with another embodiment of the present invention, the second luminescent wafer comprises a conformal coating layer overlying the second luminescent wafer.

According to the above object of the present invention, a method for fabricating a dimming light-emitting device is further provided, comprising the steps of providing at least one light-emitting chip disposed on a carrier. A first mask is provided having at least one first opening that exposes at least the light emitting wafer. Providing a spraying device disposed above the first mask to perform a first spraying process, wherein the spraying device reciprocates the first phosphor solution along a path, so that the light emitting surface and the plurality of side surfaces of the light emitting chip are A phosphor solution is conformally coated. A curing process is performed to cure the first phosphor solution coated on the surface of the luminescent wafer into a first phosphor layer.

According to an embodiment of the invention, the first phosphor solution is composed of a colloidal solvent, a colloid and a phosphor.

According to another embodiment of the present invention, while spraying the first phosphor solution to and from the first mask along the path, the method further includes performing a first heating process on the light emitting wafer, so that the first phosphor on the light emitting wafer The colloidal solvent in the solution is evaporated.

The invention discloses a dimming light-emitting element, which has a wide applicability. In order to make the description of the present invention more detailed and complete, reference is made to the following description in conjunction with the drawings of Figures 1 through 4.

Please refer to FIG. 1 , which is a top view of a dimming light emitting device according to an embodiment of the invention. In one embodiment, the dimming light emitting element 100 mainly includes a bracket 108, at least two light emitting wafers 110 and 112, and at least two independent power sources 114 and 116. The stand-alone power supplies 114 and 116 are electrically coupled to corresponding light emitting wafers 110 and 112, respectively, to supply their required power.

In an embodiment, the bracket 108 can include a wafer carrier 102 and at least two pairs of pins 104 and 106.

Referring to FIG. 2, a cross-sectional view of a portion of a device between a light-emitting wafer and a wafer carrier of a dimming light-emitting device according to an embodiment of the invention is shown. In this embodiment, the wafer carrier 102a of the holder 108a has at least one recess 124. This recess 124 is recessed in the surface 118a of the wafer carrier 102a. The recess 124 is slightly larger than the size of the light emitting wafer 112.

In the dimming light emitting element 100, one of the light emitting wafers 110 is disposed over the surface 118a of the wafer carrier 102a, and the other of the light emitting wafers 112 is disposed in the recess 124 of the wafer carrier 102a.

The luminescent wafer 112 further includes a conformal phosphor coating layer 126. The conformal phosphor coating layer 126 is overlaid over the entire luminescent wafer 112. Moreover, the conformal phosphor coating layer 126 is filled in the recess 124 of the wafer carrier 102a. Since the conformal phosphor coating layer 126 of the luminescent wafer 112 is filled in the recess 124, the light emitted by the illuminating wafer 110 can be prevented from exciting the phosphor in the conformal phosphor coating layer 126 of the illuminating wafer 112. The conformal phosphor coating layer 126 is prevented from emitting light due to accidental excitation.

In addition, as shown in FIG. 2, due to the presence of the recess 124, the phosphor coating layer 126 can be smoothly applied only to the recess 124 while maintaining the luminescent wafer 110 to maintain the uncoated phosphor coating. Light is emitted on the wafer 112.

In another example, the luminescent wafer 110 can also be coated with another phosphor coating under a fluorescent coating that does not affect the luminescent wafer 112. Therefore, the adjustment of the phosphor coating of each of the light-emitting wafers 110 and 112 in the same dimming light-emitting element 100 can be smoothly performed by the operation of the wafer carrier 102a.

Referring to FIG. 3, a cross-sectional view of a portion of a device between a light-emitting wafer and a wafer carrier of another dimming light-emitting device according to an embodiment of the present invention is shown. In this embodiment, the surface 118b of the wafer carrier 102b of the holder 108b is a planar structure. In the dimming light-emitting element 100, the two light-emitting wafers 110 and 112 are both disposed on the surface 118b of the wafer carrier 102b, and thus the light-emitting wafers 110 and 112 are disposed on the same plane. The luminescent wafer 112 further includes a conformal phosphor coating layer 128, wherein the conformal phosphor coating layer 128 is uniformly over the entire luminescent wafer 112.

Referring to FIG. 4, a cross-sectional view of a portion of a device between a light-emitting wafer and a wafer carrier of a dimming light-emitting device according to still another embodiment of the present invention is shown. In this embodiment, the surface 118 of the wafer carrier 102c of the holder 108c includes two planes 134 and 136 with a height difference between the two planes 134 and 136. In the dimming light emitting element 100, one of the light emitting wafers 110 is disposed on the plane 134 of the wafer carrier 102c, and the other light emitting chip 112 is disposed on the other plane 136 of the wafer carrier 102c.

In an embodiment, the luminescent wafer 112 further includes a conformal phosphor coating layer 130. The conformal phosphor coating layer 130 is overlaid over the entire luminescent wafer 112. Since the left and right sides of the wafer carrier 102c are the two planes 134 and 136 having the height difference, the light emitted by the light-emitting chip 110 can be prevented from exciting the phosphor powder in the conformal phosphor coating layer 130 of the light-emitting chip 112, thereby preventing The conformal phosphor coating layer 126 emits light due to accidental excitation.

In this embodiment, the bracket 108c is more selectively convexly disposed with the blocking structure 132. The two illuminating wafers 110 and 112 are respectively located on two sides of the blocking structure 132 to prevent the light emitted by the luminescent wafer 110 from exciting the phosphor in the conformal phosphor coating layer 130 of the luminescent wafer 112 to emit light.

In addition, as shown in FIG. 4, since the wafer carrier 102c includes the two planes 134 and 136 having the difference in height, it is possible to maintain the uncoated phosphor coating while maintaining the luminescent wafer 110 provided on the plane 134. The phosphor coating layer 126 is applied only to the luminescent wafer 112 disposed on the other plane 136.

In another example, the luminescent wafer 110 can also be coated with another phosphor coating under a fluorescent coating that does not affect the luminescent wafer 112. Therefore, the adjustment of the phosphor coating of each of the light-emitting wafers 110 and 112 in the same dimming light-emitting element 100 can be smoothly performed by the operation of the wafer carrier 102c.

In one embodiment, the light-emitting wafers 110 and 112 may be photovoltaic elements such as a general light-emitting diode, a high-power light-emitting diode, or a laser diode.

The above-mentioned illuminating wafers 110 and 112 may have different illuminating colors, for example, one is a white light emitting chip, and the other is a blue, green or red light emitting chip.

In one embodiment, the luminescent wafers 110 and 112 may each include a phosphor coating layer (not shown), particularly a conformal phosphor coating layer, to provide uniform color light having a desired color.

In another embodiment, there may be only one luminescent wafer, such as luminescent wafer 112, including a conformal phosphor coating layer overlying it. Of course, in a dimming light-emitting element 100, all of the light-emitting chips 112 may not have a phosphor coating layer.

5A to 5C are cross-sectional views showing a process of a dimming light-emitting device according to an embodiment of the present invention. In one embodiment, when a dimming light-emitting element, such as the dimming light-emitting element shown in FIG. 3, is fabricated, one or more light-emitting wafers, such as light-emitting wafers 110 and 112, may be provided first. Next, as shown in Fig. 5A, the light-emitting wafers 110 and 112 are disposed and fixed on the surface 118b of the carrier 102b of the holder 108b.

Next, a mask 140 is provided and the mask 140 is overlaid over the carrier 102b. The mask 140 can have at least one opening 142. The opening 142 may expose the luminescent wafer 112 below which the fluorescent paint is to be applied. However, the other luminescent wafer 110 is covered by the mask 140.

Next, a spray device 144 is provided and the spray device 144 is disposed above the mask 140. Among them, the spray device 144 can be equipped with a phosphor solution 146. In one embodiment, the phosphor solution 146 comprises a colloidal solvent, a colloid, and a phosphor. The colloidal solvent may comprise, for example, xylene, n-heptane or acetone. The colloid may comprise, for example, silicone or epoxy.

In one embodiment, the ratio of colloidal solvent, colloid to phosphor powder in the phosphor solution 146 can be about 50%, 20%, and 30%.

Next, the spraying process is performed by the spraying device 144. In one embodiment, referring to FIG. 5B, when the spraying process is performed, the spraying device 144 can be manipulated to move over the opening 142 of the mask 140 and to traverse the illuminating wafer 112 to the lower side along the path 148. Spraying of the light body solution 146. After the spraying process, the light-emitting surface 152 of the light-emitting wafer 112 and the side surface 154 are conformally covered by the phosphor solution 146.

In an embodiment, as shown in FIG. 5B, while the phosphor solution 146 is sprayed by the spraying device 144, the heating source 150 can be selectively used to perform a heating process to cover the phosphor on the light emitting chip 112. The colloidal solvent in the photo body solution 146 is evaporated.

Next, a curing process is performed to cure the phosphor solution 146 conformally coated on the surface of the light-emitting wafer 112 into the conformal phosphor coating layer 128, thereby completing the fabrication of the dimming light-emitting element as shown in FIG. 5C. .

In the first figure, the pair of pins 104 are electrically connected to the n-type electrode and the p-type electrode of the light-emitting wafer 110 through the two wires 120. The pair of pins 106 are also electrically connected to the n-type electrode and the p-type electrode of the light-emitting chip 112 through the two wires 122. In addition, the two poles of the independent power source 114 are electrically connected to the two pins 104, and the two poles of the independent power source 116 are electrically connected to the two pins 106, respectively. Therefore, the illuminating chip 110 can be electrically connected to the independent power source 114 through the wires 120 and the pins 104. The illuminating chip 112 can be electrically connected to the independent power source 116 through the wires 122 and the pins 106 in sequence.

By electrically connecting the illuminating wafers 110 and 112 to the design of the independent power sources 114 and 116, respectively, the switches of the illuminating wafers 110 and 112 can be independently controlled by controlling the independent power sources 114 and 116. Therefore, in an embodiment, in the same dimming light-emitting element, all of the light-emitting chips can be respectively connected to a separate power source, and can be independently turned on and off. Thus, in a dimming light-emitting element, all of the light-emitting wafers or only a portion of the light-emitting wafer can be illuminated at the same time to achieve the effect of dimming light.

In an embodiment, the dimming light emitting element 100 further selectively includes a switch 138. The switch 138 can respectively control the switches of the independent power sources 114 and 116 in the dimming light-emitting element 100, and further control the opening and closing of all the light-emitting chips 110 and 112 in the dimming light-emitting element 100, respectively, to achieve the dimming effect.

It can be seen from the above embodiments that one of the advantages of the present invention is that since each of the light-emitting elements in a dimming light-emitting element has an independent power source, the switches of each of the light-emitting chips can be independently controlled, and the light can be switched at any time. The illuminating color of the component, which in turn can effectively extend the application of the illuminating component.

It can be seen from the above embodiments that another advantage of the present invention is that since the dimming light-emitting elements do not use a series-parallel circuit to connect all the light-emitting chips, and the light-emitting chips have independent power sources, the width of all the light-emitting chips can be reduced. The probability that, after the partial luminescent wafer is destroyed, another portion of the illuminating wafer can still operate effectively, and the light source can continue to be provided.

It can be seen from the above embodiments that another advantage of the present invention is that the dimming light-emitting element can provide a plurality of color light sources in the same element, and can increase the diversity of the light-emitting colors of the light-emitting elements.

While the present invention has been described above by way of example, it is not intended to be construed as a limitation of the scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100. . . Variable light emitting element

102. . . Wafer carrier

102a. . . Wafer carrier

102b. . . Wafer carrier

102c. . . Wafer carrier

104. . . Pin

106. . . Pin

108. . . support

108a. . . support

108b. . . support

108c. . . support

110. . . Light emitting chip

112. . . Light emitting chip

114. . . Stand-alone power supply

116. . . Stand-alone power supply

118. . . surface

118a. . . surface

118b. . . surface

120. . . wire

122. . . wire

124. . . Groove

126. . . Conformal fluorescent coating layer

128. . . Conformal fluorescent coating layer

130. . . Conformal fluorescent coating layer

132. . . Barrier structure

134. . . flat

136. . . flat

138. . . Switcher

140. . . Mask

142. . . Opening

144. . . Spraying device

146. . . Phosphor solution

148. . . path

150. . . Heating source

152. . . Glossy surface

154. . . Side surface

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

1 is a top plan view of a dimming light emitting device according to an embodiment of the invention.

2 is a cross-sectional view showing a portion of a device between a light-emitting wafer and a wafer carrier of a dimming light-emitting device according to an embodiment of the invention.

3 is a cross-sectional view showing a portion of a device between a light-emitting wafer and a wafer carrier of a dimming light-emitting device according to another embodiment of the present invention.

4 is a cross-sectional view showing a portion of a device between a light-emitting wafer and a wafer carrier of a dimming light-emitting device according to still another embodiment of the present invention.

5A to 5C are cross-sectional views showing a process of a dimming light-emitting device according to an embodiment of the present invention.

100. . . Variable light emitting element

102. . . Wafer carrier

104. . . Pin

106. . . Pin

108. . . support

110. . . Light emitting chip

112. . . Light emitting chip

114. . . Stand-alone power supply

116. . . Stand-alone power supply

118. . . surface

120. . . wire

122. . . wire

138. . . Switcher

Claims (21)

A dimming light emitting device comprising: a holder comprising a wafer carrier; a first light emitting chip and a second light emitting chip disposed on a surface of the wafer carrier, wherein the first light emitting chip and the second The illuminating chip has different illuminating colors; and two independent power sources are electrically connected to the first illuminating chip and the second illuminating chip respectively, thereby respectively controlling the switches of the first illuminating chip and the second illuminating chip, the The two luminescent wafers comprise a layer of conformal coating overlying the conical coating. The dimming light-emitting device of claim 1, wherein the bracket further comprises two pairs of pins, respectively joining the first light-emitting chip and the corresponding independent power source and the second light-emitting chip and corresponding to the independent type power supply. The dimming light-emitting component of claim 2, further comprising a switch for separately controlling the switches of the independent power sources. The dimming light-emitting element of claim 1, wherein the first light-emitting chip and the second light-emitting chip are located on a same plane of the wafer carrier. The dimming light-emitting element of claim 1, wherein the surface of the wafer carrier is provided with at least one groove, and the second light-emitting chip is disposed in the groove. The dimming light-emitting device of claim 5, wherein the second luminescent wafer comprises a layer of conformal fluorescent coating overlying the phosphorescent coating layer, and the conformal phosphor coating layer is filled in the recess. The dimming light-emitting element of claim 1, wherein the surface of the wafer carrier comprises a first plane having a height difference and a second plane, wherein the first illuminating wafer and the second illuminating wafer Located on the first plane and the second plane, respectively. The dimming illuminating element of claim 1, wherein the bracket comprises a protruding blocking structure, wherein the first illuminating wafer and the second illuminating wafer are respectively located on two sides of the blocking structure. A dimming light emitting device comprising: a holder comprising a wafer carrier; a first light emitting chip and a second light emitting chip disposed on a surface of the wafer carrier, wherein the second light emitting chip comprises a cover a first fluorescent light emitting layer and a second light emitting chip having different light emitting colors; and two independent power sources respectively electrically connected to the first light emitting chip and the second light emitting chip, respectively a switch for controlling the first light emitting chip and the second light emitting chip; and a switch for respectively controlling the switches of the independent power sources. The dimming light-emitting device of claim 9, wherein the bracket further comprises two pairs of pins, respectively joining the first light-emitting chip and the corresponding independent power source and the second light-emitting chip and corresponding to the independent type power supply. The dimming light-emitting device of claim 9, wherein the first light-emitting chip and a second light-emitting chip are located on a same plane of the wafer carrier. The dimming light-emitting element of claim 9, wherein the surface of the wafer carrier is provided with at least one groove, and the second light-emitting chip is disposed in the groove. The dimming light-emitting element of claim 12, wherein the conformal phosphor coating layer is filled in the recess. The dimming light-emitting element of claim 9, wherein the surface of the wafer carrier comprises a first plane having a height difference and a second plane, wherein the first illuminating wafer and the second illuminating wafer Located on the first plane and the second plane, respectively. The dimming light-emitting device of claim 9, wherein the surface of the wafer carrier includes a protruding blocking structure, wherein the first light-emitting wafer and the second light-emitting chip are respectively located in the blocking structure The second side. A method for fabricating a dimming light-emitting device, comprising: providing at least one light-emitting chip, wherein the light-emitting chip is disposed on a carrier; providing a first mask having at least one first opening, the first opening exposing at least the light a spraying device is disposed above the first mask to perform a first spraying process, and the spraying device reciprocally sprays a first phosphor solution along a path to make a light emitting surface of the light emitting chip Forming a plurality of side surfaces conformally coated with the first phosphor solution; and performing a curing process to cure the first phosphor solution coated on the surface of the illuminating wafer into a first conformal fluorescing Light coating layer. The method for fabricating a dimming light-emitting device according to claim 16, wherein the first phosphor solution is composed of a colloidal solvent, a colloid and a phosphor. The method for fabricating a dimming light-emitting device according to claim 17, wherein the first phosphor process is further sprayed along the path, and further comprising: performing a first heating process on the light-emitting chip, such that The colloidal solvent in the first phosphor solution on the luminescent wafer is evaporated. The method for producing a dimming light-emitting device according to claim 17, wherein the colloidal solvent comprises xylene, n-heptane or acetone. The method for fabricating a dimming light-emitting device according to claim 19, wherein the colloid comprises silicone or epoxy resin. The method for fabricating a dimming light-emitting device according to claim 20, wherein in the first phosphor solution, the ratio of the colloidal solvent, the colloid to the phosphor powder is about 50%, 20%, and 30%.