TWI391641B - System and method for testing thermal resistivity of coolers - Google Patents
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本發明涉及散熱器熱阻係數測試儀及測試系統與方法,尤其是中央處理器(CPU)散熱器熱阻係數測試儀及測試系統與方法。 The invention relates to a heat sink thermal resistance coefficient tester and a test system and method, in particular to a central processing unit (CPU) heat sink thermal resistance coefficient tester and a test system and method.
電腦中工作最繁忙的是CPU,其發熱量也是首屈一指。從8086到Pentium系列,速度越來越快,CPU“發燒”的度數也越來越高。過高的溫度會使CPU晶片內部發生“電子遷移”現象,使CPU發生慢性損傷,縮短CPU的壽命,造成系統不穩定。 The busiest computer in the computer is the CPU, and its heat is second to none. From the 8086 to the Pentium series, the speed is getting faster and faster, and the CPU "fever" is getting higher and higher. Excessive temperature can cause "electron migration" inside the CPU chip, causing chronic damage to the CPU, shortening the life of the CPU, and causing system instability.
一般要求CPU內部溫度要小於80℃,外部溫度要小於50℃。所以我們必須採取措施解決CPU等部件的散熱問題。特別是CPU的溫度,直接關係到整個電腦的穩定。 Generally, the internal temperature of the CPU should be less than 80 °C, and the external temperature should be less than 50 °C. Therefore, we must take measures to solve the heat dissipation problem of components such as CPU. In particular, the temperature of the CPU is directly related to the stability of the entire computer.
CPU的散熱一般是透過散熱器來解決的。其工作原理是將散熱器安裝在CPU的表面,當CPU源源不絕的產生熱量時,熱量會被帶離CPU,而傳到散熱片上,等到了散熱片之後,再由散熱器的風扇轉動所造成的氣流將熱量帶走,如此回圈不絕,這就是整個散熱的過程。 The heat dissipation of the CPU is generally solved by the heat sink. The working principle is to install the heat sink on the surface of the CPU. When the CPU source generates heat, the heat will be taken away from the CPU and transferred to the heat sink. After the heat sink, the fan of the heat sink will rotate. The resulting airflow takes away the heat, so the loop is endless, which is the whole process of heat dissipation.
由上可知,散熱器傳導熱量的性能直接影響到對CPU的散熱。通常,散熱器傳導熱量的性能用熱阻係數來衡量,散熱器的熱阻係數越小,則散熱器的散熱性能越好,反之,熱阻係數越高,則散熱器的散熱性越差,因此,散熱器的熱阻係數是判斷散熱器性能好壞的重要指標。 It can be seen from the above that the heat conduction performance of the heat sink directly affects the heat dissipation to the CPU. Generally, the heat conduction performance of the heat sink is measured by the thermal resistance coefficient. The smaller the thermal resistance coefficient of the heat sink, the better the heat dissipation performance of the heat sink. Conversely, the higher the thermal resistance coefficient, the worse the heat dissipation of the heat sink. Therefore, the thermal resistance coefficient of the heat sink is an important indicator for judging the performance of the heat sink.
鑒於以上內容,有必要提出一種散熱器熱阻係數測試儀及測試系統與方法,其可以實現對CPU散熱器熱阻係數的測量。 In view of the above, it is necessary to propose a heat sink thermal resistance coefficient tester and a test system and method, which can measure the thermal resistance coefficient of the CPU heat sink.
一種散熱器熱阻係數測試儀,該散熱器熱阻係數測試儀包括:加熱器,用於向待測的散熱器傳導熱量;第一溫度感測器與第二溫度感測器,分別用於測試所述散熱器的中心位置的溫度及邊緣位置的溫度;及傳動裝置,用於帶動所述第一溫度感測器與所述第二溫度感測器,使所述第一溫度感測器與所述第二溫度感測器在測試的時候分別接觸到所述散熱器的中心位置與邊緣位置,並在結束測試時,使所述第一溫度感測器與所述第二溫度感測器離開所述散熱器。 A heat sink thermal resistance coefficient tester includes: a heater for conducting heat to a heat sink to be tested; a first temperature sensor and a second temperature sensor, respectively Testing a temperature of a center position of the heat sink and a temperature of an edge position; and a transmission device for driving the first temperature sensor and the second temperature sensor to cause the first temperature sensor And the second temperature sensor respectively contacts the center position and the edge position of the heat sink at the time of testing, and when the test is finished, the first temperature sensor and the second temperature sensor are sensed The device leaves the heat sink.
一種散熱器熱阻係數測試系統,包括電腦及散熱器熱阻係數測試儀。所述電腦包括主機與顯示器。所述散熱器熱阻係數測試儀連接待測的散熱器,並透過電纜連接到所述主機的串列埠上。所述散熱器熱阻係數測試儀包括加熱器、第一溫度感測器、第二溫度感測器及傳動裝置。所述的主機包括散熱器熱阻係數測試程式,該程式包括:系統初始化模組,用於接收用戶的初始化設定,所述初始化設定包括設定對散熱器的測試時間,所述散熱器在合格狀態下的中心位置的溫度最高值與邊緣位置的溫度最高值,及熱阻係數的最大值;測試模組,用於當所述散熱器熱阻係數測試儀啟動後,控制所述加熱器開始對所述散熱器加熱,及控制所述傳動裝置帶動所述第 一溫度感測器與第二溫度感測器轉動,使所述第一溫度感測器與第二溫度感測器分別接觸所述散熱器的中心位置與邊緣位置,開始測量所述散熱器的中心位置與邊緣位置的溫度,以及散熱器的熱阻係數;及判斷模組,用於判斷對所述散熱器的測試時間是否到達了所述預設定的測試時間,以及透過分別將所述測量的散熱器的中心位置的溫度與邊緣位置的溫度,及測量的散熱器的熱阻係數與所述設定的散熱器在合格狀態下的中心位置的溫度最高值與邊緣位置的溫度最高值相比較,及設定的熱阻係數的最大值判斷所述散熱器是否通過測試。 A heat sink thermal resistance coefficient test system includes a computer and a heat sink thermal resistance coefficient tester. The computer includes a host and a display. The heat sink thermal resistance coefficient tester is connected to the heat sink to be tested and connected to the serial port of the host through a cable. The heat sink thermal resistance coefficient tester includes a heater, a first temperature sensor, a second temperature sensor, and a transmission. The host includes a heat sink thermal resistance coefficient test program, and the program includes: a system initialization module, configured to receive an initial setting of the user, the initial setting includes setting a test time for the heat sink, and the heat sink is in a qualified state. The highest temperature value of the lower central position and the highest temperature value of the edge position, and the maximum value of the thermal resistance coefficient; the test module is configured to control the heater to start after the heat sink coefficient tester is started Heating the radiator and controlling the transmission to drive the first Rotating a temperature sensor and a second temperature sensor to cause the first temperature sensor and the second temperature sensor to respectively contact a center position and an edge position of the heat sink to start measuring the heat sink The temperature of the center position and the edge position, and the thermal resistance coefficient of the heat sink; and a judging module for judging whether the test time of the heat sink reaches the preset test time, and respectively transmitting the measurement The temperature of the center position of the heat sink and the temperature of the edge position, and the measured thermal resistance coefficient of the heat sink are compared with the highest temperature value of the central position of the set heat sink in the qualified state and the highest temperature value of the edge position. And the maximum value of the set thermal resistance coefficient determines whether the heat sink passes the test.
一種散熱器熱阻係數測試方法,運用上述的散熱器熱阻係數測試系統測試散熱器的熱阻係數。該方法包括以下步驟:對上述系統進行初始化設定,所述初始化設定包括設定對散熱器的測試時間,所述散熱器在合格狀態下的中心位置的溫度最高值與邊緣位置的溫度最高值,及熱阻係數的最大值;啟動所述散熱器熱阻係數測試儀;在所述設定的測試時間內測量所述散熱器的中心位置與邊緣位置的溫度,以及測量散熱器的熱阻係數;測試時間結束後,判斷所述測量的散熱器的中心位置的溫度與邊緣位置的溫度值是否分別高於所述設定的散熱器在合格狀態下的中心位置的溫度最高值與邊緣位置的溫度最高值;若所述測量的散熱器的中心位置的溫度與邊緣位置的溫度值分別都不高於所述設定的散熱器在合格狀態下的中心位置的溫度最高值與邊緣位置的溫度最高值,則繼續判斷所述測量的散熱器的熱阻係數是否大於所述 設定的熱阻係數的最大值;及若所述測量的散熱器的熱阻係數不大於所述設定的熱阻係數的最大值,則所述散熱器通過測試。 A method for testing the thermal resistance coefficient of a radiator, using the above-mentioned radiator thermal resistance coefficient test system to test the thermal resistance coefficient of the radiator. The method includes the following steps: initializing a setting of the system, the initial setting includes setting a test time for the heat sink, a highest temperature value of the central position of the heat sink in the qualified state, and a highest temperature value of the edge position, and a maximum value of the thermal resistance coefficient; starting the heat sink coefficient tester; measuring the temperature of the center position and the edge position of the heat sink during the set test time, and measuring the thermal resistance coefficient of the heat sink; After the time is over, it is determined whether the temperature value of the center position of the measured heat sink and the temperature value of the edge position are respectively higher than the highest temperature value and the highest temperature value of the edge position of the set heat sink in the center position of the qualified state. If the temperature value of the center position of the measured heat sink and the temperature value of the edge position are not higher than the highest temperature value and the highest temperature value of the edge position of the set heat sink at the center position in the qualified state, respectively, Continue to determine whether the measured thermal resistance coefficient of the heat sink is greater than a maximum value of the set thermal resistance coefficient; and if the measured thermal resistance coefficient of the heat sink is not greater than a maximum value of the set thermal resistance coefficient, the heat sink passes the test.
相較於習知技術,本發明所提供之散熱器熱阻係數測試儀及測試系統與方法可以實現對CPU散熱器的熱阻係數的測量,採集測試資料,並可以形成報表,並對測試資料進行分析,使生產更加合理化。 Compared with the prior art, the heat sink thermal resistance coefficient tester and the test system and method provided by the invention can measure the thermal resistance coefficient of the CPU heat sink, collect test data, and can form a report and test data. Analyze to make production more rational.
參閱圖1所示,係本發明散熱器熱阻係數測試系統較佳實施例的系統架構圖。該系統主要包括電腦1及散熱器熱阻係數測試儀2,用於測試至少一個待測散熱器3的熱阻係數。所述電腦1主要包括主機10及顯示器11。該電腦1還包括鍵盤、滑鼠等元件,但是為了使本較佳實施例描述的更加簡潔,這些元件在圖1中沒有顯示。所述主機10內包括一個散熱器熱阻係數測試程式20,其主要用於透過散熱器熱阻係數測試儀2對散熱器進行測試,判斷散熱器是否合格。為了實現電腦1的基本功能,該主機10內還應包括CPU,記憶體等其他必要的硬體或者軟體,在這裡不一一說明。所述顯示器11提供一個用戶介面,用於即時顯示測試狀態,及透過該用戶介面,用戶可以訪問主機10中的散熱器熱阻係數測試程式20及其他軟體。 Referring to Figure 1, there is shown a system architecture diagram of a preferred embodiment of the heat sink coefficient test system of the present invention. The system mainly comprises a computer 1 and a heat sink thermal resistance coefficient tester 2 for testing the thermal resistance coefficient of at least one heat sink 3 to be tested. The computer 1 mainly includes a host 10 and a display 11. The computer 1 also includes elements such as a keyboard, a mouse, etc., but these elements are not shown in Fig. 1 in order to make the description of the preferred embodiment more compact. The host 10 includes a heat sink thermal resistance coefficient test program 20, which is mainly used to test the heat sink through the heat sink thermal resistance coefficient tester 2 to determine whether the heat sink is qualified. In order to realize the basic functions of the computer 1, the host 10 should also include other necessary hardware or software such as a CPU, a memory, and the like, which will not be described herein. The display 11 provides a user interface for displaying the test status in real time, and through the user interface, the user can access the heat sink thermal resistance coefficient test program 20 and other software in the host 10.
所述散熱器熱阻係數測試儀2可以同時對兩個散熱器3進行測試,其包括加熱器21,其作用相當於發熱的CPU,用於向被測的散熱器3傳導熱量;第一溫度感測器22與第二溫度感測器23,分別用於測試散熱器3的中心位置的溫度 T1及邊緣位置的溫度T2;傳動裝置24,用於移動第一溫度感測器22與第二溫度感測器23的位置,使第一溫度感測器22與第二溫度感測器23在測試的時候分別接觸到散熱器3的中心位置及邊緣位置,並在結束測試時,使所述第一溫度感測器22與第二溫度感測器23離開散熱器3;中軸固定杆25,用於固定傳動裝置24;測試底座26,用於承載散熱器3、加熱器21及其他元件;開始按鈕27,用於控制散熱器熱阻係數測試儀2的啟動;測試狀態顯示屏幕28,用於顯示散熱器熱阻係數測試儀2的狀態,即啟動狀態或者停止狀態。 The heat sink thermal resistance coefficient tester 2 can test two heat sinks 3 at the same time, and includes a heater 21, which functions as a heat generating CPU for conducting heat to the heat sink 3 to be tested; The sensor 22 and the second temperature sensor 23 are respectively used for testing the temperature T 1 of the center position of the heat sink 3 and the temperature T 2 of the edge position; and the transmission device 24 for moving the first temperature sensor 22 and The position of the second temperature sensor 23 causes the first temperature sensor 22 and the second temperature sensor 23 to respectively contact the center position and the edge position of the heat sink 3 at the time of testing, and at the end of the test, The first temperature sensor 22 and the second temperature sensor 23 are separated from the heat sink 3; the middle shaft fixing rod 25 is used for fixing the transmission device 24; the test base 26 is used for carrying the radiator 3, the heater 21 and the like. The start button 27 is used to control the start of the heat sink thermal resistance coefficient tester 2; the test status display screen 28 is for displaying the state of the heat sink thermal resistance coefficient tester 2, that is, the start state or the stop state.
參閱圖2所示,係主機10的散熱器熱阻係數測試程式20的功能模組圖。本發明所稱的各個模組是所述散熱器熱阻係數測試程式20中每個程式段的功能性的概括,其可能會比程式段更適合於描述程式在電腦中的執行過程,因此本發明對該程式的描述都以模組描述。 Referring to FIG. 2, it is a functional module diagram of the heat sink thermal resistance coefficient test program 20 of the host computer 10. Each of the modules referred to in the present invention is a summary of the functionality of each block in the heat sink coefficient test program 20, which may be more suitable for describing the execution of the program in the computer than the program segment. The description of the program by the invention is described in modules.
所述散熱器熱阻係數測試程式20主要包括:系統初始化模組100,測試模組110,測試狀態顯示模組120,判斷模組130,報警模組140,及結果儲存模組150。 The heat sink thermal resistance coefficient test program 20 mainly includes: a system initialization module 100, a test module 110, a test status display module 120, a determination module 130, an alarm module 140, and a result storage module 150.
所述系統初始化模組100用於接收測試用戶的初始化設定。所述的初始化設定包括設定對散熱器3的測試時間,散熱器3在合格狀態下的中心位置的溫度最高值T1max、邊緣位置的溫度最高值T2max,以及熱阻係數的最大值θmax等。 The system initialization module 100 is configured to receive an initialization setting of a test user. The initial setting includes setting the test time for the heat sink 3, the highest temperature value T 1max of the center position of the heat sink 3 in the qualified state, the highest temperature value T 2max of the edge position, and the maximum value θ max of the thermal resistance coefficient. Wait.
所述測試模組110用於當所述散熱器熱阻係數測試儀2啟 動後,控制加熱器21對散熱器3加熱,及控制傳動裝置24帶動第一溫度感測器22與第二溫度感測器23轉動,使第一溫度感測器22與第二溫度感測器23分別接觸散熱器3的中心位置與邊緣位置後,開始對散熱器3的中心位置與邊緣位置的溫度,以及散熱器的熱阻係數進行測量。 The test module 110 is configured to be used when the heat sink thermal resistance coefficient tester 2 After the movement, the heater 21 is controlled to heat the radiator 3, and the control transmission device 24 drives the first temperature sensor 22 and the second temperature sensor 23 to rotate, so that the first temperature sensor 22 and the second temperature sensor are sensed. After contacting the center position and the edge position of the heat sink 3, respectively, the device 23 starts measuring the temperature of the center position and the edge position of the heat sink 3, and the thermal resistance coefficient of the heat sink.
所述測試狀態顯示模組120用於透過顯示器11即時顯示對散熱器3的測試狀態及測試結果。 The test status display module 120 is configured to display the test status and test result of the heat sink 3 through the display 11 in real time.
所述判斷模組130用於判斷用戶對測試系統的安裝是否成功;判斷對散熱器3的測試時間是否已經到達初始化設定的測試時間;以及在到達測試時間後,判斷第一溫度感測器22與第二溫度感測器23測量的散熱器3的中心位置的溫度T1及邊緣位置的溫度T2是否過高,即是否分別高於上述初始化設定的散熱器3在合格狀態下的中心位置的溫度最高值T1max及邊緣位置的溫度最高值T2max;以及判斷測量的散熱器3的熱阻係數θ是否高於所述設定的熱阻係數的最大值θmax等。 The determining module 130 is configured to determine whether the installation of the test system by the user is successful; determine whether the test time of the heat sink 3 has reached the initial set test time; and after the test time is reached, determine the first temperature sensor 22 Whether the temperature T 1 of the center position of the heat sink 3 and the temperature T 2 of the edge position measured by the second temperature sensor 23 are too high, that is, whether the center position of the heat sink 3 in the qualified state is higher than the above-described initial setting, respectively. The highest temperature value T 1max and the highest temperature value T 2max of the edge position; and whether the measured thermal resistance coefficient θ of the heat sink 3 is higher than the maximum value θ max of the set thermal resistance coefficient and the like.
報警模組140用於當散熱器3沒有通過測試時,發出警報以提示測試用戶。 The alarm module 140 is configured to issue an alarm to prompt the test user when the heat sink 3 fails the test.
所述結果儲存模組150用於將對散熱器3的測試結果儲存在主機10的記憶體中。 The result storage module 150 is configured to store the test result of the heat sink 3 in the memory of the host 10.
參閱圖3所示,係本發明散熱器熱阻係數測試方法較佳實施例的實施流程圖。 Referring to FIG. 3, it is a flowchart of an implementation of a preferred embodiment of the method for testing the thermal resistance coefficient of the heat sink of the present invention.
步驟S10,用戶對該測試系統進行安裝。所述系統安裝包括將散熱器熱阻係數測試程式20安裝到電腦1的主機10中 ,將散熱器熱阻係數測試儀2透過一根電纜與所述電腦1的主機10的串列埠相連接。 In step S10, the user installs the test system. The system installation includes installing the heat sink thermal resistance coefficient test program 20 into the host computer 10 of the computer 1. The heat sink thermal resistance coefficient tester 2 is connected to the serial port of the main body 10 of the computer 1 through a cable.
步驟S11,判斷模組130判斷對上述系統的安裝是否成功,即判斷是否所述散熱器熱阻係數測試程式20已經成功安裝到電腦1的主機10中,以及是否已經將散熱器熱阻係數測試儀2成功的連接到主機10的串列埠上。 In step S11, the determining module 130 determines whether the installation of the system is successful, that is, whether the heat sink coefficient test program 20 has been successfully installed into the host 10 of the computer 1, and whether the heat sink coefficient test has been tested. The instrument 2 is successfully connected to the serial port of the host 10.
若系統安裝成功,則步驟S12,用戶透過系統初始化模組100對系統進行初始化設定。所述的初始化設定包括設定對散熱器3的測試時間,散熱器3在合格狀態下的中心位置的溫度最高值T1max、邊緣位置的溫度最高值T2max,及熱阻係數的最大值θmax等。 If the system is successfully installed, in step S12, the user initializes the system through the system initialization module 100. The initial setting includes setting the test time for the heat sink 3, the highest temperature value T 1max of the center position of the heat sink 3 in the qualified state, the highest temperature value T 2max of the edge position, and the maximum value θ max of the thermal resistance coefficient. Wait.
步驟S13,用戶將待測的散熱器3放置到散熱器熱阻係數測試儀2上,並啟動散熱器熱阻係數測試儀2。 In step S13, the user places the heat sink 3 to be tested onto the heat sink thermal resistance coefficient tester 2, and starts the heat sink thermal resistance coefficient tester 2.
步驟S14,測試模組110開始控制加熱器21對散熱器3加熱,及控制傳動裝置24帶動第一溫度感測器22與第二溫度感測器23轉動,使第一溫度感測器22與第二溫度感測器23分別接觸散熱器3的中心位置與邊緣位置後,開始測試散熱器3的中心位置與邊緣位置的溫度T1與T2。 In step S14, the test module 110 starts to control the heater 21 to heat the heat sink 3, and the control transmission device 24 drives the first temperature sensor 22 and the second temperature sensor 23 to rotate, so that the first temperature sensor 22 and the first temperature sensor 22 After the second temperature sensor 23 contacts the center position and the edge position of the heat sink 3, respectively, the temperatures T 1 and T 2 of the center position and the edge position of the heat sink 3 are tested.
步驟S15,判斷模組130判斷對散熱器3的測試時間是否到達上述初始化所設定的測試時間。若沒有到達,則測試模組110繼續控制加熱器21對散熱器3進行加熱,並繼續測試散熱器3的中心位置與邊緣位置的溫度T1與T2,並透過測試狀態顯示模組120即時顯示T1與T2。 In step S15, the determining module 130 determines whether the test time for the heat sink 3 reaches the test time set by the initialization. If not, the test module 110 continues to control the heater 21 to heat the heat sink 3, and continues to test the temperature T 1 and T 2 of the center position and the edge position of the heat sink 3, and passes through the test state display module 120. T 1 and T 2 are displayed.
若判斷模組130判斷對散熱器3的測試時間已經到達上述 初始化所設定的測試時間,則步驟S16,測試模組110控制傳動裝置24帶動第一溫度感測器22與第二溫度感測器23轉動,使第一溫度感測器22與第二溫度感測器23離開散熱器3,並控制加熱器21停止對散熱器3加熱。 If the determining module 130 determines that the test time for the heat sink 3 has reached the above Initializing the set test time, in step S16, the test module 110 controls the transmission device 24 to drive the first temperature sensor 22 and the second temperature sensor 23 to rotate, so that the first temperature sensor 22 and the second temperature sense The detector 23 leaves the radiator 3 and controls the heater 21 to stop heating the radiator 3.
步驟S17,測試狀態顯示模組120透過顯示器11顯示測試結果。所述測試結果包括散熱器3的中心位置與邊緣位置的溫度T1與T2,及散熱器3的熱阻係數θ。 In step S17, the test status display module 120 displays the test result through the display 11. The test results include the temperatures T 1 and T 2 of the center position and the edge position of the heat sink 3, and the thermal resistance coefficient θ of the heat sink 3.
步驟S18,判斷模組130判斷散熱器3的溫度是否過高。即判斷所述測量的散熱器3的中心位置的溫度T1是否高於上述設定的中心位置的溫度最高值T1max及測量的散熱器3的邊緣位置的溫度T2是否高於上述設定的邊緣位置的溫度最高值T2max。 In step S18, the determination module 130 determines whether the temperature of the heat sink 3 is too high. That is, it is judged whether the temperature T 1 of the center position of the measured heat sink 3 is higher than the temperature maximum value T 1max of the set center position and the measured temperature T 2 of the edge position of the heat sink 3 is higher than the set edge. The highest temperature of the position is T 2max .
若所述T1小於所述T1max且所述T2小於所述T2max,則步驟S19,判斷模組130繼續判斷散熱器3的熱阻係數θ是否過高。所述熱阻係數是反映阻礙物質傳導熱量的性能的物理量。所述熱阻係數θ的計算公式為:θ=修正值+(T1-T2)/W If the T 1 is smaller than the T 1max and the T 2 is smaller than the T 2max , then in step S19 , the determining module 130 continues to determine whether the thermal resistance coefficient θ of the heat sink 3 is too high. The thermal resistance coefficient is a physical quantity that reflects the performance of the substance to conduct heat. The calculation formula of the thermal resistance coefficient θ is: θ=correction value+(T 1 -T 2 )/W
其中,W表示加熱器21的功率,修正值表示一個可以接受的誤差值。 Where W represents the power of the heater 21 and the correction value represents an acceptable error value.
若熱阻係數θ的值小於所設定的熱阻係數的最大值θmax,則步驟S20,測試狀態顯示模組120顯示散熱器3通過測試,並在步驟S23,測試狀態顯示模組120顯示測試結束。 If the value of the thermal resistance coefficient θ is less than the maximum value θ max of the set thermal resistance coefficient, then in step S20, the test status display module 120 displays the heat sink 3 through the test, and in step S23, the test status display module 120 displays the test. End.
若在步驟S18中,判斷模組130判斷所述T1大於所述T1max且/或者所述T2大於所述T2max,則步驟S21,測試狀態顯示模組120顯示散熱器3沒有通過測試,並在步驟S22,報警模組140提示報警資訊,以及在步驟S23中,測試狀態顯示模組120顯示測試結束。 If the determining module 130 determines in step S18 that the T 1 is greater than the T 1max and/or the T 2 is greater than the T 2max , then in step S21, the test status display module 120 displays that the heat sink 3 has not passed the test. And in step S22, the alarm module 140 prompts for the alarm information, and in step S23, the test status display module 120 displays the end of the test.
若在步驟S19中,判斷模組130判斷所述熱阻係數θ大於所設定的熱阻係數的最大值θmax,進入上述描述的步驟S21。 If the determination module 130 determines in step S19 that the thermal resistance coefficient θ is greater than the maximum value θ max of the set thermal resistance coefficient, the process proceeds to step S21 described above.
在步驟S23中,測試狀態顯示模組120顯示測試結束後,在步驟S24中,結果儲存模組150將上述的測試結果儲存到主機10的記憶體中。所述測試結果可以包括對散熱器3的測試時間、散熱器3的中心位置與邊緣位置的溫度T1與T2、散熱器3的熱阻係數θ、以及散熱器3是否通過測試等。至此,所述散熱器熱阻係數測試方法較佳實施例的實施流程結束。 In step S23, after the test status display module 120 displays the test, in step S24, the result storage module 150 stores the above test result in the memory of the host 10. The test results may include the test time for the heat sink 3, the temperatures T 1 and T 2 of the center position and the edge position of the heat sink 3, the thermal resistance coefficient θ of the heat sink 3, and whether the heat sink 3 passes the test or the like. So far, the implementation flow of the preferred embodiment of the heat sink coefficient test method of the heat sink is completed.
本發明所提供的散熱器熱阻係數測試儀及測試系統與方法可以實現對CPU散熱器的熱阻係數的測量,採集測試資料,並可以形成報表,並對測試資料進行分析,使生產更加合理化。 The heat sink thermal resistance coefficient tester and the test system and method provided by the invention can realize the measurement of the thermal resistance coefficient of the CPU heat sink, collect the test data, and can form a report, and analyze the test data to make the production more rationalized. .
本發明雖以較佳實施例揭露如上,然其並非用以限定本發明。任何熟悉此項技藝者,在不脫離本發明之精神和範圍內,當可做更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 The present invention has been described above in terms of preferred embodiments, and is not intended to limit the invention. The scope of the present invention is defined by the scope of the appended claims, unless otherwise claimed.
1‧‧‧電腦 1‧‧‧ computer
10‧‧‧主機 10‧‧‧Host
11‧‧‧顯示器 11‧‧‧ Display
2‧‧‧散熱器熱阻係數測試儀 2‧‧‧ Radiator thermal resistance coefficient tester
21‧‧‧加熱器 21‧‧‧ heater
22‧‧‧第一溫度感測器 22‧‧‧First temperature sensor
23‧‧‧第二溫度感測器 23‧‧‧Second temperature sensor
24‧‧‧傳動裝置 24‧‧‧Transmission
25‧‧‧中軸固定杆 25‧‧‧Center shaft fixed rod
26‧‧‧測試底座 26‧‧‧Test base
27‧‧‧開始按鈕 27‧‧‧Start button
28‧‧‧測試狀態顯示屏幕 28‧‧‧Test status display screen
3‧‧‧散熱器 3‧‧‧heatsink
100‧‧‧系統初始化模組 100‧‧‧System Initialization Module
110‧‧‧測試模組 110‧‧‧Test module
120‧‧‧測試狀態顯示模組 120‧‧‧Test status display module
130‧‧‧判斷模組 130‧‧‧Judgement module
140‧‧‧報警模組 140‧‧‧ alarm module
150‧‧‧結果儲存模組 150‧‧‧Results storage module
圖1係本發明散熱器熱阻係數測試系統較佳實施例的系統架構圖。 1 is a system architecture diagram of a preferred embodiment of a heat sink coefficient test system for a heat sink of the present invention.
圖2係圖1的電腦中主機的功能模組圖。 2 is a functional block diagram of a host in the computer of FIG. 1.
圖3係本發明散熱器熱阻係數測試方法較佳實施例的實施流程圖。 3 is a flow chart showing the implementation of a preferred embodiment of the method for testing the thermal resistance coefficient of the heat sink of the present invention.
Claims (8)
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| TW95142677A TWI391641B (en) | 2006-11-17 | 2006-11-17 | System and method for testing thermal resistivity of coolers |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95142677A TWI391641B (en) | 2006-11-17 | 2006-11-17 | System and method for testing thermal resistivity of coolers |
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| TW200823440A TW200823440A (en) | 2008-06-01 |
| TWI391641B true TWI391641B (en) | 2013-04-01 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5664884A (en) * | 1995-07-31 | 1997-09-09 | Lucent Technologies Inc. | Apparatus for determining the thermal resistivity of electrically insulating crystalline materials |
| US5997174A (en) * | 1996-05-22 | 1999-12-07 | Integrated Device Technology, Inc. | Method for determining a thermal parameter of a device by measuring thermal resistance of a substrate carrying the device |
| CN2356335Y (en) * | 1999-01-05 | 1999-12-29 | 南京大学 | Thermal conductivity dynamic measuring instrument |
| TW561251B (en) * | 2002-07-02 | 2003-11-11 | Ind Tech Res Inst | Thermal performance measurement system and its method |
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2006
- 2006-11-17 TW TW95142677A patent/TWI391641B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5664884A (en) * | 1995-07-31 | 1997-09-09 | Lucent Technologies Inc. | Apparatus for determining the thermal resistivity of electrically insulating crystalline materials |
| US5997174A (en) * | 1996-05-22 | 1999-12-07 | Integrated Device Technology, Inc. | Method for determining a thermal parameter of a device by measuring thermal resistance of a substrate carrying the device |
| CN2356335Y (en) * | 1999-01-05 | 1999-12-29 | 南京大学 | Thermal conductivity dynamic measuring instrument |
| TW561251B (en) * | 2002-07-02 | 2003-11-11 | Ind Tech Res Inst | Thermal performance measurement system and its method |
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