TWI390767B - Led package and backlight module having the same - Google Patents
Led package and backlight module having the same Download PDFInfo
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- TWI390767B TWI390767B TW97107598A TW97107598A TWI390767B TW I390767 B TWI390767 B TW I390767B TW 97107598 A TW97107598 A TW 97107598A TW 97107598 A TW97107598 A TW 97107598A TW I390767 B TWI390767 B TW I390767B
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
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Description
本發明關於一種發光二極體封裝件及背光模組,特別是關於一種具有良好擴光角度之發光二極體封裝件及背光模組。The invention relates to a light-emitting diode package and a backlight module, in particular to a light-emitting diode package and a backlight module with a good light-expanding angle.
由於發光二極體(Light-Emitting Diode;LED)具有體積小、耗電低、響應快、使用期限長等優點,故逐漸於多種應用領域取代傳統光源。然而,因為LED為點光源,經封裝後之發光角度相對較為集中,因而限制了LED的應用範圍,也因此改善LED的發光角度一直為業界主要的研發方向之一。Light-Emitting Diode (LED) has the advantages of small size, low power consumption, fast response, long service life, etc., and has gradually replaced traditional light sources in various application fields. However, because the LED is a point source, the angle of illumination after being packaged is relatively concentrated, thus limiting the application range of the LED, and thus improving the illumination angle of the LED has been one of the major research and development directions in the industry.
圖1為一習知發光二極體封裝件之示意圖。如圖1所示,LED 12設置於基座11上且基座11上設有電極(未圖示),如此LED 12即可以引線或導電凸塊(未圖示)的方式與基座11之電極電性連接,且例如透明樹脂之封裝體13包覆LED 12、引線或導電凸塊以保護LED 12。當LED 12發出的光線到達封裝體13與空氣交界之擴光面131時即產生折射現象,使LED封裝件1具有較大的發光角度。1 is a schematic view of a conventional light emitting diode package. As shown in FIG. 1 , the LED 12 is disposed on the susceptor 11 and an electrode (not shown) is disposed on the susceptor 11 , such that the LED 12 can be a lead or a conductive bump (not shown) and the pedestal 11 The electrodes are electrically connected, and a package 13 such as a transparent resin encloses the LEDs 12, leads or conductive bumps to protect the LEDs 12. When the light emitted from the LED 12 reaches the light-emitting surface 131 where the package 13 and the air meet, a refraction phenomenon occurs, so that the LED package 1 has a large illumination angle.
於比較不同發光二極體封裝件之擴光能力時,可於相同環境條件下比較各個封裝件的“半強角”量值差異。於此半強角是指以基座11上通過LED 12之法線方向所測得之光強度為基準,於相同距離下測得50%基準光強度的位置其延伸至LED 12之連線與法線兩者的夾角。如圖1所示之習知設計,該LED封裝件1擴光面131為單一曲面的設計,可獲得僅約70度的半強角,故其擴光能力仍有極大的改善空間。When comparing the light-expanding ability of different light-emitting diode packages, the difference of the "semi-strong angle" of each package can be compared under the same environmental conditions. The semi-strong angle refers to the position at which the 50% reference light intensity is measured at the same distance based on the light intensity measured by the normal direction of the LED 12 on the susceptor 11 and extends to the LED 12 connection. The angle between the two normals. As shown in the conventional design of FIG. 1, the light-emitting surface 131 of the LED package 1 has a single curved surface design, and a half-height angle of only about 70 degrees can be obtained, so that the light-expanding capability still has a great improvement space.
本發明之目的在於提供一種發光二極體封裝件及包含該發光二極體封裝件的背光模組,其具有良好的擴光效果且可有效降低背光模組的亮暗帶對比。An object of the present invention is to provide a light emitting diode package and a backlight module including the same, which has a good light-expanding effect and can effectively reduce the contrast between the light and dark bands of the backlight module.
依本發明之一實施樣態,一種發光二極體封裝件包含一基座、一發光二極體及一封裝體。基座之一表面上設有至少一電極,發光二極體設置於該表面上並與該電極電性連接。封裝體具有一呈弧形且相對基座表面凸出之一擴光面,且擴光面設有至少一第一弧形凹槽。According to one embodiment of the present invention, a light emitting diode package includes a pedestal, a light emitting diode, and a package. At least one electrode is disposed on one surface of the base, and the light emitting diode is disposed on the surface and electrically connected to the electrode. The package body has an arc-shaped surface and a light-expanding surface protruding from the surface of the base, and the light-expanding surface is provided with at least one first curved groove.
依本發明之另一實施樣態,一種背光模組包含一導光板及一發光二極體封裝件。導光板具有一入光面,發光二極體封裝件則設置於該入光面側。該發光二極體封裝件包含一基座、一發光二極體以及一封裝體。基座之一表面上設有至少一電極,發光二極體設置於該表面上並與該電極電性連接。封裝體具有一呈弧形且相對基座表面凸出之一擴光面,且擴光面設有至少一第一弧形凹槽。According to another embodiment of the present invention, a backlight module includes a light guide plate and a light emitting diode package. The light guide plate has a light incident surface, and the light emitting diode package is disposed on the light incident surface side. The LED package includes a base, a light emitting diode, and a package. At least one electrode is disposed on one surface of the base, and the light emitting diode is disposed on the surface and electrically connected to the electrode. The package body has an arc-shaped surface and a light-expanding surface protruding from the surface of the base, and the light-expanding surface is provided with at least one first curved groove.
藉由本發明各個實施例之設計,其於擴光面上設置至少一弧形凹槽,使發光二極體發出之光線能有較大的出光角度且可提昇邊緣大角度方向出射的光能量,並且能均勻化整體出光強度而有效降低背光模組的亮暗帶對比。According to the design of each embodiment of the present invention, at least one arc-shaped groove is disposed on the light-enhancing surface, so that the light emitted by the light-emitting diode can have a larger light-emitting angle and can enhance the light energy emitted from the edge at a large angle. And can evenize the overall light intensity and effectively reduce the contrast of the bright and dark bands of the backlight module.
以下將參照相關圖式,說明依本發明之發光二極體封裝件及背光模組,其中相同的元件將以相同的參照符號加以說明。Hereinafter, a light-emitting diode package and a backlight module according to the present invention will be described with reference to the related drawings, wherein the same elements will be described with the same reference numerals.
請參照圖2a,本發明一實施例之發光二極體封裝件2包含一基座21、一發光二極體22以及一封裝體23。基座21之一表面211上設有至少一電極(未圖示),且發光二極體22設置於同一基座表面211上。基座21上之電極以適當方式與發光二極體22電性連接,以提供發光二極體22發光所需之電源。發光二極體22可利用引線的方式與基座21上的電極電性連接,但不限於此,例如亦可利用覆晶的方式設置於基座21上,並以導電凸塊與基座21上的電極電性連接。封裝體23包覆發光二極體22以及其所在之表面211,藉以保護發光二極體22以及基座21表面211上之電極。於一實施例中,發光二極體22可為紅光、綠光、藍光或白光發光二極體。Referring to FIG. 2 a , the LED package 2 includes a pedestal 21 , a light emitting diode 22 , and a package 23 . At least one electrode (not shown) is disposed on one surface 211 of the susceptor 21, and the illuminating diodes 22 are disposed on the same pedestal surface 211. The electrodes on the pedestal 21 are electrically connected to the LEDs 22 in a suitable manner to provide the power required for the illuminating diodes 22 to illuminate. The light-emitting diode 22 can be electrically connected to the electrode on the pedestal 21 by means of a lead wire, but is not limited thereto. For example, the light-emitting diode 22 can be disposed on the susceptor 21 by using a flip chip, and the conductive bump and the pedestal 21 can be used. The upper electrode is electrically connected. The package body 23 encloses the light-emitting diode 22 and the surface 211 on which it is disposed, thereby protecting the light-emitting diode 22 and the electrodes on the surface 211 of the susceptor 21. In one embodiment, the light emitting diode 22 can be a red, green, blue or white light emitting diode.
封裝體23具有一大致呈弧形且相對基座表面211凸出之擴光面231。需注意該弧形擴光面231並不限定於部分圓形面或橢圓面,任何有助於光擴散效果之弧面均包含於本發明之中,例如拋物面等。再者,擴光面231設有一往基座表面211方向凹入之弧形凹槽24,使擴光面231具有一內凹之弧面241。The package body 23 has a light-expanding surface 231 that is substantially curved and protrudes from the base surface 211. It should be noted that the curved light-expanding surface 231 is not limited to a partial circular surface or an elliptical surface, and any curved surface that contributes to light diffusion effects is included in the present invention, such as a paraboloid or the like. Furthermore, the light-expanding surface 231 is provided with an arcuate recess 24 recessed toward the surface 211 of the base, so that the light-increasing surface 231 has a concave curved surface 241.
於一實施例中,弧形凹槽24設置的位置正對發光二極體22。於一實施例中,弧形凹槽24任一側的端點延伸至發光二極體22之連線、與基座表面211法線N兩者的夾角θ為大於或等於5度且小於或等於45度,以使弧形凹槽24維持適當的開口大小。另外,弧形凹槽24的深度D1與封裝體厚度T的比值的一較佳範圍為0.05≦(D1/T)≦0.7。再者,雖然圖2a之夾角θ例示為自弧形凹槽24之一端點延伸至發光二極體22之中心點,但夾角θ的定義亦可涵蓋第一弧形凹槽24之一端點延伸至發光二極體22之任一發光區域的連線與基座表面211之夾角。In one embodiment, the arcuate recess 24 is disposed opposite the light emitting diode 22. In one embodiment, the angle θ between the end of either side of the curved groove 24 extending to the light emitting diode 22 and the normal N of the pedestal surface 211 is greater than or equal to 5 degrees and less than or Equal to 45 degrees to maintain the arcuate recess 24 in the proper opening size. Further, a preferred range of the ratio of the depth D1 of the curved groove 24 to the thickness T of the package is 0.05 ≦ (D1/T) ≦ 0.7. Moreover, although the angle θ of FIG. 2a is illustrated as extending from one end of the curved groove 24 to the center point of the light-emitting diode 22, the definition of the included angle θ may also cover the end point extension of one of the first curved grooves 24. The line connecting to any of the light-emitting regions of the light-emitting diode 22 is at an angle to the surface 211 of the base.
請參照圖2b,以發光二極體22中心點所發出的光線為例,說明圖2a所示實施例之光擴散效果。如圖2b所示,光線L1沿基板21之法線方向射出,其路徑不會產生偏折,光線L2通過曲面241時則因折射效果使其路徑偏離曲面241之法線方向。相較於習知的擴光面131設計,本發明之內凹弧面241可使光線L2的光偏折角度大於光線L2’的光偏折角度;另一方面,內凹弧面241的部分區域可使入射光線發生全反射,例如光線L3遭遇內凹弧面241發生全反射,之後再經擴光面231折射後,使得光線L3以較原先為大的角度離開擴光面231而有較大的出光角度。因此,本實施例於擴光面231上形成內凹弧面241的設計,可大幅提升擴光效果。Referring to FIG. 2b, the light diffusion effect of the embodiment shown in FIG. 2a is illustrated by taking the light emitted from the center point of the light-emitting diode 22 as an example. As shown in FIG. 2b, the light ray L1 is emitted along the normal direction of the substrate 21, and the path is not deflected. When the light ray L2 passes through the curved surface 241, the path is deviated from the normal direction of the curved surface 241 due to the refraction effect. Compared with the conventional light-expanding surface 131 design, the concave curved surface 241 of the present invention can make the light deflection angle of the light beam L2 larger than the light deflection angle of the light beam L2'; on the other hand, the concave concave surface 241 portion The area can cause total reflection of the incident light. For example, the light L3 is totally reflected by the concave curved surface 241, and then refracted by the light-expanding surface 231, so that the light L3 leaves the light-expanding surface 231 at a larger angle than before. Large angle of light. Therefore, the design of the concave curved surface 241 is formed on the light-enlarged surface 231 in this embodiment, and the light-expanding effect can be greatly improved.
請參照圖3,依本發明另一實施例之發光二極體封裝件2’,其擴光面231除於正對發光二極體22位置設有一第一弧形凹槽24外,於兩側更設有第二弧形凹槽25,且第二弧形凹槽25與第一弧形凹槽24之間以具有一間距較佳。於一實施例中,第二弧形凹槽25的深度D2小於或等於第一弧形凹槽24的深度D1。Referring to FIG. 3, in a light-emitting diode package 2' according to another embodiment of the present invention, the light-expanding surface 231 is provided with a first curved groove 24 at a position opposite to the light-emitting diode 22, and two The side is further provided with a second arcuate groove 25, and the second arcuate groove 25 and the first arcuate groove 24 are preferably spaced apart from each other. In an embodiment, the depth D2 of the second curved groove 25 is less than or equal to the depth D1 of the first curved groove 24.
請參照圖4,顯示圖1所示之習知發光二極體封裝件1以及圖2a所示本發明實施例之發光二極體封件2於0度平面之光強度分析圖。經比較習知之發光二極體封裝件1(如圖中之虛線所示)與本發明之發光二極體封裝件2(如圖中之實線所示)之擴光效果可知,習知發光二極體封裝件1之半強角約為70度,而本發明之發光二極體封件2之半強角約為83度,因此,本發明之發光二極體封件2具有較佳的擴光效果,且提昇了邊緣出光能量。此外,如圖4所示,本發明之發光二極體封裝件2可平均化±40度內之出光強度,因此當搭配導光板應用於一背光模組時,可有效降低亮暗帶對比。Referring to FIG. 4, a light intensity analysis diagram of the conventional light-emitting diode package 1 shown in FIG. 1 and the light-emitting diode package 2 of the embodiment of the present invention shown in FIG. 2a on a 0 degree plane is shown. The light-emitting effect of the conventional light-emitting diode package 1 (shown by a broken line in the figure) and the light-emitting diode package 2 of the present invention (shown by the solid line in the figure) is known. The half-boom angle of the diode package 1 is about 70 degrees, and the half-brightness angle of the light-emitting diode package 2 of the present invention is about 83 degrees. Therefore, the light-emitting diode package 2 of the present invention has better The light-expanding effect enhances the edge light energy. In addition, as shown in FIG. 4, the LED package 2 of the present invention can average the light intensity within ±40 degrees, so that when the light guide plate is applied to a backlight module, the contrast of the light and dark bands can be effectively reduced.
圖5a為依本發明一實施例之背光模組5的示意圖,背光模組5包含一導光板4以及至少一發光二極體封裝件2,圖5b為顯示圖5a之發光二極體封裝件2的封裝體23外形的立體示意圖。導光板4具有一入光面41,發光二極體封裝件2則設置於入光面41對側。於本實施例中,用於背光模組5的封裝體23係為一柱體,故可配合導光板4的厚度並可使整個發光二極體封裝件2利於薄型化,且弧形凹槽24形成於該柱體的側面上。入光面41可為一平面或是如圖5a所示之凹入弧面。此外,入光面41可設有多個擴光結構42。如圖5所示之實施例,擴光結構42可為相同大小、相同形狀、連續排列且突出之圓弧形,但不限於此。請參照圖6a,各個擴光結構42’的外形亦可為圓弧形、橢圓弧形、三角形、多邊形其中之一或至少兩種以上的組合。再者,各個擴光結構可具有相同尺寸(圖5a所示),或具有不同尺寸例如以一大一小之排列順序組成(圖6a所示)。於圖6a所示之實施例中,擴光結構42’之寬度W1與其高度H之比值大於2或小於2,但是不等於2。另外,請參照圖6b,擴光結構42”亦可為往導光板4中心內凹的凹槽結構,而其寬度W2與深度D3之比值亦大於2或小於2,但是不等於2。FIG. 5 is a schematic diagram of a backlight module 5 according to an embodiment of the present invention. The backlight module 5 includes a light guide plate 4 and at least one light emitting diode package 2, and FIG. 5b shows the light emitting diode package of FIG. 5a. A perspective view of the outer shape of the package 23 of 2. The light guide plate 4 has a light incident surface 41, and the light emitting diode package 2 is disposed on the opposite side of the light incident surface 41. In the present embodiment, the package body 23 for the backlight module 5 is a cylinder, so that the thickness of the light guide plate 4 can be matched and the entire LED package 2 can be thinned and curved. 24 is formed on the side of the cylinder. The light incident surface 41 can be a flat surface or a concave curved surface as shown in Fig. 5a. In addition, the light incident surface 41 may be provided with a plurality of light diffusing structures 42. As shown in the embodiment of FIG. 5, the light-expanding structures 42 may be arcs of the same size, the same shape, and are continuously arranged and protruded, but are not limited thereto. Referring to FIG. 6a, the shape of each of the light-expanding structures 42' may be one of a circular arc shape, an elliptical arc shape, a triangular shape, a polygonal shape, or a combination of at least two or more. Furthermore, each of the light-enhancing structures may have the same size (shown in Figure 5a) or have different sizes, for example, in a large one-and-a-half order (shown in Figure 6a). In the embodiment shown in Fig. 6a, the ratio of the width W1 of the light-emitting structure 42' to its height H is greater than 2 or less than 2, but not equal to 2. In addition, referring to FIG. 6b, the light-expanding structure 42" may also be a concave structure concave toward the center of the light guide plate 4, and the ratio of the width W2 to the depth D3 is also greater than 2 or less than 2, but not equal to 2.
藉由前述各個實施例之設計,其於擴光面上設置至少一弧形凹槽,使發光二極體發出之光線能有較大的出光角度且可提昇邊緣大角度方向出射的光能量,並且能均勻化整體出光強度而有效降低亮暗帶對比。According to the design of each of the foregoing embodiments, at least one arc-shaped groove is disposed on the light-enhancing surface, so that the light emitted by the light-emitting diode can have a larger light-emitting angle and can increase the light energy emitted from the edge at a large angle. And can evenize the overall light intensity and effectively reduce the contrast between light and dark.
以上所述僅為舉例性,而非為限制性者。任何熟悉該項技術者均可依據上述本發明之實施例進行等效之修改,而不脫離其精神與範疇。故任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。The above is intended to be illustrative only and not limiting. Equivalent modifications may be made to the embodiments of the invention described above without departing from the spirit and scope of the invention. Therefore, any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.
1...發光二極體封裝件1. . . LED package
11...基座11. . . Pedestal
12...發光二極體12. . . Light-emitting diode
13...封裝體13. . . Package
131...擴光面131. . . Dimming surface
2、2’...發光二極體封裝件2, 2’. . . LED package
21...基座twenty one. . . Pedestal
211...表面211. . . surface
22...發光二極體twenty two. . . Light-emitting diode
23...封裝體twenty three. . . Package
231...擴光面231. . . Dimming surface
24...第一弧形凹槽twenty four. . . First curved groove
241...曲面241. . . Surface
25...第二弧形凹槽25. . . Second curved groove
4...導光板4. . . Light guide
41...入光面41. . . Glossy surface
42、42’、42”...擴光結構42, 42', 42"...light-emitting structure
5...背光模組5. . . Backlight module
D1...第一弧形凹槽深度D1. . . First curved groove depth
D2...第二弧形凹槽深度D2. . . Second curved groove depth
D3...擴光結構深度D3. . . Dimming structure depth
H...擴光結構高度H. . . Light-emitting structure height
L1、L2、L2’、L3...光線路徑L1, L2, L2', L3. . . Ray path
N...法線N. . . Normal
T...封裝件厚度T. . . Package thickness
W1、W2...擴光結構寬度W1, W2. . . Dimming structure width
圖1為一習知之發光二極體封裝件之示意圖。1 is a schematic view of a conventional light emitting diode package.
圖2a為本發明一較佳實施例之發光二極體封裝件。2a is a light emitting diode package according to a preferred embodiment of the present invention.
圖2b為圖2a所示實施例之光路徑示意圖。Figure 2b is a schematic illustration of the optical path of the embodiment of Figure 2a.
圖3為本發明另一較佳實施例之發光二極體封裝件。3 is a light emitting diode package according to another preferred embodiment of the present invention.
圖4為圖1所示之發光二極體封裝件以及圖2a所示之發光二極體封裝件於0度平面之光強度分析圖。4 is a light intensity analysis diagram of the light emitting diode package of FIG. 1 and the light emitting diode package of FIG. 2a at a 0 degree plane.
圖5a為依本發明一較佳實施例之背光模組的示意圖。FIG. 5a is a schematic diagram of a backlight module according to a preferred embodiment of the present invention.
圖5b為顯示圖5a之發光二極體封裝件的封裝體外形的立體示意圖。FIG. 5b is a perspective view showing the outline of a package of the LED package of FIG. 5a.
圖6a及圖6b為顯示本發明形成於導光板上的擴光結構設計例的示意圖。6a and 6b are schematic views showing a design example of a light-expanding structure formed on a light guide plate of the present invention.
2...發光二極體封裝件2. . . LED package
21...基座twenty one. . . Pedestal
211...表面211. . . surface
22...發光二極體twenty two. . . Light-emitting diode
23...封裝體twenty three. . . Package
231...擴光面231. . . Dimming surface
24...弧形凹槽twenty four. . . Curved groove
241...弧面241. . . Curved surface
D1...第一弧形凹槽深度D1. . . First curved groove depth
N...法線N. . . Normal
T...封裝件厚度T. . . Package thickness
Claims (21)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97107598A TWI390767B (en) | 2008-03-05 | 2008-03-05 | Led package and backlight module having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97107598A TWI390767B (en) | 2008-03-05 | 2008-03-05 | Led package and backlight module having the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200939517A TW200939517A (en) | 2009-09-16 |
| TWI390767B true TWI390767B (en) | 2013-03-21 |
Family
ID=44867725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97107598A TWI390767B (en) | 2008-03-05 | 2008-03-05 | Led package and backlight module having the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI390767B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114077095B (en) * | 2020-08-18 | 2025-08-19 | 瑞仪光电(苏州)有限公司 | Light source structure, backlight module and display device |
| CN113176686A (en) * | 2021-04-21 | 2021-07-27 | Tcl华星光电技术有限公司 | Backlight module and display device |
-
2008
- 2008-03-05 TW TW97107598A patent/TWI390767B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200939517A (en) | 2009-09-16 |
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