TWI388530B - Method of repairing a transparent conductive film - Google Patents
Method of repairing a transparent conductive film Download PDFInfo
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- TWI388530B TWI388530B TW95103155A TW95103155A TWI388530B TW I388530 B TWI388530 B TW I388530B TW 95103155 A TW95103155 A TW 95103155A TW 95103155 A TW95103155 A TW 95103155A TW I388530 B TWI388530 B TW I388530B
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- 238000000034 method Methods 0.000 title claims description 56
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 47
- 230000008439 repair process Effects 0.000 claims description 42
- 230000007547 defect Effects 0.000 claims description 32
- 239000011787 zinc oxide Substances 0.000 claims description 26
- 239000002245 particle Substances 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 238000005240 physical vapour deposition Methods 0.000 claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 229910003437 indium oxide Inorganic materials 0.000 claims description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 64
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Description
本發明是有關於一種透明導電層的修補方法,且特別是關於一種能夠有效修補凹陷缺陷點之透明導電層修補方法及其結構。The present invention relates to a method for repairing a transparent conductive layer, and more particularly to a method for repairing a transparent conductive layer capable of effectively repairing recessed defects and a structure thereof.
為了配合現代生活模式,視訊或影像裝置之體積日漸趨於薄輕。因此,面板式的顯示器已被發展出成為目前常見之顯示器產品,例如液晶顯示器、電漿顯示器及電致發光(electroluminance)顯示器等。液晶顯示器具有低電力消耗、無輻射線、重量輕以及體積小等傳統陰極射線管(cathode ray tube,簡稱CRT)顯示器無法達到的優點。因此,LCD已經廣泛地被應用於手提式電腦、行動電話等電子產品中。In order to cope with the modern lifestyle, the size of video or video devices is becoming thinner and lighter. Therefore, panel-type displays have been developed into currently common display products, such as liquid crystal displays, plasma displays, and electroluminance displays. Liquid crystal displays have the advantages that conventional cathode ray tube (CRT) displays, such as low power consumption, no radiation, light weight, and small size, cannot be achieved. Therefore, LCDs have been widely used in electronic products such as portable computers and mobile phones.
液晶顯示裝置通常由具有電極的彩色濾光片基板與陣列基板所組成。通常陣列基板上形成有用來當作開關元件的薄膜電晶體,此薄膜電晶體具有連接於掃描線(scan line)的閘極電極、連接於訊號線(data line)的源極電極、以及連接於透明像素電極的汲極電極。彩色濾光片基板表面則設置有遮光層、用以顯現出紅藍綠等色彩之彩色濾光膜層、以及覆蓋於遮光層與彩色濾光膜層表面的透明共通電極層。為了保持兩基板間之固定的距離,通常會設置一些俗稱為間隔物(spacer)之顆粒於兩基板間。間隔物(spacer)之設置方式可以是以散佈具有一定粒徑的顆粒於兩基板之間或是以黃光製程之方式製作出這些間隔物(spacer)。間隔物也使所填入的液晶可容置於液晶顯示裝置面板中。再藉由驅動IC分別輸出設定電壓到畫素電極與共通電極層來控制液晶的轉動,進而顯示出預期的畫面。A liquid crystal display device is usually composed of a color filter substrate having electrodes and an array substrate. Generally, a thin film transistor for forming a switching element is formed on an array substrate, the thin film transistor having a gate electrode connected to a scan line, a source electrode connected to a data line, and a connection to The drain electrode of the transparent pixel electrode. The surface of the color filter substrate is provided with a light shielding layer, a color filter layer for expressing colors such as red, blue and green, and a transparent common electrode layer covering the surface of the light shielding layer and the color filter layer. In order to maintain a fixed distance between the two substrates, particles commonly known as spacers are usually disposed between the two substrates. The spacers may be arranged by dispersing particles having a certain particle diameter between the two substrates or by forming a spacer in a yellow light process. The spacer also allows the filled liquid crystal to be accommodated in the panel of the liquid crystal display device. Then, the driving IC outputs a set voltage to the pixel electrode and the common electrode layer to control the rotation of the liquid crystal, thereby displaying the desired picture.
然而,在製備彩色濾光片基板的過程中,若有異物於鍍透明共通電極層步驟前附著於彩色濾光片基板上,將使得透明共通電極層覆蓋於異物表面及異物附著區以外的基板表面。由於異物與基板的附著性差,在後清洗製程時異物容易被移除而導致透明共通電極層剝落形成凹陷缺陷。當設定電壓分別輸入畫素電極與共通電極層時,位於共通電極層凹陷缺陷區域附近的液晶將無法正常動作,使得顯示畫面上出現亮點(或暗點)缺陷。類似的情況也可能出現在陣列基板的透明畫素電極上,使得位於透明畫素電極凹陷缺陷區域的液晶將無法正常動作,造成顯示畫面上出現亮點(或暗點)缺陷。However, in the process of preparing the color filter substrate, if a foreign matter adheres to the color filter substrate before the step of plating the transparent common electrode layer, the transparent common electrode layer is covered on the surface of the foreign matter and the substrate other than the foreign matter attachment region. surface. Due to the poor adhesion of the foreign matter to the substrate, the foreign matter is easily removed during the post-cleaning process, causing the transparent common electrode layer to peel off to form a recess defect. When the set voltage is input to the pixel electrode and the common electrode layer, respectively, the liquid crystal located near the defective region of the common electrode layer may not operate normally, so that a bright spot (or dark spot) defect appears on the display screen. A similar situation may also occur on the transparent pixel electrode of the array substrate, so that the liquid crystal located in the depressed region of the transparent pixel electrode will not operate normally, causing a bright spot (or dark spot) defect on the display screen.
在現行的畫素修補技術中,是利用雷射方法將透明畫素電極與薄膜電晶體電性隔絕,使其呈現黑色或灰色。然而,習知的透明畫素修補技術都無法讓原有畫素呈現原本想要的顏色,故降低顯示品質。若具有凹陷缺陷的畫素電極數量過多時,可能直接報廢而不進行修補。如此一來,不但嚴重影響良率也大大提高成本。In the current pixel repairing technology, the transparent pixel electrode is electrically isolated from the thin film transistor by a laser method to make it appear black or gray. However, the conventional transparent pixel repairing technique cannot make the original pixel appear the original desired color, thus reducing the display quality. If the number of pixel electrodes with recessed defects is too large, it may be directly discarded without repairing. As a result, not only does it seriously affect the yield but also greatly increases the cost.
有鑑於此,本發明之目的是提供一種透明導電層的修補方法及其結構,可於透明導電層具有凹陷缺陷時,避免在面板形成亮點(或暗點)。In view of the above, an object of the present invention is to provide a method for repairing a transparent conductive layer and a structure thereof, which can avoid forming bright spots (or dark spots) on a panel when the transparent conductive layer has a recess defect.
本發明之另一目的是提供一種透明導電層的修補方法及其結構,以提高亮點(或暗點)修復率。Another object of the present invention is to provide a method for repairing a transparent conductive layer and a structure thereof to improve the repair rate of bright spots (or dark spots).
根據上述與其他目的,本發明提出一種透明導電層之修補方法,包括提供一基板,其基板設置有透明導電層於其表面,其中透明導電層具有凹陷缺陷。接著,進行一填補步驟,填補導電修補材料於此凹陷缺陷部用以形成一導電修補層。上述填補方式包括噴墨(Ink-Jet)、化學氣相沉積(CVD)或物理氣相沉積(PVD)。本發明之修補方法,更可於填補製程之後進行平坦化步驟。According to the above and other objects, the present invention provides a method for repairing a transparent conductive layer, comprising providing a substrate having a substrate provided with a transparent conductive layer on a surface thereof, wherein the transparent conductive layer has a recessed defect. Then, a filling step is performed to fill the conductive repair material to form a conductive repair layer. The above filling methods include inkjet (Ink-Jet), chemical vapor deposition (CVD), or physical vapor deposition (PVD). The repairing method of the present invention can further perform the planarization step after filling the process.
本發明提出一種透明導電層之結構,包括一基板,其基板設置有透明導電層於其表面,其中透明導電層具有凹陷缺陷。一導電修補層填補於該凹陷缺陷部。The invention provides a structure of a transparent conductive layer, comprising a substrate, the substrate is provided with a transparent conductive layer on the surface thereof, wherein the transparent conductive layer has a concave defect. A conductive repair layer fills the recessed defect portion.
利用本發明之修補方法,直接於凹缺缺陷地區填補導電修補層,使其與透明導電層連接,如此大幅提高亮點修復率,並且於修補後面板仍能正常顯示原有的畫面。此外,凹陷缺陷區域大小或形狀並無任何侷限,皆可使用本發明之修補方式進行修補,進而大大提高良率降低成本。By using the repairing method of the invention, the conductive repair layer is directly filled in the defect defect area to be connected with the transparent conductive layer, thereby greatly improving the bright spot repair rate, and the original picture can still be normally displayed after the repaired panel. In addition, there is no limitation on the size or shape of the recessed defect region, and the repairing method of the present invention can be used for repairing, thereby greatly improving the yield and reducing the cost.
第1圖為本發明之彩色濾光片基板的剖面圖。彩色濾光片基板100包括透明基板102,其上設置有遮光層104、彩色濾光膜106、以及覆蓋於遮光層104與彩色濾光膜106表面的透明共通電極層108。當共通電極層108剝離產生凹陷缺陷110時,可利用本發明之修補方法進行修補,使顯示器能正常顯示原來的畫面。凹陷缺陷110的態樣並非侷限於第1圖所示之完全剝離態樣。舉凡因人為、機器或其他因素造成刮傷,而使共通電極層108的部份結構脫落形成凹陷缺陷110,可利用本發明之修補方法進行修補。以下將配合第2圖到第6圖詳細說明本發明之修補方法。Fig. 1 is a cross-sectional view showing a color filter substrate of the present invention. The color filter substrate 100 includes a transparent substrate 102 on which a light shielding layer 104, a color filter film 106, and a transparent common electrode layer 108 covering the surface of the light shielding layer 104 and the color filter film 106 are disposed. When the common electrode layer 108 is peeled off to generate the recessed defect 110, it can be repaired by the repairing method of the present invention, so that the display can display the original picture normally. The aspect of the recessed defect 110 is not limited to the fully peeled state shown in Fig. 1. If a portion of the common electrode layer 108 is peeled off to form a recessed defect 110 due to scratches caused by human, machine or other factors, the repairing method of the present invention can be used for repair. The repairing method of the present invention will be described in detail below with reference to Figs. 2 to 6.
本發明之修補方法的第一實施例是局部性形成導電修補層於凹陷缺陷部。如第2圖所示,利用噴墨(Ink-jet)的技術,將導電修補材料210填補於凹陷缺陷110。如第3圖所示之修補完成後的彩色濾光片基板300剖面結構,使導電修補層212與共通電極層108產生電性連接。A first embodiment of the repairing method of the present invention is to locally form a conductive repair layer on the recessed defect portion. As shown in FIG. 2, the conductive repair material 210 is filled in the recessed defect 110 by an inkjet (Ink-jet) technique. The cross-sectional structure of the color filter substrate 300 after the repair is completed as shown in FIG. 3, and the conductive repair layer 212 and the common electrode layer 108 are electrically connected.
由於共通電極層108的材質係為氧化銦錫(ITO)、氧化銦鋅(IZO)或其他透明導電材料,所以導電修補材料210之組成可例如為複數透明導電粒子以及溶劑等所組成。利用Ink-jet之技術將導電修補材料施於凹陷缺陷110。接著,可藉由烘烤等製程將溶劑去除,使複數透明導電粒子構成一導電修補層212。依據烘烤製程的不同,導電修補層212可以為透明導電粒子間緊密排列之型態所構成,也可以為導電粒子間至少具有部分相互熔合區域之型態所構成,或是由上述兩種型態所共同構成。透明導電層212的材質可例如為氧化銦錫(ITO)、氧化銦(In2 O3 )、二氧化鈦(TiO2 )、氧化鋅(ZnO)、氧化鋅(ZnO:Sn)、釩摻雜氧化鋅(ZnO:V)、鈷摻雜氧化鋅(ZnO:Co)、鋁摻雜氧化鋅(ZnO:Al)、鎵摻雜氧化鋅(ZnO:Ga)、鈦摻雜氧化鋅(ZnO:Ti)、銦摻雜氧化鋅(ZnO:In)或其組合。導電修補層212也可以由複數個粒徑大小為奈米等級以下的金屬或非金屬導電粒子所構成。這些導電粒子結構可為空心或實心,其形狀可為柱狀、碟狀、纖維狀(fiber)或球狀。Since the material of the common electrode layer 108 is indium tin oxide (ITO), indium zinc oxide (IZO) or other transparent conductive material, the composition of the conductive repair material 210 can be composed, for example, of a plurality of transparent conductive particles and a solvent. The conductive repair material is applied to the recessed defect 110 using the technique of Ink-jet. Then, the solvent can be removed by a baking process or the like to form a plurality of transparent conductive particles to form a conductive repair layer 212. Depending on the baking process, the conductive repair layer 212 may be formed by a closely arranged pattern of transparent conductive particles, or may be formed of a type in which at least a portion of the conductive particles are fused to each other, or from the above two types. The state is composed of the same. The material of the transparent conductive layer 212 can be, for example, indium tin oxide (ITO), indium oxide (In 2 O 3 ), titanium dioxide (TiO 2 ), zinc oxide (ZnO), zinc oxide (ZnO: Sn), vanadium-doped zinc oxide. (ZnO: V), cobalt-doped zinc oxide (ZnO: Co), aluminum-doped zinc oxide (ZnO: Al), gallium-doped zinc oxide (ZnO: Ga), titanium-doped zinc oxide (ZnO: Ti), Indium doped zinc oxide (ZnO: In) or a combination thereof. The conductive repair layer 212 may also be composed of a plurality of metal or non-metal conductive particles having a particle size of less than or equal to the nanometer level. These conductive particle structures may be hollow or solid and may be in the shape of a column, a dish, a fiber or a sphere.
為了讓由導電粒子所構成的導電修補層212能夠具有更平坦表面,使後來填充的液晶分子有較佳排列,可選擇將這些導電粒子表面塗佈一層界面活性劑,塗佈情形可為每個導電粒子表面皆具有一層界面活性劑或由複數個導電粒子,例如是10個導電粒子,聚集形成的導電粒子群表面具有一層界面活性劑。藉此,於填補步驟的同時,導電粒子將會自動排列達到自組裝(self-assembly)的效果。為了讓電性表現更佳,於填補步驟後,可再進行一回火(annealing)步驟用以去除界面活性劑使導電修補層212更為緻密。In order to allow the conductive repair layer 212 composed of conductive particles to have a flatter surface, so that the liquid crystal molecules to be filled later are preferably aligned, the surface of the conductive particles may be coated with a layer of surfactant, and the coating condition may be The surface of the conductive particles has a layer of surfactant or a plurality of conductive particles, for example, 10 conductive particles, and the surface of the conductive particles formed by aggregation has a layer of surfactant. Thereby, at the same time as the filling step, the conductive particles will be automatically aligned to achieve a self-assembly effect. In order to make the electrical performance better, after the filling step, an annealing step can be performed to remove the surfactant to make the conductive repair layer 212 more dense.
除了如第2圖所示的噴墨技術外,請參照第4圖,亦可使用小型鍍膜裝置414將導電修補層212形成於凹陷缺陷110部。或是,請參照第5圖,先於彩色濾光片基板500上放置遮罩514,使基板500僅露出凹陷缺陷110處。接著,當使用化學氣相沉積法或物理氣相沉積法時,導電修補層212僅形成在凹陷缺陷110部,其中物理氣相沉積法可例如為濺鍍。In addition to the ink jet technique shown in Fig. 2, referring to Fig. 4, the conductive repair layer 212 may be formed on the recessed defect portion 110 by using the small coating device 414. Alternatively, referring to FIG. 5, a mask 514 is placed on the color filter substrate 500 such that the substrate 500 exposes only the recessed defects 110. Next, when a chemical vapor deposition method or a physical vapor deposition method is used, the conductive repair layer 212 is formed only in the recessed defect portion 110, wherein the physical vapor deposition method may be, for example, sputtering.
為了後續製程考量,可進一步進行平坦化步驟,例如是以黃光製程製作平坦層或是以研磨製程,使得凹陷缺陷區域具有平坦的表面。For subsequent process considerations, a planarization step may be further performed, such as making a planar layer in a yellow light process or a polishing process such that the recessed defect regions have a flat surface.
本發明之修補方法的第二實施例是全面性形成導電修補層於基板上。如第6圖所示,藉由化學氣相沉積法或物理氣相沉積法,將導電修補層612形成於彩色濾光基板600表面。A second embodiment of the repair method of the present invention is to form a conductive repair layer on a substrate in a comprehensive manner. As shown in FIG. 6, the conductive repair layer 612 is formed on the surface of the color filter substrate 600 by chemical vapor deposition or physical vapor deposition.
同樣地,為了增加顯示器的透光度或是考量後續製程因素,可進一步進行平坦化步驟,例如以黃光製程製作平坦層或是研磨製程,使得凹陷缺陷區域與周邊共通電極層區域具有相同的水平高度。Similarly, in order to increase the transmittance of the display or to consider the subsequent process factors, a planarization step may be further performed, for example, a flat layer or a polishing process is performed in a yellow light process, so that the recessed defect region and the peripheral common electrode layer region have the same Level height.
本發明之修補方法也可用來修補陣列基板上顯示區域的畫素電極。第7圖為修補完成後的陣列基板700顯示區域之剖面結構圖。如第7圖所示,陣列基板700顯示區域包括透明基板702,其上設置有連接於掃描線(未圖示)的閘極電極704、閘極絕緣層706、半導體層708、連接於訊號線(未圖示)的汲極/源極電極710、源極/汲極電極714、保護層716、透明畫素電極718以及填補於缺陷區域的導電修補層712。畫素電極718與導電修補層712相連接。陣列基板700可為扭轉向列型液晶顯示器(TN-LCD)、垂直配向型液晶顯示器(VA-LCD)、共面切換型液晶顯示器(IPS-LCD)或其他型態顯示器的下基板。The repair method of the present invention can also be used to repair the pixel electrodes of the display area on the array substrate. Fig. 7 is a cross-sectional structural view showing the display area of the array substrate 700 after the repair is completed. As shown in FIG. 7, the display area of the array substrate 700 includes a transparent substrate 702 on which a gate electrode 704 connected to a scan line (not shown), a gate insulating layer 706, a semiconductor layer 708, and a signal line are connected. A drain/source electrode 710 (not shown), a source/drain electrode 714, a protective layer 716, a transparent pixel electrode 718, and a conductive repair layer 712 filled in the defect region. The pixel electrode 718 is connected to the conductive repair layer 712. The array substrate 700 can be a lower substrate of a twisted nematic liquid crystal display (TN-LCD), a vertical alignment type liquid crystal display (VA-LCD), a coplanar switching type liquid crystal display (IPS-LCD), or other type of display.
相較於習知技術,本發明可利用化學氣相沉積、物理氣相沉積或噴墨方式於基板上之凹陷缺陷區域填補導電修補層,使導電修補層與透明導電層連接,如此大幅提高亮點(或暗點)修復率,並且於修補後面板仍能正常顯示原有的畫面。此外,凹陷缺陷區域大小或形狀並無任何侷限,皆可使用本發明之修補方式進行修補,進而大大提高良率降低成本。Compared with the prior art, the present invention can fill the conductive repair layer on the depressed defect region on the substrate by chemical vapor deposition, physical vapor deposition or ink jet method, and connect the conductive repair layer to the transparent conductive layer, thereby greatly improving the bright spot. (or dark point) repair rate, and the original screen can still be displayed normally after repairing the panel. In addition, there is no limitation on the size or shape of the recessed defect region, and the repairing method of the present invention can be used for repairing, thereby greatly improving the yield and reducing the cost.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
100、200、300、400、500、600...彩色濾光片基板100, 200, 300, 400, 500, 600. . . Color filter substrate
102、702...透明基板102, 702. . . Transparent substrate
104...遮光層104. . . Shading layer
106...彩色濾光膜106. . . Color filter film
108...共通電極層108. . . Common electrode layer
110...凹陷缺陷110. . . Depression defect
210...導電修補材料210. . . Conductive repair material
212、612、712...導電修補層212, 612, 712. . . Conductive repair layer
414...小型鍍膜裝置414. . . Small coating device
514...遮罩514. . . Mask
700...陣列基板700. . . Array substrate
704...閘極電極704. . . Gate electrode
706...閘極絕緣層706. . . Gate insulation
708...半導體層708. . . Semiconductor layer
710...汲極/源極電極710. . . Bungee/source electrode
714...源極/汲極電極714. . . Source/drain electrode
716...保護層716. . . The protective layer
718...畫素電極718. . . Pixel electrode
第1圖為本發明之彩色濾光片基板的剖面圖。Fig. 1 is a cross-sectional view showing a color filter substrate of the present invention.
第2圖為本發明之噴墨技術修補方法。Fig. 2 is a view showing a method of repairing an ink jet technique of the present invention.
第3圖為修補完成後的彩色濾光片基板之剖面結構圖。Fig. 3 is a cross-sectional structural view of the color filter substrate after the repair is completed.
第4圖為本發明之使用小型鍍膜裝置之修補方法。Fig. 4 is a view showing a repairing method using a small-sized coating apparatus of the present invention.
第5圖為本發明之使用遮罩進行局部沉積之修補方法。Fig. 5 is a view showing a repairing method for local deposition using a mask according to the present invention.
第6圖為本發明之進行全面沉積之修補方法。Fig. 6 is a view showing the method of repairing the overall deposition of the present invention.
第7圖為修補完成後的陣列基板顯示區域之剖面結構圖。Figure 7 is a cross-sectional structural view of the display area of the array substrate after the repair is completed.
200...彩色濾光片基板200. . . Color filter substrate
102...透明基板102. . . Transparent substrate
104...遮光層104. . . Shading layer
106...彩色濾光膜106. . . Color filter film
108...共通電極層108. . . Common electrode layer
110...凹陷缺陷110. . . Depression defect
210...導電修補材料210. . . Conductive repair material
Claims (13)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95103155A TWI388530B (en) | 2006-01-26 | 2006-01-26 | Method of repairing a transparent conductive film |
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| TWI388530B true TWI388530B (en) | 2013-03-11 |
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| CN104916350A (en) * | 2014-03-13 | 2015-09-16 | 长濑化成株式会社 | Repairing and regeneration method for transparent conductive film and transparent conductive laminating body |
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| CN110083279A (en) * | 2019-05-07 | 2019-08-02 | 业成科技(成都)有限公司 | Transparent conductive material, touch-control structure and touch device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104916350A (en) * | 2014-03-13 | 2015-09-16 | 长濑化成株式会社 | Repairing and regeneration method for transparent conductive film and transparent conductive laminating body |
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| TW200728232A (en) | 2007-08-01 |
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