TWI388567B - Phosphorus containing compounds and the manufacturing method thereof - Google Patents
Phosphorus containing compounds and the manufacturing method thereof Download PDFInfo
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- TWI388567B TWI388567B TW097144014A TW97144014A TWI388567B TW I388567 B TWI388567 B TW I388567B TW 097144014 A TW097144014 A TW 097144014A TW 97144014 A TW97144014 A TW 97144014A TW I388567 B TWI388567 B TW I388567B
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- phenyl
- alkyl
- compound
- naphthyl
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- 150000001875 compounds Chemical class 0.000 title claims description 29
- 229910052698 phosphorus Inorganic materials 0.000 title claims description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 20
- 239000011574 phosphorus Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- -1 di(phenyl)propanetriyl Chemical group 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 13
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 13
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052794 bromium Inorganic materials 0.000 claims description 8
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 7
- 239000004305 biphenyl Substances 0.000 claims description 7
- 235000010290 biphenyl Nutrition 0.000 claims description 7
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 150000002367 halogens Chemical class 0.000 claims description 6
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical class O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 claims description 4
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 claims description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 3
- 125000006267 biphenyl group Chemical group 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 3
- OURODNXVJUWPMZ-UHFFFAOYSA-N 1,2-diphenylanthracene Chemical compound C1=CC=CC=C1C1=CC=C(C=C2C(C=CC=C2)=C2)C2=C1C1=CC=CC=C1 OURODNXVJUWPMZ-UHFFFAOYSA-N 0.000 claims description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 125000001188 haloalkyl group Chemical group 0.000 claims description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 229910052740 iodine Inorganic materials 0.000 claims description 2
- 239000011630 iodine Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims 2
- 239000007983 Tris buffer Substances 0.000 claims 1
- PQLFROTZSIMBKR-UHFFFAOYSA-N ethenyl carbonochloridate Chemical compound ClC(=O)OC=C PQLFROTZSIMBKR-UHFFFAOYSA-N 0.000 claims 1
- GRLXVBPHGMHJQW-UHFFFAOYSA-N ethenyl carbonofluoridate Chemical compound FC(=O)OC=C GRLXVBPHGMHJQW-UHFFFAOYSA-N 0.000 claims 1
- 125000001624 naphthyl group Chemical group 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000003063 flame retardant Substances 0.000 description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 10
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 239000002648 laminated material Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 150000002790 naphthalenes Chemical class 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BODDYKBORCLDDS-UHFFFAOYSA-N 2-methylpentyl hydrogen carbonate Chemical compound CCCC(C)COC(O)=O BODDYKBORCLDDS-UHFFFAOYSA-N 0.000 description 1
- OYOKPDLAMOMTEE-UHFFFAOYSA-N 4-chloro-1,3-dioxolan-2-one Chemical compound ClC1COC(=O)O1 OYOKPDLAMOMTEE-UHFFFAOYSA-N 0.000 description 1
- SBLRHMKNNHXPHG-UHFFFAOYSA-N 4-fluoro-1,3-dioxolan-2-one Chemical compound FC1COC(=O)O1 SBLRHMKNNHXPHG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000282412 Homo Species 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- FXPHJTKVWZVEGA-UHFFFAOYSA-N ethenyl hydrogen carbonate Chemical compound OC(=O)OC=C FXPHJTKVWZVEGA-UHFFFAOYSA-N 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
- C07F9/6564—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
- C07F9/6571—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
- C07F9/657163—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom
- C07F9/657172—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom the ring phosphorus atom and one oxygen atom being part of a (thio)phosphinic acid ester: (X = O, S)
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Fireproofing Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本發明係有關於一種含磷化合物及其製法,特別是有關於一種具有高溶解度之含磷化合物及其製法。The present invention relates to a phosphorus-containing compound and a process for the preparation thereof, and more particularly to a phosphorus-containing compound having high solubility and a process for the preparation thereof.
現今為了因應日益精進的細線路及高密度的要,積層板也需要具有更優異的電氣性質、機械性質及耐熱加工性。尤其是耐熱加工性,以目前常見的FR4積層板來說,硬化後的玻璃轉移溫度大約在130℃左右,對於印刷電路板製程中超過200℃的切割和鑽孔加工,甚至270℃以上焊接程序,此種積層板材料,有可能在製造及加工過程中發生破裂或爆板。因此,已針對各種強調高熱安定性、高玻璃轉移溫度的積層板材料積極地進行開發。此外,對積層板而言,另一項重要的性質是其難燃特性。在某些應用的領域中,例如用於飛機、汽車及大眾運輸等交通工具,因對於人身體及生命安全直接造成威脅。因此,印刷電路板的難燃特性是絕對必須的。In order to cope with increasingly fine lines and high density, laminated boards are also required to have superior electrical properties, mechanical properties and heat-resistant workability. In particular, the heat-resistant workability, in the current common FR4 laminate, the glass transition temperature after hardening is about 130 ° C, for cutting and drilling processing in the printed circuit board process exceeding 200 ° C, even the welding procedure above 270 ° C Such laminate materials may be cracked or burst during manufacturing and processing. Therefore, development has been actively carried out for various laminate materials which emphasize high heat stability and high glass transition temperature. In addition, another important property for laminates is their flame retardant properties. In certain applications, such as aircraft, automobiles, and mass transit, vehicles pose a direct threat to human health and life. Therefore, the flame retardant characteristics of printed circuit boards are absolutely necessary.
為提高積層板材料之難燃特性,必須使用某些具有隔離火燄降低燃燒性質的物質。對於積層板而言,習知係使用含鹵素化合物,特別是含溴的環氧樹脂及硬化劑,並配合如三氧化二銻之類的難燃助劑,可使該積層板的難燃特性符合所需的要求(如UL 94V-0等級)。通常,環氧樹脂須含有高達17%至21%的溴含量,並配合使用三氧化二銻或其它的難燃劑,才能達到UL 94V-0的水準。然而,使 用高溴含量的環氧樹脂或三氧化二銻,無疑地將對人類帶來嚴重的危害,這是因為三氧化二銻已經被列為致癌物質;另一方面,溴在燃燒的過程當中不只是會產生具有腐蝕性的溴自由基及溴化氫,溴含量高的芳香族化合物更會產生劇毒的溴化呋喃類及溴化戴奧辛類化合物,嚴重影響人體的健康及環境。In order to improve the flame retardant properties of laminate materials, certain materials with isolated flames to reduce combustion properties must be used. For laminates, it is customary to use halogen-containing compounds, especially bromine-containing epoxy resins and hardeners, and with flame retardant additives such as antimony trioxide to make the laminates flame retardant. Meet the required requirements (such as UL 94V-0 rating). In general, epoxy resins must contain up to 17% to 21% bromine content, combined with antimony trioxide or other flame retardants, to achieve UL 94V-0. However, The use of high bromine content epoxy resin or antimony trioxide will undoubtedly cause serious harm to humans. This is because antimony trioxide has been classified as a carcinogen; on the other hand, bromine is not burned. Only corrosive bromine radicals and hydrogen bromide are produced. The aromatic compounds with high bromine content can produce highly toxic brominated furans and brominated dioxins, which seriously affect the health and environment of the human body.
目前,以磷系化合物作為新一代具有環保概念的難燃劑,已被廣泛地研究和應用。如台灣專利第575633號中所揭示之含磷化合物,其所形成之難然性環氧樹脂組成物可達UL 94V-0的水準,並於受熱過程中不會釋出腐蝕性和劇毒性氣體。然而,這種含磷化合物,本身因結構的關係,對一般應用於環氧樹脂組成物的溶劑幾乎都不溶解,其只能溶於極性較高之溶劑中,因此若要應用此含磷化合物,則勢必使用較高極性的溶劑,因此對加工或應用上甚是不便。At present, phosphorus compounds have been widely studied and applied as a new generation of environmentally friendly flame retardants. For example, the phosphorus-containing compound disclosed in Taiwan Patent No. 575633 can form a difficult epoxy resin composition up to the level of UL 94V-0, and does not release corrosive and highly toxic gases during heating. . However, such a phosphorus-containing compound itself is hardly dissolved in a solvent generally used for an epoxy resin composition due to its structural relationship, and it can only be dissolved in a solvent having a relatively high polarity, so that a phosphorus-containing compound is to be applied. , it is bound to use a solvent with a higher polarity, so it is inconvenient for processing or application.
因此,仍需要一種具有高溶解度、高裂解溫度,可適用於熱固型樹脂或熱塑型樹之難燃添加劑。Therefore, there is still a need for a flame retardant additive which has high solubility, high cracking temperature and is suitable for use in thermosetting resins or thermoplastic trees.
本發明之主要目的係在於提供一種具有高溶解度之含磷化合物及其製法。The main object of the present invention is to provide a phosphorus-containing compound having high solubility and a process for producing the same.
本發明之另一目的係在於提供一種具有高裂解溫度之含磷化合物及其製法。Another object of the present invention is to provide a phosphorus-containing compound having a high cracking temperature and a process for the preparation thereof.
本發明之又一目的係在於提供一種可用作為難燃添加劑之含磷化合物及其製法。Still another object of the present invention is to provide a phosphorus-containing compound which can be used as a flame retardant additive and a process for producing the same.
為達上述與其他目的,本發明提供一種具有式(I)所示結構之含磷化合物:
本發明又提供一種製造具有式(I)所示結構之含磷化合物之方法,該方法係利用式(Ⅱ)所示之化合物與碳酸烷烯酯或環氧烷進行反應,再加熱去除溶劑獲得具有式(I)所示結構之含磷化合物。The present invention further provides a method for producing a phosphorus-containing compound having the structure represented by the formula (I), which is obtained by reacting a compound represented by the formula (II) with an alkylene carbonate or an alkylene oxide, and then removing the solvent by heating. A phosphorus-containing compound having a structure represented by the formula (I).
相較於一般用作為難燃添加劑之含磷化合物,本發明具有式(I)所示結構之含磷化合物,不但具有高裂解溫度之特性,且對於大部分高極性與低極性之有機溶劑均具有優異的溶解度,適合用作為熱固型或熱塑型樹脂之難燃添加劑。Compared with the phosphorus-containing compound generally used as a flame retardant additive, the phosphorus-containing compound having the structure of the formula (I) of the present invention has not only the characteristics of high cracking temperature but also most of the organic solvents having high polarity and low polarity. It has excellent solubility and is suitable for use as a flame retardant additive for thermosetting or thermoplastic resins.
本發明之含磷化合物具有式(I)所示結構:
於一具體實例中,具有1至6個碳原子之烷基包括,但非限於甲基、乙基、丙基、己基。鹵素之實例包括自氟、氯、溴、碘。二(苯基)C1-6烷基之三價基的實例包括二(苯基)甲三基、二(苯基)乙三基、二(苯基)丙三基及二(苯基)己三基所構成之三價基組群之一者。二(萘基)C1-6烷基之三價基係選自二(萘基)甲三基、二(萘基)乙三基、二(萘基)丙三基及二(萘基)己三基之三價基所構成組群之一者。In one embodiment, an alkyl group having from 1 to 6 carbon atoms includes, but is not limited to, methyl, ethyl, propyl, hexyl. Examples of halogens include from fluorine, chlorine, bromine, and iodine. Examples of the trivalent group of the di(phenyl)C1-6 alkyl group include di(phenyl)methyltriyl, di(phenyl)ethylenetriyl, di(phenyl)propanetriyl, and di(phenyl)hexyl. One of the trivalent base groups formed by the three bases. The trivalent group of the bis(naphthyl)C1-6 alkyl group is selected from the group consisting of di(naphthyl)methyltriyl, di(naphthyl)ethyltriyl, di(naphthyl)propyltriyl and di(naphthyl)hexyl. One of the groups consisting of the trivalent base of the three bases.
本發明之方法中,係使用(9,10-二氫-9-氧雜-10-磷菲-10-氧化物-10-基)-二(4-羥基苯基)甲烷(HPP)與碳酸
烷烯酯或環氧烷在溶劑中,於催化劑與加熱條件下進行反應,再去除溶劑即可獲得具有式(I)所示結構之含磷化合物。該碳酸烷烯酯的實例包括,但非限於經具有1至6個碳原子之烷基、具有1至6個碳原子之鹵烷基、或鹵素取代或未經取代之碳酸乙烯酯、碳酸丙烯酯,例如氟代碳酸乙烯酯、氯代碳酸乙烯酯、5,5-二乙基-1,3-二氧五環-2-酮、及5-甲基-5-丙基-1,3-二氧五環-2-酮等。於一較佳實例係使用碳酸乙烯酯,反應式如下所列:
本發明之方法亦可使用(9,10-二氫-9-氧雜-10-磷菲-10-氧化物-10-基)-二(4-羥基苯基)甲烷(HPP)與環氧烷,例如環氧乙烷,在溶劑中於催化劑與加熱條件下進行反應,再去除溶劑即可獲得具有式(I)所示結構之含磷化合物。反應式如下所列:
另一方面,本發明之方法亦可使用(9,10-二氫-9-氧雜-10-磷菲-10-氧化物-10-基)-二(4-羥基苯基)甲烷(HPP)與醇類化合物,在存有酸捕獲劑之溶劑中進行反應,再去除溶劑即可獲得具有式(I)所示結構之含磷化合物。反應式如下所列:
本發明之方法係於升溫條件下進行反應,例如100至210℃之範圍,較佳係於140至180℃之範圍,更佳係於160至180℃之範圍。本發明方法所使用之溶劑並無特別限制,只要能溶解反應物且易於移除即可,較佳係使用N-甲基吡喀烷酮。The process of the present invention is carried out under elevated temperature conditions, for example, in the range of from 100 to 210 ° C, preferably in the range of from 140 to 180 ° C, more preferably in the range of from 160 to 180 ° C. The solvent to be used in the method of the present invention is not particularly limited as long as it can dissolve the reactants and is easily removed, and N-methylpyrrolidone is preferably used.
以下茲藉由較佳具體實例,進一步說明本發明之特點,惟並非將本發明之範疇侷限於此。The features of the present invention are further illustrated by the preferred embodiments, but are not intended to limit the scope of the invention.
將414.4克之(9,10-二氫-9-氧雜-10-磷菲-10-氧化物-10-基)-二(4-羥基苯基)甲烷(HPP)、176.1克之碳酸 乙烯酯(EC)、0.6克之碘化鉀、以及1000克之N-甲基吡喀烷酮添加至反應容器,混合攪拌後升溫至150℃進行反應,歷時8小時,直到反應容器內不再有二氧化碳產生為止。反應完畢之後,烘乾移除溶劑,獲得468克之反應產物(HPPEC)。414.4 g of (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yl)-bis(4-hydroxyphenyl)methane (HPP), 176.1 g of carbonic acid Vinyl ester (EC), 0.6 g of potassium iodide, and 1000 g of N-methylpyrrolidone were added to the reaction vessel, and the mixture was stirred and heated to 150 ° C to carry out a reaction for 8 hours until no carbon dioxide was produced in the reaction vessel. . After the reaction was completed, the solvent was removed by drying to obtain 468 g of a reaction product (HPPEC).
經ESCA分析元素組成,C:68.5%、H:5.2%、O:20.33%、P:5.97%(m+n=2時,理論值C:69.32%、H:5.42%、O:19.10%、P:6.16%)。反應物HPP之FTIR分析圖譜如第1圖所示,產物HPPEC之FTIR分析圖譜如第2圖所示;第2圖顯示,2932 cm-1 有強吸收峰表示-CH2 -有接在上面,1251 cm-1 有強吸收峰表示酚上之羥基已反應為醚基。產物HPPEC之NMR圖譜如第3圖所示。樹脂軟化點為95℃。The composition of the elements was analyzed by ESCA, C: 68.5%, H: 5.2%, O: 20.33%, P: 5.97% (when m+n=2, theoretical value C: 69.32%, H: 5.42%, O: 19.10%, P: 6.16%). The FTIR analysis spectrum of the reactant HPP is shown in Fig. 1. The FTIR analysis spectrum of the product HPPEC is shown in Fig. 2; the second figure shows that the strong absorption peak at 2932 cm -1 indicates that -CH 2 - is attached thereto. A strong absorption peak at 1251 cm -1 indicates that the hydroxyl group on the phenol has reacted to an ether group. The NMR spectrum of the product HPPEC is shown in Figure 3. The softening point of the resin was 95 °C.
將207.2克之(9,10-二氫-9-氧雜-10-磷菲-10-氧化物-10-基)-二(4-羥基苯基)甲烷、45克之環氧乙烷、0.3克之碘化鉀、以及500克之N-甲基吡喀烷酮添加至反應容器,混合攪拌後升溫至150℃進行反應,歷時8小時,直到反應容器內不再有二氧化碳產生為止。反應完畢之後,烘乾移除溶劑,獲得230克之反應產物(HPPEO)。產物HPPEO之FTIR分析圖譜如第4圖所示;第4圖顯示,2930 cm-1 有強吸收峰表示-CH2 -有接在上面,1251 cm-1 有強吸收峰表示酚上之羥基已反應為醚基。樹脂軟化點為87℃。207.2 g of (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-yloxy)-bis(4-hydroxyphenyl)methane, 45 g of ethylene oxide, 0.3 g of Potassium iodide and 500 g of N-methylpyrrolidone were added to the reaction vessel, and the mixture was stirred and heated to 150 ° C to carry out a reaction for 8 hours until no carbon dioxide was generated in the reaction vessel. After the reaction was completed, the solvent was removed by drying to obtain 230 g of a reaction product (HPPEO). The FTIR analysis of the product HPPEO is shown in Figure 4; Figure 4 shows that a strong absorption peak at 2930 cm -1 indicates that -CH 2 - is attached to it, and a strong absorption peak at 1251 cm -1 indicates that the hydroxyl group on the phenol has been The reaction is an ether group. The softening point of the resin was 87 °C.
根據表1,分別將1克之難燃添加劑HPP與1克之實施例1產物HPPEC溶於20克之溶劑,並將結果紀錄於表1。According to Table 1, 1 gram of the flame retardant additive HPP and 1 gram of the product HPPEC of Example 1 were dissolved in 20 gram of solvent, respectively, and the results are reported in Table 1.
×:表示不溶×: indicates insoluble
◎:表示易溶◎: indicates easy to dissolve
○:表示可溶○: indicates soluble
第1圖係實施例1之反應物HPP的FTIR分析圖譜;第2圖係實施例1之產物HPPEC的FTIR分析圖譜;第3圖係實施例1之產物HPPEC的NMR圖譜;以及第4圖係實施例2之產物HPPEO的FTIR分析圖譜。1 is an FTIR analysis chart of the reactant HPP of Example 1, FIG. 2 is an FTIR analysis chart of the product HPPEC of Example 1, and FIG. 3 is an NMR spectrum of the product HPPEC of Example 1; FTIR analysis of the product HPPEO of Example 2.
Claims (11)
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| TW097144014A TWI388567B (en) | 2008-11-14 | 2008-11-14 | Phosphorus containing compounds and the manufacturing method thereof |
| EP09013379.4A EP2186816B1 (en) | 2008-11-14 | 2009-10-22 | Phosphorus compound and method for preparing the same |
| US12/611,591 US8785696B2 (en) | 2008-11-14 | 2009-11-03 | Phosphorus compound and method for preparing the same |
| JP2009256838A JP5276571B2 (en) | 2008-11-14 | 2009-11-10 | Phosphorus-containing compound and method for producing the same |
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| TWI537281B (en) | 2015-10-08 | 2016-06-11 | 長春人造樹脂廠股份有限公司 | Phosphinated poly(2,6-dimethyl phenylene oxide) oligomers and thermosets thereof |
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| JPS61282388A (en) * | 1985-06-07 | 1986-12-12 | Sanko Kagaku Kk | Organic cyclic phosphorus compound and production thereof |
| JPS6236392A (en) * | 1985-08-09 | 1987-02-17 | Nippon Ester Co Ltd | Organic phosphorus compound |
| JPH06166764A (en) * | 1992-12-01 | 1994-06-14 | Nippon Ester Co Ltd | Flame-resistant thermoset polyester film |
| JPH06264354A (en) * | 1993-03-10 | 1994-09-20 | Unitika Ltd | Flame-retardant filament nonwoven fabric and its production |
| TW528769B (en) * | 1998-06-19 | 2003-04-21 | Nat Science Council | Flame retardant advanced epoxy resins and cured epoxy resins, and preparation thereof |
| TW448207B (en) * | 1999-10-27 | 2001-08-01 | Chang Chun Plastics Co Ltd | Flame-retardant thermoplastic resin composition |
| US6432539B1 (en) * | 1999-11-01 | 2002-08-13 | Chang Chun Plastics Co. Ltd. | Phosphorus-containing polymer having phenolic units and uses thereof |
| TW476771B (en) * | 1999-11-05 | 2002-02-21 | Chang Chun Plastics Co Ltd | Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener |
| JP3412585B2 (en) * | 1999-11-25 | 2003-06-03 | 松下電工株式会社 | Epoxy resin composition for prepreg used for production of printed wiring board and multilayer printed wiring board, prepreg, multilayer printed wiring board |
| TW490474B (en) * | 2000-01-04 | 2002-06-11 | Nat Science Council | Phosphorus group containing flame retardant hardener, advanced epoxy resins and cured epoxy resins thereof |
| US7109286B2 (en) * | 2000-06-29 | 2006-09-19 | Nippon Chemical Industrial Co., Ltd. | Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets |
| TW498084B (en) * | 2000-07-19 | 2002-08-11 | Chang Chun Plastics Co Ltd | Flame-retardant resin and flame retardant composition containing the same |
| JP4783984B2 (en) * | 2001-02-15 | 2011-09-28 | 日立化成工業株式会社 | Resin composition, use thereof and production method thereof |
| US20030073781A1 (en) * | 2001-08-14 | 2003-04-17 | Chang Chun Plastics Co., Ltd. | Phosphorus-containing resin and flame retardant resin composition containing the same |
| TW513482B (en) * | 2001-08-31 | 2002-12-11 | Chang Chun Plastics Co Ltd | Nitrogen-containing flame-retardant epoxy resin and its compositions |
| TW593526B (en) * | 2001-09-20 | 2004-06-21 | Wangsuen Su Jen | Phosphorus group containing flame retardant hardener, advanced epoxy resins and cured epoxy resins thereof |
| US6576690B1 (en) * | 2002-03-22 | 2003-06-10 | Chang Chung Plastics Co., Ltd. | Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
| TW575633B (en) * | 2002-10-21 | 2004-02-11 | Chang Chun Plastics Co Ltd | Flame retardant epoxy resin composition and phosphorus containing compound |
| TWI296001B (en) * | 2002-10-22 | 2008-04-21 | Chang Chun Plastics Co Ltd | |
| TW576854B (en) * | 2002-10-25 | 2004-02-21 | Chang Chun Plastics Co Ltd | Halogen-free resin composition |
| TW200413467A (en) * | 2003-01-16 | 2004-08-01 | Chang Chun Plastics Co Ltd | Resin composition without containing halogen |
| TWI285653B (en) * | 2004-12-30 | 2007-08-21 | Univ Nat Cheng Kung | Phosphorus-containing cured benzoxazine resins and preparation thereof |
| TWI307350B (en) * | 2006-01-27 | 2009-03-11 | Chang Chun Plastics Co Ltd | Flame retarding thermoset resin composition |
| TWI324168B (en) * | 2006-03-17 | 2010-05-01 | Chang Chun Plastics Co Ltd | Flame retarding thermoset epoxy resin composition |
| TWI380991B (en) * | 2007-12-28 | 2013-01-01 | Chang Chun Plastics Co Ltd | Phosphoros-based oxazine compound and preparing method of the same |
| TWI397533B (en) * | 2008-04-11 | 2013-06-01 | Chang Chun Plastics Co Ltd | Novel phosphorus-containing compounds and their preparing process and use |
| TWI359151B (en) * | 2008-07-02 | 2012-03-01 | Chang Chun Plastics Co Ltd | Phosphorus-containing compounds and their preparat |
| TWI449707B (en) * | 2008-07-15 | 2014-08-21 | Univ Nat Chunghsing | Preparation of novel phosphorus-containing biphenols and their derivatives |
| TW201016716A (en) * | 2008-10-23 | 2010-05-01 | Chang Chun Plastics Co Ltd | Phosphorus-containing compound and manufacturing method thereof |
| TWI382035B (en) * | 2010-01-13 | 2013-01-11 | Chang Chun Plastics Co Ltd | Phosphrous-containing advanced epoxy resin and method for systhesizing the same |
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| EP2186816A1 (en) | 2010-05-19 |
| US8785696B2 (en) | 2014-07-22 |
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