TWI388412B - Resin molding method and resin molding device - Google Patents

Description

Resin forming method and resin forming device

The present invention relates to the formation of a thermosetting resin which can be applied to the formation of optical parts and the like.

In the case of synthetic resin molding, even in the case of optical parts, thermoplastic resins which are easier to handle have been used. At the time of molding, in order to take out the molded article, a mold corresponding to the target product is divided into a metal mold such as a fixed mold and a movable mold.

In most cases, in order to put the resin material into the mold, a gate is provided in a portion of the mold portion, a so-called cavity, and a resin called a runner connected to the gate is provided. Import path. After the molding, the molded article taken out from the mold, the flow path portion and the product to which it is attached are integrated, and after the product is cut away from the gate portion, the resin in the flow path portion is no longer required, and is discarded. Although the discarded parts can be reused, they are usually not reusable as optical parts.

In general, while efforts have been made to reduce waste, in most cases, due to the lower unit price of the thermoplastic resin, a small amount of waste is considered to be a necessary evil.

In the recent trend, the camera lens for mobile phone assembly has been gradually miniaturized. For example, if the size is expressed in terms of volume, it is as small as 0.01 ml (ml) each. In the case of the conventional lens, since such a lens mounted in front of the camera sensor is large, it is assembled after the IC substrate is completed. However, as the lens becomes smaller, it has begun to shift to the step of assembling the lens first when the IC substrate is fabricated.

That is, until the completion of the IC substrate, a step of reflowing is performed, at which time the pre-assembled lens will be exposed to a temperature higher than the heat applied (for example, 160 ° C to 180 ° C) when the lens is formed. That is, it is exposed to the high temperature (for example, 200 ° C to 250 ° C) of the solder melting temperature during reflow.

In the case of a conventional thermoplastic resin, the resin is softened by exceeding the high temperature of the glass transition point, and deformation of the lens is caused to become impractical.

Thus, in the case where the resin may be exposed to the molding temperature or a temperature exceeding the molding temperature, a thermosetting resin such as epoxy, silicone, or acrylic may be used. There are problems, but other new problems arise. One of the above is a thermosetting resin to be used as an optical component, and the state before molding is a liquid having an extremely low viscosity (see, for example, Patent Document 1).

In the case of a thermoplastic resin, the state before molding is, for example, a collection of small-sized solid materials called resin pellets, and forms a liquid having a higher viscosity under high temperature and pressure at the time of molding. Post-forming, so it is easy to handle. When the viscosity is high, there is an advantage that the resin does not enter even if the forming pressure is applied to the degassing hole provided so that the air which enters the mold at the beginning of molding is not sealed in the product.

On the other hand, in the case where the viscosity is too low, if a deaeration hole is provided, the resin material enters the hole, and the pressure is dissipated, so that the target can not be formed. Therefore, a molding method in which a degassing hole is not produced is required (see, for example, Patent Document 2).

Alternatively, even if a degassing hole is provided, it is necessary to take measures to prevent the forming pressure from being dissipated. In Patent Document 2, a structure in which air in a mold is sealed in a space (overflow catcher) provided inside the mold is designed.

Another problem is that the thermosetting resin has a higher unit price than the thermoplastic resin. Therefore, if a flow path or the like is designed by a conventional concept, the discarded portion may reach tens of times or more of the product portion. For example, in the case where a certain product is molded by a thermoplastic resin, the formed lens includes a flange portion having a diameter of 6 mm and an average thickness of 1.5 mm, and the volume of the unnecessary portion is a part of the product. The volume (about 0.04 ml) is about 43 times.

This is a great problem for resin materials with a higher unit price. When the product size is large, the liquid resin is poured into the fixed mold, and then the compression movable mold is pushed and pushed, so that it is not necessary to form a flow path (see, for example, Patent Document 3).

However, in compression molding, burrs are apt to occur and post-processing is required. Since the optical lens of the microlens is too small to be post-processed, it is necessary to design a molded body that does not require post-processing as much as possible.

In the patent document 2 shown in the prior art, the liquid resin is produced in a manner similar to the conventional method, and the air is sealed in the overflow receiving portion, so that the flow path portion and the overflow are connected from the molded product. Part of the take-out part is removed and discarded, not only the post-processing increases, but also the amount of waste increases.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-204604

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-238701

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2008-114428

The present invention has been made in view of such a situation, and its main object is to provide a resin molding method which can reduce the amount of useless portions as much as possible when forming an optical component or the like using a liquid thermosetting resin material. Outside of the process, post-processing is not required, which can contribute to a reduction in manufacturing costs.

In order to achieve the above object, the present invention is designed to supply a liquid thermosetting resin only to a necessary portion, and to impart a molding pressure to the permeating gas.

Specifically, in the invention of claim 1, the resin molding method is a method of molding a liquid thermosetting resin into a specific product, which is characterized in that a fixed mold and a movable mold are used. Each side is combined with each other to form a cavity corresponding to the product, a gate located at an upper portion of the cavity, and a flow path communicating with the gate and opening on the upper side of the die; a liquid thermosetting resin is provided in a manner of filling the cavity, and the upper portion of the flow path including the supply pipe is made airtight while the discharge port located below the supply pipe is closed. Pumping the air from the flow passage to the space of the cavity to make the space a vacuum state, and opening the discharge port of the supply pipe in the vacuum state to fill the cavity with the thermosetting resin; After the filling, the space is returned to the atmospheric pressure state, and the air that has passed through the space from the upper surface of the thermosetting resin applies a forming pressure to the thermosetting resin by gas pressure, and the mold is pressed. The thermosetting resin is cured by heating.

The invention of claim 2, wherein the resin forming method according to the first aspect of the invention, wherein the needle (pin) that opens and closes the discharge port by moving in the up-and-down direction is provided in the supply pipe. Pin), and sucking the air of the space in a state where the pin is closed by the pin.

The invention of claim 3, wherein the resin forming method according to claim 1 or 2, wherein the sealing member is integrally provided on the supply pipe to cover the upper portion of the flow path, and a lower portion of the supply pipe is inserted into the flow passage, and the upper portion of the flow passage is sealed in an airtight state with the sealing member, and a gas suction source is formed through a suction hole formed in the sealing member. The air in the aforementioned space is sucked.

The invention of claim 4 is the resin molding method according to the third aspect of the invention, wherein the supply pipe and the sealing member are integrated after the thermosetting resin is filled in the cavity. After the unit is retracted from the metal mold and the upper portion of the flow path is opened, a forming pressure applying means is provided to seal the upper portion of the flow path into an airtight state, and the step of applying a forming pressure by gas pressure is started. .

The invention of claim 5 is a resin molding apparatus comprising: a metal mold, wherein each of the fixed mold and the movable mold is combined with each other to form a cavity corresponding to the product, and the mold cavity is located at the mold cavity. a gate of the upper portion and a flow path that communicates with the gate and opens to the upper surface side of the mold; the supply pipe has a discharge port at the lower side, and the liquid thermosetting resin can be supplied from the flow channel to be filled in the a cavity; an air suction means for making the space in a vacuum state by air above the flow path including the supply pipe and sucking air from the flow path to the cavity; and forming pressure applying means a molding pressure is applied to the thermosetting resin; and the discharge port of the supply pipe is opened while the space is in a vacuum state, and the thermosetting resin is filled in the cavity, and after filling, the aforementioned The space is restored to the atmospheric pressure state, and the heat is applied to the thermosetting resin by the gas pressure by the air passing through the space from the upper surface of the thermosetting resin by the forming pressure applying means. The pressure is formed, and the mold is heated to harden the thermosetting resin.

The invention of claim 6 is the resin molding apparatus of claim 5, wherein the supply tube is provided with a pin that opens and closes the discharge port by moving in the up and down direction, and The air in the space is sucked in a state in which the pin is closed by the pin.

The invention of claim 7 is the resin molding apparatus according to claim 5, wherein the air suction means has a sealing member having a shape covering the upper portion of the flow passage and integrating Formed in the supply pipe; a suction hole formed in the sealing member and communicating with the flow passage via a space above the flow passage; and a gas suction source connected to the suction hole; wherein the supply pipe is In the sealing member, the sealing member seals the upper portion of the flow passage into an airtight state as the lower portion of the supply tube is inserted into the flow passage.

According to a seventh aspect of the invention, in the resin molding apparatus of the seventh aspect of the invention, the supply pipe is integrated with the sealing member after the thermosetting resin is filled in the cavity. The unit is retracted from the metal mold, and after the upper portion of the flow path is opened, the forming pressure applying means seals the upper portion of the flow path to an airtight state, and the step of applying a forming pressure by gas pressure is started.

According to the present invention, even if a high-priced liquid thermosetting resin is used, a waste portion is generated less, and a resin molded article which is low in cost and easy to handle can be obtained by overcoming the problem caused by the liquid.

Further, the article can be easily taken out from the mold without being damaged, and the defective product due to the incorporation of gas (air) into the inside of the article can be reduced with high precision.

Embodiments of the present invention will be described below with reference to the drawings.

First, a first embodiment will be described with reference to Figs. 1 to 5, which is an example in which an imaging lens of a mobile phone is molded into a molded product.

Fig. 1 is a view showing two shape examples (common to the other embodiments) of a fixed mold in a metal mold used in the resin molding apparatus of the resin molding method of the present invention. Fig. 1(a) shows an example in which an overflow portion is provided, and Fig. 1(b) shows an example in which no overflow portion is provided.

In Fig. 1, reference numeral 1 denotes a fixed mold, 11 is a mold clamping surface, 12 is a cavity portion, 13 is a gate portion, 14 is an overflow portion, and 15 is a flow passage connection portion. 16 is a flow path portion, 17 is a resin material injection portion, and 18 is a positioning pin through hole for mold clamping.

Fig. 2 is a view showing a movable mode of the embodiment.

In Fig. 2, reference numeral 2 denotes a movable mold, 21 is a mold clamping surface (parting surface), 22 is a cavity portion, 26 is a flow path portion, 27 is a resin material injection portion, and 28 is a mold clamping portion. Counter sales.

Further, the uppermost flat portion of each of the molds is not required, but is formed for the convenience of the production of the mold and the easy application of the pressure described later.

The metal mold portion of the molding apparatus is configured such that the mold clamping surface 21 of the movable mold 2 faces the mold clamping surface 11 of the fixed mold 1 shown in Fig. 1(a) or Fig. 1(b). When the movable mold is moved in the direction perpendicular to the mold clamping surface, the two positioning pins 28, 28 are inserted into the positioning pin through holes 18, 18 to position the mold with good precision.

Further, when the mold clamping faces of both sides are closely followed, the cavity portion 12 and the cavity portion 22 are tightly closed to form one cavity (symbol 3 to be described later). After the molding, in order to easily remove the molded article from the mold, a so-called draft angle is naturally added.

Although the above two figures are exemplified by a two-convex lens or a meniscus lens, for example, in the case of a plano-convex lens, when one surface is a planar lens, the cavity portion 12 corresponding to the planar side may be The cavity portion 22 is formed on a simple plane which is the same surface as the mold clamping surface.

As shown in Fig. 4, each lens mold portion is formed around the lens body 50 to form a flange 51 for mounting to the camera. The portion of the flange 51 that is connected to the gate portion 13 is formed in a shape in which a part of the circular shape is cut straight.

The reason for this is that the gate portion is cut as a useless portion after the forming, and some of the gate portion left by the cutting is accommodated in the hole of the flange accommodating portion prepared for mounting to the camera. .

Figure 3 is a cross-sectional view showing the mold clamping surface that has been clamped.

In Fig. 3, reference numeral 3 shows a cavity formed by the cavity portion 12 of the fixed die 1 and the cavity portion 22 of the movable die 2, a system showing the flow path portion 16 of the fixed die 1, and an activity. The flow path formed by the flow path portion 26 of the die 2.

In addition, for convenience of explanation, FIG. 3 shows a case where the fixed mold 1 shown in FIG. 1(a) is used.

The respective mold clamping faces 11, 21 of the fixed mold and the movable mold are respectively subjected to mirror finishing around at least the portion which is dug into the mold, so that the edge portion of the mold is correctly formed at an angle without causing deformation of the end surface. By this finishing, the edge portion of the molded article does not cause so-called burrs, and the airtightness is maintained so that the pressure does not escape when the gas pressure described later is applied.

As can be seen from the second and third figures, the movable mold 2 is only a part of the cavity portion and the flow path required for the product formation, and the other portions are formed into a flat surface.

However, as long as the gas to which the predetermined pressure is applied can be kept airtight, the plane other than the cavity and other portions to which the gas is applied may not necessarily have a high degree of mirror surface. If both surfaces are mirror-finished, molecular adsorption force is generated between the surface and the surface when the mold is opened, so that great force is required for separation, so in order to reduce the force, a rough surface can be made instead of the mirror surface if it is not necessary.

Next, a molding method using this mold will be described.

Fig. 4 is a view for explaining the relative relationship with a dispenser for injecting a liquid thermosetting resin. Fig. 4(a) is a side cross-sectional view of the center portion of the mold clamping, and Fig. 4(b) is a view showing a state in which the liquid resin is injected as viewed from the front surface of the fixed mold.

In Fig. 4, the main body of the fixed mold and the movable mold is omitted, and only the cavity 3 for injecting the liquid resin and the hollow portion connected to the cavity 3 are shown. The same is true in the following figures.

In Fig. 4, reference numeral 31 denotes a needle portion as a supply tube of a dispenser, a 32-series liquid resin, a 33-type inflowing liquid resin, and a 40-part recess formed as a mold by a fixed mold and a movable mold. That is, from the flow path to the space portion of the cavity.

The needle-like needle portion 31 projecting from the dispenser body (not shown) is inserted into a cylindrical hole portion of the flow path 4 formed by the mold clamping of the fixed mold and the movable mold. In the case of a dispenser, it is more convenient to use any one of the commercially available ones, but it is more convenient to use a meter attached. That is, since the body which is an effective part of the product is actively small, it is economical that the liquid resin flowing into the mold is also supplied in a quantitative manner.

When a predetermined amount of the liquid resin 32 is gradually supplied from the dispenser by its own weight drop, the resin is less viscous, and therefore reaches the gate from the flow path 4 via the flow path connecting portion 15 and the overflow portion 14. 13. Although the gate 13 is formed as a narrow passage, since the resin is low in viscosity, the resin does not cover the entire gate entrance as it flows slowly, but flows into the cavity 3 along the wall portion. When the amount of the resin is exhausted, the liquid resin 33 is filled in the cavity 3, and the gate 13 is also filled, and the injection is completed in a state where at least a part of the overflow portion 14 flows.

As is well known, as shown by the solid line L1 in Fig. 4, the reason why a small amount of excess resin is injected into the overflow portion 14 is to facilitate the application of pressure to the resin during molding and to remove the useless portion from the molded article after molding. In the case of an overflow, it is easier to determine the cutting position.

If necessary, the resin may flow into the entire overflow portion as indicated by the one-point chain line L2 in Fig. 4. At this time, in order to prevent the lens portion from coming into contact with the lens portion, a circular portion formed by the overflow portion directly above the lens can be used as the grip portion for cutting the gate portion.

The resin material is not hardened at the moment of exposure to a high temperature, and it takes some time to harden even if the predetermined hardening temperature inherent to the resin material is maintained. Therefore, the mold clamping system is preheated to the temperature required for the forming, and when the injection of the material is completed, the needle portion 31 is removed from the flow path 4, and a predetermined time is elapsed in a state where the gas pressure is applied to the resin by the molding pressure. For example, about 30 seconds.

If the material is hardened, the mold is opened and the molded article is taken out. In the case of the first example, since the depth of the excavation of the fixed mold cavity is deeper than that of the movable mold, the molded article is easily separated from the movable mold and remains in the fixed mold.

Therefore, some means is employed for the fixed mold to separate the molded article from the mold, but since the temperature of the mold is mostly about 200 degrees, it is difficult to directly take it out by hand. Depending on the shape of the molded product, it is also possible to use the method of blowing air. However, the lens of such a situation cannot be simply separated by the degree of blowing air, and when it is sprayed with air, there is a lens for the product. The risk of damage is caused, so air blowing cannot be used.

A method of supersonic vibration of a fixed mold is known as a method which can be used in such a case (see, for example, Japanese Laid-Open Patent Publication No. 2008-201122). That is, the fixed portion of the fixed mold is first formed into a horn shape suitable for ultrasonic vibration, and the ultrasonic generating means is connected. By generating an ultrasonic wave when the mold is opened, the ultrasonic wave is transmitted to the fixed mold, and the minute vibration is transmitted between the cavity portion of the fixed mold and the molded product, so that the fixation between the two is loose and easy to separate. When this state is obtained, the molded article can be taken out from the mold by, for example, an air type adsorption member.

After the mold is opened, the molded article can also be directly taken out by air suction means. As shown in Fig. 5(a), the air suction means 52 has an air suction source 53 and an adsorption pad 54 connected to the air suction source 53 as an adsorption member. At least the front end portion of the adsorption pad 54 is formed of a material that can ensure airtightness such as ruthenium rubber. After the mold is released, the adsorption pad 54 is adhered to the overflow portion 14 for adsorption, and the overflow portion belongs to even the adsorption. Scars are also a good part. Here, an example in which the resin flows into L2 of Fig. 4(b) is shown.

As shown in Fig. 5(b), the lens body 50 can be taken out without touching the lens body 50 by moving the adsorption pad 54 in the state of being adsorbed.

When the surface of the lens body 50 is directly adsorbed, even if the adsorption pad 54 is formed of a rubber-based material, it is liable to cause damage on the surface of the lens, which may become a fatal defect of the optical component after the damage is caused.

As described above, this problem can be solved by adsorbing the overflow portion 14. By making the overflow portion 14 an object to be adsorbed, the suction area can be secured by the overflow portion 14 regardless of the diameter of the lens body 50, so that a certain take-up property can be maintained.

Here, although the resin material is supplied so as to completely fill the overflow portion 14, it is not necessary to completely fill it as long as it does not cause an obstacle to adsorption.

Further, in the present embodiment, the gate portion 13 and the overflow portion 14 are designed to be separated, but the gate portion 13 may be designed to be an overflow portion to be adsorbed.

Next, the gas pressure applying step in the present embodiment will be described.

Fig. 6 is a view showing an embodiment in which a gas pressure as a molding pressure is applied after injection of a liquid resin.

In Fig. 6, reference numeral 34 denotes a gas pressure supply member, 35 is a packing for airtightness, 36 is a gas introduction pipe, and 37 is a pressure gas.

After the needle portion 31 of the dispenser is retracted, the gas pressure supply member 34 is automatically positioned at the upper portion of the flow path 4 and lowered. The heat-resistant circular spacer 35 is in contact with the periphery of the flow path 4, and is pressed against the upper surface of the mold by a pressing means (not shown). The driving source for raising and lowering the gas pressure supply member 34 may also be designed as a pressing means.

The pushing pressure is designed to be a pressure at which the gas does not escape relative to the gas pressure applied thereafter. A gas of a relatively high pressure (for example, several tens of kg/cm ² ) is supplied via a gas introduction pipe 36 from a pressure supply source (for example, a compressor such as a compressor).

The gas pressure supply member 34, the gasket 35, the gas introduction pipe 36, and the pressure supply source constitute a molding pressure applying means.

In terms of gas, the most common is air. In the case of air, there is no problem even if it is discharged directly into the atmosphere when no pressure is required. Nitrogen can also be used in addition to this. Nitrogen is also a major component of the air composition, so even if it is discharged into the atmosphere, it does not immediately cause major problems. However, as long as the gas pressure is reduced to the same pressure as the atmosphere before the mold is opened, only a small amount of nitrogen is released into the atmosphere. And thus better.

When the high-pressure gas is supplied from the flow path, the gas pressure reaches the uppermost portion of the liquid resin 33 filled in the cavity 3 or the like. At this time, since the resin material is still in a liquid state, the pressure supplied to the resin material acts on the entire material as well as the hydrostatic pressure.

As described above, since the mold system is maintained at a predetermined high temperature, if the material becomes high temperature, thermal hardening starts. In the meantime, it is preferable to keep the supply pressure at least constant, and in the same manner as in the case of injection molding of the thermoplastic resin, an additional pressure is applied when the material is collapsed by thermal hardening.

Depending on the material, there are also two stages of additional pressure applied, or vice versa. The pressurizing device is preferably configured to be pressurized and depressurized at any timing according to a predetermined program.

Figure 7 is a view for explaining the second embodiment of the present invention.

In the present embodiment, the concave portion 40 (hereinafter referred to as the mold unit 40) of the mold shown in Fig. 4 is a so-called majority mold structure formed in a plurality of metal molds. The dispenser for supplying the material is prepared in association with each of the mold units 40.

Although the gas pressure supply means is not shown, it may be prepared separately for all the mold units 40, and one of them may be prepared as a common device.

Fig. 8 is a view for explaining a third embodiment of the present invention.

In Fig. 8, reference numeral 38 shows a degassing hole for removing air in the mold, and L shows a liquid level above the injection material.

When the liquid resin is injected, a degassing hole 38 that communicates with the air outlet 38a is provided above the end portion before the insertion of the needle portion 31 of the dispenser. The lower portion of the degassing hole 38 communicates with the upper portion of the cavity 3. It is preferable that the degassing holes 38 are formed to be as fine as possible, but the size must be maintained such that the material does not rise due to the capillary phenomenon of the liquid resin material.

The upper end of the degassing hole may also extend over the mold, and is designed as an air outlet 38b as indicated by the dashed line in the figure.

Since the liquid material is only injected into the liquid level indicated by the figure as L (L1 or L2), the amount of material used for the addition of the degassing holes is only a small amount.

After the resin material is injected, when the gas pressure is applied, as illustrated in FIG. 6, as long as the gasket 35 covering the flow path 4 is used to be large, the gas pressure can be applied to the outlet 38b including the degassing hole 38. No special measures are required for the addition of the degassing holes.

By applying a gas pressure to both the degassing holes, the pressure does not escape from the degassing holes.

Figure 9 is a view for explaining a fourth embodiment of the present invention. Fig. 9(a) is a view in which the entire mold unit is inclined, and Fig. 9(b) is a view in which only the vicinity of the cavity portion is inclined.

In Fig. 9, reference numeral 39 indicates the flow of air from the cavity to the outside of the mold, and D indicates the insertion direction of the needle portion 31 connected to the dispenser.

In Fig. 9(a), the die unit 40' inclines the center line of the flow path 4 to the cavity 3 by a predetermined angle with respect to the vertical direction. The needle portion 31 of the dispenser is also inserted from the oblique direction as shown in Fig. D in accordance with the angle.

The liquid resin material 33, as shown by the broken line in the figure, enters the overflow portion 14 substantially along the wall surface when the liquid material flowing down reaches the bottom of the flow path 4, and flows into the gate portion 13 from the lower portion thereof. At this time, since the resin material flows from the one end of the gate portion 13 into the cavity 3, the air contained in the cavity 3 is dissipated to the upper portion along the flow direction 39 indicated by the dotted arrow in the figure.

This air is finally released to the outside through the gap between the flow path 4 and the needle portion 31. According to this configuration, the air in the cavity can be stably discharged without making the degassing hole. This method is also applicable to the configuration of the non-overflow portion as shown in Fig. 1(b).

Further, the upper portion of the cavity 3 is connected to the gate portion 13, but a part of the flange portion is cut into a linear portion, and the linear portion is set to be horizontal. The reason is that when the portion is inclined from the horizontal, there is a possibility that the uppermost portion of the gate is higher at the upper portion of the cavity, and the air remains in the highest portion of the cavity.

The predetermined angle at which the mold unit 40' is inclined is not particularly problematic as long as the flow direction of the gas flows in the gate portion when the liquid resin material flows down, but the width of the gate is limited when the tilt is excessively inclined. Therefore, the inclination angle is preferably designed to be about 10 degrees.

In the mold unit 40" shown in Fig. 2(b), the flow path 4 is oriented in the vertical direction as in Fig. 4, but only the overflow portion 14 and the cavity 3 are inclined at a predetermined angle from the vertical line. In this case, the needle portion 31 of the dispenser can be moved in the vertical direction as in the case of FIG. 4, and therefore the configuration is easy.

The liquid resin material 33 is in contact with the wall surface of the flow path connecting portion 15 when it reaches the bottom of the flow path 4, and then flows into the cavity 3 along the wall surface of the overflow portion 14. Therefore, the flow of the air flows out to the outside in the same flow manner as in Fig. 9(a).

In Figs. 8 and 9, only the mold units 40, 40', and 40" are shown for the sake of illustration, but a plurality of mold units can be freely inserted into one combined mold as shown in Fig. 7.

Further, in the first to third figures, although the mold clamping surface is circular, it may be formed into a square shape as needed.

Fig. 10 is a view for explaining a fifth embodiment of the present invention. Fig. 10(a) shows a side cross-sectional view of the mold clamping, and Fig. 10(b) shows a front view of the fixed mold.

Since the needle portion of the dispenser can be made thinner, in the present embodiment, an example in which the needle portion 31 having the outer diameter of the flow path 4 having a diameter of half or less is used is used.

The needle portion 31 is inserted near the bottom of the flow path portion 16 of the fixed mold 1 to inject a liquid resin material. As shown in FIG. 2(b), when the fixed mold is viewed from the front, the needle portion 31 is inserted from the center portion of the flow path portion 16 to one side.

The guide plate 16a is fixed in the vicinity of the center portion of the flow path portion 16, and when the needle portion 31 is inserted into the flow path 4, the guide plate 16a guides the needle to a predetermined position even if it is slightly offset, so that the needle portion 31 is attached thereto. Positioned from the central part to one side. When the liquid resin is injected in this state, the resin does not block all of the flow path connecting portion 15, and must flow from a portion to the overflow portion 14.

Therefore, the liquid resin also flows into the cavity through a portion of the gate 13, and the air in the cavity escapes to the outside through the right side of the guide 16a through the non-injected resin side on the right side in the drawing.

Figure 11 is a view for explaining a sixth embodiment of the present invention. Figure (a) shows a side cross-sectional view, and Figure (b) shows a front view of the fixed mold.

This embodiment is an embodiment in which a thinner needle portion is used. In this case, the case where the metal mold is not provided with the overflow portion is shown.

The outer diameter of the needle portion is designed to be, for example, 3 mm or less. As long as it is a lens having a flange having a diameter of several mm and having a shape of a thickness of about 2 mm, it is easy to manufacture the gate 13 into which the needle portion 31 can be inserted. This embodiment is an example that can be applied to such a condition.

The needle portion 31 of the dispenser is inserted into the gate 13 . The width of the gate is formed to be approximately twice the diameter of the needle portion 31. The liquid resin can be injected into the front end of the needle portion (the dot line L1 in Fig. 11), or can be injected near the bottom surface of the flow path portion 16 (the dot line L2 in Fig. 11).

The case where the guide portion 16a is provided for the needle portion is the same as that of the previous embodiment.

Fig. 12 and Fig. 13 are views for explaining the seventh embodiment of the present invention.

In the configuration shown in Fig. 8, in order to prevent generation of air bubbles inside the molded article, air in the cavity 3 is designed to escape from the upper portion of the cavity 3 via the degassing hole 38.

In the case where the molding pressure is applied in this case, a part of the liquid resin filled in the cavity 3 enters the degassing hole 38 due to the difference in the compression ratio of the air and the liquid resin. For example, in the case of an ultra-low viscosity resin having a viscosity of 1000 Pa ‧ or less, even a small hole is easily accessible.

When the liquid resin enters the degassing hole 38, it hardens directly, and in the next forming cycle, the degassing hole 38 is blocked and the degassing cannot be performed.

In the present embodiment, it is intended to solve such doubts. The resin molding apparatus used in the present embodiment includes a metal mold composed of the fixed mold 1 and the movable mold 2 shown in Figs. 1 and 2, and a resin material supply means 55 shown in Fig. 12; The resin material is supplied to the air suction means 56 which sucks the air in the mold unit 40 before being supplied to the vacuum state, and the forming pressure applying means shown in Fig. 6.

As shown in Fig. 12, the resin material supply means 55 has a sealing unit 57 for opening and closing the supply of the resin material, a nozzle 58 integrally formed at the lower end of the sealing unit 57, or a screw which is fixed by screwing; An air source 59 for driving the sealing unit 57; and a dispenser 60 for feeding the resin material into the nozzle 58 and the like.

An upper space 61 is formed in a casing 57a of the sealing unit 57; and a space 62 is fixed to the lower surface of the nozzle 58. A slider 63 that slides in an airtight state is provided in the upper space 61, and a pin 64 that seals the discharge port of the nozzle 58 is fixed to the slider 63.

The airtightness between the slider 63 of the upper space 61 and the outer casing 57a is maintained by an O ring 65, and the airtightness between the outer casing 57a and the pin 64 is held by the O-ring 66.

An air supply port 67 is formed above the slider 63 at the side of the upper space 61, and an air supply port 68 is formed below.

The compressed air is selectively supplied from the air source 59 to the air supply port 67 or the air supply port 68 via an air valve 69. This control of the air supply is performed by the control means 70.

A resin material supply port 71 is formed on the side surface of the lower space 62, and the resin material supply port 71 is connected to the dispenser 60. The dispenser 60 constantly supplies a fixed supply pressure by the pressurizing means 72.

The air suction means 56 has a skirt-like sealing member 73 integrally fixed to the outer surface of the nozzle 58 for sealing the upper surface of the flow path 4 in an airtight state, and an air suction source 74. The air suction source 74 is connected to a suction hole 75 formed on the side of the sealing member 73. The airtightness between the upper surface of the metal mold and the sealing member 73 is maintained by the O-ring 76.

The sealing unit 57, the nozzle 58, and the sealing member 73 are integrated into one unit, and are automatically positioned above or below the flow path 4 by an actuator (not shown) controlled by the control means 70.

When the unit is lowered by a predetermined amount, the front end of the nozzle 58 is inserted into the flow path 4, and the upper surface of the flow path 4 is kept airtight by the sealing member 73.

When the lowering of the above unit is completed, the control means 70 drives the air suction source 74 to suck the inside of the mold unit 40 into a vacuum state. At this point, the pin 64 is lowered to seal the discharge port of the nozzle 58 and the liquid resin in the nozzle 58 is not sucked (sent).

When the control means 70 judges that the suction is completed by a timer count or the like, the driving of the air suction source 74 is stopped to stop the suction, and the air supply source 59 and the air valve 69 are driven to drive the air supply port from the lower side. 68 is supplied with air to raise the pin 64. The slider 63 limits the upper limit position by a stopper (not shown).

When the pin 64 is raised, as shown in Fig. 13, the discharge port of the nozzle 58 is opened to supply the liquid resin.

The supply amount of the liquid resin can be adjusted by the closing timing of the pin 64.

When the supply step of the liquid resin is completed, the pin 64 is retracted to a predetermined retracted position by the actuator described above while the discharge port of the nozzle 58 is sealed.

Thereafter, the step of applying the forming pressure by the forming pressure applying means shown in Fig. 6 is started. The removal of the molded article after the molding is completed is the same as that shown in Fig. 5.

In the configuration in which the deaeration hole 38 shown in Fig. 8 is provided, the resin entering the degassing hole 38 cannot be prevented from being hardened by the heating of the mold. However, in the present embodiment, even if the discharge port of the nozzle 58 is not pinned. The part of the 64 seal is not affected by the heating of the mold without causing problems.

In the present embodiment, the air valve 69 is designed to selectively supply air to the two air supply ports by one air source 59. However, it is also possible to design the air supply individually by an independent air source.

Further, although the sealing member 73 is integrally provided to the nozzle 58, it may be designed to be standing on the upper portion of the flow path 4 and shared with the forming pressure applying means.

When a lens composed of a resin material is attached to a substrate using a reflowed solder prior to reflow, in the case of a conventional thermoplastic resin, the resin is thermally deformed during reflow.

In the case of the resin used in this manner, it is necessary to use a thermosetting resin, but the thermosetting resin having desired optical characteristics is expensive, and is often liquid.

When a liquid thermosetting resin is used, in the case where a degassing hole of a usual method of a thermoplastic resin is used for the liquid resin, when a molding pressure is applied to the resin material as in the prior art, since it is liquid, the resin is used. The material will leak through the degassing holes to the outside, creating the problem of not applying the desired pressure. Further, if the molding pressure is directly applied from the resin material as in the conventional art, a large amount of unnecessary portions are generated in the flow path portion, which is costly.

According to the present invention, since the molding die which does not require the degassing hole or the forming of the degassing hole, the forming pressure is applied to the liquid resin by using the gas, the unnecessary forming portion can be minimized and the desired forming pressure can be applied without flowing. The road part forms a useless resin material.

1. . . Fixed mode

2. . . Activity model

3. . . Cavity

4. . . Runner

11, 21. . . Molding surface

12, 22. . . Cavity

13. . . Gate (part)

14. . . Overflow area

15. . . Runner connection

16, 26. . . Flow department

16a. . . Guides

18. . . Locating pin through hole

28. . . Locating pin

31. . . As the needle of the supply tube

32. . . Liquid resin material

33. . . Injection of liquid resin material

34. . . Gas pressure supply member

35. . . pad

36. . . Gas introduction tube

37. . . gas

38. . . Degassing hole

38a, 38b. . . Air outlet

39. . . Flow direction

40. . . Concave part of the combined mold (mold unit)

50. . . Lens body

51. . . Flange

52. . . Air suction

53. . . Air suction source

54. . . Adsorption pad

55. . . Resin material supply means

56. . . Air suction

57. . . Sealing unit

57a. . . shell

58. . . As a nozzle for the supply pipe

59. . . Air source

60. . . Dispenser

61. . . Upper space

62. . . Lower space

63. . . Slider

64. . . Pin

65, 66, 76. . . O ring

67, 68. . . Air supply port

69. . . Air valve

70. . . Control means

71. . . Resin material supply port

72. . . Pressurization

73. . . Sealing member

74. . . Air suction source

75. . . Suction hole

Fig. 1 (a) and (b) are diagrams showing a fixed mold of a resin molding apparatus for carrying out the resin molding method according to the first embodiment of the present invention.

Fig. 2 is a view showing a movable mode for the resin molding apparatus.

Fig. 3 is a cross-sectional view showing the mold clamping surface on which the mold clamping has been performed.

Fig. 4 (a) and (b) are diagrams for explaining the relative relationship with the dispenser for injecting a liquid resin.

Fig. 5 (a) and (b) are diagrams showing the removal of the molded article after molding.

Fig. 6 is a view showing an embodiment in which a gas pressure is applied after injecting a liquid resin.

Figure 7 is a view for explaining the second embodiment of the present invention.

Fig. 8 is a view for explaining a third embodiment of the present invention.

Fig. 9 (a) and (b) are views for explaining a fourth embodiment of the present invention.

Fig. 10 (a) and (b) are views for explaining a fifth embodiment of the present invention.

Fig. 11 (a) and (b) are views for explaining a sixth embodiment of the present invention.

Figure 12 is a view for explaining the seventh embodiment of the present invention.

Fig. 13 is a view showing a state in which the discharge port of the nozzle is opened in the embodiment of Fig. 7.

13. . . Gate (part)

14. . . Overflow area

16. . . Flow department

33. . . Injection of liquid resin material

34. . . Gas pressure supply member

35. . . pad

36. . . Gas introduction tube

37. . . gas

Claims (8)

A resin molding method for molding a liquid thermosetting resin into a specific product, characterized in that: by combining the fixed mold and the movable mold with each other, a cavity corresponding to the product is formed, and the mold is located at the mold. a gate at the upper portion of the hole, and a flow passage that communicates with the gate and opens on the upper surface side of the mold; and the supply pipe is provided so as to supply the liquid thermosetting resin from the flow channel and fill the cavity And in a state in which the discharge port located below the supply pipe is closed, the upper portion of the flow path including the supply pipe is made airtight, and the air from the flow path to the space of the cavity is sucked. The space is in a vacuum state, and the discharge port of the supply pipe is opened in the vacuum state, and the thermosetting resin is filled in the cavity; after the filling, the space is restored to an atmospheric pressure state, and the space is transmitted through the space. The air is applied to the thermosetting resin by gas pressure from the upper surface of the thermosetting resin, and the mold is heated to cure the thermosetting resin. The resin molding method according to claim 1, wherein a needle that opens and closes the discharge port by moving in a vertical direction is provided in the supply pipe, and the discharge port is closed by the pin The air in the aforementioned space is sucked down. The resin molding method according to claim 1 or 2, wherein the supply pipe is integrally provided with a sealing member for covering an upper portion of the flow passage, and a lower portion of the supply pipe is inserted into the flow passage, and The upper portion of the flow path is sealed in an airtight state with the sealing member as it is inserted, and the air of the space is sucked by a gas suction source via a suction hole formed in the sealing member. The resin molding method according to claim 3, wherein after the thermosetting resin is filled in the cavity, a unit in which the supply pipe and the sealing member are integrated is provided from the metal mold. After the upper portion of the flow path is opened by the evacuation, the forming pressure applying means seals the upper portion of the flow path into an airtight state, and the step of applying the forming pressure by the gas pressure is started. A resin molding apparatus comprising: a metal mold, which is formed by combining each side of a fixed mold and a movable mold to form a cavity corresponding to the product, a gate located at an upper portion of the cavity, and a connection with the gate a flow passage opened to the upper side of the mold; the supply pipe has a discharge port at the lower side, and the liquid thermosetting resin is supplied from the flow path to be filled in the cavity; and the air suction means includes the supply The upper portion of the flow passage of the tube is airtight, and the air from the flow passage to the space of the cavity is sucked to make the space into a vacuum state; and the forming pressure applying means applies the forming of the thermosetting resin. a pressure; and the discharge port of the supply pipe is opened while the space is in a vacuum state, and the thermosetting resin is filled in the cavity, and after the filling, the space is restored to an atmospheric pressure state, and The forming pressure applying means transmits air to the thermosetting resin from the upper surface of the thermosetting resin by applying pressure to the thermosetting resin, and heats the mold. The thermosetting resin is cured. The resin molding apparatus according to claim 5, wherein a needle that opens and closes the discharge port by moving in a vertical direction is provided in the supply pipe, and the discharge port is closed by the pin The air in the aforementioned space is sucked down. The resin molding apparatus according to claim 5, wherein the air suction means has a sealing member having a shape covering an upper portion of the flow path and integrally formed in the supply pipe; and a suction hole formed in the suction hole The sealing member is connected to the flow passage via a space above the flow passage; and a gas suction source is connected to the suction hole; wherein the supply pipe and the sealing member are configured as the sealing member The lower portion of the supply pipe is inserted into the flow passage to seal the upper portion of the flow passage to an airtight state. The resin molding apparatus according to claim 7, wherein after the thermosetting resin is filled in the cavity, the unit in which the supply pipe and the sealing member are integrated is retracted from the mold, and After the upper portion of the flow path is opened, the forming pressure applying means seals the upper portion of the flow path into an airtight state, and starts the step of applying a forming pressure by gas pressure.