TWI386130B - Etching device and method for etching printed circuit board - Google Patents

Description

Etching device and method of etching the same

The present invention relates to the field of circuit board manufacturing, and more particularly to an etching apparatus for a circuit board etching process and a method of etching a circuit board.

With the rapid development of electronic technology, the integration of circuit boards is getting higher and higher, and the conductive lines of circuit boards are made more and more fine. This requires that the dimensional tolerance of the conductive lines of the same circuit board be as small as possible, that is, etching in the etching process. The effect needs to be as consistent as possible.

Etching lines are more automated and less costly, and are widely used in circuit board production. The process uses a leveling roller to drive the circuit substrate, and the etching liquid is sprayed onto the circuit substrate by a linear nozzle etching device provided with a plurality of nozzles. However, when the circuit substrate is etched by using the etching device, since the number of nozzles and the length of each nozzle are the same, the etching liquid flows out of the board from the edge region of the circuit board, so that the etching rate of the etching liquid in the edge region of the circuit board is higher. It is fast, and accumulates in the central area of the circuit board to form a pool, which produces a pool effect. The pool effect causes the etching liquid in the central region of the circuit substrate to be renewed slowly, and the accumulated etching liquid film reduces the amount of bite on the line, and the etching of the line is prone to occur, and the etching liquid in the edge portion of the circuit substrate flows at a high speed. The update is faster and the line is prone to erosion. That is, the pool effect may cause uneven etching of the circuit substrate, and in particular, it may easily lead to uneven line width of the finally produced circuit board, and the conductive lines of the central area are connected. In order to obtain sufficient line width, extra line width has to be reserved for the line in the edge area of the board, which greatly reduces the line density of the board.

In view of the above, it is necessary to provide an etching apparatus and a method of etching a circuit board which can improve the etching uniformity of a circuit board.

Hereinafter, a method for improving an etching uniformity etching apparatus and an etching circuit board will be described by taking an embodiment as an example.

An etching apparatus for spraying an etching solution to etch a circuit board, the etching apparatus comprising a plurality of nozzles, a plurality of sensors, and a controller. The plurality of nozzles are arranged in parallel in a direction perpendicular to the conveying direction of the circuit board, and each of the nozzles includes a nozzle and a valve disposed thereon, and the number of nozzles on each nozzle gradually increases along the conveying direction of the circuit board. The distance between two adjacent nozzles on each nozzle is equal, and the nozzles on each of the nozzles are symmetrically distributed with respect to a line perpendicular to the plurality of nozzles, and the valves are used to control the same Whether the nozzle of the nozzle sprays the etchant. The plurality of sensors are in one-to-one correspondence with the plurality of nozzles, and the sensors are configured to sense a positional relationship between the circuit board and the nozzle corresponding to the sensor. The controller is electrically connected to the plurality of sensors and the plurality of valves, wherein the controller is configured to control opening and closing of the valve corresponding to the sensor according to the sensing result of the sensor, thereby controlling the valve Whether the nozzle located in the same nozzle sprays the etchant.

A method of etching a circuit board, comprising the steps of: providing the etching device; providing a circuit board having a first surface to be etched; opposing a first surface of the circuit board opposite the nozzle of the plurality of nozzles, and Driving the circuit board to move, perpendicular to the moving direction of the circuit board, the circuit board has a first side and a second side opposite to each other, the controller is configured to have the first side passing through each of the nozzles The distance between the first side and each of the nozzles and the distance between the second side and the second side of each of the nozzles before each of the nozzles are sensed by a plurality of sensors Corresponding nozzles are in position relationship with the first side and the second side, and transmit the result of the sensing to the controller, when the first side passes the nozzle corresponding to each sensor The first side of the nozzle corresponding to the sensor is greater than the first side of the controller, and the first side of the nozzle corresponding to the sensor is sprayed corresponding to the sensor. When the distance of the tube is reached, the controller controls the opening of the valve corresponding to the sensor when The second side of the nozzle is not passed before the nozzle corresponding to the sensor, and the distance between the second side and the nozzle corresponding to the sensor is less than the second side of the controller. When the detector corresponds to the distance between the second side of the nozzle and the nozzle corresponding to the sensor, the controller controls the closing of the valve corresponding to the sensor.

Compared with the prior art, the present invention provides an etching apparatus including a nozzle on a plurality of nozzles in an isosceles triangle or an isosceles trapezoidal arrangement, and each nozzle is provided with a valve capable of performing a circuit board etching process. By controlling whether the nozzle sprays the etching liquid, the nozzle can be controlled to spray the etching liquid on the surface of the circuit board to improve the etching uniformity of the circuit board. The circuit board etching method provided by the technical solution is that when the circuit board is etched, the middle portion of the circuit board is sprayed with the etching liquid for a long time, and the edge region of the circuit board is sprayed with the etching liquid for less time, so that the middle portion of the circuit board can be made. Can be in contact with more fresh etchant to prevent pooling in the middle of the board. The edge of the board is sprayed with less etchant time, which prevents over-etching on the edge of the board, which can effectively improve the uniformity of board etching.

The etching apparatus and the method of etching the circuit board provided by the present technical solution will be described in detail below with reference to the plural drawings and the plural embodiments.

Referring to FIG. 1 , an etching apparatus 100 according to a first embodiment of the present invention includes an infusion device 110 , a first nozzle 120 , a second nozzle 130 , a third nozzle 140 , a fourth nozzle 150 , and a fifth nozzle . The sixth nozzle 170, the first sensor 181, the second sensor 182, the third sensor 183, the fourth sensor 184, the fifth sensor 185, the sixth sensor 186, Controller 190 and transmitting device 101.

In the present embodiment, the infusion device 110 includes an infusion tube 111. The infusion tube 111 is for supplying an etchant to the first nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170. Of course, a valve can be installed on the infusion tube 111 for controlling whether the etching liquid flows into the infusion tube 111 and adjusting the flow rate of the etching liquid in the infusion tube 111.

The first nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 are disposed in parallel with each other and are in communication with the infusion tube 111. In this embodiment, the first nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 are all perpendicular to the infusion tube 111 and have the same length. The lengths of the first nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 are equal to or slightly larger than the length of the circuit board to be etched. The length of the etched circuit board. When the board is etched, the infusion tube 111 extends in the same direction as the board, and the board is transferred from the first nozzle 120 to the sixth nozzle 170.

In the embodiment, the first nozzle 120 includes a first nozzle 121, a first valve 122 and a first tube 123. The first nozzle 121 is disposed at an intermediate portion of the first pipe body 123. The first valve 122 is mounted on the first tube body 123 and located between the infusion tube 111 and the first nozzle 121 for controlling whether the etching liquid is supplied from the infusion tube 111 into the first nozzle 120, thereby controlling the first nozzle 121. Whether to spray the etchant.

The second nozzle 130 includes two second nozzles 131, a second valve 132, and a second tube body 133. The two second nozzles 131 are disposed at an intermediate portion of the second tube body 133, and the two second nozzles 131 are symmetrically disposed with respect to the center of the second tube body 133 in the longitudinal direction. The second valve 132 is mounted on the second tube body 133 and located between the second nozzle 131 adjacent to the infusion tube 111 and the infusion tube 111 for controlling whether liquid is supplied from the infusion tube 111 to the second tube body 133, thereby controlling Whether the two second nozzles 131 spray the etching liquid.

The third nozzle 140 includes three third nozzles 141, a third valve 142, and a third tube body 143. The three third nozzles 141 are disposed in the middle portion of the third tube body 143, and the three third nozzles 141 are symmetrically disposed with respect to the center of the third tube body 143 in the longitudinal direction. Preferably, the distance between the adjacent two third nozzles 141 is equal to the distance between the two second nozzles 131. The third valve 142 is mounted on the third tube body 143 and located between the third nozzle 141 and the infusion tube 111 adjacent to the infusion tube 111 for controlling whether liquid is supplied from the infusion tube 111 to the third tube body 143, thereby controlling Whether the three third nozzles 141 spray the etching liquid.

The fourth nozzle 150 includes four fourth nozzles 151, a fourth valve 152, and a fourth tube 153. The four fourth nozzles 151 are disposed in the middle portion of the fourth pipe body 153, and the four fourth nozzles 151 are symmetrically disposed with respect to the center of the fourth nozzle 150 in the longitudinal direction. The four fourth nozzles 151 are equally spaced. Preferably, the distance between the adjacent two fourth nozzles 151 is equal to the distance between the two second nozzles 131. The fourth valve 152 is mounted on the fourth pipe body 153 and located between the fourth nozzle 151 and the infusion pipe 111 adjacent to the infusion pipe 111 for controlling whether liquid is supplied from the infusion pipe 111 to the fourth pipe body 153, thereby controlling Whether the four fourth nozzles 151 spray the etching liquid.

The fifth nozzle 160 includes five fifth nozzles 161, a fifth valve 162, and a fifth tube body 163. The five fifth nozzles 161 are disposed on the fifth tube body 163, and the five fifth nozzles 161 are symmetrically disposed with respect to the center of the longitudinal direction of the fifth nozzle tube 160. Preferably, the distance between the adjacent two fifth nozzles 161 is equal to the distance between the two second nozzles 131. The fifth valve 162 is mounted on the fifth tube body 163, and the fifth valve 162 is located between the fifth nozzle 161 and the infusion tube 111 near the infusion tube 111 for controlling whether to supply liquid from the infusion tube 111 to the fifth tube body 163. Thereby controlling whether the fifth fifth nozzle 161 sprays the etching liquid.

The sixth nozzle 170 includes six sixth nozzles 171, a sixth valve 172 and a sixth tubular body 173. The six sixth nozzles 171 are disposed on the sixth tubular body 173, and the six sixth nozzles 171 are disposed on the sixth tubular body. The center of 173 is symmetrically set. Preferably, the distance between the adjacent two sixth nozzles 171 is equal to the distance between the two second nozzles 131, and the distance between the two outermost two sixth nozzles 171 is close to the length of the circuit board to be etched. The sixth valve 172 is installed between the sixth nozzle 171 and the infusion tube 111 near the infusion tube 111 for controlling whether to supply liquid from the infusion tube 111 to the sixth tube 173, thereby controlling six Whether the sixth nozzle 171 sprays the etching liquid.

The first valve 122, the second valve 132, the third valve 142, the fourth valve 152, the fifth valve 162, and the sixth valve 172 may be pneumatic valves and are all electrically connected to the controller 190. The first nozzle 121, the second nozzle 131, the third nozzle 141, the fourth nozzle 151, the fifth nozzle 161, and the sixth nozzle 171 are all disposed downward to face the surface of the circuit board to be etched. The distribution areas of the first nozzle 121, the second nozzle 131, the third nozzle 141, the fourth nozzle 151, the fifth nozzle 161, and the sixth nozzle 171 are substantially isosceles triangles. The number of nozzles is not limited to the six provided in the embodiment, and in actual production, different numbers can be set according to the etching requirements. The number of the first nozzle 121, the second nozzle 131, the third nozzle 141, the fourth nozzle 151, the fifth nozzle 161, and the sixth nozzle 171 is not limited to the number provided in the embodiment, and the first nozzle 121 and the second nozzle 131, the number of the third nozzle 141, the fourth nozzle 151, the fifth nozzle 161, and the sixth nozzle 171 can be set to other numbers according to the size and shape of the actual circuit board product, as long as the transmission along the circuit board can be ensured. In the direction, the nozzle of the plurality of nozzles is generally an inverted isosceles triangle or an isosceles trapezoid. The positions of the first nozzle 121, the second nozzle 131, the third nozzle 141, the fourth nozzle 151, the fifth nozzle 161, and the sixth nozzle 171 on the corresponding nozzles are not limited to the middle as long as each nozzle is provided. The nozzles are all symmetrically distributed about the same straight line perpendicular to the plurality of nozzles.

The first sensor 181 corresponds to the first nozzle 120 for sensing the positional relationship between the circuit board to be etched and the first nozzle 120, and transmits the sensing result to the controller 190. In this embodiment, the first sensor 181 is mounted on the first nozzle 120. The second sensor 182 corresponds to the second nozzle 130 for sensing the positional relationship between the etched circuit board and the second nozzle 130 and transmitting the sensing structure to the controller 190. The second sensor 182 is mounted on the second nozzle 130. The third sensor 183 corresponds to the third nozzle 140 for sensing the positional relationship between the circuit board to be etched and the third nozzle 140, and transmits the sensing result to the controller 190. The third sensor 183 is mounted on the third nozzle 140. The fourth sensor 184 corresponds to the fourth nozzle 150 for detecting the positional relationship between the circuit board to be etched and the fourth nozzle 150, and transmitting the sensing result to the controller 190. The fourth sensor 184 is mounted on the fourth nozzle 150. The fifth sensor 185 corresponds to the fifth nozzle 160 for detecting the positional relationship between the circuit board to be etched and the fifth nozzle 160, and transmits the sensing result to the controller 190. The fifth sensor 185 is mounted on the fifth nozzle 160. The sixth sensor 186 corresponds to the sixth nozzle 170 for sensing the positional relationship between the sixth nozzle 170 and the circuit board to be etched, and transmits the sensing result to the controller 190. The sixth sensor 186 is mounted on the sixth nozzle 170.

The controller 190 is electrically connected to the first sensor 181, the second sensor 182, the third sensor 183, the fourth sensor 184, the fifth sensor 185, and the sixth sensor 186, and is controlled. The setting value of each nozzle and the circuit board relative position is set according to the first sensor 181, the second sensor 182, the third sensor 183, the fourth sensor 184, the first The relationship between the sensing result of the five sensors 185 and the sixth sensor 186 and the set value corresponds to controlling the first valve 122, the second valve 132, the third valve 142, the fourth valve 152, and the fifth valve. The opening and closing of the 162 and the sixth valve 172 control whether the first nozzle 121, the second nozzle 131, the third nozzle 141, the fourth nozzle 151, the fifth nozzle 161, and the sixth nozzle 171 spray the etching liquid. Specifically, the controller 190 controls the first valve 122 to be turned on or off according to the sensing result of the first sensor 181. The controller 190 controls the opening or closing of the second valve 132 according to the sensing result of the second sensor 182. The controller 190 controls the opening or closing of the third valve 142 according to the sensing result of the third sensor 183. The controller 190 controls the opening or closing of the fourth valve 152 according to the sensing result of the fourth sensor 184. The controller 190 controls the opening or closing of the fifth valve 162 according to the sensing result of the fifth sensor 185. The controller 190 controls the opening or closing of the sixth valve 172 according to the sensing result of the sixth sensor 186.

The conveying device 101 is configured to carry a circuit board for etching and to drive the circuit board to move therein, so that the circuit board sequentially passes through the first nozzles 120 to the sixth nozzles 170. In this embodiment, the conveying device 101 is a plurality of sets of rollers disposed parallel to the extending direction of the first nozzle 120, and the plurality of sets of rollers are parallel to each other and located in the first nozzle 120, the second nozzle 130, the third nozzle 140, and the Below the four nozzles 150, the fifth nozzle 160 and the sixth nozzle 170. Each set of rollers includes an upper roller 1011 and a lower roller 1012. The upper roller 1011 and the lower roller 1012 are oppositely disposed, and the distance between the upper roller 1011 and the lower roller 1012 is slightly smaller than the thickness of the circuit board to be transmitted. The plane of the upper roller 1011 of the plurality of sets of rollers is parallel to the plane of the first nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160 and the sixth nozzle 170. The plane of the lower roller 1012 of the plurality of sets of rollers is parallel to the plane of the upper roller 1011 of the plurality of sets of rollers. By driving the upper roller 1011 and the lower roller 1012 to rotate in opposite directions, the circuit board sandwiched between the upper roller 1011 and the lower roller 1012 is moved by the friction of the upper roller 1011 and the lower roller 1012, and is moved from a group. The roller moves to the adjacent lower set of rollers such that the circuit board sequentially passes through the first nozzles 120 to the sixth nozzles 170.

Referring to FIG. 2, an etching apparatus 200 according to a second embodiment of the present technical solution is provided. The structure of the etching apparatus 200 is similar to that of the etching apparatus 100 provided by the first embodiment of the present technical solution. The etching device 200 also includes an infusion device 210, a first nozzle 220, a second nozzle 230, a third nozzle 240, a fourth nozzle 250, a fifth nozzle 260, a sixth nozzle 270, and a first sensor. 281. The second sensor 282, the third sensor 283, the fourth sensor 284, the fifth sensor 285, the sixth sensor 286, the controller 290, and the transmitting device 201. The first sensor 281, the second sensor 282, the third sensor 283, the fourth sensor 284, the fifth sensor 285, the sixth sensor 286, the controller 290, and the transmitting device 201 and the first sensor 181, the second sensor 182, the third sensor 183, the fourth sensor 184, the fifth sensor 185, and the sixth sense in the etching apparatus 100 of the first embodiment The structure, arrangement and function of the detector 186, the controller 190 and the transmission device 101 are basically the same.

In this embodiment, the infusion device 210 includes a first infusion tube 211 and a second infusion tube 212 that are disposed in parallel with each other. The extending direction of the first infusion tube 211 and the second infusion tube 212 is parallel to the conveying direction of the circuit board. The distance between the first infusion tube 211 and the second infusion tube 212 is slightly larger than the length of the circuit board to be etched. The first infusion tube 211 and the second infusion tube 212 are both used for the first nozzle 220, the second nozzle 230, the third nozzle 240, the fourth nozzle 250, the fifth nozzle 260, and the sixth nozzle 270. Supply etchant.

The arrangement of the first nozzle 220, the second nozzle 230, the third nozzle 240, the fourth nozzle 250, the fifth nozzle 260, and the sixth nozzle 270 is the same as that of the etching apparatus 100 in the first embodiment. The nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 are disposed in a similar manner, and a first nozzle 221 and two second nozzles 231 are disposed. The three third nozzles 241, the four fourth nozzles 251, the five fifth nozzles 261, and the six sixth nozzles 271 are also disposed in the first nozzle 121, the second nozzle 131, and the third in the first embodiment. The arrangement of the nozzle 141, the fourth nozzle 151, the fifth nozzle 161, and the sixth nozzle 171 is similarly similar. The difference is that, in this embodiment, the first nozzle 220, the second nozzle 230, the third nozzle 240, the fourth nozzle 250, the fifth nozzle 260 and the sixth nozzle 270 are all connected to the first Between the infusion tube 211 and the second infusion tube 212. One end of the first nozzle 220, one end of the second nozzle 230, one end of the third nozzle 240, one end of the fourth nozzle 250, one end of the fifth nozzle 260, and one end of the sixth nozzle 270 are both An infusion tube 211 is in communication. The other end of the first nozzle 220, the other end of the second nozzle 230, the other end of the third nozzle 240, the other end of the fourth nozzle 250, the other end of the fifth nozzle 260, and the sixth nozzle 270 The other end is in communication with the second infusion tube 212. A first valve 222 is disposed at each end of the first nozzle 220. The two first valves 222 are located at two sides of the first nozzle 221 for controlling whether the first infusion tube 211 and the second infusion tube 212 are in the first direction. A nozzle 220 supplies an etchant. Both ends of the second nozzle 230 are provided with a second valve 232, and the two second nozzles 231 are located between the two second valves 232. A third valve 242 is disposed at each end of the third nozzle 240, and three third nozzles 241 are located between the two third valves 242. A fourth valve 252 is disposed at both ends of the fourth nozzle 250, and four fourth nozzles 251 are located between the two fourth valves 252. A fifth valve 262 is disposed at both ends of the fifth nozzle 260, and five fifth nozzles 261 are located between the two fifth valves 262. A sixth valve 272 is disposed at both ends of the sixth nozzle 270, and six sixth nozzles 271 are located between the two sixth valves 272.

The first sensor 281, the second sensor 282, the third sensor 283, the fourth sensor 284, the fifth sensor 285, and the sixth sensor 286 are all in electrical communication with the controller 290. The controller 290 controls the opening and closing of the two first valves 222 according to the sensing result of the first sensor 281, thereby controlling whether the first nozzle 221 sprays the etching liquid; according to the sensing result of the second sensor 282, controlling Opening and closing of the two second valves 232, thereby controlling whether the second nozzle 231 sprays the etching liquid; according to the sensing result of the third sensor 283, controlling the opening and closing of the two third valves 242, thereby controlling the third nozzle 241 whether to spray the etching liquid; according to the sensing result of the fourth sensor 284, controlling the opening and closing of the two fourth valves 252, thereby controlling whether the fourth nozzle 251 sprays the etching liquid; sensing according to the fifth sensor 285 As a result, the opening and closing of the two fifth valves 262 are controlled to control whether the fifth nozzle 261 sprays the etching liquid; and according to the sensing result of the sixth sensor 286, the opening and closing of the two sixth valves 272 are controlled, thereby controlling Whether the sixth nozzle 271 sprays the etching liquid.

In the embodiment, the infusion device 210 includes a first infusion tube 211 and a second infusion tube 212, and each of the nozzles is provided with two valves, so that the spraying liquid can be improved when the nozzle is sprayed on the corresponding nozzle. The injection pressure is used to improve the quality of the board etching.

Referring to FIG. 3, a third embodiment of the present invention provides a method for etching a circuit board. The following uses an etching apparatus 100 according to the first embodiment of the present technical solution as an example. The method for etching a circuit board includes the following steps. :

In a first step, an etching apparatus 100 is provided.

In the second step, the circuit board 10 to be etched is provided.

The circuit board 10 to be etched is substantially rectangular and has a length substantially equal to the length of the first nozzle 120. In this embodiment, the circuit board 10 has a length of 61 cm and a width of 53 cm. The circuit board 10 has a first surface 11 which is a copper foil surface. Along the length of the circuit board 10, the circuit board 10 has opposing first side edges 12 and second side edges 13.

In the third step, the transfer board 10 is sequentially passed through the first nozzles 120 to the sixth nozzles 170 and etches the circuit board 10.

The circuit board 10 is placed on one side of the conveying device 101 near the first nozzle 120 such that the first surface 11 of the circuit board 10 is upward, and the surface opposite to the first surface 11 is in contact with the conveying device 101, the first side 12 and The second side 13 is substantially parallel to the first nozzle 120, and the center of the first nozzle 120 in the longitudinal direction corresponds to the center of the longitudinal direction of the circuit board 10. The first side 12 is adjacent to the first nozzle 120 and the second side 13 is remote from the first nozzle 120. The circuit board 10 placed in the plurality of sets of rollers is moved from the first nozzle 120 to the sixth nozzle 170 at a set rate by driving the plurality of sets of rollers to rotate.

In this embodiment, the controller 190 is configured with a first nozzle 120, a second nozzle 130, a third nozzle 140, a fourth nozzle 150, a fifth nozzle 160, a sixth nozzle 170, and a circuit board 10. The set value of the distance between the first side 12 and the second side 13. That is, the distance between the first side 12 of the circuit board 10 and the nozzle after passing through a nozzle and the second side 13 of the circuit board 10 are not passed through the nozzle before the nozzle. The first side 12 of the circuit board 10 is gradually increased from the first nozzle 120 to the sixth nozzle 170 by the distance between the nozzles and the nozzles, and the second side 13 of the circuit board 10 is 13 The set value of the distance from the respective nozzles before passing through the respective nozzles is also gradually increased from the first nozzle 120 to the sixth nozzle 170. The first sensor 181, the second sensor 182, the third sensor 183, the fourth sensor 14, the fifth sensor 185, and the sixth sensor 186 sense the first side 12 and the first The positional relationship of the two side edges 13 with their corresponding nozzles and the sensing signals are transmitted to the controller 190. When the first sensor 181, the second sensor 182, the third sensor 183, the fourth sensor 14, the fifth sensor 185, and the sixth sensor 186 sense the first of the circuit board 10 When one side 12 passes the corresponding nozzle and the distance from the nozzle is greater than a set value, the controller 190 controls the opening of the corresponding valve of the corresponding nozzle. For example, when the first sensor 181 senses that the first side 12 of the circuit board 10 passes through the first nozzle 120 and the distance from the first nozzle 120 is greater than a set value, the controller 190 controls the first valve. 122 is turned on. When the first sensor 181, the second sensor 182, the third sensor 183, the fourth sensor 14, the fifth sensor 185, and the sixth sensor 186 sense the first of the circuit board 10 When the distance between the two side edges 13 and the nozzle before the corresponding nozzle is less than the set value, the controller 190 controls the closing of the corresponding valve of the corresponding nozzle. For example, when the second sensor 182 senses that the first side 12 of the circuit board 10 passes through the second nozzle 130 and the distance from the second nozzle 130 is greater than a set value, the controller 190 controls the second valve. 132 is closed. The controller 190 controls the opening and closing of the respective nozzles corresponding to the valves, thereby controlling the area where each nozzle sprays the etching liquid on the first surface 11 of the circuit board 10.

In this embodiment, the first side 12 of the circuit board 10 and the first nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 The set values of the distance are +10 cm (cm), +16 cm, +21 cm, +24 cm, +27 cm, +28 cm; the second side 13 of the circuit board 10 and the first nozzle 120, the second nozzle 130, The set values of the distances of the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 are -0 cm, -6 cm, -10 cm, -13 cm, -15 cm, -18 cm, respectively. +" represents the corresponding distance is the distance between the first side 12 of the circuit board 10 and the nozzle after passing the corresponding nozzle, "-" represents the corresponding distance is the second side 13 of the circuit board 10 does not pass before the corresponding nozzle and spray The distance of the pipe. When the distance between the first side 12 and the first nozzle 120 is 10 cm after the first side 12 passes under the first nozzle 120, the first sensor 181 sends a sensing signal to the controller 190. The controller 190 controls the first valve 122 to be opened such that the first nozzle 121 of the first nozzle 120 sprays an etchant into the intermediate portion of the circuit board 10. The circuit board 10 continues to move in the transmitting device 101. When the second side 13 of the circuit board 10 reaches the first nozzle 120, the controller 190 receives the sensing signal of the first sensor 181 and controls the first valve 122. Closing, whereby the first nozzle 121 of the first nozzle 120 stops spraying the etchant into the intermediate portion of the circuit board 10. When the first side 12 passes under the second nozzle 130 and the level distance between the first side 12 and the second nozzle 130 is 16 cm, the controller 190 receives the sensing signal of the second sensor 182. The second valve 132 is controlled to be opened, so that the second nozzle 131 of the second nozzle 130 sprays the etching liquid toward the intermediate portion of the circuit board 10. When the second side 13 of the circuit board 10 has not passed the second nozzle 130, and the horizontal distance between the second side 13 and the second nozzle 130 is 6 cm, the controller 190 receives the second sensor 182. After sensing the signal, the second valve 132 is controlled to be closed, so that the second nozzle 131 of the second nozzle 130 stops spraying the etching liquid toward the intermediate portion of the circuit board 10. When the first side 12 passes under the third nozzle 140 and the first side 12 and the third nozzle 140 are at a level of 21 cm, the controller 190 receives the sensing signal of the third sensor 183, and then controls The third valve 142 is opened such that the third nozzle 141 of the third nozzle 140 sprays an etchant onto the first surface 11 of the circuit board 10. When the second side 13 of the circuit board 10 does not pass through the third nozzle 140 and the level of the third nozzle 140 is 10 cm, the controller 190 receives the sensing signal of the third sensor 183 and controls the third. The valve 142 is closed so that the third nozzle 141 of the third nozzle 140 stops spraying the etchant into the intermediate portion of the circuit board 10. When the first side 12 passes under the fourth nozzle 150 and the first side 12 and the fourth nozzle 150 are at a level of 24 cm, the controller 190 receives the sensing signal of the fourth sensor 184, and then controls The fourth valve 152 is opened such that the fourth nozzle 151 of the fourth nozzle 150 sprays the etching liquid onto the first surface 11 of the circuit board 10. When the second side 13 of the circuit board 10 does not pass through the fourth nozzle 150 and the level of the fourth nozzle 150 is 13 cm, the controller 190 receives the sensing signal of the fourth sensor 184 and controls the fourth. The valve 152 is closed so that the fourth nozzle 151 of the fourth nozzle 150 stops spraying the etchant into the intermediate portion of the circuit board 10. When the first side 12 passes under the fifth nozzle 160 and the first side 12 and the fifth nozzle 160 are at a level of 27 cm, the controller 190 receives the sensing signal of the fifth sensor 185, and then controls The fifth valve 162 is opened such that the fifth nozzle 161 of the fifth nozzle 160 sprays an etchant liquid onto the first surface 11 of the circuit board 10. When the second side 13 of the circuit board 10 does not pass through the fifth nozzle 160 and the level of the fifth nozzle 160 is 15 cm, the controller 190 receives the sensing signal of the fifth sensor 185 and controls the fifth. The valve 162 is closed so that the fifth nozzle 161 of the fifth nozzle 160 stops spraying the etchant into the intermediate portion of the circuit board 10. When the first side 12 passes under the sixth nozzle 170 and the horizontal distance between the first side 12 and the sixth nozzle 170 is 28 cm, after the controller 190 receives the sensing signal of the sixth sensor 186, The sixth valve 172 is controlled to be opened such that the sixth nozzle 171 of the sixth nozzle 170 sprays the etching liquid onto the first surface 11 of the circuit board 10. When the second side 13 of the circuit board 10 does not pass through the sixth nozzle 170 and the horizontal distance from the sixth nozzle 170 is 18 cm, the controller 190 receives the sensing signal of the sixth sensor 186 and controls the sixth. The valve 172 is closed so that the sixth nozzle 171 of the sixth nozzle 170 stops spraying the etchant into the intermediate portion of the circuit board 10.

Referring to FIG. 4, the first nozzle 120, the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 are set to the first surface 11 of the circuit board 10. The areas where the etching liquid is sprayed are A1, A2, A3, A4, A5, and A6, respectively, and the direction of the arrow is the conveying direction of the board 10. Then, from A1 to A6, the length in the moving direction of the circuit board is sequentially decreased, and the length in the moving direction perpendicular to the circuit board is sequentially increased, that is, the first nozzle 120 sprays the etching liquid on the first surface 11. The length of the area in the moving direction of the circuit board is greater than that of the second nozzle 130, the third nozzle 140, the fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 spraying the etching liquid to the first surface 11 The length of the region in the moving direction of the circuit board, the length of the first nozzle 120 spraying the etching liquid to the first surface 11 in the moving direction perpendicular to the circuit board is smaller than the rear second nozzle 130 and the third nozzle 140 The fourth nozzle 150, the fifth nozzle 160, and the sixth nozzle 170 spray the region of the etching liquid toward the first surface 11 in a direction perpendicular to the moving direction of the circuit board.

The value of the distance between the first side 12 of the circuit board 10 set by the controller 190 and the nozzle after passing through each nozzle and the second side 13 of the circuit board 10 are not passed through the front of the nozzle and the spray The value of the distance of the tube is not limited to the value provided in the embodiment. The above values can be set according to the actual circuit board size and the setting of the multiple nozzles. As long as the distance from the first nozzle 120 to the sixth nozzle 170 is ensured, the set value of the distance between the first side 12 of the circuit board 10 and the nozzle after passing through each nozzle is gradually increased, and the second side of the circuit board 10 The setting value of the distance between the edge 13 and the nozzle before the nozzle 13 is gradually increased, so as to ensure that the central portion of the circuit board 10 is in contact with the fresh etching liquid for a long time, the edge region of the circuit board and the fresh etching liquid. Short contact time.

The etching device provided by the technical solution comprises: the nozzles on the plurality of nozzles are arranged in an isosceles triangle or an isosceles trapezoid, and each nozzle is provided with a control valve, which can be controlled by the control valve during the etching process of the circuit board Whether the nozzle sprays the etching liquid, thereby controlling the area where the nozzles spray the etching liquid on the surface of the circuit board, so as to improve the etching uniformity of the circuit board. The circuit board etching method provided by the technical solution is that when the circuit board is etched, the middle portion of the circuit board is sprayed with the etching liquid for a long time, and the edge region of the circuit board is sprayed with the etching liquid for less time, so that the middle portion of the circuit board can be made. It is able to contact more fresh etchant to prevent pooling in the middle of the board. The edge of the board is sprayed with less etchant time, which prevents over-etching on the edge of the board, which can effectively improve the uniformity of board etching.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧ boards

11‧‧‧ first surface

12‧‧‧ first side

13‧‧‧Second side

100,200‧‧‧ etching device

101, 201‧‧‧ conveyor

1011‧‧‧Upper wheel

1012‧‧‧Down roller

110, 210‧‧‧ Infusion device

111‧‧‧Infusion tube

120, 220‧‧‧ first nozzle

121, 221‧‧‧ first nozzle

122, 222‧‧‧ first valve

123‧‧‧First body

130, 230‧‧‧ second nozzle

131, 231‧‧‧ second nozzle

132, 232‧‧‧ second valve

133‧‧‧Second body

140, 240‧‧‧ third nozzle

141, 241‧‧‧ third nozzle

142, 242‧‧‧ third valve

143‧‧‧3rd body

150, 250‧‧‧ fourth nozzle

151, 251‧‧‧ fourth nozzle

152, 252‧‧‧ fourth valve

153‧‧‧4th body

160, 260‧‧‧ fifth nozzle

161, 261‧‧‧ fifth nozzle

162, 262‧‧‧ fifth valve

163‧‧‧ fifth pipe

170, 270‧‧‧ sixth nozzle

171, 271‧‧‧ sixth nozzle

172, 272‧‧‧ sixth valve

173‧‧‧6th body

181, 281‧‧‧ first sensor

182, 282‧‧‧ second sensor

183, 283‧‧‧ third sensor

184, 284‧‧‧ fourth sensor

185, 285‧‧‧ fifth sensor

186, 286‧‧‧ sixth sensor

190, 290‧‧ ‧ controller

211‧‧‧First infusion tube

212‧‧‧Second infusion tube

FIG. 1 is a schematic diagram of an etching apparatus provided in a first embodiment of the present technical solution.

2 is a schematic view of an etching apparatus provided in a second embodiment of the present technical solution.

FIG. 3 is a schematic diagram of an etching device provided by an etching apparatus according to a third embodiment of the present technical solution.

FIG. 4 is a schematic view showing a change of a region in which the nozzles are sprayed with an etching liquid on the surface of the circuit board according to the third embodiment of the present technical solution.

100‧‧‧ etching device

101‧‧‧Transfer device

1011‧‧‧Upper wheel

1012‧‧‧Down roller

110‧‧‧Infusion device

111‧‧‧Infusion tube

120‧‧‧First nozzle

121‧‧‧first nozzle

122‧‧‧First valve

123‧‧‧First body

130‧‧‧second nozzle

131‧‧‧second nozzle

132‧‧‧Second valve

133‧‧‧Second body

140‧‧‧ third nozzle

141‧‧‧ third nozzle

142‧‧‧ third valve

143‧‧‧3rd body

150‧‧‧four nozzle

151‧‧‧four nozzle

152‧‧‧fourth valve

153‧‧‧4th body

160‧‧‧ fifth nozzle

161‧‧‧ fifth nozzle

162‧‧‧ fifth valve

163‧‧‧ fifth pipe

170‧‧‧ sixth nozzle

171‧‧‧ sixth nozzle

172‧‧‧ sixth valve

173‧‧‧6th body

181‧‧‧first sensor

182‧‧‧Second sensor

183‧‧‧ third sensor

184‧‧‧ fourth sensor

185‧‧‧ fifth sensor

186‧‧‧ sixth sensor

190‧‧‧ Controller

Claims (10)

An etching device for spraying an etchant to etch a circuit board, the etching device comprising:
a plurality of nozzles arranged in parallel in a direction perpendicular to the conveying direction of the circuit board, each of the nozzles including a nozzle and a valve disposed thereon, and the number of nozzles on each nozzle is gradually increased along the conveying direction of the circuit board The distance between two adjacent nozzles on each nozzle is equal, and the nozzles on each of the nozzles are symmetrically distributed with respect to a line perpendicular to the plurality of nozzles, and the valve is used to control the same Whether the nozzle of the same nozzle sprays the etching liquid;
a plurality of sensors, the plurality of sensors are in one-to-one correspondence with the plurality of nozzles, wherein the sensor is configured to sense a positional relationship between the circuit board and the nozzle corresponding to the sensor; and a controller, the controller and the controller The plurality of sensors and the plurality of valves are electrically connected, and are configured to control opening and closing of the valve corresponding to the sensor according to the sensing result of the sensor, thereby controlling whether the nozzle located in the same nozzle as the valve is sprayed Etching solution. The etching apparatus according to claim 1, wherein the nozzles of the plurality of nozzles are arranged in an isosceles triangle or an isosceles trapezoidal arrangement along a conveying direction of the circuit board. The etching apparatus of claim 1, wherein the etching apparatus further comprises a conveying apparatus disposed parallel to the plurality of nozzles and opposite to the plurality of nozzles for conveying the board movement for etching . The etching apparatus of claim 1, wherein the etching apparatus further comprises at least one infusion tube, wherein the infusion tube is in communication with the plurality of nozzles for supplying an etching liquid to the plurality of nozzles . The etching apparatus of claim 4, wherein the etching apparatus comprises an infusion tube, each of the nozzles is provided with one of the valves, and the valve is disposed on the infusion tube and the valve Located between the nozzles of the same nozzle. The etching apparatus of claim 4, wherein the etching apparatus comprises two infusion tubes, wherein the plurality of infusion tubes are connected between the two infusion tubes, and each of the nozzles is provided with two a valve, the two valves being respectively disposed on opposite sides of the nozzle of the same nozzle as the two valves. The etching apparatus according to any one of claims 1 to 6, wherein the circuit board has a first side and a second side perpendicular to a conveying direction thereof, and the controller has a setting a distance between the first side and each of the nozzles after the first side passes through each of the nozzles, and the second side does not pass the second side of each of the nozzles and each of the nozzles The distance of the nozzle. The etching apparatus of claim 7, wherein the first side of the controller is set to pass through the first side and each of the nozzles in sequence along the conveying direction of the circuit board. The distance between the nozzles is gradually increased, and the second side of the controller is disposed along the conveying direction of the circuit board, and the distance between the second side of each of the nozzles and each of the nozzles is also gradually increase. A method of etching a circuit board, comprising the steps of:
Providing an etching apparatus as described in any one of claims 1 to 6;
Providing a circuit board having a first surface to be etched;
Opposing the first surface of the circuit board opposite the nozzle of the plurality of nozzles and driving the circuit board to move, the circuit board having a first side and a second side opposite to the direction of movement of the circuit board, the controller a distance between the first side and each of the nozzles after the first side passes through each of the nozzles, and a second side of the second side before each of the nozzles is not The distance between each of the nozzles is sensed by a plurality of sensors to sense the positional relationship between the corresponding nozzles and the first side and the second side, and the result of the sensing is transmitted to the controller. After the first side passes through the nozzle corresponding to each sensor, the first side of the nozzle corresponding to the sensor has a larger distance than the first side set by the controller, and corresponds to the sensor. When the distance between the first side of the nozzle and the nozzle corresponding to the sensor, the controller controls the opening of the valve corresponding to the sensor, when the second side does not pass the corresponding sensor a distance between the nozzle and the second side of the nozzle corresponding to the sensor is less than the number of the controller setting When the distance from the nozzle side of the sensor corresponding to a second side of said sensor corresponding to the front of the nozzle has not elapsed, the controller controls the valve corresponding to the closing of said sensor. The method of etching a circuit board according to claim 9, wherein the first side of the controller is set to sequentially pass the first side of each of the nozzles along a conveying direction of the circuit board. The distance from each of the nozzles is gradually increased, and the second side of the controller is disposed in the direction of the transmission of the circuit board without passing through the second side of each of the nozzles and each of the nozzles. The distance has also gradually increased.