TWI385480B - Method for manufacturing photo mask assembly - Google Patents

Description

Method for preparing photomask set

The present invention relates to the field of exposure technology, and in particular, to a method for preparing a photomask set with simple alignment.

The conductive circuit of the printed circuit board is firstly transferred to a photosensitive material such as a dry film on the substrate by an exposure and development process, and then formed on the substrate by an etching process. Need a line. See literature, Moon-Youn Jung, Won Ick Jang, Chang Auck Choi, Myung Rae Lee, Chi Hoon Jun, Youn Tae Kim; Novel lithography process for extreme deep trench by using laminated negative dry film resist; 2004: 685-688; 2004. 17th IEEE International Conference on Micro Electro Mechanical Systems.

The exposure process is generally carried out in an exposure machine in which a transparent mask mounted on the exposure machine is provided with a pattern to be produced, and after exposure, the pattern provided by the collection of the mask is transferred to a circuit board fixed to the exposure machine. Then, the subsequent development and etching process of the circuit board can complete the conductive circuit on the circuit board.

The reticle collection is usually obtained by fixing the periphery of the reticle required for exposure to the glass substrate with an adhesive tape. Since the positioning groove is formed around the glass substrate, the photomask can be aligned with the glass substrate by fixing the photomask to the area enclosed by the positioning groove. Then, the glass substrate attached with the reticle is mounted on the exposure machine, and the reticle is further fine-tuned to the electricity by the accurate alignment of the exposure machine. The board is positioned corresponding to the exposure operation of the board. Therefore, the second precise alignment is based on the fine adjustment operation of the first reticle and glass substrate alignment. However, if the reticle of different sizes is used to expose the circuit board, a plurality of glass substrates are required, each of which has a positioning groove corresponding to each size reticle; or only a glass substrate is used, the glass substrate A positioning groove corresponding to each size mask is separately provided. The method for preparing the reticle assembly described above not only increases the manufacturing cost of the reticle assembly, but also affects the exposure quality by opening a plurality of positioning grooves.

Therefore, it is necessary to provide a method of preparing a reticle assembly to solve the aforementioned problems and reduce the manufacturing cost of the reticle assembly.

A method of preparing a reticle assembly will be described below by way of examples.

A method of fabricating a reticle assembly, comprising the steps of: first, providing a transparent substrate comprising a first surface and a second surface. Next, a reference plate is attached to and completely covers the first surface, and the reference plate is provided with a positioning base point. Providing a patterned mask, the patterned mask is provided with an positioning point corresponding to the positioning base point, the positioning point of the patterned mask is aligned with the positioning base point of the reference plate, and the patterned mask is attached On the second surface.

Compared with the prior art, the reticle assembly is prepared by using a reference plate as a reference in the process of aligning the patterned reticle with the transparent substrate, and determining whether the patterned reticle is patterned by whether the reticle and the reference plate are aligned Alignment with the transparent substrate is accurate. The process of positioning in the groove on the transparent substrate in the prior art is avoided, the alignment and the exposure process are simplified, and the cost is saved.

The method for preparing the reticle collection provided by the embodiments of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

Please refer to FIG. 1 to FIG. 4 , a method for preparing a reticle set provided by an embodiment of the present technical solution, which includes the following steps:

In the first step, the transparent substrate 10, the reference plate 20, and the patterned photomask 30 are provided.

Referring to FIG. 1, the transparent substrate 10 may be made of glass, resin or other light transmissive material having opposite first and second surfaces 11 and 12. The transparent substrate 10 can be provided with a vacuum adsorption device for adsorbing and fixing the patterned mask 30 to the transparent substrate 10, or a substrate having a positioning groove in the prior art. In this embodiment, the transparent substrate 10 is a plate body in which no vacuum adsorption device is provided and no positioning groove is provided.

The reference plate 20 is provided with a plurality of positioning base points 21. The positioning base point 21 serves as a reference for the alignment of the patterned mask 30 and the transparent substrate 10, and can be disposed at any position of the reference plate 20 according to actual exposure requirements for use in different exposure requirements. In the present embodiment, the reference plate 20 is a mask that is not patterned. Preferably, the positioning base point 21 is disposed at least at a central position of the reference plate 20. In the present embodiment, the size of the reference plate 20 is the same as the size of the transparent substrate 10.

Of course, the size of the reference plate 20 may be larger than the size of the transparent substrate 10. In this case, as long as the area of the transparent substrate 10 is marked by light drawing or other means on the reference plate 20, the positioning base point 21 is set. It can be in this area.

The patterned mask 30 has a pattern required for exposure (using virtual in FIG. 1) Line representation). The patterned mask 30 is provided with positioning points 31 corresponding to the positioning base points 21 of the reference plate 20. The number of the positioning points 31 and the number of the positioning base points 21 may be determined according to actual needs, as long as there is a positioning base point 21 corresponding to the positioning points 31.

In this embodiment, the number of the positioning points 31 is smaller than the number of the positioning base points 21, that is, the positioning points 31 correspond to the partial positioning base points 21 on the reference plate 20. An locating point 31 is disposed at the center of the patterned reticle 30.

In the second step, the reference plate 20 and the photomask 30 are respectively attached to the first surface 11 and the second surface 12 of the transparent substrate 10, so that the positioning point 31 of the patterned mask 30 is aligned with the positioning base point 21 of the reference plate 20.

Referring to FIG. 2 , the positioning base point 21 of the reference plate 20 faces the transparent substrate 10 , and the periphery of the reference plate 20 is adhered to the first surface 11 by an adhesive, so that the positioning base point 21 can be observed from the second plane 12 . . Since the reference plate 20 is the same size as the transparent substrate 10, the reference plate 20 attached to the first surface 11 completely covers the transparent substrate 10, and the reference plate 20 is located at the center of one of the centering points 21 and the center of the transparent substrate 10. coincide.

The positioning base point 21 of the first surface 11 is observed through the transparent substrate 10 from the second surface 12, and is aligned with the positioning point 31 of the patterned mask 30 and the positioning base point 21 corresponding to the positioning point 31 on the reference plate 20, and patterned. The photomask 30 is attached to the second surface 12 of the transparent substrate 10. Thereby, the patterned photomask 30 is fixed to the center of the transparent substrate 10 by the reference plate 20.

In the third step, the reference plate 20 (shown in FIG. 3) is removed from the first surface 11 of the transparent substrate 10.

In the fourth step, the surface of the patterned mask 30 facing away from the transparent substrate 10 is bonded. Protective film 40.

In this embodiment, the transparent substrate 10 to which the patterned mask 30 is attached is placed on the laminating machine, and the protective film 40 is pressed against the surface of the patterned mask 30 facing away from the transparent substrate 10 by a laminating machine. The protective film 40 is completely covered by the patterned mask 30 to protect the pattern of the patterned mask 30 from being damaged during subsequent fabrication. The protective film 40 and the patterned photomask 30 are bonded together by an adhesive. Preferably, the protective film 40 has a thickness of from 2 micrometers to 6 micrometers.

The size of the protective film 40 can be designed according to actual needs. Referring to FIG. 4 and FIG. 5, this embodiment lists two kinds of bonding protective films 40. In the first case, the size of the protective film 40 is equal to the size and shape of the patterned mask 30, and the protective film 40 and the patterned mask 30 are in contact with and adhered to the surface of the transparent substrate 10, so that the protective film 40 completely covers the pattern. The reticle 30 faces away from the surface of the transparent substrate 10 (as shown in FIG. 4). In the second case, the size of the protective film 40 is larger than the size of the patterned mask 30, and the protective film 40 is simultaneously in contact with the surface of the patterned mask 30 facing away from the transparent substrate 10 and the second surface 12 located around the patterned mask 30. And the protective film 40 completely covers the surface of the patterned mask 30 facing away from the transparent substrate 10 and the side of the patterned mask 30 (as shown in FIG. 5), so that the patterned mask 30 and the transparent substrate 10 are protected. The film 40 is in close contact.

Finally, the transparent substrate 10 to which the patterned mask 30 and the protective film 40 are attached is mounted on an exposure machine to perform an exposure operation on the circuit board or other substrate using an exposure machine.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only the preferred embodiment of the present invention. In this way, it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Transparent substrate

11‧‧‧ first surface

12‧‧‧ second surface

20‧‧‧ reference board

21‧‧‧ Positioning point

30‧‧‧ patterned mask

31‧‧‧Location points

40‧‧‧Protective film

1 is a schematic structural view of a transparent substrate, a reference plate, and a patterned reticle according to an embodiment of the present technical solution.

2 is a schematic structural view of a transparent substrate bonding reference plate and a patterned photomask provided by an embodiment of the present technical solution.

3 is a schematic structural view of the transparent substrate with the reference plate removed in FIG. 2.

4 is a schematic structural view showing the first case in which the surface of the patterned photomask attached to the transparent substrate is bonded to the protective film in FIG.

Figure 5 is similar to Figure 4 but showing a cross-sectional view of another protective film.

10‧‧‧Transparent substrate

11‧‧‧ first surface

12‧‧‧ second surface

20‧‧‧ reference board

21‧‧‧ Positioning point

30‧‧‧ patterned mask

31‧‧‧Location points

Claims (9)

A method for preparing a reticle assembly, comprising the steps of: providing a transparent substrate comprising a first surface and a second surface; attaching a reference plate to and completely covering the first surface, the reference plate is provided with positioning Base point; providing a patterned mask, the patterned mask is provided with an positioning point corresponding to the positioning base point, the positioning point of the patterned mask is aligned with the positioning base point of the reference plate, and the patterned mask is Attached to the second surface. The method of preparing a reticle assembly according to claim 1, wherein a reference plate having the same size as the transparent substrate is attached to and completely covers the first surface. The method for preparing a reticle assembly according to claim 1, wherein the method of preparing the reticle assembly further comprises the step of removing the reference plate attached to the first surface. The method for preparing a reticle assembly according to claim 1, wherein the method for preparing the reticle assembly further comprises attaching a protective film to the surface of the patterned reticle facing away from the transparent substrate. The method for preparing a reticle assembly according to claim 4, wherein the protective film is attached to the surface of the patterned reticle facing away from the transparent substrate such that the protective film completely covers the surface of the patterned reticle facing away from the transparent substrate. The method for preparing a reticle assembly according to claim 4, wherein the protective film is attached to the surface of the patterned reticle facing away from the transparent substrate and the second surface around the patterned reticle, so that the protective film completely covers the pattern The reticle faces away from the surface of the transparent substrate and the side of the patterned reticle. The method for preparing a reticle collection according to claim 1, wherein The transparent substrate to which the patterned mask and the protective film are attached is attached to an exposure machine for exposure. The method for preparing a reticle assembly according to claim 1, wherein a central position of the reference plate is provided with a positioning base point, and a central position of the patterned reticle is provided with an positioning point corresponding to the positioning base point, and is aligned The positioning base point and the positioning point fix the patterned mask to the center of the transparent substrate. The method for preparing a reticle assembly according to claim 1, wherein the protective film is pressed against the patterned reticle by a laminator.