TWI384542B - Processing device and surface treatment fixture - Google Patents

Description

Processing device and surface treatment fixture

The present invention relates to a processing apparatus for treating a surface of a workpiece with a treatment liquid, and a surface treatment fixture suitable for the treatment.

In recent years, IC cards or mobile phones have been required to be thinner, smaller, and lighter. To meet this requirement, the semiconductor wafer to be mounted must also be a thin semiconductor wafer. Therefore, the thickness (film thickness) of the semiconductor wafer which is the basis of the semiconductor wafer is currently 125 μm to 150 μm, but it is required to be 25 μm to 50 μm for the next generation wafer.

One of the methods for obtaining the semiconductor wafer having the above film thickness is the following thinning method. In this method, first, a sheet of a semiconductor wafer, a support plate, or the like is attached via an adhesive tape or an adhesive having an adhesive layer on both sides. This support plate serves to protect the thinned semiconductor wafer. Further, in a state of being protected by a support plate, the semiconductor wafer is polished by a grinder or the like to form a thinned semiconductor wafer. Finally, the support plate is peeled off from the thinned semiconductor wafer.

However, in the above thinning method, when a method of attaching a support plate and a semiconductor wafer via an adhesive is used, when the support plate is separated from the semiconductor wafer, an adhesive remains on the semiconductor wafer. Therefore, it is necessary to remove the adhesive to form a clean surface on the upper surface of the semiconductor wafer. Here, the thinned semiconductor wafer is generally cut in a state of being attached to a dicing tape fixed to a dicing frame, and is divided into individual wafers. The thinned semiconductor wafer is attached to the dicing tape in a state of being bonded to the support plate, and then the support plate is peeled off, and then the adhesive on the semiconductor wafer is removed. When the dicing tape is used, since the surface area is generally larger than that of the semiconductor wafer, the exposed surface of the dicing tape is provided on the outer periphery of the semiconductor wafer. When such a target object is subjected to a method of dropping a treatment liquid (solvent) while rotating the object to be processed, or a normal cleaning process of immersing the semiconductor wafer, the exposed surface of the dicing tape is also treated with the treatment liquid. deal with. That is, the surface to be processed is not only the surface of the semiconductor wafer, but also the exposed surface of the dicing tape provided on the outer periphery of the semiconductor wafer is processed. According to the type of the treatment liquid at this time, the dicing tape may be deteriorated. Therefore, it is desired to develop a treatment method for removing the adhesive on the semiconductor wafer while protecting the dicing tape.

The present invention has been made in view of the above problems, and an object of the invention is to provide a treatment apparatus and a surface treatment fixture which perform treatment using a treatment liquid only on a surface to be treated.

(1) The processing apparatus according to the present invention includes: a mounting table on which a target object is placed; a surface treatment jig that processes the processed surface of the object to be processed by a treatment liquid; and a supply means Providing a treatment liquid to the surface treatment jig; a recovery means for recovering a treatment liquid supplied to the surface treatment fixture; and a separation maintaining means for maintaining the surface treatment fixture in a state of being separated from the surface to be treated Further, the surface treatment jig includes: a facing surface facing the surface to be processed; and the processing liquid supplied from the supply means is held between the facing surface and the surface to be processed, and Processing the processing unit of the processed surface.

The processing apparatus of the present invention includes a surface treatment jig that can supply and recover the treatment liquid to the surface treatment jig while maintaining the state of being separated from the surface to be treated. Therefore, the treatment liquid can be held only between the surface to be treated and the opposite surface (and the surface to be treated), and the treatment liquid is not scattered to the surface to be treated. As a result, according to the processing apparatus of the present invention, it is possible to perform processing only on the field in which the processing is to be performed among the processed surfaces. Further, since the surface treatment jig does not come into contact with the object to be treated, the possibility of damage to the object to be processed can be reduced.

(2) In the processing apparatus of the present invention, preferably, the processing unit includes: a protruding portion that protrudes from the opposite surface toward the object to be processed, and a processing liquid between the protruding portion and the processed surface The surface tension is to maintain the supplied processing liquid between the opposing surface and the surface to be processed.

According to this aspect, the processing liquid can be surely held between the surface to be processed and the opposing surface by the provision of the protruding portion.

(3) In the processing apparatus of the present invention, preferably, the surface of the protruding portion facing the processed surface is a flat surface, and the distance between the protruding portion and the processed surface is maintained at 3 mm by the separation maintaining means. the following.

According to this aspect, the surface tension of the treatment liquid can be used to more reliably hold the treatment liquid between the surface to be treated and the opposing surface of the surface treatment fixture. Therefore, it is possible to suppress the treatment liquid from scattering to the outside of the treated surface.

(4) In the treatment apparatus of the present invention, it is preferable to provide a drying means for drying the treated surface after the treatment.

According to this aspect, even if the processing liquid cannot be completely recovered, the surface to be treated can be dried.

(5) In the processing apparatus of the present invention, it is preferable that the drying means is an inert gas supply means for supplying an inert gas to the surface to be treated.

According to this aspect, the treatment liquid can be scattered and dried by blowing an inert gas.

(6) In the processing apparatus of the present invention, it is preferable that the drying means is a suction means for sucking the treatment liquid remaining on the surface to be treated.

(7) In the processing apparatus of the present invention, it is preferable that the suction means is performed by the surface treatment jig, and the remaining means is used to attract the residue by stopping the supply of the treatment liquid from the supply means. The treatment liquid on the surface to be treated.

According to this aspect, the surface treatment jig can be used for both the treatment and the drying.

(8) In the processing apparatus of the present invention, it is preferable that the area of the opposing surface is smaller than the area of the surface to be processed.

(9) In the processing apparatus of the present invention, the separation preventing means can move the surface treatment fixture to the object to be processed.

According to this aspect, even if the area of the opposing surface is smaller than the area of the processed surface, the entire area of the processed surface can be processed.

(10) In the processing apparatus of the present invention, the separation preventing means can move the surface treatment fixture from the approximate center of the object to the outer edge.

In addition, in this form, the "general center" means the periphery including a center and a center. According to this aspect, in particular, the entire surface of the object to be processed can be processed by moving the surface treatment jig from the center to the outer periphery while rotating the object to be processed.

(11) In the processing apparatus of the present invention, the mounting table can rotate the object to be processed placed thereon.

According to this aspect, when the area of the surface to be processed is larger than the opposing surface, the efficiency of the processing can be improved.

(12) The surface treatment jig of the present invention is a surface treatment jig for treating a surface to be treated of a target object with a treatment liquid, characterized in that it has a treatment portion which is provided to maintain a separation from the treated surface At the time of facing the opposite surface of the surface to be processed, the processing liquid supplied between the opposing surface and the surface to be processed is held to process the surface to be processed.

The surface treatment jig of the present invention can hold the treatment liquid between the treated surface and the opposite surface. Therefore, under the treatment using the surface treatment jig of the present invention, the treatment using the treatment liquid can be carried out only in the desired field. As a result, even if the surface on which the treatment is not desired is provided at the same level as the surface to be processed, the treatment in which the treatment liquid is scattered on the surface can be suppressed.

Other objects, features, and advantages of the present invention will be apparent from the description. Further, the advantages of the present invention can be understood from the following description of the drawings.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(processing device)

The processing apparatus 100 according to the present embodiment will be described with reference to Figs. 1 to 3 . Fig. 1 is a cross-sectional view showing the main part of a processing apparatus 100 according to the present embodiment. Fig. 2 is a cross-sectional view showing a portion A of Fig. 1 in more detail. Fig. 3 is a plan view showing a part of a surface treatment jig provided in the processing apparatus of the embodiment. In addition, FIG. 3 is a plan view showing the opposing surface (surface facing the surface to be processed) of the surface treatment jig.

As shown in Fig. 1, the processing apparatus 100 includes a mounting table 10 on which the object 18 to be processed is placed, and a surface treatment jig 20 for treating the processed surface 18a of the object 18 to be treated with a treatment liquid, and a surface treatment treatment The supply means 30 for supplying the treatment liquid 20, the recovery means 40 for recovering the treatment liquid supplied to the surface treatment fixture 20, and the separation maintaining means 50 for maintaining the surface treatment fixture 20 in a state of being separated from the surface to be treated 18a. Further, the processing apparatus 100 is provided with a washing cup 16 which is disposed to surround the object 18 to be processed.

The mounting table 10 is, for example, capable of attracting and holding the object 18 to be processed. Further, the mounting table 10 is provided on the rotatable rotating shaft 12 with the center as the axis, and the rotating motor 14 is attached to the rotating shaft 12. With this configuration, the object 18 can be rotated with the perpendicular line passing through the approximate center of the processed surface 18a as an axis.

The surface treatment jig 20 has a facing surface 22a facing the surface to be processed 18a, and a task for holding the processing liquid supplied from the supply means 30 between the opposing surface 22a and the surface to be processed 18a. In the processing apparatus of the present embodiment, the surface treatment jig 20 is not particularly limited as long as it can volatilize the above task.

Hereinafter, an example of the structure of the surface treatment jig 20 will be described with reference to FIGS. 2 and 3. As shown in FIG. 2, the surface treatment jig 20 is a processing unit 22 that holds the supplied processing liquid to process the to-be-processed surface 18a. The processing unit 22 has a facing surface 22a that faces the processed surface 18a when the surface treatment jig 20 is kept away from the surface to be processed 18a. In other words, according to the surface treatment jig 20 of the present embodiment, the treatment liquid can be held between the treatment portion 22 and the opposing surface 22a.

The processing unit 22 is provided with a first through hole 26 and a second through hole 28 . The first through hole 26 is a hole for supplying the processing liquid to the processing unit 22, and the second through hole 28 is a hole for collecting the processing liquid of the processing unit 22. In Fig. 2, the arrows of the respective broken lines indicate the flow direction of the treatment liquid. In addition, in FIG. 2 and FIG. 3, it is shown that the first through-holes 26 are provided, and the number of the second through-holes 28 is four. However, the present invention is not limited thereto. For example, six or eight second through holes may be provided. . Further, the arrangement of the first through holes 26 and the second through holes 28 is not limited to the arrangement shown in the drawings. The planar shape of the first through hole 26 and the second through hole 28 may be circular, elliptical or rectangular, and is not particularly limited as long as it does not interfere with the flow of the treatment liquid. The opening diameters of the first through hole 26 and the second through hole 28 are also the same.

Moreover, it is preferable that the processing unit 22 includes a protruding portion 24 that protrudes from the opposing surface 22a toward the object 18 to be processed. As shown in FIGS. 2 and 3, the protruding portion 24 is preferably provided on the peripheral edge of the opposing surface 22a. In this way, the processing unit 22 can hold the supplied processing liquid more reliably between the processed surface 18a by providing the protruding portion 24. The maintenance of the treatment liquid is carried out by using the surface tension of the treatment liquid.

Further, when the bottom surface of the protruding portion 24 (the surface facing the surface to be processed 18a) is a flat surface, it is preferable that the distance between the protruding portion 24 and the surface to be processed 18a is maintained at 0.5 mm by the separation maintaining means 50 to be described later. Above, 3 mm or less, more preferably in the range of 0.5 to 1.5 mm. Further, the distance between the protruding portion 24 and the surface to be processed 18a is not limited to the range in which it is not in contact, and may be closer to 0 mm. Thereby, the treatment liquid can be more reliably maintained.

The surface treatment jig 20 of the present embodiment is preferably a treatment of the object 18 to be processed having a larger area than the area of the facing surface 22a (processing area of the processing unit 22). When the area of the processed surface 18a is larger than the area of the opposing surface 22a, the distance between the processed surface 18a and the processing portion 22 can be adjusted by the separation maintaining means 50, and the processing liquid can be held by the surface tension. Specifically, when the opposing surface 22a and the processed surface 18a (processing area of the processing unit 22) have a circular shape, the diameter of the opposing surface 22a is preferably smaller than the radius of the processed surface 18a.

The supply means 30 is a task of supplying the treatment liquid to the treatment portion 22 of the surface treatment fixture 20. The supply means 30 includes, for example, a processing liquid tank 34 for storing the processing liquid, a supply pipe 32 connected to the processing liquid tank 34, and a pump (not shown) for supplying the processing liquid to the surface treatment fixture 22. Further, the supply pipe 32 is connected to the first through hole 26. Then, the treatment liquid is supplied to the treatment unit 22 via the treatment liquid tank 34, the supply pipe 32, and the first through hole 26.

The suction means 40 is a task of recovering the treatment liquid from the treatment portion 22 of the surface treatment jig 20. The suction means 40 is, for example, a recovery pipe 42 including a treatment liquid, a recovery tank 44 for recovering the treated liquid, a pump or an ejector for sucking the treatment liquid, and the like. Further, the pump or the ejector may be disposed at the rear of the recovery tank. Further, the recovery pipe 42 is connected to the second through hole 28. Then, the processing liquid supplied to the processing unit 22 can be recovered in the recovery tank 44 through the second through hole 28 and the recovery pipe 42. Although the configuration in which the treatment liquid is collected in the recovery tank is described above, the treatment liquid may be discharged from the surface treatment fixture 20 by a pump or an ejector.

The detachment maintaining means 50 is such that the surface treatment jig 20 is kept separated from the treated surface 18a. The distance between the surface treatment jig 20 and the surface to be treated 18a is maintained at a predetermined distance, whereby the treatment liquid can be held in the treatment portion 22. Further, the detachment maintaining means 50 may include means for moving the surface treatment jig 20 in a direction parallel to the surface to be processed 18a and a direction upward and downward of the surface 18a to be processed. Specifically, the intervening maintenance means 50 can be realized by, for example, holding the arm 52 of the surface treatment jig 20 or the like.

Further, the processing apparatus 100 of the present embodiment is provided with a drying means for drying the processed surface 18a after the treatment. The drying means may be, for example, an inert gas supply means 60 for supplying an inert gas to the surface to be treated 18a, and a suction means (not shown) for sucking the treatment liquid remaining on the surface to be processed 18a. The inert gas supply means 60 can be constituted, for example, by an inert gas tank 62, an inert gas supply pipe 64, and a nozzle 66 provided at the tip end of the inert gas supply pipe 64. As the inert gas, a known inert gas such as argon, nitrogen or the like can be used. Further, when the inert gas is supplied, it is preferably supplied so as to be able to be blown to the surface 18a to be processed. Further, the suction means may be constituted by, for example, a pump for suction, a recovery tank for recovering the treatment liquid, and a recovery pipe for the treatment liquid. The inert gas supply means 60 and the suction means may be integrally formed with a surface treatment jig 20 to be described later, or may be configured separately. Further, the drying of the object 18 can be carried out by using the surface treatment fixture 20. The processing method when the surface to be treated 18a is dried by the surface treatment jig 20 will be described later.

(Approach)

Next, a processing method of the object to be processed using the above processing apparatus will be described. In the present processing method, first, the object to be processed 18 is held on the mounting table 10. An attraction mechanism is provided in the mounting table 10 to hold the object 18 to be processed. Further, the surface treatment jig 20 is placed above the object 18 by the separation maintaining means 50. At this time, the distance between the surface 18a to be processed of the object 18 to be treated and the surface treatment jig 20 (particularly, the protruding portion 24) is preferably maintained at, for example, 3 mm or less. Thereby, it is easy to hold the processing liquid between the to-be-processed surface 18a and the opposing surface 22a of the surface-processing jig 20.

Next, the treatment liquid supply device 30 supplies the treatment liquid to the surface treatment fixture 20 (the treatment unit 22). The supply of the treatment liquid is performed through the first through hole 26 of the surface treatment fixture 20. At the same time as the supply of the treatment liquid, the recovery of the supplied treatment liquid is performed by the recovery means 40 (hereinafter referred to as "supply and recovery treatment"). The recovery of the treatment liquid is performed by suctioning the treatment liquid to the recovery pipe 44 side through the second through hole 28 of the surface treatment fixture 20.

Then, the treatment liquid can be held by the surface tension of the treatment liquid generated between the treated surface 18a and the surface treatment fixture 20. In addition, the above supply. The supply amount and the recovery amount of the treatment liquid to be recovered may be such that the treatment liquid does not diffuse from the surface treatment fixture 20 as long as the surface tension is maintained. For example, the treatment liquid may be adjusted to have substantially the same amount or the like.

The supply of this treatment liquid. The collection process can be performed while moving the surface treatment jig 20 to the object 18 to be processed. At this point, it is preferable to move the surface treatment jig 20 from the middle to the outer edge of the object 18 to be processed. As described above, even when the surface treatment jig 20 is moved, even if the treatment surface of the treatment portion 22 of the surface treatment jig 20 is smaller than the surface to be treated 18a, the entire surface of the surface 18a to be processed can be subjected to processing. In addition, in this form, the "general center" means the periphery including a center and a center.

Further, the object to be processed 18 may be supplied while being rotated about a vertical line passing through the center of the surface thereof. Recycling treatment. In this case, the rotation speed is preferably 10 rpm or more and 100 rpm or less. When it is in the above range, the treatment liquid can be held between the treatment portion 22 and the surface to be treated 18a, and the treatment liquid can be prevented from scattering to other fields. Further, the processing body 18 is rotated as described above to improve the efficiency of the processing.

Second, at the end of the supply. After the recovery treatment, the treated surface 18a is dried (hereinafter referred to as "drying treatment"). The drying treatment can be carried out by the inert gas supply means 60 or the suction means. Also, the drying process can be performed using the surface treatment fixture 20. When the surface treatment tool 20 is used, the processing liquid remaining on the surface to be processed 18a is sucked by the recovery means 40 in a state where the supply of the processing liquid from the supply means 30 is stopped. In this case, the surface treatment jig 20 can realize the treatment and drying of the treatment liquid, and can effectively utilize the treatment device.

As described above, the processing liquid of the surface to be processed 18a can be processed by the processing apparatus of the present embodiment.

According to the processing apparatus 100 of the present embodiment, the treatment of the surface treatment jig 20 can be performed while maintaining the disengaged state of the surface to be treated 18a and the surface treatment jig 20 by the separation maintaining means 50. Recovery of the treated liquid to be supplied. By simultaneously supplying the processing liquid and recovering the supplied processing liquid, the processing liquid can be held between the surface treatment jig 20 and the surface to be treated 18a. Therefore, the scattering of the treatment liquid in the field where the treatment liquid is not desired to be scattered can be suppressed. As a result, it is possible to provide a processing apparatus that performs processing only on the surface (processed surface) on which the treatment is to be performed.

Further, in the processing apparatus 100 of the present embodiment, the distance between the surface treatment fixture 20 and the surface to be processed 18a can be adjusted by the separation maintaining means 50, and the processing liquid can be more reliably held by the surface tension of the processing liquid. Therefore, it is possible to prevent the scattering of the treatment liquid while maintaining the amount of the treatment liquid in the field to be treated. Further, when the protruding portion 24 is provided, a depression is formed in the treatment portion 22 in accordance with the length of the protruding portion 24. As a result, the depression can be made to function as a holding area of the treatment liquid. Under the surface treatment jig 20 as described above, the desired amount of the treatment liquid can be maintained and the treatment can be performed satisfactorily.

Further, according to the processing apparatus of the present embodiment, the treatment liquid can be prevented from scattering, so that the utilization efficiency of the treatment liquid can be improved.

Next, an example of the object to be processed which is particularly well processed by the processing apparatus of the present embodiment will be described. Further, of course, the object to be processed 18 is not limited to the object to be processed exemplified below.

The object 18 to be processed which is satisfactorily processed by the processing apparatus of the present embodiment is a thinned semiconductor wafer provided on a dicing tape of a support. Such a thinned semiconductor wafer sometimes has an adhesive remaining on the surface of the semiconductor wafer in its thinning process. In the removal process of the adhesive of such a semiconductor wafer, the processing apparatus of this embodiment can be utilized.

In the following description, first, the advantages of the processing apparatus using the present embodiment will be described after explaining the thinning process of the semiconductor wafer with reference to the drawings. 4(a) to 4(d) are cross-sectional views illustrating a thinning process of a semiconductor wafer. Here, an example of using the perforated support plate 70 will be described.

First, as shown in FIG. 4(a), the support plate 70 and the semiconductor wafer 74a are attached via the adhesive 72. This semiconductor wafer 74a is thinned before. Further, as shown in FIG. 4(b), the semiconductor wafer 74a is polished to form a thinned semiconductor wafer 74. The polishing of the semiconductor wafer 74a can be performed by various well-known techniques. Further, as shown in FIG. 4(c), a surface that is not in contact with the adhesive 72 of the semiconductor wafer 74 is bonded to a dicing tape (support) 76. At this time, the dicing tape 76 is intended to fill the strength of the semiconductor wafer 74 after peeling, and it is easy to handle. Further, a cutting frame (fixing tool) 78 is provided around the dicing tape 76. This cutting frame 78 is intended to prevent slack in the dicing tape 76. Then, the solvent for dissolving the adhesive 72 is supplied from the hole of the support plate 70, and after the adhesive 72 is dissolved, the support plate 70 is removed. At this point, the adhesive 72 is not completely removed and remains on the semiconductor wafer 74. The remaining adhesive 72 is shown as a residual adhesive 73. As described above, the semiconductor wafer 74 having the residual adhesive 73 corresponds to the object 18 to be processed.

This object to be processed 18 is provided with a dicing tape 76 on its outer circumference via the above-described work. The dicing tape 76 may be deteriorated by adhering a solvent (treatment liquid) used for removal of the residual adhesive 73. Deterioration of the dicing tape 76 causes slack, which sometimes causes cracking of the semiconductor wafer 74 which is reduced in thinning strength. Therefore, it is necessary to remove the residual adhesive 73 on the semiconductor wafer 74 without deteriorating the dicing tape 76. That is, it is required to perform removal of the solvent only on the surface of the semiconductor wafer 74.

When the processing apparatus 100 of the present embodiment is used for removing the residual adhesive 73 on the semiconductor wafer 74, as described above, it is possible to suppress the scattering of the solvent other than the semiconductor wafer 74 (the object 18 to be processed). Therefore, the removal of the residual adhesive 73 can be favorably performed without deteriorating the dicing tape 76. According to the processing apparatus of the present embodiment, it is possible to provide a processing apparatus that performs a good treatment on the surface to be processed, in response to the scattering of the surface treatment liquid which is not intended to be processed.

Further, the present embodiment is directed to the semiconductor wafer 74 on which the object 18 to be processed is provided on the dicing tape 76, but is not limited thereto. The processing apparatus of this embodiment can be used for any object to be processed as long as it is a subject to be subjected to the treatment of the treatment liquid.

Further, in the above-described processing apparatus 100, when the planar shape of the surface treatment jig 20 is circular, the shape of the surface treatment jig 20 is not limited thereto. A surface treatment jig 70 according to a modification of the surface treatment jig 20 will be described below with reference to Fig. 5 . Fig. 5 is a plan view showing the surface treatment jig 70 positioned above the surface to be treated 18a. The other constitution is the same as the surface treatment fixture 20.

As shown in FIG. 5, the surface treatment jig 70 has a rectangular shape and has a planar shape in which the corner is an arc. The surface treatment jig 70 is provided with a first through hole 76 that supplies the treatment liquid to the surface 18a to be processed, and a second through hole 78. The supply of the treatment liquid to the treatment unit is performed through the first through hole 76, and the supply of the treatment liquid to be supplied is performed through the second through hole 78. The shape, number, and arrangement of the openings of the first through holes 76 and the second through holes 78 are not limited to those shown in FIG. 5. When the surface to be processed 18a is circular, it is preferable that the length of the surface treatment jig 70 in the longitudinal direction is substantially the same as the radius of the surface to be processed 18a. In this case, for example, it is possible to perform processing on the entire surface of the processed surface while performing the processing while rotating the object to be processed in the direction indicated by the arrow. Further, the surface treatment jig 70 is also the same as the surface treatment jig 20, and of course, a protruding portion may be provided on the opposing surface of the surface to be processed 18a. Further, although the surface treatment jig 70 has a rectangular shape in plan view, the shape is not limited thereto, and the surface treatment may be performed by supplying the treatment liquid to the surface to be treated 18a and recovering the supplied treatment liquid. The treatment liquid may be held between the device 70 and the surface to be treated 18a.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims. The embodiments obtained by appropriately combining the technical means disclosed in the respective embodiments are also included in the technical scope of the present invention.

The processing apparatus of the present invention includes a surface treatment jig that maintains a separation from the object to be processed, and a supply means and a recovery means for the treatment liquid, whereby the treatment liquid can be held between the surface to be treated and the opposite surface, thereby suppressing The treatment of scattering of the treatment liquid other than the surface to be treated.

The treatment apparatus of the present invention can realize various treatments such as washing or coating of the treatment liquid.

The specific embodiments or examples in the detailed description of the invention are intended to clarify the technical contents of the present invention, and are not limited to such specific examples, as long as they are in the technical idea of the present invention and the patent application described in the second embodiment. Various changes can be implemented within the scope.

10. . . Mounting table

12. . . Rotary axis

14. . . motor

16. . . Washing tank

18. . . Object to be processed

18a. . . Processed surface

20. . . Surface treatment fixture

twenty two. . . Processing department

22a. . . Opposite face

twenty four. . . Protruding

26. . . First through hole

28. . . Second through hole

30. . . Supply means

32. . . Supply piping

34. . . Treatment tank

40. . . Recycling method

42. . . Recycling piping

44. . . Suction pump

50. . . Separation maintenance

52. . . arm

60. . . Inert gas supply means

62. . . Inert gas tank

64. . . Inert gas supply piping

66. . . nozzle

100. . . Processing device

Fig. 1 is a cross-sectional view showing a main part of a configuration of a processing apparatus according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a portion A of Fig. 1 in more detail.

Fig. 3 is a plan view showing a surface treatment jig included in the processing apparatus of the embodiment.

Fig. 4 (a) is a cross-sectional view showing an example of a target object processed by the processing apparatus of the embodiment.

Fig. 4 (b) is a cross-sectional view showing an example of the object to be processed which is processed by the processing apparatus of the embodiment.

Fig. 4 (c) is a cross-sectional view showing an example of the object to be processed which is processed by the processing apparatus of the embodiment.

Fig. 4 (d) is a cross-sectional view showing an example of the object to be processed which is processed by the processing apparatus of the embodiment.

Fig. 5 is a plan view showing a surface treatment jig of another embodiment.

10. . . Mounting table

12. . . Rotary axis

14. . . motor

16. . . Washing tank

18. . . Object to be processed

18a. . . Processed surface

20. . . Surface treatment fixture

22a. . . Opposite face

30. . . Supply means

32. . . Supply piping

34. . . Treatment tank

40. . . Recycling method

42. . . Recycling piping

44. . . Suction pump

50. . . Separation maintenance

60. . . Inert gas supply means

62. . . Inert gas tank

64. . . Inert gas supply piping

66. . . nozzle

100. . . Processing device

A. . . Sectional view

Claims (15)

A processing apparatus, comprising: a mounting table on which a target object is placed; a surface treatment fixture that treats a processed surface of the object to be processed by a treatment liquid; and a supply means for the surface treatment The jig is supplied with a treatment liquid; the recovery means is for recovering the treatment liquid supplied to the surface treatment fixture; and the separation maintenance means is for maintaining the surface treatment fixture in a state of being separated from the surface to be treated, and The surface treatment jig includes: a facing surface facing the surface to be processed; and the processing liquid supplied from the supply means is held between the facing surface and the surface to be processed to process the surface to be processed In the processing unit, the processing unit includes a protruding portion that protrudes from the opposite surface toward the object to be processed, and is supplied by a surface tension of the processing liquid between the protruding portion and the processed surface. The treatment liquid is held between the opposite surface and the surface to be treated. The processing device according to claim 1, wherein the surface of the protruding portion facing the surface to be processed is a flat surface, and the protruding portion and the processed surface are used by the separation maintaining means The distance is maintained below 3mm. The processing apparatus according to the first aspect of the invention, further comprising: a drying means for drying the treated surface after the treatment. The processing apparatus according to claim 3, wherein the drying means is an inert gas supply means for supplying an inert gas to the surface to be treated. The processing apparatus according to claim 3, wherein the drying means is a suction means for sucking the treatment liquid remaining on the surface to be treated. The processing apparatus according to claim 5, wherein the suction means is performed by the surface treatment tool, and the remaining means is used to attract the residue by stopping the supply of the treatment liquid from the supply means. The treatment liquid on the surface to be treated. The processing apparatus according to claim 1, wherein the area of the opposing surface is smaller than the area of the surface to be processed. The processing apparatus according to claim 1, wherein the separation preventing means moves the surface treatment fixture to the object to be processed. The processing apparatus of claim 8, wherein the separation preventing means moves the surface treatment fixture from a center of the object to the outer edge. The processing apparatus according to claim 1, wherein the mounting table rotates the object to be processed. A surface treatment jig for use in a surface treatment tool for treating a treated surface of a treated object with a treatment liquid, characterized in that: The processing unit includes a processing liquid that is opposed to the processed surface when the surface to be processed is kept away, and is supplied with a processing liquid that is supplied between the opposing surface and the processed surface, and is processed In the processed surface, the processing unit includes a protruding portion that protrudes from the opposing surface toward the object to be processed, and is supplied by a surface tension of the processing liquid between the protruding portion and the processed surface. The treatment liquid is held between the opposite surface and the surface to be treated. A processing apparatus, comprising: a mounting table on which a target object is placed; a surface treatment fixture that treats a processed surface of the object to be processed by a treatment liquid; and a supply means for the surface treatment The jig is supplied with a treatment liquid; the recovery means is for recovering the treatment liquid supplied to the surface treatment fixture; and the separation maintenance means is for maintaining the surface treatment fixture in a state of being separated from the surface to be treated, and The surface treatment jig includes: a facing surface facing the surface to be processed; and the processing liquid supplied from the supply means is held between the facing surface and the surface to be processed to process the surface to be processed In the processing unit, the area of the opposing surface is smaller than the area of the surface to be processed. A surface treatment jig for use in a surface treatment tool for treating a treated surface of a treated object with a treatment liquid, characterized in that: The processing unit includes a processing liquid that is opposed to the processed surface when the surface to be processed is kept away, and is supplied with a processing liquid that is supplied between the opposing surface and the processed surface, and is processed The surface to be processed has an area smaller than the area of the surface to be processed. A processing apparatus, comprising: a mounting table on which a target object is placed; a surface treatment fixture that treats a processed surface of the object to be processed by a treatment liquid; and a supply means for the surface treatment The jig is supplied with a treatment liquid; the recovery means is for recovering the treatment liquid supplied to the surface treatment fixture; and the separation maintenance means is for maintaining the surface treatment fixture in a state of being separated from the surface to be treated, and The surface treatment jig includes: a facing surface facing the surface to be processed; and the processing liquid supplied from the supply means is held between the facing surface and the surface to be processed to process the surface to be processed In the processing unit, the detachment maintaining means moves the surface treatment jig to the object to be processed, and the detachment maintaining means moves the surface treatment jig from the approximate center of the object to the outer edge. A surface treatment jig for use in a surface treatment jig for treating a treated surface of a target object with a treatment liquid, comprising: a treatment portion having a treatment portion that is opposed to while maintaining a separation from the surface to be treated The processing surface supplied between the opposing surface and the surface to be processed is held by the opposing surface of the surface to be processed, and the surface to be treated is treated, and the surface treatment means is maintained. In the state of being separated from the surface to be treated, the separation preventing means moves the surface treatment jig to the object to be processed, and the separation means moves the surface treatment jig from the center of the object to the outer edge.