TWI384351B - Heat dissipation device - Google Patents

Description

Heat sink

The present invention relates to a heat sink, and more particularly to a heat sink for cooling electronic components.

With the rapid development of the electronics industry, the operating speed of electronic components (such as central processing units) continues to increase, generating a large amount of heat during operation, which increases the temperature of the system itself and the system, which in turn affects the stability of the system. In order to ensure the normal operation of the electronic components, a heat sink is usually installed thereon to discharge the heat generated by the heat sink.

A conventional solution to the problem of heat dissipation of electronic components is usually to mount a heat sink on each of the heat-generating electronic components. The heat sink includes a bottom plate in close contact with the electronic components and a plurality of heat-dissipating fins disposed on the bottom plate. However, with the advent of the digital information era, light and thin have become the main trend of current electronic products, and its manufacturing process has continued to develop toward high-density packaging and multi-functionality. The distance between various electronic components such as wafers is getting smaller and smaller, and the heat is getting hotter. The bigger. Therefore, in practical applications, when the distance between the plurality of heat-generating electronic components, especially the main heat-generating electronic components and the secondary heat-generating electronic components, is small or even different, if separate heat dissipation devices are used to dissipate heat to maintain the normal operation of the system. If it is running, it is necessary to open too many openings on the circuit board, which will occupy too much space, and not only will the system's heat dissipation structure be dispersed and the system space is wasted, but also the separate heat dissipation will be limited due to the small distance between the electronic components. The size of the device, so that the heat dissipation performance of the system is greatly limited.

In view of this, it is necessary to provide a heat sink that can simultaneously accommodate a plurality of electronic components.

A heat dissipating device for dissipating heat from two electronic components on a circuit board, comprising: a first heat sink and a second heat sink respectively attached to the two electronic components, and fixing the first and second heat sinks to a plurality of fixing components on the circuit board, the first heat sink includes a substrate and a plurality of heat dissipation fins on the substrate, the second heat sink is disposed on a side of the first heat sink with a first shoulder, and the fixing component includes a first a fixed rod of the head, wherein a fixed rod sleeve is provided with a double spring, and sequentially passes through the first shoulder of the second heat sink and the substrate of the first heat sink, the double spring comprises an outer spring and an outer layer An inner layer spring connected to the top of the spring, the outer spring is pressed between the head of the fixing rod and the first shoulder of the second heat sink, and the inner layer spring is pressed against the head of the fixing rod and the first radiator Between the substrates.

Compared with the prior art, the above-mentioned double-layer spring outer layer spring and the inner layer spring act on the first heat sink and the second heat sink independently of each other, so that the two heat sinks share the perforation between them, thereby reducing the circuit board. The number of openings can make full use of the space between the two heat sinks to maximize the heat dissipation area of the heat sink. In addition, the above-mentioned double-layer spring integrally formed structure can ensure that the first and inner layer springs sleeved on the same fixing rod do not interfere with each other, and bring convenience to the assembly operation.

Referring to FIG. 1 and FIG. 2, a heat dissipating device of a preferred embodiment of the present invention is configured to dissipate heat from two electronic components 42 and 44 mounted on a circuit board 40. The heat dissipating device includes a first heat sink 10, and A heat sink 10 overlaps one of the second heat sink 20 and a plurality of fixed elements that secure the first and second heat sinks 10, 20 to the two electronic components 42, 44, respectively.

The electronic component 42 described above is a primary heat generating component that is larger in size and power than the electronic component 44. The height of the two electronic components 42, 44 may be unequal. In this embodiment, the top surface of the electronic component 42 is higher than the electronic component 44. The circuit board 40 is symmetrically and uniformly provided with four mounting holes 43 around the electronic component 42. The circuit board 40 is provided with a buttonhole 45 at a diagonal of the electronic component 44 away from the electronic component 42.

The first heat sink 10 includes a substrate 12 and a plurality of heat dissipation fins 14 extending vertically from the substrate 12 . The substrate 12 has a substantially rectangular shape, and the bottom surface thereof is in close contact with the electronic component 42. The mounting portions 120 of the heat dissipation fins 14 are arranged on the four corners of the substrate 12. Each of the mounting portions 120 defines a through hole 122.

The second heat sink 20 is integrally formed of a metal material having good thermal conductivity such as aluminum, copper, or the like, and has a smaller size than the first heat sink 10. The second heat sink 20 includes a bottom plate 22, a plurality of fins 24 extending vertically upward from the bottom plate 22, a first shoulder portion 26 extending away from one side of the first heat sink 10, and a distance from the first heat sink. The other side of the 10 extends out of one of the second shoulders 28, i.e., the first shoulder 26 and the second shoulder 28 are disposed diagonally. The bottom plate 22 is substantially rectangular and has a bottom surface in close contact with the electronic component 44. The first shoulder portion 26 extends horizontally from the side of the second heat sink 20 toward the one end, and is disposed on the first heat sink 10 substrate 12 near the front side mounting portion 120. The first shoulder portion 26 is opened. The through hole 260 corresponding to the through hole 122 of the mounting portion 120 has an inner diameter larger than the inner diameter of the through hole 122. The second shoulder portion 28 extends horizontally from the other side of the second heat sink 20 and opposite to one end of the first shoulder portion 26, and a through hole 280 is defined in the second shoulder portion 28. The first and second shoulders 26 and 28 are substantially on the same horizontal line. The two outermost fins 24 extend from the bottom end of the second heat sink 20 to the bottom end of the bottom plate 22, so that the first and the second The bottom surfaces of the shoulders 26, 28 are slightly higher than the top surface of the bottom plate 22.

Referring to FIGS. 2 and 3, the fixing component for mounting the first heat sink 10 and the second heat sink 20 to the circuit board 40 includes four fixing rods 32, a double spring 34 sleeved on one of the fixing rods 32, Three first springs 36, a locking member 38 and four snap rings 39 are disposed on the other three fixing rods 32. The fixing rod 32 with the double spring 34 is disposed for passing through the first shoulder portion 26 of the second heat sink 20 and the mounting portion 120 corresponding to the first heat sink 10 overlapping the first shoulder portion 26, the locking member 38 is then used to pass through the second shoulder 28 of the second heat sink 20. Each of the fixing rods 32 includes a flat cylindrical head portion 320 and a rod body 322 extending perpendicularly from the bottom surface of the head portion 320 and a threaded portion 324 at the bottom end of the connecting rod body 322. The top surface of the head portion 320 is provided with a screw a knife-fitted cross sipe 3200, the diameter of the rod 322 is smaller than the diameter of the head 320, and the rod body 322 is adjacent to the thread portion 324 and is provided with an annular card slot 3220 that cooperates with the snap ring 39; the double spring 34 is composed of an outer spring 340 is integrally connected with the inner layer spring 342 connected to the top of the outer layer spring 340. The outer diameter of the outer layer spring 340 is smaller than the diameter of the head portion 320. The inner diameter of the outer layer spring 340 is slightly larger than the outer diameter of the inner layer spring 342 and the length is smaller than the inner length. The layer spring 342 has an inner diameter larger than the through hole 122 of the first heat sink 10 mounting portion 120. The lower end portion of the inner layer spring 342 protrudes from the bottom end of the outer layer spring 340 and passes through the second heat sink 20 The through hole 260 of one shoulder portion 26 is pressed against the mounting portion 120 of the first heat sink 10 substrate 12; the first spring 36 is substantially the same size and length as the inner layer spring 342 of the double spring 34; the lock 38 includes a locking rod 380 and a second spring 3 sleeved on the locking rod 380 82. The locking rod 380 includes a head (not labeled) and a barb (not labeled) formed at the bottom end; the snap ring 39 defines an opening 390 in the middle thereof, and the opening 390 has a slit formed in the radial direction. The opening 390 is enlarged when the elongated slit is pressed and deformed.

When the heat dissipating device is assembled, the fixing rod 32 in which the double spring 34 is sleeved is disposed through the through hole of the first shoulder portion 26 of the second heat sink 20 disposed on the mounting portion 120 of the substrate 12 of the first heat sink 10 26 and the corresponding through hole 122 of the mounting portion 120; the other three fixing rods 32 are respectively sleeved with three first springs 36 and inserted into the through holes 122 of the other three mounting portions 120, and the sleeve is provided with the locking member 38 of the second spring 382. The fastener 38 is pre-assembled onto the second shoulder 28 by being inserted into the through hole 280 of the second shoulder 28 of the second heat sink 20 and being barbed against the second shoulder 38 by its barbs. When the slot 3220 of the fixing rod 32 passes from the through hole 122 to the bottom of the substrate 12, the snap ring 39 is sleeved from the bottom to the bottom of the slot 3220 to be sleeved with the first spring 36 or the double spring 34. 32 is pre-assembled onto the first and second heat sinks 10, 20. Finally, the pre-assembled heat sink is placed on the two electronic components 42 and 44 of the circuit board 40, and the driving rod 32 is screwed down to the corresponding mounting hole 43 of the circuit board 40 or downwardly through the corresponding mounting hole 43 and The backing plate 50 (shown in FIG. 4) fixed to the circuit board 40 is screwed and fixed, and then the locking member 38 is pressed down to be barbed through the buttonhole 45 of the circuit board 40 and fixed under the circuit board 40.

When the heat dissipating device is used, the double layer spring 34 outer layer spring 340 and the inner layer spring 342 are respectively clamped between the fixed rod 32 head 320 and the second heat sink 20 first shoulder 26 and the head 320 and the first The heat sink 10 is disposed between the mounting portions 120, and the outer layer spring 340 and the inner layer spring 342 act on the first heat sink 10 and the second heat sink 20 independently of each other. Thus, the two heat sinks 10, 20 share the perforations 43 between them, which can reduce the number of openings on the circuit board 40, and can fully utilize the space between the two heat sinks 10, 20 to maximize the heat dissipation of the heat sinks 10, 20. area. In addition, the structure in which the double-layer springs 34 are integrally formed can ensure that the first and inner layer springs 340 and 342 which are sleeved on the same fixing rod 32 do not interfere with each other, and facilitate the assembly operation.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

The first radiator. . . 10

Substrate. . . 12

Installation department. . . 120

perforation. . . 122

Cooling fins. . . 14

Second radiator. . . 20

Base plate. . . twenty two

heat sink. . . twenty four

First shoulder. . . 26

Through hole. . . 260

Second shoulder. . . 28

Through hole. . . 280

Fixed pole. . . 32

head. . . 320

Slot. . . 3200

Rod body. . . 322

Card slot. . . 3220

Thread segment. . . 324

Double spring. . . 34

Outer spring. . . 340

Inner layer spring. . . 342

First spring. . . 36

Lock firmware. . . 38

Locking rod. . . 380

Second spring. . . 382

Clasp. . . 39

Opening. . . 390

Circuit board. . . 40

Electronic component. . . 42,44

Mounting holes. . . 43

Buckle hole. . . 45

Backboard. . . 50

1 is a perspective assembled view of an embodiment of a heat sink of the present invention.

2 is an exploded perspective view of the heat sink of FIG. 1.

Figure 3 is an enlarged exploded view of a portion of the fastener of Figure 2.

Figure 4 is a cross-sectional view taken along line IV-IV of Figure 1.

Substrate. . . 12

Installation department. . . 120

Cooling fins. . . 14

Base plate. . . twenty two

heat sink. . . twenty four

First shoulder. . . 26

Second shoulder. . . 28

Lock firmware. . . 38

Circuit board. . . 40

Buckle hole. . . 45

Claims (9)

A heat dissipating device for dissipating heat from two electronic components on a circuit board, comprising: a first heat sink and a second heat sink respectively attached to the two electronic components, and fixing the first and second heat sinks to a plurality of fixing components on the circuit board, the first heat sink includes a substrate and a plurality of heat dissipation fins on the substrate, the second heat sink is disposed on a side of the first heat sink with a first shoulder, and the fixing component includes a first The fixing rod of the head is improved in that: one of the fixing rod sleeves is provided with a double spring, and sequentially passes through the first shoulder of the second heat sink and the substrate of the first heat sink, the double layer spring comprises an outer layer a spring and an inner layer spring coupled to the top of the outer spring, the outer spring being pressed between the head of the fixed rod and the first shoulder of the second heat sink, the inner layer spring being pressed against the fixed rod and the head Between the substrates of the first heat sink. The heat dissipating device of claim 1, wherein the double spring is integrally formed, and an inner layer spring length extends from the lower end beyond the outer layer spring. The heat dissipating device of claim 1 or 2, wherein each of the corners of the substrate is formed with a mounting portion, the mounting portion defines a through hole penetrating the fixing rod, and the inner layer spring passes through the first shoulder of the second heat sink. The part is pressed against the corresponding mounting part. The heat sink of claim 3, wherein the second heat sink comprises a bottom plate, a plurality of fins extending on the bottom plate, and a second shoulder extending from a side of the second heat sink away from the first heat sink The first shoulder and the second shoulder are located substantially at opposite diagonal positions. The heat sink of claim 4, wherein the first shoulder height is slightly higher than the floor surface. The heat dissipating device of claim 4, wherein the fixing member further comprises a locking member, the locking member being disposed in the second shoulder. The heat dissipating device of claim 3, wherein the fixing component further comprises a plurality of springs, and the fixing rod sleeved with the spring is disposed in the through hole of the remaining three mounting portions of the substrate. The heat dissipating device of claim 3, wherein the bottom end of the fixing rod forms a threaded section screwed to the circuit board and an annular card slot is formed above the threaded section. The heat dissipating device of claim 8, wherein the fixing component further comprises a snap ring, and the snap ring card is disposed in the fixing rod slot below the first heat sink substrate and is sleeved with a spring or a double layer. The spring fixing rod is pre-assembled onto the first heat sink.